CN101128886A - Insulation-coated electroconductive particles - Google Patents
Insulation-coated electroconductive particles Download PDFInfo
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- CN101128886A CN101128886A CNA2005800486907A CN200580048690A CN101128886A CN 101128886 A CN101128886 A CN 101128886A CN A2005800486907 A CNA2005800486907 A CN A2005800486907A CN 200580048690 A CN200580048690 A CN 200580048690A CN 101128886 A CN101128886 A CN 101128886A
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- insulative resin
- insulation
- electroconductive particles
- anisotropic conductive
- coated electroconductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/10—Treatment with macromolecular organic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0224—Conductive particles having an insulating coating
Abstract
To impart simultaneously excellent solvent resistance and connection reliability to insulation-coated elecroconductive particles for anisotropic conductive adhesives. [MEANS FOR SOLVING PROBLEMS] In an electroconductive particle whose surface is covered with an insulating resin layer made of an insulating resin having functional groups, the insulating resin layer is surface-treated with a polyfunctional compound having other functional groups reactive with the functional groups of the insulating resin. When the functional groups of the insulating resin are carboxyl, it is preferable to use as the polyfunctional compound a polyfunctional aziridine such as trimethylolpropane tri-ss-aziridinylpropionate, tetra- methylolmethane tri-ss-aziridinylpropionate or N,N-hexa- methylene-1,6-bis-1-aziridinecarboxamide. The insulating resin layer is constituted of an insulating resin comprising acrylic acid monomer units or methacrylic acid monomer units, preferably an acrylic acid/styrene copolymer.
Description
Technical field
The insulation-coated electroconductive particles that the present invention relates in anisotropic conductive adhesive, use.
Background technology
As the conducting particles that in anisotropic conductive adhesive, uses, in order to prevent the short circuit between conducting particles, be extensive use of the insulation-coated electroconductive particles that the surface of electroconductive particle is covered by thermoplastic insulative resin or insulating properties thermosetting resin, described electroconductive particle is metallic such as nickel, be provided with the metal-plated particles of metal cladding etc. on the surface of resin particle.
Patent documentation 1: the spy opens flat 5-217617 communique
Patent documentation 2: the spy opens flat 5-70750 communique
Patent documentation 3: the spy opens flat 11-241054 communique
Summary of the invention
; make the anisotropic conductive adhesive of membranaceous or pasty state if use above-mentioned insulation-coated electroconductive particles; solvent swell, the dissolving used in the time of then according to circumstances can existing the insulative resin layer that is overlayed on the insulation-coated electroconductive particles manufactured, the perhaps problem of insulative resin layer distortion.Under these circumstances, also the conducting reliability of anisotropic conductive adhesive is produced harmful effect.
In order to improve the solvent resistance of insulative resin layer, also considered to constitute the insulative resin layer by heat cured insulating resin composition, if but the insulative resin layer is too hard, can not use the insulative resin layer from fully getting rid of to connect between the opposed electrode that should connect, the result exists can not obtain sufficient conducting reliability problems.
The objective of the invention is to, can give excellent solvent resistance and conducting reliability simultaneously the insulation-coated electroconductive particles of the conducting particles that is suitable for anisotropic conductive adhesive.
Discoveries such as the inventor, by surface the insulative resin layer that comprises the insulative resin with functional group is set at conducting particles, with the multi-functional compounds who has in a part more than 2 with other functional groups of this functional group reactions this insulative resin layer is carried out surface treatment again, make the functional group of insulative resin layer and multi-functional compounds's functional group reactions, can improve the solvent resistance and the conducting reliability of the insulation-coated electroconductive particles that obtains, thereby finish the present invention.
Promptly, the invention provides a kind of insulation-coated electroconductive particles, this insulation-coated electroconductive particles is used the surface of insulative resin layer coated electroconductive particles, described insulative resin layer comprises the insulative resin with functional group, wherein this insulative resin layer carries out surface treatment with the multi-functional compounds, and described multi-functional compounds has more than 2 other functional groups with this functional group reactions in a part.
