CN101232061B - Luminous source packaging - Google Patents
Luminous source packaging Download PDFInfo
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- CN101232061B CN101232061B CN2007100044207A CN200710004420A CN101232061B CN 101232061 B CN101232061 B CN 101232061B CN 2007100044207 A CN2007100044207 A CN 2007100044207A CN 200710004420 A CN200710004420 A CN 200710004420A CN 101232061 B CN101232061 B CN 101232061B
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- Prior art keywords
- transparent
- package
- wafer
- light source
- reflector
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- 238000004806 packaging method and process Methods 0.000 title 1
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 63
- 230000004308 accommodation Effects 0.000 claims description 40
- 238000001816 cooling Methods 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 claims description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- 230000005284 excitation Effects 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 239000003086 colorant Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract 5
- 235000012431 wafers Nutrition 0.000 description 110
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 239000011345 viscous material Substances 0.000 description 5
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000009795 derivation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
A light emitting source package comprises a reflective cup disposed in the placing space of a transparent carrier with a plurality of via-holes formed on the end wall of the sealed end; a light emitting unit disposed near an opening end of the reflective cup including a transparent mounting substrate, an light-emitting diode (LED) chip and/or a laser diode (LD) chip installed on the mounting substrate with conductive contacts electrically connected with corresponding conductive contacts on the mounting substrate, and a plurality of external connection conductive pins including first ends electrically connected with corresponding conductive pins of the mounting substrate and second ends protruding to the outside of the transparent carrier through the end wall of the sealed end of the reflective cup and a formation wall of the transparent carrier; and a transparent cover arranged on the transparent carrier to form a sealed space together with the transparent carrier. A heat conducting liquid may be filled in the sealed space to effectively dissipate the heat generated during the operation of the chip. The mounting surface of the mounting substrate can form a 90 or 180 DEG angle together with the end wall of the sealed end of the reflective cup. The light beams emitted from six light-emitting surfaces of the chip can be guided completely, thus improving the brightness.
Description
Technical field
The present invention relates to a kind of package of light source.
Background technology
In recent years, the application of light-emitting diode is more and more extensive, and the institute that following replacement general lighting has been gesture becomes.Yet present light-emitting diode is still not enough aspect heat radiation, so that cause quite serious light decay problem, therefore, a kind of package of light source of excellent heat radiation performance is necessary.
In view of this, the present application people is engaged in the many years of experience of the sector with it, and in line with excelsior spirit, the active research improvement is so there is generation of the present invention.
Summary of the invention
The purpose of this invention is to provide a kind of the heat radiation well to enable to overcome the package of light source of optical attenuation problem.
According to a feature of the present invention, a kind of package of light source is provided, and this package of light source comprises: the clear hollow carrier, and this transparent carrier has accommodation space; Place the interior reflector of described accommodation space of this transparent carrier, this reflector is the diameter tubaeform cup-shaped thing larger than the diameter of sealing end with sealed end and open end and this open end, the inner wall surface of this reflector is laid with light reflection layer or phosphor powder layer, so that leaded light efficient is promoted, the end wall of the described sealed end of this reflector is formed with a plurality of through holes; Place near the light emission unit the open end of this reflector, this light emission unit comprises and has wafer and the surface is installed and two or morely is formed at the transparent installation base plates that this installs lip-deep conductive junction point, be installed on the installation surface of this transparent installation base plate and have the LED wafer of the conductive junction point that a plurality of and the corresponding conductive junction point of this transparent installation base plate be electrically connected, reach a plurality of respectively the have first end that is electrically connected with the corresponding conductive junction point of this transparent installation base plate and the end wall of the sealed end that passes this reflector and the formation walls of this transparent carrier, the outside that protrudes out the second end of this transparent carrier outside connects conductive connecting pin; And being arranged at the transparent cover body that can jointly form with this transparent carrier confined space on this transparent carrier, hot-air can be via the opposite side of these a plurality of through holes from a side flow of the end wall of the sealed end of this reflector to the end wall of the sealed end of this reflector.
According to another characteristic of the invention, a kind of package of light source is provided, and this package of light source comprises: the clear hollow carrier, and this transparent carrier has accommodation space; Place the interior reflector of accommodation space of this transparent carrier, this reflector is that the diameter with sealed end and open end and this open end is the tubaeform cup-shaped thing larger than the diameter of sealing end, the inner wall surface of this reflector is laid with light reflection layer or phosphor powder layer so that leaded light efficient is promoted, and the end wall of the sealed end of this reflector is formed with a plurality of through holes; Place near the light emission unit the open end of this reflector, this light emission unit comprises LED wafer with a plurality of conductive junction points and a plurality ofly respectively has an outside connection conductive connecting pin that formation wall that the first end that is electrically connected with the corresponding conductive junction point of this LED wafer and the sealed end that is connected this reflector get end wall and this transparent carrier protrudes out the second end of this transparent carrier outside; And being arranged at the transparent cover body that can jointly form with this transparent carrier confined space on this transparent carrier, hot-air can be via the opposite side of these a plurality of through holes from a side flow of the end wall of the sealed end of this reflector to the end wall of the sealed end of this reflector.
