CN101128886B - Insulation-coated electroconductive particles - Google Patents
Insulation-coated electroconductive particles Download PDFInfo
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- CN101128886B CN101128886B CN200580048690.7A CN200580048690A CN101128886B CN 101128886 B CN101128886 B CN 101128886B CN 200580048690 A CN200580048690 A CN 200580048690A CN 101128886 B CN101128886 B CN 101128886B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/10—Treatment with macromolecular organic compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
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- Engineering & Computer Science (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
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- Non-Insulated Conductors (AREA)
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Abstract
To impart simultaneously excellent solvent resistance and connection reliability to insulation-coated elecroconductive particles for anisotropic conductive adhesives. [MEANS FOR SOLVING PROBLEMS] In an electroconductive particle whose surface is covered with an insulating resin layer made of an insulating resin having functional groups, the insulating resin layer is surface-treated with a polyfunctional compound having other functional groups reactive with the functional groups of the insulating resin. When the functional groups of the insulating resin are carboxyl, it is preferable to use as the polyfunctional compound a polyfunctional aziridine such as trimethylolpropane tri-ss-aziridinylpropionate, tetra- methylolmethane tri-ss-aziridinylpropionate or N,N-hexa- methylene-1,6-bis-1-aziridinecarboxamide. The insulating resin layer is constituted of an insulating resin comprising acrylic acid monomer units or methacrylic acid monomer units, preferably an acrylic acid/styrene copolymer.
Description
Technical field
The insulation-coated electroconductive particles that the present invention relates to use in anisotropic conductive adhesive.
Background technology
As the conducting particles using in anisotropic conductive adhesive, in order to prevent the short circuit between conducting particles, be widely used by thermoplastic insulative resin or insulating properties thermosetting resin and the surface of electroconductive particle carried out to the insulation-coated electroconductive particles of coating, the metallic such as described electroconductive particle is nickel, on the surface of resin particle, be provided with the metal-plated particles of metal cladding etc.
Patent documentation 1: Unexamined Patent 5-217617 communique
Patent documentation 2: Unexamined Patent 5-70750 communique
Patent documentation 3: Unexamined Patent 11-241054 communique
Summary of the invention
; if manufacture the anisotropic conductive adhesive of membranaceous or pasty state with above-mentioned insulation-coated electroconductive particles; solvent swell, the dissolving in the time of according to circumstances can existing the insulative resin layer being overlayed on insulation-coated electroconductive particles manufactured, used, or the problem of insulative resin layer distortion.Under these circumstances, also the conducting reliability of anisotropic conductive adhesive is produced to harmful effect.
In order to improve the solvent resistance of insulative resin layer, also considered to form insulative resin layer by heat cured insulating resin composition, if but insulative resin layer is too hard, can not use insulative resin layer from fully getting rid of to connect between the opposed electrode that should connect, there is the problem that can not obtain sufficient conducting reliability in result.
The object of the invention is to, can give excellent solvent resistance and conducting reliability to being suitable for the insulation-coated electroconductive particles of the conducting particles of anisotropic conductive adhesive simultaneously.
The discoveries such as the inventor, the insulative resin layer that comprises the insulative resin with functional group is set by the surface at conducting particles, with the multi-functional compounds in a part with other functional groups of 2 above and these functional group reactionses, this insulative resin layer is carried out to surface treatment again, make the functional group of insulative resin layer and multi-functional compounds's functional group reactions, can improve solvent resistance and the conducting reliability of the insulation-coated electroconductive particles obtaining, thereby complete the present invention.
; the invention provides a kind of insulation-coated electroconductive particles; this insulation-coated electroconductive particles is used the surface of insulative resin layer coated electroconductive particles; described insulative resin layer comprises the insulative resin with functional group; wherein this insulative resin layer carries out surface treatment with multi-functional compounds, and described multi-functional compounds has more than 2 other functional groups with this functional group reactions in a part.
In addition, the invention provides a kind of manufacture method of insulation-coated electroconductive particles, it is characterized in that, with multi-functional compounds, surface treatment is carried out in the surface of this insulative resin layer of the conducting particles of the insulative resin layer coating that comprises the insulative resin with functional group, described multi-functional compounds in a part, have more than 2 can with other functional groups of this functional group reactions.
The present invention also provides a kind of anisotropic conductive adhesive, it is characterized in that, above-mentioned insulation-coated electroconductive particles is dispersed in insulating properties binding agent.
The present invention also provides a kind of anisotropy connection sheet, this anisotropy connection sheet has the anisotropic conductive layer that comprises above-mentioned anisotropic conductive adhesive, wherein, the low low viscosity insulating properties adhesive layer of this anisotropic conductive layer of ratio of viscosities while connecting is set at least one face of this anisotropic conductive layer.
In addition, the invention provides a kind of method of attachment, the conducting between the electrode of the 1st electronic unit and the electrode of the 2nd electronic unit is guaranteed in described method of attachment, these electrodes are bondd mutually simultaneously, it is characterized in that, by making above-mentioned anisotropic conductive adhesive or anisotropy connection sheet be clipped between opposed these electrodes and carrying out pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles contacting with the both sides of these electrodes, thereby guarantee the conducting between opposed electrode, electrode is bondd simultaneously; And a kind of syndeton body is also provided, it is by this method of attachment, the electrode of the 1st electronic unit and the electrode of the 2nd electronic unit to be connected to obtain.
Invention effect
According to the present invention, can to being suitable for the insulation-coated electroconductive particles of the conducting particles of anisotropic conductive adhesive, give excellent solvent resistance and conducting reliability simultaneously.Therefore, even if adopt by the technique of solvent, manufacture this insulation-coated electroconductive particles is dispersed in insulating properties binding agent and the anisotropic conductive adhesive obtaining or the anisotropy connection sheet with the anisotropic conductive layer that comprises this anisotropic conductive adhesive, also not only can guarantee the insulating properties of insulation-coated electroconductive particles, and can to make the concentration of the insulation-coated electroconductive particles in anisotropic conductive adhesive or anisotropy connection sheet be high concentration.Therefore, when using anisotropic conductive adhesive or anisotropy connection sheet to connect between by opposed electrode, can make to contribute to the quantity of the insulation-coated electroconductive particles of opposed interelectrode conducting to increase, thereby can realize low conducting resistance and high conducting reliability.
Embodiment
Insulation-coated electroconductive particles of the present invention is the insulation-coated electroconductive particles of surface the being insulated property resin bed coating of conducting particles.
In the present invention, as the insulative resin that forms the insulative resin layer of coated electroconductive particles, use the insulative resin with functional group, thus, can improve the tack between conducting particles and insulative resin layer.As such functional group, can enumerate carboxyl, oxazolinyl, amino, epoxy radicals, sulfydryl or there is substituting group (for example, saturated hydrocarbyl, unsaturated alkyl) of the hydrogen that can be taken off by living radical etc.The insulative resin with such functional group is the insulative resin that comprises any monomeric unit with these functional groups.
For the amount of these functional groups in insulative resin, if very few, solvent resistance is insufficient, and if too much, crosslink density is superfluous, and conducting reliability reduces, and therefore, preferably according to the kind of functional group or multi-functional compounds's kind, suitably determines.
Particularly, as the insulative resin with carboxyl, can enumerate and comprise the monomeric unit with carboxyl, the insulative resin of preferred acrylic monomers unit or methacrylic acid monomer unit, for example, acrylic acid styrol copolymer (PP-2000S, Dainippon Ink. & Chemicals Inc; Acid number 5mgKOH/g is following), carboxyl acid modified SDVB copolymer (SX8742A, JSR (strain) manufactures; The about 3.5mgKOH/g of acid number) etc.Carboxyl amount (acid number) in insulative resin is preferably 0.1～50mgKOH/g, more preferably 0.5～5mgKOH/g.
Insulative resin as Ju You oxazolinyl, can enumerate the monomeric unit that comprises Ju You oxazolinyl, the insulative resin of You Xuan oxazolinyl ethylene monomer unit, for example oxazolinyl ethylene styrene copolymer (エ Port Network ロ ス RPS, Nippon Shokubai Co., Ltd) etc.
As thering is amino insulative resin, can enumerating, comprise thering is amino monomeric unit, the insulative resin of preferred (methyl) acrylic acid aminoalkyl ester monomeric unit or acrylamide unit etc.Amino amount in insulative resin is preferably 0.01～5 mM/g (insulative resin).
As the insulative resin with epoxy radicals, for example, can use the high performance of < < epoxy resin and the compounding technique of curing agent and evaluate application (intelligence technology association of publisher Co., Ltd., 1997,12,12) epoxy resin of enumerating in the 2nd of > > the page～40 pages.
As the insulative resin with sulfydryl, can enumerate the insulative resin that comprises the monomeric unit with sulfydryl, such as enumerating polyvinyl alcohol that contains end sulfydryl of recording in Unexamined Patent 2004-216703 communique etc.
As comprising the substituent insulative resin with the hydrogen that can be taken off by living radical, can enumerate and comprise the substituent monomer that there is the hydrogen that can be taken off by living radical by becoming, the insulative resin of optimal ethylene monomer, divinylic monomer, isoprene monomer unit, for example, polyethylene, polybutadiene, polyisoprene etc.
If the thickness of insulative resin layer is too thin, electrical insulating property is insufficient, if too thick, on state characteristic reduces, and is therefore preferably 0.01～1 μ m, more preferably 0.1～0.5 μ m.
; as mentioned above; insulation-coated electroconductive particles of the present invention is the surface of the insulative resin layer coated electroconductive particles that comprise the insulative resin with functional group; but in order to ensure the sufficient conducting reliability of anisotropic conductive adhesive, be necessary when thermo-compressed is processed from being connected the insulative resin layer itself of getting rid of insulation-coated electroconductive particles between portion.Therefore, under heat-treat condition, insulative resin layer itself must be thermoplastic, but while being thermoplasticity, easily by organic solvent swelling, according to circumstances dissolves, and therefore aspect solvent resistance, has problems.In addition, due to functional group, the epoxide group of the epoxy resin that for example carboxyl bonding component easy and usually used as anisotropic conductive adhesive is used reacts, and therefore likely makes the keeping quality of anisotropic conductive adhesive reduce.
Therefore, in the present invention, with multi-functional compounds, the insulative resin layer of insulation-coated electroconductive particles is carried out to surface treatment, described multi-functional compounds have 2 above can with other functional groups of the functional group reactions of insulative resin.This surface treatment is to make multi-functional compounds's functional group and the functional group reactions of insulative resin.Particularly, conventionally multi-functional compounds's solution (for example ethanolic solution) can be sprayed to surface the heat drying of insulative resin layer, then be heated to reaction temperature, thereby react.Can also by functional group be combined in heat drying time react.Or can also for example, by putting into the conducting particles of insulative resin coating in multi-functional compounds's solution (ethanolic solution), dispersed with stirring adds thermal agitation with this state and reacts at the necessary temperature of reaction.Thus, insulative resin layer surface is crosslinked by multi-functional compounds, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free functional group, therefore, even if use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
The multi-functional compounds that can use be in the present invention in a part, have more than 2 can with the compound of other functional groups of the functional group reactions of insulative resin, can select according to the functional group of insulative resin.As such multi-functional compounds, can enumerate polyol compound, polyamine compounds, polyisocyanate compound, polybasic carboxylic acid compound, polyepoxy compound, many aziridine cpds, organic peroxide etc.
As the functional group of insulative resin and multi-functional compounds's preferred combination, for carboxyl, can enumerate many aziridine cpds, polyol compound, polyamine compounds etc.; Dui Yu oxazolinyl, can enumerate polybasic carboxylic acid compound etc.; For amino, can enumerate polybasic carboxylic acid compound, polyepoxy compound etc.; For epoxide group, can enumerate polyamine compounds etc.
As the object lesson of polyol compound, can enumerate PEPA, polyethylene glycol etc.
As the object lesson of polyamine compounds, can enumerate
diamines, IPD, MDA, m-phenylene diamine (MPD), many cyclohexyl polyamines, polyamidoamines.
As the object lesson of polyisocyanate compound, can enumerate hexamethylene diisocyanate etc.
As the object lesson of polybasic carboxylic acid compound, can enumerate cyclobutane tetrabasic carboxylic acid, biphenyltetracarboxyacid acid, benzophenone biphenyltetracarboxyacid acid, PMA etc.
As the object lesson of polyepoxy compound, can enumerate bisphenol-type epoxy resin, novolac-type epoxy resin, cyclic aliphatic epoxy resin, dimerization acids 2-glycidyl ester etc.
As the object lesson of many aziridine cpds, can enumerate trimethylolpropane-tri-β-'-aziridino propionic ester, tetramethylol methane-tri-β-'-aziridino propionic ester, N, N-hexa-methylene-1,6-pair-1-aziridine formamide.Wherein, from reactive viewpoint, preferred trimethylolpropane-tri-β-'-aziridino propionic ester.
As the object lesson of organic peroxide etc., can enumerate benzoyl peroxide etc.
Here, as the preferred mode of insulation-coated electroconductive particles of the present invention, the situation that can be listed below: the substituting group that forms the insulative resin of insulative resin layer is carboxyl, and multi-functional compounds is many aziridine cpds.The surface treatment of which is the carboxyl reaction that makes aziridine group and the insulative resin of polyfunctional aziridines compound.Particularly, conventionally the solution of polyfunctional aziridines compound (for example ethanolic solution) can be sprayed to the surface of insulative resin layer, heat drying at 80～140 ℃, thus react.In addition, can also for example, by putting into the conducting particles of insulative resin coating in the solution (ethanolic solution) of polyfunctional aziridines compound, dispersed with stirring adds thermal agitation with this state and reacts at 30～80 ℃.Thus, the carboxyl on insulative resin layer surface is crosslinked by aziridine cpd, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free carboxyl, therefore, even if use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
For the reaction of '-aziridino and carboxyl, it is the item (Encyclopedia ofChemical Technology, Vol.13,142-166 page (1984) etc.) being widely known by the people.
The use amount of polyfunctional aziridines compound can be according to the suitably decisions such as degree of the solvent resistance of the carboxyl equivalent of the number of the aziridine group of aziridine cpd, insulative resin, necessity.
In addition, as preferred other modes of insulation-coated electroconductive particles of the present invention, the situation that can be listed below: the substituting group that forms the insulative resin of insulative resin layer is oxazolinyl, and multi-functional compounds is polybasic carboxylic acid.The surface treatment of which is that the carboxyl of polybasic carboxylic acid compound is reacted with insulative resin oxazolinyl.Particularly, conventionally the solution of polybasic carboxylic acid compound (for example ethanolic solution) can be sprayed to the surface of insulative resin layer, heat drying at 80～140 ℃, thus react.In addition, can also for example, by putting into the conducting particles of insulative resin coating in the solution (ethanolic solution) of polybasic carboxylic acid compound, dispersed with stirring adds thermal agitation with this state and reacts at 30～80 ℃.Thus, insulative resin layer surface is crosslinked by polybasic carboxylic acid compound, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free oxazolinyl and carboxylic acid, therefore, even if use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
The reaction of oxazolinyl and polybasic carboxylic acid compound is the item being widely known by the people, and is follow the open loop of oxazoline ring and can obtain carboxylic acid amide esters (CO
2cH
2cH
2nHCO-) reaction of key.
The use amount of polybasic carboxylic acid compound can be according to the suitably decisions such as degree of the solvent resistance of the number of the carboxylic acid of polybasic carboxylic acid compound, insulative resin oxazolinyl equivalent, necessity.
As the conducting particles using in insulation-coated electroconductive particles of the present invention, can use the conducting particles with the identical formation of conducting particles of using in anisotropic conductive adhesive in the past.Such as can enumerate the metallic of scolding tin or nickel etc., by resin particle, glass particle or the ceramic particle of metal (nickel, gold, aluminium, copper etc.) coating coating and by insulation-coated particle of these particles etc.Wherein, can preferably use the coating metal resin particle of easy reply electrode flatness fluctuation, for example nickel gold plating resin particle.In these conducting particless, as required, can use the conducting particles with protrusion of surface.Now, good to the invasive of electrode, and can improve conducting reliability.
If the average grain diameter of the conducting particles using in the present invention is too little, conducting reliability reduces, if too large, insulating reliability reduces, and is therefore preferably 2～10 μ m.
Insulation-coated electroconductive particles of the present invention can be manufactured by following method: the surface engagement of this insulative resin layer of the conducting particles by the coating of insulative resin layer have can with the multi-functional compounds of other functional groups of above-mentioned functional group reactions, by heating, the functional group of insulative resin and other compounds of multi-functional compounds are reacted, wherein said insulative resin layer comprises the insulative resin with functional group.More specifically, can adopt usual way with insulative resin surface-coated by conducting particles, for example, to the solution of its surface spray polyfunctional aziridines compound (ethanolic solution), and at 80～140 ℃ heat drying, thereby react.In addition, can also, by by putting into the conducting particles of insulative resin coating in the solution of polyfunctional aziridines compound, at 30～80 ℃, heat and react while stirring.Now, can filter afterwards the particle that obtains processing in reaction.
Insulation-coated electroconductive particles of the present invention can be preferably used as the conducting particles of anisotropic conductive adhesive.Such anisotropic conductive adhesive can be manufactured as follows: adopt usual way that insulation-coated electroconductive particles is evenly mixed together with insulating properties binding agent as bonding component and the organic solvent using as required or inorganic filler.This anisotropic conductive adhesive can adopt usual way to make pasty state or membranaceous.
If the use level of insulation-coated electroconductive particles in this anisotropic conductive adhesive very little, conducting reliability reduces, if too many, insulating reliability reduces, and is therefore preferably 1～30 capacity %.
As the insulating properties binding agent using in this anisotropic conductive adhesive, can use the agent of known thermoplastic insulation's cohesive or heat or light-cured type insulating properties binding agent, for example, can use the liquid insulating properties binding agent of the thermohardening type of the curing agent components such as polymerization compositions such as comprising liquid epoxy resin and imidazole curing agent or modified amine curing agent, comprise and there is the two acrylic resins of key of polymerism and the liquid insulating properties binding agent of curing catalysts, comprise acrylic compounds, SBR, SIS, the thermoplastic resins such as polyurethane, the liquid rubber class binding agent of rubber resin etc. etc.
In addition, in insulating properties binding agent, can also contain as required and not show close-burning film formative resin, such as phenoxy resin, mylar, polyurethane resin, SEBS resin, SIS resin, NBR resin etc.
As required, can also in anisotropic conductive adhesive, coordinate various additives, such as tackifier, surfactant etc.
Anisotropic conductive adhesive of the present invention can be according to usual way, by insulative resin coated electroconductive particles is dispersed in insulating properties binding agent and is manufactured.
Anisotropic conductive adhesive of the present invention can be made anisotropic conductive layer and use as anisotropy connection sheet by being shaped to stratiform.Now, the low low viscosity insulating properties adhesive layer of ratio of viscosities anisotropic conductive layer while connecting is preferably set at least one face of anisotropic conductive layer.While forming like this, because the viscosity of the ratio of viscosities low viscosity insulating properties adhesive layer of anisotropic conductive layer when connecting uprises relatively, therefore can suppress flowing of anisotropic conductive layer, and can prevent that conducting particles from flowing out between the electrode that will connect, thereby can more improve conducting reliability.
The viscosity of the ratio of viscosities low viscosity insulating properties adhesive layer of the anisotropic conductive layer while preferably connecting is at least high more than 10 times.
Such low viscosity insulating properties adhesive layer can be used by adjusting the composition of the insulating properties binding agent using in above-mentioned anisotropic conductive adhesive and make those of its reduced viscosity.
The thickness of low viscosity insulating properties adhesive layer is preferably set at while connecting and can produce short circuit because of the conducting particles flowing out in interelectrode gap, and at least can fill the thickness in gap.According to circumstances, by the excessive filling in gap, in surrounding's formation of coupling part, overflow portion, can be used as encapsulant or damp-proof material works.
The anisotropy connection sheet with low viscosity insulating properties adhesive layer can be according to usual way, by anisotropic conductive layer and low viscosity insulating properties adhesive layer by the laminated method of dry type or successively rubbing method carry out lamination and manufacture.
Anisotropic conductive adhesive of the present invention or anisotropy connection sheet can be preferred for following situation: guarantee the electrode of semiconductor chip or liquid crystal display cells grade in an imperial examination 1 electronic unit and for load the substrate of semiconductor chip or for the interelectrode conducting of substrate grade in an imperial examination 2 electronic units of liquid crystal drive, these electrodes are bondd mutually simultaneously.Now, anisotropic conductive adhesive or anisotropy connection sheet are clipped between opposed these electrodes and pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles contacting with the both sides of these electrodes, thereby can guarantee opposed interelectrode conducting, electrode be bondd simultaneously.Therefore, the electrode of the electrode of the 1st electronic unit and the 2nd electronic unit is connected and the syndeton body that obtains shows good conducting reliability.
Embodiment
Below, by embodiment, specifically describe the present invention.
Comparative example 1
Adopt usual way the surface of the styrene resin particle at diameter 4 μ m to be formed to the conducting particles (AU204 of Ni/Au electroless plating, ponding chemical industrial company) the thick acrylic acid styrol copolymer (PP-2000S of surface-coated 0.2 μ m, Dainippon Ink. & Chemicals Inc), obtain the insulation-coated electroconductive particles of comparative example 1.
Embodiment 1
5 weight portion trimethylolpropane-tri-β-'-aziridino propionic esters (TAZM) are dissolved in 95 parts by weight of ethanol, the solution obtaining is had no to omit and be sprayed on the insulation-coated electroconductive particles that comparative example 1 obtains, heat drying at 100 ℃, carry out cross-linking reaction, obtain the insulation-coated electroconductive particles of embodiment 1.
Embodiment 2
The insulation-coated electroconductive particles that 100 weight portion comparative examples 1 are obtained is dispersed in 100 parts by weight of ethanol, in this dispersion liquid, add 2 weight portion trimethylolpropane-tri-β-'-aziridino propionic ester (TAZM) dispersed with stirring, at 65 ℃, add thermal agitation 4 hours, carry out after cross-linking reaction, isolated by filtration, at 80 ℃, be dried 30 minutes, obtain the insulation-coated electroconductive particles of embodiment 2.
Embodiment 3
Except use tetramethylol methane-tri-β-'-aziridino propionic esters (TAZO) replace trimethylolpropane-tri-β-'-aziridino propionic ester (TAZM), carry out operation similarly to Example 2, obtain the insulation-coated electroconductive particles of embodiment 3.
Embodiment 4
Except using N, N-hexa-methylene-1,6-pair-1-aziridine formamide (HDU) replaces trimethylolpropane-tri-β-'-aziridino propionic ester (TAZM) in addition, carries out operation similarly to Example 2, obtains the insulation-coated electroconductive particles of embodiment 4.
(evaluation)
Each insulation-coated electroconductive particles of 10 weight portion comparative examples 1 and embodiment 1～4 is put in 3 kinds of solvents of 90 parts by weight of toluene, MEK or ethyl acetate, at room temperature placed 100 hours, make insulation-coated electroconductive particles sedimentation, take its supernatant.By the supernatant heating of taking, remove volatile ingredient, measure the weight of fixedness composition.This fixedness composition is equivalent to be dissolved in the weight of the insulative resin in solvent.The ratio (% by weight) that is dissolved in the solvent in insulative resin is as shown in table 1.
The insulation-coated electroconductive particles of sedimentation is dry, the drier insulation-coated electroconductive particles obtaining is filled into (φ 6mm * 125 μ m) between a pair of copper electrode, between electrode, apply voltage, measure the voltage (proof voltage) leaking.The result obtaining is as shown in table 1.
In addition, adhesive composition is coated on the PETG film that lift-off processing crosses, and to make dry thickness be 25 μ m, at 80 ℃, be dried 5 minutes, form tack coat, make bonding sheet, described adhesive composition comprises 35 weight portion phenoxy resin (YP50, Dongdu changes into (strain)), 30 weight portion epoxy resin (YL980, japan epoxy resin, epoxide equivalent 185g/eq), 35 weight portion epoxies disperse imidazole curing agent (HX3941HP, Asahi Chemical Industry's (strain)), 20 weight portion conducting particless (conducting particles of embodiment 1～4 or comparative example 1), 40 parts by weight of toluene and 40 weight portion ethyl acetate.With bonding machine, with the TEG (chip size 25 * 2.5mm, 8376 of salient point numbers, bump size 35 * 55 μ m, salient point gap 10 μ m) that insulate, be crimped on the face of tack coat of this bonding sheet arriving the short circuit evaluation under 210 ℃ of temperature, the condition in 10 seconds of crimping time, the ITO wiring being arranged on comb teeth-shaped on glass substrate being had.And measure the insulation resistance between salient point, calculate short circuit incidence.The result obtaining is as shown in table 1.
[table 1]
As shown in Table 1, compare with the insulation-coated electroconductive particles of the comparative example 1 of not processing with aziridine cpd, for any solvent, the solvent resistance of the insulation-coated electroconductive particles of embodiment 1～4 and proof voltage are all excellent.Therefore, conducting reliability is also improved.And the incidence of short circuit is very little, can expect good storage stability.
Embodiment 5
(1) formation of anisotropic conductive layer
Following blended resin composition is dissolved in MEK and the mixed solvent of toluene with identical weight mixing, obtain the resin solution of 40 % by weight, described blended resin composition comprises: 50 weight portion phenoxy resin (YP50, Dongdu changes into company and manufactures), 25 weight portion solid epoxy resin (EP1009, japan epoxy resin company), the liquid-state epoxy resin (HX3941HP, Asahi Kasei Corporation manufactures) that 25 weight portions contain microcapsule-type potentiality curing agent.
Nickel Zai Yong oxazoline modified polystyrene resin (the エ Port Network ロ ス RPS that coating 0.2 μ m is thick on the polystyrene particle of average grain diameter 3 μ m, Japan catalyst company) by coating the surface of the thick golden coating metal resin particle of 0.02 μ m carry out coating, and it is thick to make it to reach 0.2～0.5 μ m, with BTCA, process again, make insulation-coated electroconductive particles, the insulation-coated electroconductive particles obtaining is dispersed in the resin solution of previous preparation with 10 volume %.
With roll coater, the dispersion liquid obtaining is coated on polysiloxanes and has been carried out on the lift-off processing face of PETG (PET) film of lift-off processing, and to make dry thickness be that 5 μ m are thick, at 80 ℃, be dried 5 minutes, on PET, form anisotropic conductive layer.
(2) formation of low viscosity insulating properties adhesive layer
Following blended resin composition is dissolved in MEK and the mixed solvent of toluene with identical weight mixing, obtain the resin solution of 40 % by weight, described blended resin composition comprises: 50 weight portion solid epoxy resin (EP1009, japan epoxy resin company) and the 50 weight portions liquid-state epoxy resin that contains microcapsule-type potentiality curing agent (HX3941HP, Asahi Kasei Corporation manufactures).The resin solution that use obtains according to operation same when forming anisotropic conductive layer, is made thick low viscosity insulative resin layer and the thick low viscosity insulative resin layer of 3 μ m of 12 μ m containing conducting particles on the PET of lift-off processing film.
(3) anisotropic conductive sheet
At the thick low viscosity insulating resin layer of a face superimposed layer 12 μ m of the anisotropic conductive layer of previously having made, at the thick low viscosity insulative resin layer of another face superimposed layer 3 μ m, make the anisotropic conductive sheet of embodiment 1.
Comparative example 2
Except come generation for oxazoline modified styrene resin, the surface of conducting particles to be carried out beyond coating, similarly to Example 5, making anisotropic conductive sheet with the thick polystyrene resin of 0.2～0.5 μ m (G100C, Japan スチロル company).
Comparative example 3
Except the liquid-state epoxy resin (HX3941HP with containing microcapsule-type potentiality curing agent, Asahi Kasei Corporation) solidfied material (0.2～0.5 μ m is thick) comes Dai Ti oxazoline modified styrene resin to carry out beyond coating the surface of conducting particles, similarly to Example 5, make anisotropic conductive sheet.
(4) evaluate
(4a) the conductive particle subnumber of each electrode of IC chip (salient point)
Before evaluating, prepare IC chip and circuit substrate for connecting.Specification for the IC chip evaluated is: chip size 2.5mm is square, 8376 of salient point numbers, gold-plated bump size 35 * 55 μ m, salient point gap 10 μ m, bump height 15 μ m.Circuit substrate arranges ITO wiring on glass substrate.Anisotropic conductive sheet is clipped between this IC chip and circuit substrate, with bonding machine, under 210 ℃ of temperature of arrival, the condition of 10 seconds crimping time, carries out thermo-compressed, obtain syndeton body.Use the light microscope of 340 times of multiplying powers from circuit substrate unilateral observation 200 salient points of this syndeton body, count the conductive particle subnumber on a salient point that remains in IC chip.The result obtaining is as shown in table 2.From the viewpoint of conducting reliability, wish residual more than 5 conducting particles on salient point.
(4b) conducting reliability
Make with for evaluating the same sample of the sample of the conductive particle subnumber on each salient point of IC chip, working pressure cooking test device (EHS-411, タ バ イ エスペツ Network company) is implemented the etching of 24 hours to this sample.After etching finishes, measure the opposed interelectrode conducting resistance of sample.The result obtaining is as shown in table 2.By conducting resistance, being that average evaluation below 20 Ω is " G " (well), is " NG " (bad) by the average evaluation that surpasses 20 Ω.
(4c) insulating reliability
The same sample of sample using in the evaluation of making and conducting reliability, measures the interelectrode insulation resistance that this sample is adjacent.The result obtaining is as shown in table 2.By insulation resistance less than 1 * 10
8the average evaluation of Ω is " NG " (bad), by insulation resistance, is 1 * 10
8average evaluation more than Ω is " G " (well).
[table 2]
| Conductive particle subnumber on salient point | Conducting reliability | Insulating reliability | |
| Embodiment 5 | 20 | G | G |
| Comparative example 2 | 19 | G | NG |
| Comparative example 3 | 22 | NG | G |
Result from the embodiment 5 of table 2, if low viscosity insulating properties adhesive layer is set on anisotropic conductive layer, the conducting particles remaining in when connecting on salient point increases, and therefore enter into adjacent interelectrode conductive particle subnumber and relatively reduce, thereby insulating reliability improves.
In addition, in the situation that use, do not there is the material of functional group as the comparative example 2 of the insulative resin of insulation-coated electroconductive particles, owing to can not obtaining surface-crosslinked structure, the therefore measurable reduction to solvent resistance, in fact, its insulating reliability is poor.In addition we know, the situation of comparative example 3, although have functional group as the insulative resin of insulation-coated electroconductive particles, self is completely curing, reacting of expectability and BTCA do not have problems in conducting reliability.
Industrial applicability
The solvent resistance of insulation-coated electroconductive particles of the present invention and proof voltage are excellent, conducting reliability is improved, and the incidence of short circuit is very little, can expect good storage stability, therefore, the conducting particles as anisotropic conductive adhesive is useful.
Claims (13)
1. insulation-coated electroconductive particles, it is the insulative resin layer coating of the involved insulative resin with functional group in the surface of conducting particles and the insulation-coated electroconductive particles that forms, wherein, this insulative resin layer in a part, had 2 above can be surface-crosslinked with the multi-functional compounds of other functional groups of this functional group reactions.
2. insulation-coated electroconductive particles claimed in claim 1, wherein, the functional group of insulative resin be carboxyl,
azoles quinoline base, amino, epoxy radicals, sulfydryl or there is the substituting group of the hydrogen that can be taken off by living radical.
3. insulation-coated electroconductive particles claimed in claim 1, wherein, multi-functional compounds is polyol compound, polyamine compounds, polyisocyanate compound, polybasic carboxylic acid compound, polyepoxy compound, many aziridine cpds or organic peroxide.
4. insulation-coated electroconductive particles claimed in claim 1, wherein, the functional group of insulative resin is carboxyl, multi-functional compounds is many aziridine cpds.
5. the insulation-coated electroconductive particles described in claim 3 or 4, wherein, many aziridine cpds are trimethylolpropane-tri--β-'-aziridino propionic ester, tetramethylol methane-tri--β-'-aziridino propionic ester or N, N-hexa-methylene-1,6-pair-1-aziridine formamide.
6. the insulation-coated electroconductive particles described in any one in claim 1～4, wherein, this insulative resin layer consists of the insulative resin with acrylic monomers unit or methacrylic acid monomer unit.
7. insulation-coated electroconductive particles claimed in claim 6, wherein, this insulative resin is acrylic acid/styrol copolymer.
8. the manufacture method of insulation-coated electroconductive particles, wherein, with multi-functional compounds, surface treatment is carried out in the surface of this insulative resin layer of the conducting particles of the insulative resin layer coating of the involved insulative resin with functional group, wherein said multi-functional compounds in a part, have more than 2 can with other functional groups of this functional group reactions.
9. anisotropic conductive adhesive, it is that insulation-coated electroconductive particles described in claim 1-7 any one is dispersed in insulating properties binding agent and forms.
10. anisotropic conductive adhesive claimed in claim 9, wherein, insulating properties binding agent contains epoxy resin.
11. anisotropy connection sheets, it has the anisotropic conductive layer that comprises the anisotropic conductive adhesive described in claim 9 or 10, wherein, the low low viscosity insulating properties adhesive layer of this anisotropic conductive layer of ratio of viscosities while connecting is set at least one side of this anisotropic conductive layer.
12. methods of attachment, the method is guaranteed the conducting between the electrode of the 1st electronic unit and the electrode of the 2nd electronic unit, these electrodes are bondd mutually simultaneously, wherein, by making anisotropic conductive adhesive or the anisotropy connection sheet described in claim 11 described in claim 9 or 10 be clipped between opposed these electrodes and carry out pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles contacting with the both sides of these electrodes, thereby guarantee the conducting between opposed electrode, electrode is bondd simultaneously.
13. syndeton bodies, it is by the method for attachment described in claim 12, the electrode of the 1st electronic unit and the electrode of the 2nd electronic unit to be formed by connecting.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005048948A JP5099284B2 (en) | 2005-02-24 | 2005-02-24 | Anisotropic connection sheet material |
| JP048948/2005 | 2005-02-24 | ||
| PCT/JP2005/003115 WO2006090467A1 (en) | 2005-02-24 | 2005-02-25 | Insulation-coated electroconductive particles |
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| CN101128886B true CN101128886B (en) | 2014-03-26 |
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| KR (2) | KR101246516B1 (en) |
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| WO2008047600A1 (en) * | 2006-10-17 | 2008-04-24 | Hitachi Chemical Company, Ltd. | Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film |
| JP4957695B2 (en) * | 2007-10-02 | 2012-06-20 | 日立化成工業株式会社 | Conductive particle, method for producing the same, method for producing insulating coated conductive particle, and anisotropic conductive adhesive film |
| KR101148143B1 (en) * | 2008-12-17 | 2012-05-23 | 제일모직주식회사 | Insulated conductive particles and anisotropic conductive film composition using the same |
| JP5788130B2 (en) * | 2008-12-26 | 2015-09-30 | 日本発條株式会社 | Conductive resin film and method for producing the same |
| JP4957838B2 (en) | 2009-08-06 | 2012-06-20 | 日立化成工業株式会社 | Conductive fine particles and anisotropic conductive materials |
| JP5398455B2 (en) * | 2009-09-30 | 2014-01-29 | デクセリアルズ株式会社 | Anisotropic conductive film and manufacturing method thereof |
| JP6518101B2 (en) * | 2014-03-26 | 2019-05-22 | 積水化学工業株式会社 | PHOTO-CURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE |
| WO2016080515A1 (en) * | 2014-11-20 | 2016-05-26 | 積水化学工業株式会社 | Conductive particles, method for manufacturing conductive particles, conductive material, and connection structure |
| JP6592350B2 (en) * | 2014-12-26 | 2019-10-16 | 積水化学工業株式会社 | Anisotropic conductive material, connection structure, and manufacturing method of connection structure |
| CN107077914B (en) * | 2015-02-19 | 2019-05-31 | 积水化学工业株式会社 | Conductive paste and connection structural bodies |
| CN106318244A (en) * | 2015-07-02 | 2017-01-11 | 玮锋科技股份有限公司 | Nuclear layer technology anisotropic conductive film |
| KR102605910B1 (en) * | 2015-08-24 | 2023-11-24 | 세키스이가가쿠 고교가부시키가이샤 | Conductive materials and connection structures |
| CN110875101A (en) * | 2018-08-31 | 2020-03-10 | 玮锋科技股份有限公司 | Anisotropic conductive film structure and manufacturing method thereof |
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| JP2006236759A (en) | 2006-09-07 |
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| TWI257741B (en) | 2006-07-01 |
| HK1116595A1 (en) | 2008-12-24 |
| KR101163436B1 (en) | 2012-07-13 |
| TW200631240A (en) | 2006-09-01 |
| WO2006090467A1 (en) | 2006-08-31 |
| KR101246516B1 (en) | 2013-03-26 |
| KR20110134946A (en) | 2011-12-15 |
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| KR20070105972A (en) | 2007-10-31 |
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