In addition, the invention provides a kind of manufacture method of insulation-coated electroconductive particles, it is characterized in that, with the multi-functional compounds surface treatment is carried out on the surface of this insulative resin layer of the conducting particles of the insulative resin layer lining that comprise the insulative resin with functional group, described multi-functional compounds in a part, have more than 2 can with other functional groups of this functional group reactions.
The present invention also provides a kind of anisotropic conductive adhesive, it is characterized in that, above-mentioned insulation-coated electroconductive particles is dispersed in the insulating properties binding agent.
The present invention also provides a kind of anisotropy to connect sheet material, this anisotropy connects sheet material and has the anisotropic conductive layer that comprises above-mentioned anisotropic conductive adhesive, the low low viscosity insulating properties adhesive layer of this anisotropic conductive layer of ratio of viscosities when wherein, connection being set at least one face of this anisotropic conductive layer.
In addition, the invention provides a kind of method of attachment, the conducting between the electrode of the electrode of the 1st electronic unit and the 2nd electronic unit is guaranteed in described method of attachment, simultaneously these electrodes are bondd mutually, it is characterized in that, by making above-mentioned anisotropic conductive adhesive or anisotropy connection sheet material be clipped between opposed these electrodes and carrying out pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles that contacts with the both sides of these electrodes, thereby guarantee the conducting between the opposed electrode, simultaneously electrode is bondd; And a kind of syndeton body also is provided, it is by this method of attachment the electrode of the electrode of the 1st electronic unit and the 2nd electronic unit to be connected to obtain.
The invention effect
According to the present invention, can be simultaneously give excellent solvent resistance and conducting reliability to the insulation-coated electroconductive particles of the conducting particles that is suitable for anisotropic conductive adhesive.Therefore, anisotropic conductive adhesive that obtains or anisotropy with the anisotropic conductive layer that comprises this anisotropic conductive adhesive connect sheet material even adopt to use the technology of solvent to make this insulation-coated electroconductive particles is dispersed in the insulating properties binding agent, also not only can guarantee the insulating properties of insulation-coated electroconductive particles, and the concentration that can make anisotropic conductive adhesive or anisotropy connect the insulation-coated electroconductive particles in the sheet material is high concentration.Therefore, when using anisotropic conductive adhesive or anisotropy to connect sheet material to connect between with opposed electrode, the quantity of the insulation-coated electroconductive particles that helps opposed interelectrode conducting is increased, thereby can realize low conducting resistance and high conducting reliability.
Embodiment
Insulation-coated electroconductive particles of the present invention is the insulation-coated electroconductive particles of surface the being insulated property resin bed lining of conducting particles.
In the present invention,, use insulative resin, thus, can improve the tack between conducting particles and the insulative resin layer with functional group as the insulative resin of the insulative resin layer that constitutes coated electroconductive particles.As such functional group, can enumerate carboxyl, azoles quinoline base, amino, epoxy radicals, sulfydryl or have substituting group (for example, saturated hydrocarbyl, unsaturated alkyl) of the hydrogen that to be taken off by living radical etc.Insulative resin with such functional group is the insulative resin that comprises any monomeric unit with these functional groups.
For the amount of these functional groups in the insulative resin, if very few, then solvent resistance is insufficient, and if too much, crosslink density surplus then, the conducting reliability reduces, and therefore, preferably suitably determines according to the kind of functional group or multi-functional compounds's kind.
Particularly, as insulative resin, can enumerate and comprise monomeric unit with carboxyl with carboxyl, the insulative resin of preferred acrylic monomers unit or methacrylic acid monomer unit, for example, acrylic acid styrol copolymer (PP-2000S, Dainippon Ink. ﹠ Chemicals Inc; Acid number 5mgKOH/g is following), carboxyl acid modified SDVB copolymer (SX8742A, JSR (strain) makes; The about 3.5mgKOH/g of acid number) etc.Carboxyl amount (acid number) in the insulative resin is preferably 0.1～50mgKOH/g, more preferably 0.5～5mgKOH/g.
As insulative resin with azoles quinoline base, can enumerate and comprise monomeric unit with azoles quinoline base, the insulative resin of preferred azoles quinoline base ethylene monomer unit, for example, azoles quinoline base ethylene styrene copolymer (worker's Port Network ロ ス RPS, Nippon Shokubai Co., Ltd) etc.
