CN101211758B - 基板处理装置 - Google Patents
基板处理装置 Download PDFInfo
- Publication number
- CN101211758B CN101211758B CN2007103081119A CN200710308111A CN101211758B CN 101211758 B CN101211758 B CN 101211758B CN 2007103081119 A CN2007103081119 A CN 2007103081119A CN 200710308111 A CN200710308111 A CN 200710308111A CN 101211758 B CN101211758 B CN 101211758B
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- 238000004140 cleaning Methods 0.000 claims abstract description 95
- 230000002093 peripheral effect Effects 0.000 claims description 24
- 101100076305 Arabidopsis thaliana MDIS2 gene Proteins 0.000 description 41
- 101100131280 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) MRH1 gene Proteins 0.000 description 41
- 101100510220 Arabidopsis thaliana KINUC gene Proteins 0.000 description 31
- 239000003344 environmental pollutant Substances 0.000 description 13
- 231100000719 pollutant Toxicity 0.000 description 13
- 102100030373 HSPB1-associated protein 1 Human genes 0.000 description 12
- 101000843045 Homo sapiens HSPB1-associated protein 1 Proteins 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 210000000078 claw Anatomy 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000011010 flushing procedure Methods 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
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- 230000033001 locomotion Effects 0.000 description 1
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- 235000014347 soups Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006351997A JP4744425B2 (ja) | 2006-12-27 | 2006-12-27 | 基板処理装置 |
JP2006351997 | 2006-12-27 | ||
JP2006-351997 | 2006-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101211758A CN101211758A (zh) | 2008-07-02 |
CN101211758B true CN101211758B (zh) | 2010-06-16 |
Family
ID=39582208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007103081119A Active CN101211758B (zh) | 2006-12-27 | 2007-12-27 | 基板处理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080156361A1 (zh) |
JP (1) | JP4744425B2 (zh) |
KR (1) | KR100957912B1 (zh) |
CN (1) | CN101211758B (zh) |
TW (1) | TWI376766B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100195083A1 (en) * | 2009-02-03 | 2010-08-05 | Wkk Distribution, Ltd. | Automatic substrate transport system |
JP5678177B2 (ja) * | 2011-04-13 | 2015-02-25 | シャープ株式会社 | 基板支持装置、及び乾燥装置 |
KR101373507B1 (ko) * | 2012-02-14 | 2014-03-12 | 세메스 주식회사 | 디스플레이 셀들을 검사하기 위한 장치 |
KR101414136B1 (ko) * | 2012-04-10 | 2014-07-07 | 주식회사피에스디이 | 기판 반송 장치 |
CN103523555A (zh) * | 2013-10-31 | 2014-01-22 | 京东方科技集团股份有限公司 | 一种基板反转装置 |
JP6320448B2 (ja) * | 2016-04-28 | 2018-05-09 | Towa株式会社 | 樹脂封止装置および樹脂封止方法 |
JP2018085354A (ja) * | 2016-11-21 | 2018-05-31 | 株式会社荏原製作所 | 反転機、反転ユニット、反転方法および基板処理方法 |
JP7114424B2 (ja) * | 2018-09-13 | 2022-08-08 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN111029273B (zh) * | 2018-10-10 | 2022-04-05 | 沈阳芯源微电子设备股份有限公司 | 一种低接触晶圆翻转*** |
JP7227729B2 (ja) * | 2018-10-23 | 2023-02-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
WO2020082232A1 (en) * | 2018-10-23 | 2020-04-30 | Yangtze Memory Technologies Co., Ltd. | Semiconductor device flipping apparatus |
CN110640324B (zh) * | 2019-09-02 | 2022-06-10 | 中芯集成电路(宁波)有限公司 | 一种晶圆双面制作*** |
