CN204240090U - For providing the LED light device of directional beam - Google Patents
For providing the LED light device of directional beam Download PDFInfo
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- CN204240090U CN204240090U CN201420356261.2U CN201420356261U CN204240090U CN 204240090 U CN204240090 U CN 204240090U CN 201420356261 U CN201420356261 U CN 201420356261U CN 204240090 U CN204240090 U CN 204240090U
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Abstract
The utility model relates to semiconductor illumination technique, particularly for providing light emitting diode (LED) lighting device of directional beam.According to the utility model embodiment for providing the LED light device of directional beam to comprise: funnelform glass lamp cup, it has smooth inner surface; Lamp holder, it attaches to the bottom of described glass lamp cup; The metal heat sink of plate-like, it is arranged in described glass lamp cup and the inner surface of outer surface and described glass lamp cup fits tightly; LED light module, it is arranged at the bottom of described metal heat sink; The LED drive power module be electrically connected with described LED light module, it to be arranged in the inner chamber limited by described glass lamp cup and lamp holder and to be positioned at the below of described metal heat sink; And optical unit, its be arranged at described glass lamp cup opening part and in the face of described LED light module, the directional beam being required form with the light conversion that described LED light module is sent.
Description
Technical field
The utility model relates to semiconductor illumination technique, particularly for providing light emitting diode (LED) lighting device of directional beam.
Background technology
LED, as a kind of novel green light source product, has the features such as energy-saving and environmental protection, the life-span is long, volume is little, can be widely used in the fields such as various instruction, display, decoration, backlight, general lighting and urban landscape.
LED is a kind of solid-state semiconductor device, the support that its basic structure generally comprises band lead-in wire, the encapsulating material (such as fluorescence silica gel or epoxy resin) being arranged on the semiconductor wafer on support and this wafer surrounding being sealed.Above-mentioned semiconductor wafer includes P-N junction structure, and when an electric current passes through it, electronics is pushed to P district, and in P district, electronics is with hole-recombination, then sends energy with the form of photon, and the wavelength of light is then determined by the material forming P-N junction structure.
Such as the lighting device of the generation directional beam of shot-light (being also called multiaspect reflection Lamp cup (MR) lamp) and handkerchief lamp (being also called dishes shape aluminium reflection (PAR) lamp) and so on is widely used in market, KTV, show window merchandise display and house decoration at present, in this kind of lighting device, therefore adopt LED to have good commercial promise as light source.But be subject to the restriction of technical development, LED still has quite a few electric energy to be converted into heat energy in the course of the work.When heat energy is trapped in lamp interior, will unavoidably causes LED temperature to raise, thus cause light source performance degradation and inefficacy.In MR lamp and PAR lamp, because heat density is higher, so the problem how efficiently heat that LED produces being dispersed into lighting device outside seems particularly outstanding.
Current industry proposed multiple using LED as the MR lamp of light source and PAR lamp.The U.S. Patent No. 6,787,999 of the people such as such as Tomislav J.Stimac discloses a kind of LED-based Assembled lamp, its as a reference, the mode quoted in full comprises in this manual.The LED-based Assembled lamp that this United States Patent (USP) discloses comprises optical module and electronic module, wherein, optical module comprises multiple setting LED on a printed circuit and radiator (heat sink), and the printed circuit board (PCB) being provided with LED is bonded to the surface of radiator; Electronic module is suitable for powering to LED, and its one end is connected with radiator, and the other end arranges electric connector to receive external electric energy.
It is pointed out that the LED light device of existing generation directional beam is structurally comparatively complicated, and limit by heat-sinking capability, be difficult in high-power lower work.
Utility model content
The purpose of this utility model is to provide a kind of LED light device providing directional beam, and it has the advantages such as the simple and heat-sinking capability of structure is strong.
According to the utility model embodiment for providing the LED light device of directional beam to comprise:
Funnelform glass lamp cup, it has smooth inner surface;
Lamp holder, it attaches to the bottom of described glass lamp cup;
The metal heat sink of plate-like, it is arranged in described glass lamp cup and the inner surface of outer surface and described glass lamp cup fits tightly;
LED light module, it is arranged at the bottom of described metal heat sink;
The LED drive power module be electrically connected with described LED light module, it to be arranged in the inner chamber limited by described glass lamp cup and lamp holder and to be positioned at the below of described metal heat sink; And
Optical unit, its be arranged at described glass lamp cup opening part and in the face of described LED light module, the directional beam being required form with the light conversion that described LED light module is sent.
Preferably, above-mentioned for providing in the LED light device of directional beam, described glass lamp cup and lamp holder adopt Lamp cup and the lamp holder of halogen spot light respectively.
Preferably, above-mentioned for providing in the LED light device of directional beam, the shell constructed from glass material of described lamp holder is made and one-body molded with described glass lamp cup.
Preferably, above-mentioned for providing in the LED light device of directional beam, by making the bottom of described metal heat sink and top state the bottom of glass lamp cup and described optical unit respectively against residence, described metal heat sink is limited in described glass lamp cup.
Preferably, above-mentioned for providing in the LED light device of directional beam, described metal heat sink is made of aluminum and it is formed with nickeliferous metal level on the surface, and the inner surface of described glass lamp cup is formed with the metal level containing aluminium.
Preferably, above-mentioned for providing in the LED light device of directional beam, described LED light module comprises:
Metal support plate, it comprises disconnected first pattern area and the second pattern area mutually, wherein, described first pattern area and described LED drive module are electrically connected, and described second pattern area is between described first pattern area and be fixed on the bottom of described metal heat sink;
One or more LED die being arranged on described second pattern area, it comprises the electrode being formed at top, and described LED die is electrically connected by pin interconnection with described first pattern area; And
The framework be made up of insulating materials, itself and described first and second pattern area are fixed together.
Preferably, for providing in the LED light device of directional beam, the bottom of described metal heat sink is formed with through hole above-mentioned, and described first pattern area comprises and is positioned at the inside of described through hole or the part of top to realize the electrical connection with described LED light module.
Preferably, above-mentioned for providing in the LED light device of directional beam, described metal heat sink is made of aluminum and it is formed with nickeliferous metal level on the surface, the inner surface of described glass lamp cup is formed with the metal level containing aluminium, described first and second pattern area are made of copper, and the back side of described second pattern area is formed with the metal level of argentiferous to realize by welding the bottom that described metal heat sink is fixed in described second pattern area.
Preferably, above-mentioned for providing in the LED light device of directional beam, described optical unit is bowl body shape, comprise sidewall and convex body, described sidewall narrows from top lower portion and connects with the described convex body formed bottom bowl body, at least one in the upper surface of described convex body and lower surface is convex surface, and at least one in described upper surface and lower surface forms multiple projection or pit.
Preferably, above-mentioned for providing in the LED light device of directional beam, described sidewall from the joint of itself and described convex body to downward-extension, thus limits a cavity to hold described LED light module jointly with described convex body.
Preferably, above-mentioned for providing in the LED light device of directional beam, comprise the metallic reflector on the outer surface covering described sidewall.
Preferably, above-mentioned for providing in the LED light device of directional beam, described multiple projection be fish scale-shaped be formed on described upper surface and/or lower surface.
Preferably, for providing in the LED light device of directional beam, described lens element is infundibulate above-mentioned, offers cavity to hold described LED light module bottom it.
Preferably, above-mentioned for providing in the LED light device of directional beam, the outer surface of described lens element is formed with metallic reflector.
Accompanying drawing explanation
Description by the various aspects below in conjunction with accompanying drawing is become more clear and is easier to understand by above-mentioned and/or other side of the present utility model and advantage, and in accompanying drawing, same or analogous unit adopts identical label to represent, accompanying drawing comprises:
Fig. 1 is the decomposing schematic representation of the light emitting diode illuminating apparatus for providing directional beam according to the utility model embodiment.
Fig. 2 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 1.
Fig. 3 is a kind of schematic diagram of the LED light module for Fig. 1 and 2 illustrated embodiment.
The schematic diagram of optical unit of Fig. 4 for adopting in Fig. 1 and 2 illustrated embodiment.
Fig. 5 shows the polycrystalline substance of optical unit shown in Fig. 4.
Detailed description of the invention
More all sidedly the utility model is described referring to the accompanying drawing which illustrates the utility model illustrative examples.But the utility model can realize by multi-form, and should not be read as each embodiment being only limitted to provide herein.The various embodiments described above provided are intended to make disclosure herein comprehensively complete, so that protection domain of the present utility model is conveyed to those skilled in the art more all sidedly.
In this manual, unless stated otherwise, term " semiconductor crystal wafer " refers at the upper multiple independently single circuit formed of semi-conducting material (such as silicon, GaAs etc.), " semiconductor wafer " or " wafer (die) " refers to this single circuit, and " packaged chip " refers to the physical arrangement of semiconductor wafer after encapsulation, in typical this physical arrangement, semiconductor wafer to be such as installed on support and to encapsulate with encapsulant.
Term " light emitting diode " refers to the unit comprising electroluminescent material, and the example of this unit includes but not limited to P-N junction inorganic semiconductor light emitting diode and Organic Light Emitting Diode (OLED and polymer LED (PLED)).
P-N junction inorganic semiconductor light emitting diode can have different version, such as, include but not limited to LED core and light emitting diode monomer.Wherein, " LED core " refers to semiconductor wafer that include P-N junction structure, that have electroluminescent ability, and " light emitting diode monomer " refers to the physical arrangement will formed after die package, in typical this physical arrangement, tube core to be such as installed on support and to encapsulate with encapsulant.
Term " wiring ", " wiring pattern " and " wiring layer " refer to the conductive pattern for being electrically connected between components and parts arranged on insulating surface, include but not limited to cabling (trace) and hole (as pad, component hole, fastener hole and plated through-hole etc.).
" electrical connection " should be understood to be included in the situation directly transmitting electric flux or the signal of telecommunication between two unit, or indirectly transmits the situation of electric flux or the signal of telecommunication through one or more Unit the 3rd.
" driving power " or " LED drive power " refer to the interchange (AC) or direct current (DC) power supply that are connected to lighting device outside and as light source light emitting diode between " electronic-controlled installation ", for providing required curtage (such as constant current, constant voltage or firm power etc.) for light emitting diode.In particular embodiments, driving power can modular structure realize, such as it comprises printed circuit board (PCB) and one or more installation also passes through the components and parts be electrically connected together that connect up on a printed circuit, and the example of these components and parts includes but not limited to LED driving governor chip, rectification chip, resistor, capacitor, inductor and transformer etc.
Such as " comprise " and the term of " comprising " and so on represents except having the unit and step that have in the specification and in the claims directly and clearly state, the technical solution of the utility model does not get rid of the situation had not by other unit of directly or clearly stating and step yet.
The such as term of " first " and " second " and so on does not represent the order of unit in time, space, size etc. and is only be used as to distinguish each unit.
Such as the term of " object A is arranged on the surface of object B " and so on should be broadly interpreted as surface object A being directly placed on object B, or object A is placed on the surface having other object contacted with object B.
By accompanying drawing, embodiment of the present utility model is described below.
Fig. 1 is the decomposing schematic representation of light emitting diode (LED) lighting device for providing directional beam according to the utility model embodiment.Fig. 2 is the generalized section of light emitting diode illuminating apparatus shown in Fig. 1.
According to the embodiment shown in Fig. 1 and 2, the LED light device 1 of directional beam is provided to comprise glass lamp cup 10, lamp holder 20, metal heat sink 30, LED light module 40, LED drive power module 50 and optical unit 60.Below above-mentioned unit is further described.
Glass lamp cup 10 is in funnel-form, but this is non-essential.Glass lamp cup 10 also can adopt other shape, such as tubular and prismatic etc.In the present embodiment, the heat that LED drive power module 30 and LED light module 40 produce is passed to glass lamp cup 10 with heat exchange pattern, and is dispersed in environment through glass lamp cup.Because glass has higher transmissivity for infra-red radiation, therefore heat can also thermal-radiating mode distribute through Lamp cup.Rise and fall although glass lamp cup 10 inner surface is height as shown in Figure 1, it also can be smooth or level and smooth surface.
Lamp holder 20 is attached at the bottom of glass lamp cup 10, and it comprises shell 210 and draws pair of metal pin 221,222 from outer casing bottom.Lamp holder 20 provides the electric interfaces between external power source and LED drive power module 30.In the present embodiment, the shell 210 of lamp holder adopts ceramic material, but alternatively, it also can adopt glass material to make to realize the one-body molded of glass lamp cup 10 and shell 210.In addition, preferably, in the present embodiment, Lamp cup 10 and lamp holder 20 directly can adopt Lamp cup and the lamp holder of existing halogen spot light.
It is to be noted, in the present embodiment, although what lamp holder 20 adopted as illustrated in fig. 1 and 2 is the interface being similar to GU10 form, other interface shape is equally applicable to the utility model, and they include but not limited to screw socket, contact pin type lamp holder and terminal connections etc.
See Fig. 1 and 2, metal heat sink 30 is in plate-like, and it is arranged in the inner chamber of glass lamp cup 10.By making the bottom of metal heat sink 30 and top respectively against bottom and the optical unit 60 of living glass lamp cup 10, even if therefore not by adhesive, the position of metal heat sink 30 in glass lamp cup 10 is also fixed.Metal heat sink 30 such as can adopt the metal material of aluminium and so on to make.
In the present embodiment, as shown in Figure 2, the external surface shape of metal heat sink 30 is mated with the inner surface configuration of Lamp cup 10, together with therefore the outer surface of metal heat sink fits tightly with the inner surface of glass lamp cup, thus eliminate or reduce space therebetween, significantly improve capacity of heat transmission.In addition, in order to improve thermal conduction effect further, the nickeliferous metal level of one deck (such as passing through electroplating technology) can be formed on the surface of metal heat sink 30 made of aluminum, and on the inner surface of Lamp cup 10, form the metal level (such as by evaporation of aluminum technique) of one deck containing aluminium, thus reduce the thermal resistance between Lamp cup 10 and metal heat sink 30.
In the present embodiment, the bottom of metal heat sink 30 also offers through hole 311 and 312 to provide the electrical connection passage of LED drive power module 50 with LED light module 40, below will be further described.
As illustrated in fig. 1 and 2, LED light module 40 is arranged on metal heat sink 30 inside (bottom of such as metal heat sink).The structure of LED light module 40 is described below in detail by Fig. 3.
As shown in Figure 3, LED light module 40 comprises multiple LED die 410, metal support plate 420 and framework 430.
Metal support plate 420 is made up of the metal (such as copper) that heat conductivility is excellent.Comprise first pattern area 421A, 421B and the second pattern area 422 between first pattern area 421A, 421B.The P-type electrode of LED die 410 and N-type electrode are all arranged on the upper surface of tube core, and its lower surface is such as fixed in the second pattern area 422 by eutectic solder technology.Due to the heat conductivility that metal is good, the thermal resistance between LED die 410 and the second pattern area 422 is close to zero, and the heat that therefore the former produces can pass to the metal heat sink 30 below LED light module 40 efficiently.Framework 430 is made up of insulating materials, and it is such as fixed together by noting pressure or Shooting Technique and metal support plate 420, and LED die 410 is surrounded wherein.Because the first and second pattern area are all fixed on framework 430, therefore their relative position relation is fixed.
As shown in Figure 3, first pattern area 421A, 421B is not all communicated with each other and with the second pattern area 422, and each of first pattern area 421A, 421B comprises the electrode that extends to framework 430 outside or input pin 421A' and 421B' using as LED die 410 and outside electric interfaces.
See Fig. 3, LED die 410 realizes the interconnection between them and the connection with first pattern area 421A, 421B by lead-in wire 440, and lead-in wire such as can be made up of gold, copper, aluminium or alloy material.In the present embodiment, LED die 410 is connected between first pattern area 421A, 421B in a series arrangement.It is pointed out that other type of attachment that also can adopt such as series, parallel or crossed array and so between LED die.Moreover the embodiment shown in Fig. 3 for multiple LED die, but adopts single led tube core to be also feasible as light-emitting component.
In order to avoid LED die 410 and lead-in wire 440 are directly exposed in air, transparent silica gel can be injected they to be encapsulated in framework 430.As shown in Figure 3, due to the setting of framework 430, the flowing of silica gel is restricted and is only distributed in around LED die.
Alternatively, change by surrounding LED die with the silica gel of mixed fluorescent powder (such as yttrium-aluminium-garnet (YAG) fluorescent material, Nitride phosphor, silicate fluorescent powder and sulphide fluorescent material etc.) or applying fluorescent material and silica gel on the surface of LED die successively the color that light source assembly emits beam.Alternatively, the coating of fluorescent material and transparent silica gel can separate execution, that is, first in each LED die 410, cover fluorescent material and then inject transparent silica gel in framework 430.
It is pointed out that first pattern area 421A, 421B due to metal support plate 420 comprises electrode or input pin, therefore the first pattern area all should with metal heat sink 30 electric insulation.Input pin 421A', 421B' such as can be made to lay respectively within through hole 311 and 312 or top for this reason, the remainder of the first pattern area is then set to the lower surface of its lower surface higher than the second pattern area 422, or is set to be separated by by framework 430 between itself and metal heat sink 40.
LED light source module 40 and metal heat sink 30 can adopt following manner to combine: the metal level (such as passing through electroplating technology) first forming argentiferous at the lower surface of the second pattern area 422 of metal support plate 420, then by welding procedure, the bottom that surface is formed with the metal heat sink 30 containing nickel metal layer are fixed in the second pattern area 422.
In the present embodiment, the bottom of metal heat sink 30 is formed with through hole 311 and 312, the position of through hole is set to when the second pattern area 422 is fixed on the bottom of metal heat sink 30, and the input pin of LED light module 40 or electrode (input pin 421A' and 421B' in such as Fig. 3) lay respectively at inside or the top of through hole 311 and 312.
In the present embodiment, LED drive power module 50 adopts modular structure, and it comprises printed circuit board (PCB) and one or more installation also passes through the components and parts be electrically connected together that connect up on a printed circuit.
As shown in Figure 2, LED drive power module 50 to be arranged in the inner chamber limited by glass lamp cup 10 and lamp holder 20 and to be positioned at the below of metal heat sink 30, and it comprises a pair input lead 511,512 and a pair output lead 521,522.Input lead 511,512 inserts the inner chamber of the metal pins 221,222 of lamp holder 20, and this sets up on the one hand and is electrically connected between lamp holder 20 and LED drive power module 50, also makes the position of LED drive power module 50 be fixed on the other hand.Output lead 521 and 522 is each passed through the through hole 311 and 312 that metal heat sink 30 is offered and is also electrically connected with input pin 421A' and 421B' of the LED light module 40 be arranged on bottom metal heat sink 30 respectively.
Alternatively, thermal plastic insulation can be filled in the inner chamber limited by glass lamp cup 10 and lamp holder 20, it contributes to making the heat of LED drive power module 50 be passed to glass lamp cup 10 on the one hand, also makes the position of LED drive power module 50 more firm on the other hand.
According to the mode of externally fed, LED drive power module 50 can adopt the circuit of various topological structure, such as, include but not limited to non-isolated voltage-dropping type topological circuit structure, reverse exciting topological circuit structure and half-bridge LLC topological circuit structure etc.Drive circuit multiple type of drive modes such as () such as constant voltage are powered, constant current-supplying and constant pressure and flow are powered can provide suitable curtage to LED light module 40.About the detailed description of driving power circuit can see " LED illumination driving power and Design of Luminaires " book of the 1st edition in People's Telecon Publishing House's May in 2011, this publication in full way of reference comprises in this manual.
The schematic diagram of optical unit of Fig. 4 for adopting in Fig. 1 and 2 illustrated embodiment.Fig. 5 shows the polycrystalline substance of optical unit shown in Fig. 4.
See Figure 4 and 5, in the present embodiment, optical unit 60 is in bowl body shape, and the convex body 620 comprising sidewall 610 and form bottom bowl body, wherein, sidewall 610 narrows from the top down and its underpart connects with convex body 620.It is worthy of note, although sidewall 610 and convex body 620 are described as discrete parts here, the two can be considered as being the different piece of parts completely, that is, sidewall 610 and convex body 620 both can be discrete parts, also can be integrated.
As shown in Figure 5, in the present embodiment, preferably, flange 611 is formed in the upper end of sidewall 610.Correspondingly, the inner surface of the opening part of Lamp cup 10 is formed as the step 110 that flange 611 provides supporting.Thus, optical unit 60 can be arranged on the opening of Lamp cup 10.By adhesive (such as heat-conducting glue), flange 611 can be fixed on step 110.Optical unit 60 can be made up of the plastic material of glass or acrylic and so on.
Convex body 620 plays a part lens element.As shown in Figure 2, be arranged on the optical unit 60 of Lamp cup 10 opening part in the face of being positioned at the LED light module 40 at place bottom metal heat sink 30, the light that therefore LED light module 40 sends is transformed to the light beam with required form through the convergence effect of convex body 620.When forming projection or pit on the upper surface and/or lower surface of convex body, the light transmittance (such as light transmittance being improved 10%) of convex body effectively can be improved.For this reason, as shown in Figures 4 and 5, the upper surface 621 and lower surface 622 of convex body 620 are formed with the fish scale-shaped projection spreading all over whole surface.
Preferably, see Fig. 2 and 5, sidewall 610 continues to downward-extension in the joint with convex body 620, thus jointly limits a cavity 630 with convex body 620, and this cavity is suitable for holding LED light module 40.When LED light module is arranged in this cavity, the light sent through convex body 620 convergence effect and form the light beam with required form.Curved cavity makes LED light module can be closed in a space, and this is conducive to improving light extraction efficiency.The light that LED light module 60 sends is under the convergence effect of convex body 620, and major part is outwards launched, but some light will be gone out by sidewall 610 transmission and form light loss.In order to improve light extraction efficiency, preferably, metallic reflector can be formed at the outer surface of sidewall 610, therefore be reflected back again after light therethrough sidewall 610, make more light along desired direction outgoing thus.In addition, in order to form better reflecting effect, the inner surface of sidewall 610 can be level and smooth curved surface.
In the present embodiment, alternatively, can adjust by covering fluorescent material on the inner surface of cavity 630 color that LED light device emits beam.Compared with the aforementioned mode directly applying the silica gel of fluorescent material or mixed fluorescent powder in LED die, cover the fluorescent material of cavity inner surface owing to directly not contacting with LED die, therefore heating temperature decreases, thus can delay the aging of fluorescent material.
Although it is pointed out that shown in Figure 4 and 5 to be the layout simultaneously forming projection on two surfaces of convex body, it is also feasible for one of them in upper surface and lower surface being formed projection.In addition, in the present embodiment, can substitute with pit the light transmittance that projection improves convex body.Moreover, only form projection or pit also can obtain the effect improving light transmittance at the regional area of upper surface and/or lower surface.
It is also worth noting that, although the upper surface of the convex body 620 shown in Figure 4 and 5 and lower surface are all convex surfaces, this is not necessary.In other embodiments, one in the upper surface of convex body 620 and lower surface for convex surface be also feasible.
Although represented and discussed aspects more of the present utility model, but those skilled in the art it is appreciated that and can change in above-mentioned under the condition not deviating from the utility model principle and spirit, and therefore scope of the present utility model limited by claim and equivalent content.
Claims (10)
1. for providing a LED light device for directional beam, it is characterized in that, comprising:
Funnelform glass lamp cup, it has smooth inner surface;
Lamp holder, it attaches to the bottom of described glass lamp cup;
The metal heat sink of plate-like, it is arranged in described glass lamp cup and the inner surface of outer surface and described glass lamp cup fits tightly;
LED light module, it is arranged at the bottom of described metal heat sink;
The LED drive power module be electrically connected with described LED light module, it to be arranged in the inner chamber limited by described glass lamp cup and lamp holder and to be positioned at the below of described metal heat sink; And
Optical unit, its be arranged at described glass lamp cup opening part and in the face of described LED light module, the directional beam being required form with the light conversion that described LED light module is sent.
2. as claimed in claim 1 for providing the LED light device of directional beam, wherein, described glass lamp cup and lamp holder adopt Lamp cup and the lamp holder of halogen spot light respectively.
3. as claimed in claim 1 for providing the LED light device of directional beam, wherein, the shell constructed from glass material of described lamp holder is made and one-body molded with described glass lamp cup.
4. as claimed in claim 1 for providing the LED light device of directional beam, wherein, by making the bottom of described metal heat sink and top state the bottom of glass lamp cup and described optical unit respectively against residence, described metal heat sink is limited in described glass lamp cup.
5. as claimed in claim 1 for providing the LED light device of directional beam, wherein, described metal heat sink is formed with metal level on the surface, and the inner surface of described glass lamp cup is formed with metal level.
6. as claimed in claim 1 for providing the LED light device of directional beam, wherein, described LED light module comprises:
Metal support plate, it comprises disconnected first pattern area and the second pattern area mutually, wherein, described first pattern area and described LED drive module are electrically connected, and described second pattern area is between described first pattern area and be fixed on the bottom of described metal heat sink;
One or more LED die being arranged on described second pattern area, it comprises the electrode being formed at top, and described LED die is electrically connected by pin interconnection with described first pattern area; And
The framework be made up of insulating materials, itself and described first and second pattern area are fixed together.
7. as claimed in claim 6 for providing the LED light device of directional beam, wherein, the bottom of described metal heat sink is formed with through hole, and described first pattern area comprises and is positioned at the inside of described through hole or the part of top to realize the electrical connection with described LED light module.
8. as claimed in claim 6 for providing the LED light device of directional beam, wherein, described metal heat sink is formed with metal level on the surface, the inner surface of described glass lamp cup is formed with metal level, and the back side of described second pattern area is formed with metal level to realize by welding the bottom that described metal heat sink is fixed in described second pattern area.
9. as claimed in claim 1 for providing the LED light device of directional beam, wherein, described optical unit is bowl body shape, comprise sidewall and convex body, described sidewall narrows from top lower portion and connects with the described convex body formed bottom bowl body, at least one in the upper surface of described convex body and lower surface is convex surface, and at least one in described upper surface and lower surface forms multiple projection or pit.
10. as claimed in claim 9 for providing the LED light device of directional beam, wherein, described sidewall from the joint of itself and described convex body to downward-extension, thus limits a cavity to hold described LED light module jointly with described convex body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420356261.2U CN204240090U (en) | 2014-06-30 | 2014-06-30 | For providing the LED light device of directional beam |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420356261.2U CN204240090U (en) | 2014-06-30 | 2014-06-30 | For providing the LED light device of directional beam |
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| CN204240090U true CN204240090U (en) | 2015-04-01 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287496A (en) * | 2015-05-19 | 2017-01-04 | 赵依军 | LED light source component, LED photovoltaic integration module and LED spotlight |
| EP3447359A1 (en) * | 2017-08-24 | 2019-02-27 | Leedarson America Inc. | Spotlight apparatus and manufacturing method thereof |
-
2014
- 2014-06-30 CN CN201420356261.2U patent/CN204240090U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287496A (en) * | 2015-05-19 | 2017-01-04 | 赵依军 | LED light source component, LED photovoltaic integration module and LED spotlight |
| WO2016184372A3 (en) * | 2015-05-19 | 2017-02-02 | 赵依军 | Led light source assembly, led photoelectric integration module, and led spotlight |
| EP3447359A1 (en) * | 2017-08-24 | 2019-02-27 | Leedarson America Inc. | Spotlight apparatus and manufacturing method thereof |
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