According to another feature of the present invention, a kind of package of light source is provided, and this package of light source comprises: the first transparent installation base plate, this first transparent installation base plate have wafer installation surface and a plurality of these wafers that are formed at are installed lip-deep conductive junction point; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively arrange, and link together via the clear, viscous material so that be formed with accommodation space between them, it is outside that the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that LED wafer with conductive junction point that a plurality of and the corresponding conductive junction point of this first transparent installation base plate be electrically connected is connected conductive connecting pin with being connected respectively to have with the first end of the corresponding conductive junction point electrical connection of this LED wafer with the outside that is connected this accommodation space outside; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has the first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that produces when LED wafer operates is enough derived from this accommodation space inside via this group heat pipe and is delivered to this cooling base, can dissipate via these radiating fins.
According to again another feature of the present invention, a kind of package of light source is provided, and this package of light source comprises: the first transparency carrier, this first transparency carrier have wafer installation surface and a plurality of these wafers that are formed at are installed lip-deep conductive junction point; The second transparency carrier, this second transparency carrier and this first transparency carrier relatively arrange, and link together via the clear, viscous material, so that be formed with accommodation space between them, it is outside that the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that having wafer installs the surface and are connected and be arranged on that this wafer is installed lip-deep transparent installation base plate, the LED wafer of conductive junction point with corresponding conductive junction point electrical connection of a plurality of and this transparent installation base plate respectively has a first end with the corresponding conductive junction point electrical connection of this transparent installation base plate and is connected conductive connecting pin with the outside that is connected this accommodation space outside with being connected; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has the first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that produces when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, can dissipate via these radiating fins.
According to again another feature of the present invention, a kind of package of light source is provided, and this package of light source comprises: the first transparent installation base plate, this first transparent installation base plate have wafer the surface are installed; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively arrange, and link together via the clear, viscous material, so that be formed with accommodation space between them, it is outside that the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that at least one respectively has the LED wafer of a plurality of conductive junction points; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has and protrudes out this accommodation space first end inner and that be electrically connected with the corresponding conductive junction point of each LED wafer and the second end that is connected to this cooling base, like this, the heat energy that produces when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, can dissipate via these radiating fins, the surface that in these heat pipes each is installed the surface towards the wafer of this first transparent installation base plate is towards the inclined-plane with light reflection coating of these LED wafer, and this can derive the sidelight that is sent by these LED wafer.
According to an again feature of the present invention, a kind of package of light source is provided, and this package of light source comprises: the first transparent installation base plate, this first transparent installation base plate have wafer the surface are installed; The second transparent installation base plate, this second transparent installation base plate and this first transparent installation base plate relatively arrange, and link together via the clear, viscous material, so that be formed with accommodation space between them, it is outside that the light that this accommodation space can send LED wafer and/or laser diode wafer six faces exports to this space fully; Place the light emission unit in this accommodation space, this light emission unit comprises that at least one respectively has the LED wafer of a plurality of conductive junction points, and circuit board unit, the first end of this circuit board unit is positioned at this accommodation space, and its second end protrudes out in this accommodation space outside, this circuit board unit has interchange and turns DC circuit, the input that this interchange turns DC circuit is suitable for being electrically connected to AC power, and its output is electrically connected to the conductive junction point of these LED wafer, the surface that the wafer towards this first transparent installation base plate of this circuit board unit is installed the surface is towards the inclined-plane with light reflection coating of these LED wafer, and it can be derived the sidelight that is sent by these LED wafer; And heat abstractor, this heat abstractor comprises one group of heat pipe, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe has the first end that protrudes out this accommodation space inside and the second end that is connected to this cooling base, like this, the heat energy that produces when LED wafer operates is enough derives from this accommodation space is inner via this group heat pipe, and deliver to this cooling base, it can dissipate via these radiating fins.
Description of drawings
Be to reach above-mentioned purpose, the technological means that adopts and effect thereof about the present invention, especially exemplified by preferred embodiment and cooperate illustrate as follows:
Fig. 1 is the signal phantom that shows the package of light source of the first preferred embodiment of the present invention;
Fig. 2 is the signal phantom that shows the package of light source of the second preferred embodiment of the present invention;
Fig. 3 is the signal phantom that shows the package of light source of the 3rd preferred embodiment of the present invention;
Fig. 4 is the signal phantom that shows the package of light source of the 4th preferred embodiment of the present invention;
Fig. 5 is the diagrammatic side view of light emission unit that shows the package of light source of the 5th preferred embodiment of the present invention;
Fig. 6 is the chart that shows the relation of the brightness of different chips and power;
Fig. 7 is the chart that shows the relation of the brightness of different chips and power;
Fig. 8 is the chart that shows the relation of the brightness of different chips and power;
Fig. 9 is the diagrammatic side view of light emission unit that shows the package of light source of the 6th preferred embodiment of the present invention;
Figure 10 is the diagrammatic side view of light emission unit that shows the package of light source of the 7th preferred embodiment of the present invention;
Figure 11 is the top schematic view of light emission unit that shows the package of light source of the 8th preferred embodiment of the present invention;
Figure 12 is the top schematic view of light emission unit that shows the package of light source of the 9th preferred embodiment of the present invention;
Figure 13 is the top schematic view of light emission unit that shows the package of light source of the tenth preferred embodiment of the present invention;
Figure 14 is the signal phantom that shows the package of light source of the 11 preferred embodiment of the present invention;
Figure 15 is the schematic isometric of another implementation of carrier that shows the package of light source of the first preferred embodiment of the present invention;
Figure 16 is the schematic isometric of another implementation of carrier that shows the package of light source of the second preferred embodiment of the present invention;
Figure 17 is the diagrammatic side view that shows when package of light source of the present invention is used in backlight arrangement;
Figure 18 is the schematic isometric that shows the package of light source of the first preferred embodiment of the present invention;
Figure 19 is the schematic isometric that shows the package of light source of the second preferred embodiment of the present invention;
Figure 20 is the signal phantom that shows the package of light source of the 13 preferred embodiment of the present invention;
Figure 21 is another signal phantom that shows the package of light source of the 13 preferred embodiment of the present invention;
Figure 22 is the signal phantom that shows the package of light source of the 14 preferred embodiment of the present invention;
Figure 23 is another signal phantom that shows the package of light source of the 14 preferred embodiment of the present invention;
Figure 24 is the signal phantom that shows the package of light source of the 15 preferred embodiment of the present invention;
Figure 25 is another signal phantom that shows the package of light source of the 15 preferred embodiment of the present invention;
Figure 26 is the signal phantom that shows the package of light source of the 16 preferred embodiment of the present invention;
Figure 27 is another signal phantom that shows the package of light source of the 16 preferred embodiment of the present invention;
Figure 28 is the signal phantom that shows the package of light source of the 17 preferred embodiment of the present invention;
Figure 29 is another signal phantom that shows the package of light source of the 17 preferred embodiment of the present invention;
Figure 30 is the signal phantom that shows the package of light source of the 18 preferred embodiment of the present invention;
Figure 31 is another signal phantom that shows the package of light source of the 18 preferred embodiment of the present invention;
Figure 32 is the signal phantom that shows the package of light source of the 12 preferred embodiment of the present invention; And
Figure 33 shows that the interchange of package of light source of the present invention turns the block schematic diagram of DC circuit.
Embodiment
In the detailed description of the preferred embodiments of the present invention of back, same or similar element is to be indicated by identical label, and their detailed description will be omitted.In addition, for clear disclosure feature of the present invention, the element in the diagram is not to describe by actual ratio.
Fig. 1 is the schematic sectional view that shows the package of light source U1 of the first preferred embodiment of the present invention, and Figure 18 is the schematic isometric that is presented at the package of light source U1 among Fig. 1.
Please refer to shown in Fig. 1 and 18, the package of light source U1 of the first preferred embodiment of the present invention comprises clear hollow carrier 1, place reflector 2 in this transparent carrier 1, light emission unit 3, and transparent cover body.
This transparent carrier 1 (is seen Figure 18) as an example of hemisphere example in the present embodiment, yet, should be noted that this transparent carrier 1 is not restricted to hemisphere, it can have any suitable shape, for example, halfpipe etc. (seeing Figure 15).In addition, as long as can allow light transmit, this transparent carrier 1 can be made by any suitable material.
This reflector 2 is to have blind end and open end, and the diameter of this open end tubaeform cup-shaped thing larger than the diameter of this blind end.The inner wall surface of this reflector 2 is laid with light reflection layer or phosphor powder layer (not shown), it can promote leaded light efficient, and be formed with a plurality of through holes 20 at the end wall of blind end, so that hot-air can get via the side flow that these through holes 20 get end wall from the blind end of reflector 2 opposite side of end wall to the blind end of reflector 2.
This light emission unit 3 comprises transparent installation base plate 30, LED wafer 31 and is connected conductive connecting pin 32 with pair of outer.
This transparent installation base plate 30 can be made by any suitable material, and the wafer with parallel with the end surfaces of the sealed end of this reflector 2 (that is, becoming 180 °) is installed surface 300.Install on the surface 300 at this wafer, be provided with two conductive junction points 301.This is electrically connected to the conductive junction point 301 of a correspondence of this installation base plate 30 to each the end in the conductive connecting pin 32, and its other end passes the sealed end of this reflector 2 and this shell 1 via the open end of this reflector 2 and can protrude out that this shell 1 is outside to be electrically connected with external circuit.
This LED wafer 31 is installed on the wafer of this installation base plate 30 and installs on the surface 300, and has two conductive junction points 310 that are electrically connected with the corresponding conductive junction point 301 of this installation base plate 30 respectively.In the present embodiment, the conductive junction point 310 of this LED wafer 31 is electrically connected to each other via wire 33 with the conductive junction point 301 of this installation base plate 30.
It should be noted, these LED wafer 31 settings like this can make six surface emitting light out by this LED wafer 31 all be exported utilization, and then overall brightness is promoted.
This transparent cover body 4 is the open ends that are connected to this carrier 1, and it can form confined space jointly with this carrier 1.In the present embodiment, this lid 4 and this carrier 1 common formation outward appearance are spherical encapsulation.Certainly, as shown in Figure 15, this lid 4 is the encapsulation of tubulose with this carrier 1 common formation outward appearance.Should be noted that, when this lid 4 is the encapsulation of tubulose with this carrier 1 shared formation outward appearance, it is applicable to the backlight arrangement of this case inventor in No. 95117532 patent application, as shown in Figure 17, package of light source of the present invention places between the prism of brightness enhancement film of backlight arrangement.
As mentioned above, because the setting of the through hole 20 of reflector 2, can cause hot and cold air to flow phenomenon in encapsulation inside, therefore the heat energy that produces owing to the running of LED wafer 31 enough effectively leaves, and then solve because of the overheated optical attenuation problem that rises, therefore the brightness of package of light source U1 of the present invention is promoted.
It should be noted, except the inner wall surface of this reflector 2, all can lay phosphor powder layer the surface being installed and installing on the surface on surface and the surfaces externally and internally at this lid with this wafer on the surfaces externally and internally of carrier, at the wafer of installation base plate.
Please refer to Fig. 2 and 19, the package of light source U2 of the second preferred embodiment of the present invention is shown.Different from the first preferred embodiment, the wafer installation surface 300 of the installation base plate 30 of the light emission unit 3 of the present embodiment and the end surfaces of the sealed end of this reflector 2 vertical (that is, one-tenth is 90 °).
Identical with the first preferred embodiment, transparent cover body 4 and this carrier 1 of the present embodiment can form the encapsulation that outward appearance is tubulose jointly, as shown in Figure 16.
See also shown in Figure 3ly, the package of light source U3 of the 3rd preferred embodiment of the present invention is shown.Different from the first and second preferred embodiments, the LED wafer 31 of this light emission unit 3 is installed on the wafer of this installation base plate 30 and installs on the surface 300 to cover crystal type (Flip Chip), and the surface of the industrial sapphire layer (sapphire) of this LED wafer 31 is formed with V shape groove 34, and it can promote light reflection efficient up to 2 times.
It should be noted, in the present embodiment, the lip-deep V shape groove 34 that is formed on the industrial sapphire layer of LED wafer 31 is asymmetrical V shape groove.
See also shown in Figure 4ly, the package of light source U4 of the 4th preferred embodiment of the present invention is shown.Different from the 3rd preferred embodiment, the surface of the industrial sapphire layer of the LED wafer 31 of this light emission unit 3 also is formed with symmetrical V shape groove 35 except asymmetrical V shape groove 34, and the wafer of installation base plate 30 installation surface 300 is vertical with the end surfaces of the sealed end of this reflector 2.
See also shown in Figure 5ly, the light emission unit of the package of light source of the 5th preferred embodiment of the present invention 3 is shown.In the present embodiment, except this LED wafer 31, this light emission unit 3 also comprises laser diode wafer 4.This laser diode wafer 4 also is mounted in the wafer of this installation base plate 30 and installs on the surface 300, and is connected in series or in parallel with this LED wafer 31.
In addition, in the present embodiment, be laid in fluorescence coating on the inner surface of this reflector and be doped with the fluorescent material that is fit to respectively this LED wafer 31 and the different wave length of this laser diode wafer 4, so that laser diode wafer 4 can be when LED wafer 31 once excites wherein a kind of suitable fluorescent material the another kind of suitable fluorescent material of secondary excitation, this can reach two sections energy rank and excite to promote brightness (seeing Fig. 6).Certainly, in aforesaid first to fourth preferred embodiment, this LED wafer can be replaced by laser diode wafer, and this can excite more the high energy rank to send more high brightness effect (seeing Fig. 7 and 8).
See also shown in Figure 9ly, the light emission unit of the package of light source of the 6th preferred embodiment of the present invention 3 is shown.Different from the 5th preferred embodiment, what this laser diode wafer 4 was installed on this installation base plate 30 installs on another relative surface of surface 300 with wafer.
It should be noted, although in Fig. 9 this LED wafer 31 and this laser diode wafer 4 shown being arranged on symmetrically on the different surfaces of this installation base plate 30, yet they can be arranged on the different surfaces of this installation base plate 30 asymmetrically.
See also shown in Figure 10ly, the package of light source U7 of the 7th preferred embodiment of the present invention is shown.Different from the first to six preferred embodiment, installation base plate is omitted in the present embodiment.These conductive connecting pins 32 are employed gold threads in general routing joint technology (wire bonding process), and are electrically connected to the conductive junction point 310 of the correspondence of this LED wafer 31.Coated by transparent adhesive tape 36 in the junction of these conductive connecting pins 32 with these conductive junction points 310, this can strengthen the connection of these conductive connecting pins 32 and corresponding conductive junction point 310.
See also shown in Figure 11ly, the light emission unit of the package of light source of the 8th preferred embodiment of the present invention 3 is shown.Different from the 5th preferred embodiment, the conductive junction point 310,40 of wafer 31,4 in the present embodiment is arranged on the side of wafer 31,4.
It should be noted, although in the 5th and the 8th preferred embodiment take LED wafer 31 and laser diode wafer 4 as example, yet the present invention is not limited to this, and it can all adopt LED wafer 31 or all adopt laser diode wafer 4.
See also shown in Figure 12ly, the light emission unit of the package of light source of the 9th preferred embodiment of the present invention 3 is shown.Different from the 8th preferred embodiment, the present embodiment comprise four wafers 31,4 and these wafers 31,4 with " ten " word shape arranges the wafer that is installed in this installation base plate 30 and installs on the surface 300.
See also shown in Figure 13ly, the light emission unit of the package of light source of the tenth preferred embodiment of the present invention 3 is shown.Different from the 8th preferred embodiment, the present embodiment comprise eight wafers 31,4 and these wafers 31,4 with " rice " word shape arranges the wafer that is installed in this installation base plate 30 and installs on the surface 300.
See also shown in Figure 14ly, the package of light source U11 of the 11 preferred embodiment of the present invention is shown.Different from the first preferred embodiment, the package of light source U11 of the present embodiment also comprises the heat abstractor of the outer wall surface that is attached to this carrier 1.This heat abstractor comprises pedestal 80 and a plurality of fin 81 that is formed on this pedestal 80 on the outer wall surface that is installed on this carrier 1.
See also shown in Figure 32ly, the package of light source U12 of the 12 preferred embodiment of the present invention is shown.Different from the 11 preferred embodiment, the heat abstractor of the package of light source U12 of the present embodiment comprises one group of heat pipe 82, pedestal 80 and a plurality of fin 81 that is formed on this pedestal 80.
Each heat pipe in this group heat pipe 82 has near the first end the LED wafer 31 that protrudes out this light emission unit 3 and is connected to the second end of this pedestal 80.Therefore, the heat energy that produces when LED wafer 31 running is enough derives from this package of light source is inner via this group heat pipe 82, and delivers to this pedestal 80, and it can dissipate via these radiating fins 81.
It should be noted, in aforesaid preferred embodiment, in the confined space of this package of light source U1 to U12, can be poured the non-conductive transparent heat-conducting liquid that is doped with fluorescent material, so that at this (a plurality of) wafer 31, the heat energy that produces during 4 running is enough to be conducted heat, arrives external metallization through the inner heat conduction of confined space by the circulation of non-conductive transparent heat-conducting liquid in this confined space, or through the confined space surface radiating.
It should be noted, in order to prevent the fluorescent material precipitation, prevent that precipitation reagent must be added into this non-conductive transparent heat-conducting liquid.
Perhaps, in aforesaid preferred embodiment, this light emission unit also comprises the phosphor powder layer (not shown) that can cover this (a plurality of) wafer on the installation surface that is formed at this installation base plate, and non-conductive pure water is poured in this confined space, conduct heat by the circulation of non-conductive pure water in this confined space so that the heat energy that produces when this (a plurality of) wafer running is enough, derive heat through heat pipe again.
In addition, in aforesaid preferred embodiment, this transparent installation base plate is installed lip-deep conductive junction point and circuit trace can be formed by the transparent conductive material such as tin indium oxide, indium zinc oxide etc. at wafer.
See also shown in Figure 20 and 21, the package of light source U13 of the 13 preferred embodiment of the present invention is shown.In the present embodiment, this package of light source U13 comprises the first transparency carrier 90.This first transparency carrier 90 has wafer surface 900 and a plurality of conductive junction point 901 that is formed on this wafer installation surface 900 is installed.
The second transparency carrier 91 relatively arranges with this first transparency carrier 90, and links together via clear, viscous material 910, so that be formed with accommodation space between them.It is outside that the light that this accommodation space can send wafer six faces of putting in the inner exports to this space fully.
Heat abstractor comprises one group of heat pipe or metal bar 82, cooling base 80 and a plurality of radiating fin 81 that is installed on this cooling base 80.Each heat pipe 82 in this group heat pipe 82 has the first end that protrudes out this accommodation space inside and is connected to the second end of this cooling base 80, like this, the heat energy that produces when wafer 31 running is enough derived from this accommodation space inside via this group heat pipe 82 and is delivered to this cooling base 80, and it can dissipate via these radiating fins 81.
It should be noted, can be poured the non-conductive transparent heat-conducting liquid that is doped with fluorescent material in the accommodation space, conduct heat, arrive external metallization through the inner heat conduction of confined space by the circulation of non-conductive transparent heat-conducting liquid in this confined space so that the heat energy that produces when this (a plurality of) wafer running is enough, or through the confined space surface radiating.
In addition, in aforesaid preferred embodiment, this transparent installation base plate is installed lip-deep conductive junction point and circuit trace can be formed by the transparent conductive material such as tin indium oxide, indium zinc oxide etc. at wafer.
In addition, the outer surface at this first and second transparency carrier also can be formed with phosphor powder layer 902,911.
See also shown in Figure 22 and 23, the package of light source U14 of the 14 preferred embodiment of the present invention is shown.Different from the 13 preferred embodiment, on this first transparency carrier 90, do not form conductive junction point and this light emission unit 3 also comprises transparent installation base plate 30.This installation base plate 30 has wafer surface 300 and a plurality of conductive junction point 301 that is installed on that this wafer is installed on the surface 300 and is electrically connected with the corresponding conductive junction point 310 of these wafers 31 is installed.
See also shown in Figure 24 and 25, the package of light source U15 of the 15 preferred embodiment of the present invention is shown.Different from the 14 preferred embodiment, this first transparency carrier 90 is longer than this second transparency carrier 91.This light emission unit 3 also comprises the interchange away from the end portion of this second transparency carrier 91 that places this first transparency carrier 90 and turns DC circuit 37 and be sheathed on metal connector 38 on the end portion of this first transparency carrier 90 that this circuit 37 is installed.This interchange turns DC circuit 37 and has the output that is electrically connected with corresponding conductive connecting pin 32.
This metal connector 38 is for being used for bulb is fixed in the metal connector on the AC power supplies socket at known bulb, and has and exchange the electrode that the input that turns DC circuit 37 is electrically connected with this.
In the present embodiment, cooling base and radiating fin are omitted, and second end that protrudes out in this accommodation space outside of heat pipe 82 is connected to this metal connector 38.
Therefore, the present embodiment can replace present bulb.
Figure 26 and 27 shows the package of light source U16 of the 16 preferred embodiment of the present invention.Different from the 13 preferred embodiment, the present embodiment also comprises the transparent tube body 92 that is sheathed on this first and second transparency carrier 90 and 91 outsides.This comes to be electrically connected with corresponding conductive junction point 301 via the circuit trace on the installation surface 300 of this installation base plate 30 to heat pipe 82, and the first end portion of each heat pipe 82 extends to this body 92 outsides from an end of this body 92, it can further extend to the mounting receptacle of known fluorescent tube, and the second end portion of each heat pipe 82 is electrically connected with the output that turns DC circuit 37 exchanging of these body 92 inside.The input that this interchange turns DC circuit 37 is connected to a pair of electrode 370 that is suitable for protruding out to the mounting receptacle of known fluorescent tube.Therefore, the package of light source U16 of the present embodiment can replace known fluorescent tube.
Should be noted that this body 92 can be laid with light reflection layer (not shown) on suitable inner surface.
Figure 28 and 29 shows the package of light source U17 of the 17 preferred embodiment of the present invention.Different from the 13 preferred embodiment, the conductive junction point 310 of the wafer 31 of the light emission unit of the present embodiment is electrically connected to corresponding heat pipe 82 via wire 33.The output that the interchange of this light emission unit 3 turns DC circuit 37 is electrically connected to corresponding heat pipe 82, and input is electrically connected to AC power.
It should be noted, this is formed with light reflection inclined-plane 820 to heat pipe 82 on the surface towards the transparency carrier that wafer 31 is installed, and it can strengthen the derivation of the light that emitted by wafer 31.
Figure 30 and 31 shows the package of light source U18 of the 18 preferred embodiment of the present invention.Different from the 17 preferred embodiment, the conductive junction point 310 of the wafer 31 of the light emission unit of the present embodiment is electrically connected to the first electrode trace and second electrode trace of circuit board via wire 33.This circuit board also has interchange and turns DC circuit.The output that this interchange turns DC circuit is electrically connected to this first and second electrode trace, and its input is electrically connected to AC power supplies.The package of light source U18 of the present embodiment also has heat abstractor.This heat abstractor comprises heat pipe 82, the cooling base 80 that is connected with this heat pipe 82 and is installed on radiating fin 81 on this cooling base 80.
It should be noted, identical with the 17 preferred embodiment, this circuit board also is formed with light reflection inclined-plane 820, and it can strengthen the derivation of the light that emitted by wafer 31.
In order to promote the brightness of package of light source of the present invention, the interchange of package of light source of the present invention turns DC circuit can also comprise the control circuit zone.As shown in Figure 33, this control circuit zone comprises transistor T and pierce circuit OSC at least.
This transistor T has the emitter that is connected to this interchange and turns one of them output in DC circuit zone, be connected to this interchange turn another output in DC circuit zone and this wafer 31,4 one of them electrode collector electrode and be connected to the base stage of the output of this pierce circuit OSC.
This pierce circuit OSC also is connected to another electrode of this wafer 31,4.
The effect of this control circuit is the conducting and not conducting by pierce circuit OSC control transistor T, this wafer 31,4 become by the pulsed drive current signal and drive, so that when the output signal at the output of this pierce circuit OSC is in high level, this transistor T conducting, this wafer 31, therefore 4 are lit, and when the output signal at the output of this pierce circuit OSC is in low level, this not conducting of transistor T, therefore this wafer 31,4 is not lit.
Like this, by increasing the current value of this driving current signal, the instantaneous power of this wafer 31,4 is promoted, and then brightness is promoted.On the other hand, the output signal of the output by adjusting this pierce circuit OSC is in the duration of high level within the unit interval, and the consumed power within this unit interval can remain unchanged.
It should be noted, the principle and the effect that promote brightness in mode so at length disclosed in the present application people's No. 200510052766.5 patent application case already.
In sum, package of light source of the present invention really can pass through above-mentioned disclosed structure, device, reaches purpose and the effect of expection, and does not see also unexposed use of publication before the application, meets the important documents such as novelty, creativeness of patent of invention.
In addition, above-mentioned appended diagram and explanation only are embodiments of the invention, are not in order to limit embodiments of the invention; Those skilled in the art are according to feature category of the present invention, and other equivalences of doing change or revise, and all should be included in the scope that following claim defines.
Claims (13)
1. package of light source comprises:
The clear hollow carrier, this transparent carrier has accommodation space;
Place the interior reflector of described accommodation space of this transparent carrier, this reflector is the diameter tubaeform cup-shaped thing larger than the diameter of sealing end with sealed end and open end and this open end, the inner wall surface of this reflector is laid with light reflection layer or phosphor powder layer, so that leaded light efficient is promoted, the end wall of the described sealed end of this reflector is formed with a plurality of through holes;
Place near the light emission unit the open end of this reflector, this light emission unit comprises and has wafer and the surface is installed and two or morely is formed at the transparent installation base plates that this installs lip-deep conductive junction point, be installed on the installation surface of this transparent installation base plate and have the LED wafer of the conductive junction point that a plurality of and the corresponding conductive junction point of this transparent installation base plate be electrically connected, reach a plurality of respectively the have first end that is electrically connected with the corresponding conductive junction point of this transparent installation base plate and the end wall of the sealed end that passes this reflector and the formation walls of this transparent carrier, the outside that protrudes out the second end of this transparent carrier outside connects conductive connecting pin; And
Be arranged at the transparent cover body that can jointly form with this transparent carrier confined space on this transparent carrier,
Hot-air is via the opposite side of these a plurality of through holes from a side flow of the end wall of the sealed end of this reflector to the end wall of the sealed end of this reflector.
2. package of light source as claimed in claim 1, wherein, it is vertical with the end wall of the sealed end of this reflector that the wafer of this transparency carrier is installed the surface, 90 degree, perhaps parallel, 180 spend.
3. package of light source as claimed in claim 1 also comprises heat abstractor, and this heat abstractor comprises cooling base and a plurality of radiating fin that is formed on this cooling base on the outer wall surface that is installed on this transparent carrier.
4. package of light source as claimed in claim 1, also comprise heat abstractor, this heat abstractor comprises one group of heat pipe or metal bar, cooling base and a plurality of radiating fin that is installed on this cooling base, each heat pipe in this group heat pipe or the metal bar or metal bar have the first end that protrudes out this transparent carrier inside and the second end that is connected to this cooling base, therefore, the heat energy that produces when LED wafer operates is enough derives from this transparent carrier is inner via this group heat pipe or metal bar, and deliver to this cooling base, it can dissipate through described a plurality of radiating fins.
5. package of light source as claimed in claim 1, wherein, this transparent installation base plate is installed lip-deep conductive junction point and circuit trace is formed by the transparent conductive material such as tin indium oxide, indium zinc oxide etc. at wafer.
6. package of light source as claimed in claim 1, wherein, this transparent carrier and this transparent cover body form hollow sphere jointly.
7. package of light source as claimed in claim 1, wherein, this transparent carrier and this transparent cover body form hollow tube jointly.
8. package of light source as claimed in claim 1, wherein, this light emission unit also comprises at least another LED wafer and/or laser diode wafer, these LED wafer with " one " font, " ten " font or " rice " the font wafer that is arranged in this transparent installation base plate installs on the surface.
9. package of light source as claimed in claim 8, wherein, these LED wafer and/or laser diode wafer can comprise red light emitting diodes wafer and/or laser diode wafer, green LED wafer and/or laser diode wafer, blue LED wafer and/or laser diode wafer, and are connected to each other with series connection and/or mode in parallel.
10. package of light source as claimed in claim 9, wherein, this phosphor powder layer is the fluorescent material that is doped with different wave length, so that laser diode wafer can be when LED wafer once excites wherein a kind of suitable fluorescent material the another kind of suitable fluorescent material of secondary excitation, can reach like this two sections energy rank and excite to promote brightness, or single excite more the high energy rank to send more high brightness effect by laser diode wafer.
11. package of light source as claimed in claim 10, wherein, it is 400 to 470nm, 500 to 560nm, 600 to 620nm that the fluorescent material of described these different colours comprises wavelength, reach 250 to 380nm fluorescent material.
12. a package of light source comprises:
The clear hollow carrier, this transparent carrier has accommodation space;
Place the interior reflector of accommodation space of this transparent carrier, this reflector is the diameter tubaeform cup-shaped thing larger than the diameter of sealing end with sealed end and open end and this open end, the inner wall surface of this reflector is laid with light reflection layer or phosphor powder layer, so that leaded light efficient is promoted, the end wall of the sealed end of this reflector is formed with a plurality of through holes;
Place near the light emission unit the open end of this reflector, the formation wall that this light emission unit comprises LED wafer with a plurality of conductive junction points and a plurality of end walls that respectively have the first end that is electrically connected with the corresponding conductive junction point of this LED wafer and a sealed end that is connected this reflector and this transparent carrier protrudes out the outside connection conductive connecting pin of the second end of this transparent carrier outside; And
Be arranged at the transparent cover body that can jointly form with this transparent carrier confined space on this transparent carrier,
Hot-air is via the opposite side of these a plurality of through holes from a side flow of the end wall of the sealed end of this reflector to the end wall of the sealed end of this reflector.
13. package of light source as claimed in claim 12, wherein, the longitudinal axis of this LED wafer is vertical with the end wall of the sealed end of this reflector, 90 the degree, perhaps parallel, 180 the degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100044207A CN101232061B (en) | 2007-01-22 | 2007-01-22 | Luminous source packaging |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100044207A CN101232061B (en) | 2007-01-22 | 2007-01-22 | Luminous source packaging |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910221752XA Division CN101764188B (en) | 2007-01-22 | 2007-01-22 | Luminous source encapsulation |
| CN200910221751A Division CN101742776A (en) | 2007-01-22 | 2007-01-22 | Package of light source |
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| Publication Number | Publication Date |
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| CN101232061A CN101232061A (en) | 2008-07-30 |
| CN101232061B true CN101232061B (en) | 2013-04-03 |
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| CN2007100044207A Expired - Fee Related CN101232061B (en) | 2007-01-22 | 2007-01-22 | Luminous source packaging |
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| US9115868B2 (en) | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
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| US8390193B2 (en) * | 2008-12-31 | 2013-03-05 | Intematix Corporation | Light emitting device with phosphor wavelength conversion |
| CN101858503B (en) * | 2009-04-10 | 2012-06-27 | 富士迈半导体精密工业（上海）有限公司 | Solid-state light source assembling device and method |
| US8192051B2 (en) | 2010-11-01 | 2012-06-05 | Quarkstar Llc | Bidirectional LED light sheet |
| JP5733743B2 (en) * | 2010-12-15 | 2015-06-10 | 日東電工株式会社 | Optical semiconductor device |
| US8410726B2 (en) | 2011-02-22 | 2013-04-02 | Quarkstar Llc | Solid state lamp using modular light emitting elements |
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| CN102347292A (en) * | 2011-09-30 | 2012-02-08 | 常熟市广大电器有限公司 | Novel chip packaging structure |
| TW201320412A (en) * | 2011-11-14 | 2013-05-16 | Evergreen Optronics Inc | Light emitting diode package |
| CN102723443A (en) * | 2012-01-18 | 2012-10-10 | 许并社 | Dorsal-direction-type white light emitting diode |
| CN103325927A (en) * | 2013-07-05 | 2013-09-25 | 江苏华英光宝科技股份有限公司 | LED (light-emitting diode) support emitting light at 360 degrees, LED lamp post with support, and preparation method of support |
| CN103996664B (en) * | 2014-05-30 | 2016-08-24 | 佐志温控技术（上海）有限公司 | A kind of liquid forced cooling device of counnter attack diode |
| CN204407360U (en) * | 2015-02-14 | 2015-06-17 | 吴鼎鼎 | A kind of long-life LED luminescence unit and long-life LED |
| CN104976539B (en) * | 2015-07-22 | 2018-03-27 | 深圳市中孚能电气设备有限公司 | Metal is fitted together to forward type refractive apparatus and light source |
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| CN101232061A (en) | 2008-07-30 |
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