JP7446073B2 (ja) * | 2019-09-27 | 2024-03-08 | 株式会社Screenホールディングス | 基板処理装置 |
KR102483735B1 (ko) * | 2022-06-15 | 2023-01-02 | 엔씨케이티 주식회사 | 다기능 반송로봇을 이용한 반도체 웨이퍼 세정장비 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686143A (en) * | 1993-11-05 | 1997-11-11 | Tokyo Electron Limited | Resist treating method |
US6842932B2 (en) * | 2000-10-02 | 2005-01-18 | Tokyo Electron Limited | Cleaning processing system and cleaning processing apparatus |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
CN1685080A (zh) * | 2002-11-15 | 2005-10-19 | 株式会社荏原制作所 | 基板处理装置和基板处理方法 |
CN1712333A (zh) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0723559B2 (ja) * | 1989-06-12 | 1995-03-15 | ダイセル化学工業株式会社 | スタンパー洗浄装置 |
JP3052105B2 (ja) * | 1992-11-20 | 2000-06-12 | 東京エレクトロン株式会社 | 洗浄処理装置 |
US6068002A (en) * | 1997-04-02 | 2000-05-30 | Tokyo Electron Limited | Cleaning and drying apparatus, wafer processing system and wafer processing method |
JP2001176833A (ja) * | 1999-12-14 | 2001-06-29 | Tokyo Electron Ltd | 基板処理装置 |
KR100431515B1 (ko) * | 2001-07-30 | 2004-05-14 | 한국디엔에스 주식회사 | 반도체 세정설비에서의 웨이퍼 반전 유닛 |
JP2006502310A (ja) * | 2002-10-08 | 2006-01-19 | 株式会社荏原製作所 | 電解加工装置 |
US7735451B2 (en) * | 2002-11-15 | 2010-06-15 | Ebara Corporation | Substrate processing method and apparatus |
JP4287663B2 (ja) * | 2003-02-05 | 2009-07-01 | 芝浦メカトロニクス株式会社 | 基板の処理装置 |
JP4283559B2 (ja) * | 2003-02-24 | 2009-06-24 | 東京エレクトロン株式会社 | 搬送装置及び真空処理装置並びに常圧搬送装置 |
JP2004327674A (ja) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | 基板反転装置およびそれを備えた基板処理装置 |
KR100568103B1 (ko) * | 2003-08-19 | 2006-04-05 | 삼성전자주식회사 | 반도체 기판 세정 장치 및 세정 방법 |
US6993171B1 (en) * | 2005-01-12 | 2006-01-31 | J. Richard Choi | Color spectral imaging |
-
2006
- 2006-12-27 JP JP2006351997A patent/JP4744425B2/ja active Active
-
2007
- 2007-12-14 KR KR1020070130772A patent/KR100957912B1/ko active IP Right Grant
- 2007-12-17 TW TW096148184A patent/TWI376766B/zh active
- 2007-12-18 US US11/959,085 patent/US20080156361A1/en not_active Abandoned
- 2007-12-27 CN CN2007103081119A patent/CN101211758B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5686143A (en) * | 1993-11-05 | 1997-11-11 | Tokyo Electron Limited | Resist treating method |
US6842932B2 (en) * | 2000-10-02 | 2005-01-18 | Tokyo Electron Limited | Cleaning processing system and cleaning processing apparatus |
US6874515B2 (en) * | 2001-04-25 | 2005-04-05 | Tokyo Electron Limited | Substrate dual-side processing apparatus |
CN1685080A (zh) * | 2002-11-15 | 2005-10-19 | 株式会社荏原制作所 | 基板处理装置和基板处理方法 |
CN1712333A (zh) * | 2004-06-22 | 2005-12-28 | 大日本网目版制造株式会社 | 基板翻转装置及方法、基板运送装置及方法、基板处理装置及方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20080061281A (ko) | 2008-07-02 |
JP4744425B2 (ja) | 2011-08-10 |
TWI376766B (en) | 2012-11-11 |
JP2008166367A (ja) | 2008-07-17 |
CN101211758A (zh) | 2008-07-02 |
US20080156361A1 (en) | 2008-07-03 |
KR100957912B1 (ko) | 2010-05-13 |
TW200834805A (en) | 2008-08-16 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto City, Kyoto, Japan Patentee after: Skilling Group Address before: Kyoto City, Kyoto, Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto City, Kyoto, Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto City, Kyoto, Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |