JP4702566B2 - Connecting material - Google Patents
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- JP4702566B2 JP4702566B2 JP2008156922A JP2008156922A JP4702566B2 JP 4702566 B2 JP4702566 B2 JP 4702566B2 JP 2008156922 A JP2008156922 A JP 2008156922A JP 2008156922 A JP2008156922 A JP 2008156922A JP 4702566 B2 JP4702566 B2 JP 4702566B2
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本発明は相対する電極を有する被接続部材を接続するための接続材料、特に熱硬化性樹脂を含む接続材料に関するものである。 The present invention relates to a connection material for connecting to-be-connected members having opposed electrodes, and particularly to a connection material containing a thermosetting resin.
相対する電極を有する被接続部材間を接続するために、熱硬化性樹脂を主成分とする接続材料が用いられている。例えばＬＣＤ（液晶ディスプレイ）ではガラス基板上のＩＴＯ(Indium Tin Oxide)膜とＴＣＰ（Tape Carrier Package）との接続、ＩＴＯ膜とドライバーＩＣとの接続などがある。またＩＣ、ＬＳＩ等の半導体をプリント基板に実装する技術として、ベアチップ等の半導体チップを接続材料により直接基板に実装する方法がある。これらの被接続部材の接続は、チップや基板のそれぞれ相対する位置に設けた多数の電極を対向させた状態で、接続材料により接続し、電気的接続と機械的固着を同時に得ようとするものである。 In order to connect between connected members having opposing electrodes, a connecting material mainly composed of a thermosetting resin is used. For example, an LCD (Liquid Crystal Display) includes a connection between an ITO (Indium Tin Oxide) film on a glass substrate and a TCP (Tape Carrier Package), and a connection between the ITO film and a driver IC. Further, as a technique for mounting a semiconductor such as an IC or LSI on a printed board, there is a method of directly mounting a semiconductor chip such as a bare chip on a board with a connecting material. The connection of these members to be connected is made by connecting with a connecting material in a state where a large number of electrodes provided at opposing positions of the chip and the substrate are opposed to each other, so that electrical connection and mechanical fixation are simultaneously obtained. It is.
このような接続材料としては主成分として熱硬化性樹脂が用いられており、チップや基板等の被接続部材間に接続材料を介在させ、相対する電極を対向させた状態で両側から加圧するとともに、加熱して樹脂を硬化させることにより接続している。チップと基板等の被接続部材間の機械的固着は樹脂の固着（接着）力により行い、電極の電気的接続は樹脂の固着により接点同士を圧着することにより行っている。この場合接続材料中に導電性粒子を分散させることにより電極間に導電粒子を介在させて電気的接続を得る場合と、電極同士を直接接触させて電気的接続を得る場合とがある。 As such a connection material, a thermosetting resin is used as a main component, and a connection material is interposed between connected members such as a chip and a substrate, and pressure is applied from both sides with opposing electrodes facing each other. The connection is established by heating and curing the resin. Mechanical fixation between a chip and a member to be connected such as a substrate is performed by a resin adhesion (adhesion) force, and electrodes are electrically connected by pressing the contacts together by resin adhesion. In this case, there are a case where the conductive particles are dispersed in the connecting material to obtain electrical connection by interposing the conductive particles between the electrodes, and a case where electrical connection is obtained by bringing the electrodes into direct contact with each other.
近年、携帯電子機器を中心とした軽薄短小化の市場要求から、半導体チップと基板間あるいはＴＣＰとＩＴＯ間の接続における接続面積の低下による接着強度の低下が問題となっている。またドライバーＩＣ等をフレキシブルプリント基板（ＦＰＣ）上に搭載することが検討されており、接続材料についても接着強度（引き剥がし強度）を上げる必要性が出てきている。特にＦＰＣにはポリイミド樹脂フィルムが用いられているが、このようなポリイミド樹脂フィルムに対して優れた接着性を示す接着材料は知られていなかった。 2. Description of the Related Art In recent years, a reduction in adhesive strength due to a decrease in connection area in a connection between a semiconductor chip and a substrate or between a TCP and ITO has become a problem due to market demands for miniaturization, mainly for portable electronic devices. In addition, it has been studied to mount a driver IC or the like on a flexible printed circuit board (FPC), and it is necessary to increase the bonding strength (peeling strength) of the connection material. In particular, a polyimide resin film is used for FPC, but an adhesive material exhibiting excellent adhesion to such a polyimide resin film has not been known.
一般に接着強度を大きくするためには、接着剤バルクをより軟らかくしてタフネスパラメーターを向上させる手法が知られているが、この場合ガラス転移温度（以下、Ｔｇという場合がある）が低下したり、あるいは弾性率が大幅に低下する現象が起こる。接着強度としては、このような処理により向上が期待できるが、種々条件下における電気的接続の確保は困難になる。例えば高温、高湿エージングにおける接着強度の低下に伴い、接続部で電気抵抗が上昇することが知られており、この現象をいかに小さく抑えるかも重要である。 In general, in order to increase the adhesive strength, a technique for softening the bulk of the adhesive and improving the toughness parameter is known, but in this case, the glass transition temperature (hereinafter sometimes referred to as Tg) decreases, Or the phenomenon in which an elasticity modulus falls significantly occurs. The adhesive strength can be expected to be improved by such treatment, but it is difficult to ensure electrical connection under various conditions. For example, it is known that the electrical resistance increases at the connection portion as the adhesive strength decreases at high temperature and high humidity aging, and it is also important how to suppress this phenomenon.
本発明の課題は、接着強度および電気的接続信頼性が高く、ポリイミド樹脂フィルムを接続する場合でも有効に機械的固着と電気的接続を行うことができ、また高温多湿下において使用しても電気的接続信頼性が低下しない接続材料を得ることである。 The problems of the present invention are that the adhesive strength and electrical connection reliability are high, and even when a polyimide resin film is connected, it is possible to effectively perform mechanical fixation and electrical connection, and even when used under high temperature and high humidity. It is to obtain a connection material that does not reduce the reliability of connection.
本発明は次の接続材料である。
（１） 相対する電極を有する被接続部材を接続する接続材料であって、
熱硬化性樹脂を含有する接着剤成分を含み、
硬化後の３０℃における弾性率が０．９〜３ＧＰａ、
弾性率測定時のｔａｎδのピーク温度で表されるガラス転移温度が１００℃以上、
引張り伸び率が３％以上であり、
接着強度および電気的接続信頼性が高く、
ポリイミド樹脂フィルムを接続する場合でも有効に機械的固着と電気的接続を行うことができ、
高温多湿下において使用しても電気的接続信頼性が低下しない接続材料。
（２） 接着剤成分がガラス転移温度が５０℃以下の熱可塑性樹脂および／または平均粒径３０〜３００ｎｍのエラストマー微粒子を１〜９０重量％含有する上記（１）記載の接続材料。
（３） 接着剤成分に対し導電性粒子を０〜４０容量％含有する上記（１）または（２）記載の接続材料。
（４） 引張り伸び率が６％以上である上記（１）ないし（３）のいずれかに記載の接続材料。
The present invention is the following connecting material.
(1) A connecting material for connecting a connected member having opposing electrodes,
Including an adhesive component containing a thermosetting resin,
The elastic modulus at 30 ° C. after curing is 0.9-3 GPa,
The glass transition temperature represented by the peak temperature of tan δ when measuring the elastic modulus is 100 ° C. or higher,
The tensile elongation is 3% or more,
High adhesive strength and electrical connection reliability
Even when connecting polyimide resin film, it can effectively perform mechanical fixation and electrical connection,
A connection material that does not deteriorate the electrical connection reliability even when used under high temperature and high humidity.
(2) The connection material according to (1), wherein the adhesive component contains 1 to 90% by weight of a thermoplastic resin having a glass transition temperature of 50 ° C. or less and / or elastomer fine particles having an average particle size of 30 to 300 nm.
(3) The connection material according to the above (1) or (2), which contains 0 to 40% by volume of conductive particles with respect to the adhesive component.
(4) The connection material according to any one of (1) to (3), wherein the tensile elongation is 6% or more.
本発明において接続の対象となる被接続部材は、相対する電極、特に多数の電極を有する部材がすべて対象となる。その中でもＬＣＤのドライバーＩＣやＴＣＰ、あるいはメモリー、ＡＳＩＣ等の半導体チップのように、狭い領域に多数の電極が設けられ、電極のピッチ、幅および間隔が狭い被接続部材の電極間の接続に適している。上記の半導体チップ等の被接続部材を接続する相手としては基板の場合が多いが、本発明の接続材料は半導体チップ等を直接プリント基板に実装する場合にも、またインターポーザ等を介して実装する場合にも適用可能である。基板としてはガラス／エポキシ基板、樹脂基板、ガラス基板、フレキシブル樹脂基板など、任意の材質からなる基板がある。材質的にはポリイミド樹脂フィルムは接着性が悪いが、本発明の接続材料はこのようなポリイミド樹脂フィルムでも接着することができ、しかも、電気的接続信頼性を得ることができる。ポリイミド以外の材質についても接着可能であり、この場合一般の接続材料よりもさらに優れた接着性と電気的接続信頼性を得ることができる。 In the present invention, the members to be connected are all the electrodes facing each other, particularly members having a large number of electrodes. Among them, a large number of electrodes are provided in a narrow area, such as LCD driver IC and TCP, or a semiconductor chip such as a memory or ASIC, and it is suitable for connection between electrodes of a connected member with a narrow electrode pitch, width and interval. ing. In many cases, a substrate is connected to a member to be connected such as a semiconductor chip as described above, but the connection material of the present invention is mounted even when a semiconductor chip or the like is directly mounted on a printed circuit board or via an interposer or the like. It is also applicable to cases. Examples of the substrate include a substrate made of an arbitrary material such as a glass / epoxy substrate, a resin substrate, a glass substrate, and a flexible resin substrate. Although the polyimide resin film has poor adhesiveness in terms of material, the connection material of the present invention can be bonded even with such a polyimide resin film, and electrical connection reliability can be obtained. A material other than polyimide can also be adhered, and in this case, it is possible to obtain adhesion and electrical connection reliability superior to those of general connection materials.
本発明の接続材料は熱硬化性樹脂を含有する接着剤成分を含み、この接続材料を被接続部材間に介在させ、両側から加圧して相対する電極を押しつけて接触させ、接続材料を電極の存在しない部分に集めた状態で硬化させて接着することにより、電気的接続と機械的固着を行うように構成される。電極間は直接接触させてもよく、導電性粒子を存在させて接触させてもよい。スタッドバンプのように電極の突出部の面積が小さい場合（例えば１０００μｍ2以下の場合）に直接接触させることができるが、電極面積が大きい場合には導電性粒子を存在させるのが好ましい。導電性粒子を存在させるためには接続材料中に導電性粒子を配合する。 The connection material of the present invention includes an adhesive component containing a thermosetting resin, the connection material is interposed between the members to be connected, pressed from both sides to press and contact the opposite electrodes, and the connection material is contacted with the electrode. It is configured to be electrically connected and mechanically fixed by being cured and bonded in a collected state in a non-existing portion. The electrodes may be brought into direct contact or may be brought into contact in the presence of conductive particles. When the area of the protruding portion of the electrode is small (for example, 1000 μm 2 or less) like a stud bump, it can be brought into direct contact, but when the electrode area is large, it is preferable that conductive particles are present. In order to make the conductive particles exist, the conductive particles are blended in the connecting material.
本発明の接続材料の接着剤成分に用いる熱硬化性樹脂の主剤樹脂としてはエポキシ樹脂、ウレタン樹脂、フェノール樹脂、水酸基含有ポリエステル樹脂、水酸基含有アクリル樹脂など、硬化剤との併用により加熱下またはＵＶ等の光照射下に硬化する樹脂が制限なく使用できるが、特にその硬化温度、時間、保存安定性等のバランスからエポキシ樹脂が好ましい。エポキシ樹脂としては、ビスフェノール型エポキシ樹脂、エポキシノボラック樹脂または分子内に２個以上のオキシラン基を有するエポキシ化合物等が使用できる。これらの樹脂には市販品がそのまま使用できる。 As the main resin of the thermosetting resin used for the adhesive component of the connection material of the present invention, epoxy resin, urethane resin, phenol resin, hydroxyl group-containing polyester resin, hydroxyl group-containing acrylic resin, etc. are used under heating or UV. A resin that cures under light irradiation such as the above can be used without limitation, but an epoxy resin is particularly preferred from the balance of curing temperature, time, storage stability and the like. As the epoxy resin, a bisphenol type epoxy resin, an epoxy novolac resin, an epoxy compound having two or more oxirane groups in the molecule, and the like can be used. Commercially available products can be used as they are for these resins.
上記の熱硬化性樹脂の主剤樹脂は一般に硬化剤と併用することにより硬化反応を行うことができるが、主剤樹脂に硬化反応に寄与する官能基が結合している場合は硬化剤を省略することができる。硬化剤としてはイミダゾール、アミン、酸無水物、ヒドラジッド、ジシアンジアミド、これらの変性物など、加熱、光照射等により主剤樹脂と反応して硬化反応を行うものが使用でき、市販品でもよい。このような硬化剤としては潜在性硬化剤が好ましい。 The main resin of the above thermosetting resin can generally perform a curing reaction when used in combination with a curing agent, but omit the curing agent when a functional group contributing to the curing reaction is bonded to the main resin. Can do. As the curing agent, there can be used imidazole, amine, acid anhydride, hydrazide, dicyandiamide, modified products thereof, and the like, which undergo a curing reaction by reacting with the main resin by heating, light irradiation or the like, and may be commercially available. As such a curing agent, a latent curing agent is preferable.
潜在性硬化剤は常温における製造、保存ならびに比較的低温（４０〜１００℃）による乾燥時には硬化反応を行わず、硬化温度における加熱加圧（熱圧着）またはＵＶ等の光照射により硬化反応を行う硬化剤である。このような潜在性硬化剤としてはイミダゾール、アミン等の上記の硬化剤成分をマイクロカプセル化したものなどが特に好ましく、市販品をそのまま使用することもできる。熱活性の場合、硬化開始温度としては８０〜１５０℃のものが好ましい。 The latent curing agent does not undergo a curing reaction during production, storage at room temperature, and drying at a relatively low temperature (40 to 100 ° C.), but undergoes a curing reaction by heating and pressing at the curing temperature (thermocompression bonding) or irradiation with light such as UV. It is a curing agent. As such a latent curing agent, those obtained by encapsulating the above-mentioned curing agent components such as imidazole and amine are particularly preferable, and commercially available products can be used as they are. In the case of thermal activity, the curing start temperature is preferably 80 to 150 ° C.
本発明の接続材料はこのような熱硬化性樹脂を含有するが、前記の特性を得るためにＴｇが５０℃以下の熱可塑性樹脂および／または平均粒径３０〜３００ｎｍのエラストマー微粒子を含有することができる。熱可塑性樹脂としては、Ｔｇが５０℃以下、好ましくは３０℃以下であり、室温でゴム弾性を有する樹脂が使用でき、例えばアクリル樹脂、ポリエステル樹脂等があげられる。 The connection material of the present invention contains such a thermosetting resin, but contains a thermoplastic resin having a Tg of 50 ° C. or less and / or an elastomer fine particle having an average particle size of 30 to 300 nm in order to obtain the above-described characteristics. Can do. As the thermoplastic resin, a resin having a Tg of 50 ° C. or lower, preferably 30 ° C. or lower, and having rubber elasticity at room temperature can be used, and examples thereof include acrylic resins and polyester resins.
エラストマー微粒子としては、Ｔｇが５０℃以下、好ましくは３０℃以下であり、室温でゴム弾性を有する天然または合成ゴムの微粒子が使用でき、例えば天然ゴム（ＮＲ）、イソプレンゴム（ＩＲ）、ブタジエンゴム（ＢＲ）、スチレンブタジエンゴム（ＳＢＲ）、クロロプレンゴム（ＣＲ）、アクリロニトリルブタジエンゴム（ＮＢＲ）などがあげられる。これらのゴムは架橋ゴムが使用されるが、Ｔｇが３０℃以下であれば熱可塑性エラストマーも使用できる。エラストマー微粒子の平均粒径は３０〜３００ｎｍ、好ましくは５０〜２００ｎｍが好適である。これらのエラストマー微粒子も市販品がそのまま使用可能である。 As the elastomer fine particles, natural or synthetic rubber fine particles having a Tg of 50 ° C. or less, preferably 30 ° C. or less and having rubber elasticity at room temperature can be used. For example, natural rubber (NR), isoprene rubber (IR), butadiene rubber (BR), styrene butadiene rubber (SBR), chloroprene rubber (CR), acrylonitrile butadiene rubber (NBR), and the like. These rubbers are cross-linked rubbers, and thermoplastic elastomers can be used as long as Tg is 30 ° C. or lower. The average particle size of the elastomer fine particles is 30 to 300 nm, preferably 50 to 200 nm. Commercially available products of these elastomer fine particles can be used as they are.
本発明では接続材料に塗布性あるいはフィルム形成性を付与することを目的としてＴｇが５０℃を超える熱可塑性高分子材料を接着剤成分に配合することができる。このような熱可塑性高分子材料としてはフェノキシ樹脂、ポリエステル樹脂、アクリル樹脂等が使用できる。このほか本発明の接着剤成分には界面活性剤、カップリング剤、老化防止剤等の添加剤を配合することができる。 In the present invention, a thermoplastic polymer material having a Tg exceeding 50 ° C. can be blended in the adhesive component for the purpose of imparting coating properties or film-forming properties to the connecting material. As such a thermoplastic polymer material, a phenoxy resin, a polyester resin, an acrylic resin, or the like can be used. In addition, additives such as a surfactant, a coupling agent, and an anti-aging agent can be added to the adhesive component of the present invention.
本発明においては上記の接着剤成分のほかに導電性粒子を用いなくてもよいが、用いる場合、はんだ、ニッケル等の金属粒子、高分子核材粒子をメッキ等により導電材で被覆した導電被覆粒子、またはこれらの導電性の粒子を絶縁性樹脂で被覆した絶縁被覆導電粒子などが使用できる。これらの導電性粒子の平均粒径は１〜２０μｍ、好ましくは３〜１０μｍとすることができる。 In the present invention, it is not necessary to use conductive particles in addition to the adhesive component described above. However, when used, conductive coating in which metal particles such as solder, nickel, and polymer core material particles are coated with a conductive material by plating or the like. Particles or insulating coated conductive particles obtained by coating these conductive particles with an insulating resin can be used. These conductive particles have an average particle diameter of 1 to 20 μm, preferably 3 to 10 μm.
本発明の接続材料において、接着剤成分は熱硬化性樹脂を１０〜９９重量％、好ましくは４０〜７０重量％、Ｔｇが５０℃を超える熱可塑性樹脂を０〜５０重量％、好ましくは１０〜３０重量％、Ｔｇが５０℃以下の熱可塑性樹脂および／またはエラストマー微粒子を１〜９０重量％、好ましくは５〜３０重量％、他の添加剤を０〜１０重量％、好ましくは０〜５重量％含むことができる。導電性粒子はこれらの接着剤成分に対して０〜４０容量％好ましくは０〜３０容量％配合することができる。 In the connection material of the present invention, the adhesive component is 10 to 99% by weight of a thermosetting resin, preferably 40 to 70% by weight, and 0 to 50% by weight of a thermoplastic resin having a Tg exceeding 50 ° C., preferably 10 to 10% by weight. 30% by weight, thermoplastic resin having Tg of 50 ° C. or less and / or elastomer fine particles 1 to 90% by weight, preferably 5 to 30% by weight, other additives 0 to 10% by weight, preferably 0 to 5% by weight % Can be included. The conductive particles can be blended in an amount of 0 to 40% by volume, preferably 0 to 30% by volume, based on these adhesive components.
本発明の接続材料はペースト状またはフィルム状の形態の製品とすることができる。ペースト状とする場合は上記の各成分を選択することにより無溶媒でペースト状とすることもできるが、一般的には各成分を溶媒に溶解または分散させてペースト状とすることができる。溶媒としては、アルコール、ケトン、エステル、エーテル、フェノール類、アセタール、窒素含有炭化水素のような溶媒が使用でき、例えば、トルエン、ＭＥＫ、酢酸エチル、セロソルブアセテート等があげられる。溶媒の使用量は、樹脂成分に対して２０〜４０重量％程度である。フィルム状とする場合は上記のペーストを剥離シートにフィルム状に塗布し、溶媒を揮発させることにより成形することができる。 The connecting material of the present invention can be a product in the form of a paste or film. In the case of making a paste, it is possible to make a paste without a solvent by selecting each of the above components, but in general, each component can be dissolved or dispersed in a solvent to make a paste. As the solvent, solvents such as alcohols, ketones, esters, ethers, phenols, acetals, nitrogen-containing hydrocarbons can be used, and examples thereof include toluene, MEK, ethyl acetate, cellosolve acetate and the like. The usage-amount of a solvent is about 20 to 40 weight% with respect to the resin component. When forming into a film form, it can shape | mold by apply | coating said paste on a peeling sheet in a film form, and volatilizing a solvent.
本発明の接続材料は硬化後の３０℃における弾性率が０．９〜３ＧＰａ、好ましくは０．９〜２ＧＰａ、Ｔｇが１００℃以上、好ましくは１１０〜１８０℃、引張り伸び率が３％以上、好ましくは５〜１６％となるように前記各成分の種類および量を選ぶ。上記の各特性の測定法は次の通りである。
弾性率：ＤＭＡ法
Ｔｇ：弾性率測定時のｔａｎδのピーク温度をＴｇとする
引張り伸び率：ＪＩＳ Ｋ７１６１
The connecting material of the present invention has an elastic modulus at 30 ° C. after curing of 0.9 to 3 GPa, preferably 0.9 to 2 GPa, Tg of 100 ° C. or more, preferably 110 to 180 ° C., and a tensile elongation of 3% or more. The type and amount of each component are preferably selected to be 5 to 16%. The measuring method for each of the above characteristics is as follows.
Elastic modulus: DMA method Tg: Tensile elongation: Tg is the peak temperature of tan δ when measuring elastic modulus: JIS K7161
本発明の接続材料は、相対する電極を有する被接続部材間、例えば基板と半導体チップ間に介在させた状態で、被接続部材の両側から加圧、加熱して、樹脂を硬化させることにより接続を行う。接続材料がペースト状の場合は被接続部材の電極を含む接続領域に接続材料を塗布し、乾燥後あるいは乾燥することなく他の被接続部材を重ねて圧着し、硬化させる。接続材料がフィルム状の場合は、接続材料を被接続部材間に介在させて加圧、加熱、硬化を行う。硬化は加熱のほかＵＶ等の光照射によって行うこともできる。 The connecting material of the present invention is connected by pressing and heating from both sides of the connected member between the connected members having opposing electrodes, for example, between the substrate and the semiconductor chip, and curing the resin. I do. When the connection material is in a paste form, the connection material is applied to the connection region including the electrode of the connected member, and after other or without drying, another connected member is stacked and pressure-bonded and cured. When the connection material is in the form of a film, the connection material is interposed between the members to be connected, and pressurization, heating, and curing are performed. Curing can be carried out by irradiation with light such as UV in addition to heating.
上記の接続の工程では、被接続部材間に接続材料を介在させた状態で加熱して接続材料を溶解させ加圧すると、接続材料は電極の対向する部分から電極のない部分に流れ、電極部分が圧着する。導電粒子が含まれる場合には、導電粒子が電極間に残って電極間に接触する。電極のない部分に流れた接着剤成分はその部分で硬化して被接続部材間を固着する。これにより電極間の電気的接続と部材間の機械的固着が行われる。本発明の接続材料を用いることにより、電極の面積および間隔が狭い場合、あるいはＦＰＣのようにポリイミド樹脂フィルムを用いる場合でも機械的固着および電気的接続は良好に行われる。ポリイミド以外の被接続部材の場合も接着強度が大きくなる。 In the above connection step, when the connection material is heated and melted and pressed in a state where the connection material is interposed between the connected members, the connection material flows from the opposite portion of the electrode to the portion without the electrode, and the electrode portion Crimps. When conductive particles are included, the conductive particles remain between the electrodes and come into contact between the electrodes. The adhesive component that has flowed to the portion where there is no electrode is cured at that portion and adheres between the connected members. Thereby, the electrical connection between electrodes and the mechanical fixation between members are performed. By using the connection material of the present invention, mechanical fixation and electrical connection are satisfactorily performed even when the area and interval of the electrodes are narrow, or even when a polyimide resin film is used like FPC. In the case of a connected member other than polyimide, the adhesive strength is increased.
例えば基板に半導体チップ等を実装する場合、上記により一方の被接続部材としての半導体チップ等を、他方の被接続部材としての基板等に接続することにより実装した後、高温、多湿の環境において使用することになるが、本発明の接続材料を用いることにより、長期にわたり電気的接続信頼性が得られ、電極間の導通不良は発生しない。 For example, when mounting a semiconductor chip or the like on a substrate, the semiconductor chip or the like as one connected member is mounted by connecting it to the substrate or the like as the other connected member, and then used in a high temperature and high humidity environment. However, by using the connection material of the present invention, electrical connection reliability is obtained over a long period of time, and no conduction failure between the electrodes occurs.
本発明によれば、熱硬化性樹脂を主成分とし、特定の弾性率、Ｔｇ、引張り伸び率となるようにしたので、接着強度および電気的接続信頼性が高く、ポリイミド樹脂フィルムを接続する場合でも有効に固着と電気的接続を行うことができ、また高温多湿下において使用しても電気的接続信頼性が低下しない接続材料を得ることができる。 According to the present invention, the thermosetting resin is the main component, and the specific elastic modulus, Tg, and tensile elongation are obtained, so that the adhesive strength and electrical connection reliability are high, and the polyimide resin film is connected. However, it is possible to obtain a connection material that can be effectively fixed and electrically connected, and that the electrical connection reliability does not deteriorate even when used under high temperature and high humidity.
以下、本発明の実施形態を実施例により説明する。 Hereinafter, embodiments of the present invention will be described by way of examples.
実施例１〜５、比較例１〜３
（接続材料の調製）
熱硬化性樹脂としてエポキシ樹脂（大日本インキ化学工業社製、４０３２Ｄ、商品名）、硬化剤としてイミダゾール系硬化剤（旭化成社製、ＨＸ−３９４１ＨＰ、商品名）、エラストマー微粒子としてポリブタジエンゴム微粒子（クラレ社製、平均粒径８０ｎｍ）、Ｔｇ５０℃以下の熱可塑性樹脂としてアクリル樹脂（藤倉化成社製、ＳＧ８０、商品名、Ｔｇ：−２５℃）、Ｔｇ５０℃を超える熱可塑性樹脂としてフェノキシ樹脂（東都化成社製、ＹＰ５０、商品名、Ｔｇ：８０℃）、導電性粒子として導電被覆粒子（日本化学工業社製、ＥＨ２０ＧＮＲ、商品名、粒径５μｍ）を表１の組成で用い、溶媒としてトルエンに溶解させてペースト状の接続材料とした。これを剥離処理の施されたＰＥＴ（ポリエチレンテレフタレート）からなる剥離フィルム上に乾燥膜厚４０μｍとなるようにコーティングし、８０℃の熱風循環式オーブン中に５分間放置してフィルム状の接続材料を得た。
Examples 1-5, Comparative Examples 1-3
(Preparation of connecting material)
Epoxy resin (Dainippon Ink & Chemicals, 4032D, trade name) as thermosetting resin, Imidazole type hardener (HX-3941HP, trade name) as curing agent, Polybutadiene rubber fine particles (Kuraray) as elastomer fine particles Acrylic resin (manufactured by Fujikura Kasei Co., Ltd., SG80, trade name, Tg: -25 ° C.) as a thermoplastic resin having an average particle size of 80 nm and a Tg of 50 ° C. or less, and phenoxy resin (Toto Kasei) YP50, trade name, Tg: 80 ° C.), conductive coated particles (manufactured by Nippon Chemical Industry Co., Ltd., EH20GNR, trade name, particle size 5 μm) are used as the conductive particles in the composition shown in Table 1, and dissolved in toluene as a solvent. Thus, a paste-like connection material was obtained. This is coated on a release film made of PET (polyethylene terephthalate) that has been subjected to a release treatment so as to have a dry film thickness of 40 μm, and left in an oven with circulating air at 80 ° C. for 5 minutes to form a film-like connecting material. Obtained.
（物性試験）
弾性率の測定方法は、未硬化の接続材料を６ｃｍ×０．２ｃｍの大きさに切り出し、１８０℃で１５分間硬化後ＰＥＴフィルムから剥してサンプルとした。試験機としてオリエンテック社製バイブロンＤＤＶ０１ＦＰ（商品名）を用いチャック間距離５ｃｍ、測定周波数１１Ｈｚ、昇温速度３℃／ｍｉｎで測定した。この弾性率測定時のｔａｎδのピーク温度をＴｇとした。
(Physical property test)
The elastic modulus was measured by cutting an uncured connection material into a size of 6 cm × 0.2 cm, curing at 180 ° C. for 15 minutes, and then peeling off from the PET film as a sample. Vibron DDV01FP (trade name) manufactured by Orientec Co., Ltd. was used as a tester, and measurement was performed at a distance between chucks of 5 cm, a measurement frequency of 11 Hz, and a heating rate of 3 ° C./min. The peak temperature of tan δ at the time of measuring the elastic modulus was defined as Tg.
（引張試験）
引張試験の測定方法は、未硬化の接続材料を１ｃｍ×１５ｃｍの大きさにカッターナイフを用いて切り出し、１８０℃の熱風循環式オーブン中で１５分間硬化後、ＰＥＴフィルムから剥がしてサンプルとした。引張試験機として島津社製オートグラフＡＧＳ−Ｈおよびビデオ式伸び計ＤＶＥ−２００を用い、引張速度１ｍｍ／ｍｉｎ、チャック間距離１０ｃｍ、標線間距離５ｃｍ、測定温度２３℃で引張り伸び率を測定した。
(Tensile test)
As a measuring method of the tensile test, an uncured connection material was cut into a size of 1 cm × 15 cm using a cutter knife, cured for 15 minutes in a 180 ° C. hot air circulation oven, and then peeled off from the PET film to obtain a sample. Using a Shimadzu autograph AGS-H and a video extensometer DVE-200 as the tensile tester, the tensile elongation was measured at a tensile speed of 1 mm / min, a distance between chucks of 10 cm, a distance between marked lines of 5 cm, and a measurement temperature of 23 ° C. did.
（接続試験）
ＩＣチップ（材質：シリコン、寸法：６ｍｍ×３ｍｍ、厚さ：０．４ｍｍｔ、バンプ：金メッキ、バンプ厚：２０μｍｔ、バンプ数：２７２ピン、ピッチ：８５μｍ）を、上記フィルム状接続材料を介してＦＰＣ基板に接続した。ＦＰＣ基板は厚さ２５μｍのポリイミドフィルム（東レ社製、カプトン、商品名、寸法：４０ｍｍ×４０ｍｍ）にＩＣチップのバンプに対応して導体パターン（銅１２μｍ、ニッケル−金メッキ）を形成したものである。上記基板上に接続材料を介してＩＣチップをバンプと導体パターンが対向するように重ね１９０℃×１０秒×推力４ｋｇｆで加熱加圧して接続した。上記接続体について、９０°ピール強度を測定して接続強度とした。なお、電気的接続信頼性については、４端子法にて、初期および８５℃８５％ＲＨ雰囲気下に１０００ｈｒ放置後の接続抵抗を測定し、測定端子４０箇所の平均値で表示した。結果を表１に示す。
(Connection test)
An IC chip (material: silicon, dimension: 6 mm × 3 mm, thickness: 0.4 mmt, bump: gold plating, bump thickness: 20 μmt, number of bumps: 272 pins, pitch: 85 μm) is connected to the FPC through the film-like connecting material. Connected to the substrate. The FPC board is obtained by forming a conductor pattern (copper 12 μm, nickel-gold plating) corresponding to a bump of an IC chip on a 25 μm-thick polyimide film (Toray Industries, Kapton, trade name, dimensions: 40 mm × 40 mm). . The IC chip was stacked on the substrate via a connecting material so that the bump and the conductor pattern faced each other, and connected by heating and pressing at 190 ° C. × 10 seconds × thrust 4 kgf. About the said connection body, 90 degree peel strength was measured and it was set as connection strength. In addition, regarding the electrical connection reliability, the connection resistance after being left for 1000 hours in an initial state and an atmosphere of 85 ° C. and 85% RH was measured by a four-terminal method, and displayed as an average value at 40 measurement terminals. The results are shown in Table 1.
表１の結果より、実施例１〜５の接続材料はポリイミド樹脂フィルムに対しても優れた接着性を示し、電気的接続信頼性についても優れた結果が得られている。これに対して各特性が本発明の範囲を満足しない比較例１〜３は、接続強度に劣るものがあるほか、電気的接続性についてはいずれも劣っていることがわかる。 From the result of Table 1, the connection material of Examples 1-5 showed the adhesiveness outstanding also with respect to the polyimide resin film, and the result excellent also about the electrical connection reliability was obtained. On the other hand, it can be seen that Comparative Examples 1 to 3 whose characteristics do not satisfy the scope of the present invention are inferior in connection strength and in terms of electrical connectivity.
Claims (2)
主剤であるエポキシ樹脂と硬化剤である潜在性硬化剤からなる熱硬化性樹脂を含有する接着剤成分中に、ガラス転移温度が５０℃以下の平均粒径３０〜３００ｎｍの架橋ブタジエンゴムからなるエラストマー微粒子とガラス転移温度が５０℃以下の室温でゴム弾性を有するアクリル樹脂とを５〜３０重量％の範囲で含み、
硬化後の３０℃における弾性率が０．９〜３ＧＰａ、弾性率測定時のｔａｎδのピーク温度で表されるガラス転移温度が１００℃以上、引張り伸び率が６％以上であり、
接着強度および電気的接続信頼性が高く、ポリイミド樹脂フィルムを接続する場合でも有効に機械的固着と電気的接続を行うことができ、高温多湿下において使用しても電気的接続信頼性が低下しない接続材料。 A connection material for connecting a member to be connected having opposing electrodes,
An elastomer composed of a crosslinked butadiene rubber having an average particle size of 30 to 300 nm with a glass transition temperature of 50 ° C. or lower in an adhesive component containing a thermosetting resin composed of an epoxy resin as a main agent and a latent curing agent as a curing agent Containing 5 to 30% by weight of fine particles and an acrylic resin having rubber elasticity at room temperature having a glass transition temperature of 50 ° C. or lower,
The elastic modulus at 30 ° C. after curing is 0.9-3 GPa, the glass transition temperature represented by the peak temperature of tan δ at the time of elastic modulus measurement is 100 ° C. or higher, and the tensile elongation is 6% or higher,
Adhesive strength and electrical connection reliability are high, and even when a polyimide resin film is connected, mechanical fixation and electrical connection can be performed effectively, and electrical connection reliability does not deteriorate even when used under high temperature and high humidity. Connection material.
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|---|---|---|---|---|
| JPH05179108A (en) * | 1991-12-28 | 1993-07-20 | Kobe Steel Ltd | Thermosetting resin composition |
| JPH0625632A (en) * | 1992-07-10 | 1994-02-01 | Hitachi Chem Co Ltd | Adhesive composition and laminated film |
| JPH06260533A (en) * | 1993-03-08 | 1994-09-16 | Sony Chem Corp | Mounting of ic chip |
| WO1998003047A1 (en) * | 1996-07-15 | 1998-01-22 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
| JPH1030050A (en) * | 1996-07-15 | 1998-02-03 | Hitachi Ltd | Thermosetting resin composition for sealing semiconductor and semiconductor device using the same and its production |
| JPH11148059A (en) * | 1997-09-11 | 1999-06-02 | Hitachi Chem Co Ltd | Adhesive and electronic parts |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05179108A (en) * | 1991-12-28 | 1993-07-20 | Kobe Steel Ltd | Thermosetting resin composition |
| JPH0625632A (en) * | 1992-07-10 | 1994-02-01 | Hitachi Chem Co Ltd | Adhesive composition and laminated film |
| JPH06260533A (en) * | 1993-03-08 | 1994-09-16 | Sony Chem Corp | Mounting of ic chip |
| WO1998003047A1 (en) * | 1996-07-15 | 1998-01-22 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
| JPH1030050A (en) * | 1996-07-15 | 1998-02-03 | Hitachi Ltd | Thermosetting resin composition for sealing semiconductor and semiconductor device using the same and its production |
| JPH11148059A (en) * | 1997-09-11 | 1999-06-02 | Hitachi Chem Co Ltd | Adhesive and electronic parts |
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