Comprise having amino monomeric unit, the insulative resin of preferred (methyl) acrylic acid aminoalkyl ester monomeric unit or acrylamide unit etc. as having amino insulative resin, can enumerating.Amino amount in the insulative resin is preferably 0.01～5 mM/g (insulative resin).
As insulative resin with epoxy radicals, for example, can use " high performance of epoxy resin and the compounding technique of curing agent and evaluation application (intelligence technology association of publisher Co., Ltd., 1997,12,12) epoxy resin of enumerating in " the 2nd page～40 pages.
As insulative resin with sulfydryl, can enumerate the insulative resin that comprises monomeric unit with sulfydryl, for example can enumerate the spy and open polyvinyl alcohol that contains terminal sulfydryl of putting down in writing in the flat 2004-216703 communique etc.
As comprising substituent insulative resin with the hydrogen that can be taken off by living radical, can enumerate and comprise the substituent monomer that has the hydrogen that to be taken off by living radical with becoming, the insulative resin of optimal ethylene monomer, divinylic monomer, isoprene monomer unit, for example, polyethylene, polybutadiene, polyisoprene etc.
If the thickness of insulative resin layer is too thin, then electrical insulating property is insufficient, if too thick, then on state characteristic reduces, and therefore is preferably 0.01～1 μ m, more preferably 0.1～0.5 μ m.
; as mentioned above; insulation-coated electroconductive particles of the present invention is the surface that comprises the insulative resin layer coated electroconductive particles of the insulative resin with functional group; but, be necessary when thermo-compressed is handled from being connected the insulative resin layer itself of getting rid of insulation-coated electroconductive particles between the portion in order to ensure the sufficient conducting reliability of anisotropic conductive adhesive.Therefore, under heat-treat condition, insulative resin layer itself must be thermoplastic, but when being thermoplasticity, easily by the organic solvent swelling, therefore dissolving according to circumstances has problems aspect solvent resistance.In addition because functional group, for example carboxyl easily with the epoxide group reaction of the epoxy resin that uses as the bonding component of anisotropic conductive adhesive usually, the keeping quality of anisotropic conductive adhesive is reduced.
Therefore, in the present invention, the insulative resin layer of insulation-coated electroconductive particles is carried out surface treatment with the multi-functional compounds, described multi-functional compounds have more than 2 can with other functional groups of the functional group reactions of insulative resin.This surface treatment is to make multi-functional compounds's the functional group and the functional group reactions of insulative resin.Particularly, multi-functional compounds's solution (for example ethanolic solution) can be sprayed to the surface and the heat drying of insulative resin layer usually, be heated to reaction temperature again, thereby react.Can also by functional group be combined in heat drying the time react.Perhaps can also be by putting in multi-functional compounds's the solution (for example ethanolic solution) with the conducting particles of insulative resin lining, dispersed with stirring adds thermal agitation with this state and reacts under the necessary temperature of reaction.Thus, the insulative resin laminar surface is crosslinked by the multi-functional compounds, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free functional group, therefore, even use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
The multi-functional compounds that can use in the present invention be in a part, have more than 2 can with the compound of other functional groups of the functional group reactions of insulative resin, can select according to the functional group of insulative resin.As such multi-functional compounds, can enumerate polyol compound, polyamine compounds, polyisocyanate compound, polybasic carboxylic acid compound, polyepoxy compound, many aziridine cpds, organic peroxide etc.
As the functional group of insulative resin and multi-functional compounds's preferred combination,, can enumerate many aziridine cpds, polyol compound, polyamine compounds etc. for carboxyl; For azoles quinoline base, can enumerate polybasic carboxylic acid compound etc.; For amino, can enumerate polybasic carboxylic acid compound, polyepoxy compound etc.; For epoxide group, can enumerate polyamine compounds etc.
As the object lesson of polyol compound, can enumerate PEPA, polyethylene glycol etc.
As the object lesson of polyamine compounds, can enumerate
Diamines, IPD, MDA, m-phenylene diamine (MPD), many cyclohexyl polyamines, polyamidoamines.
As the object lesson of polyisocyanate compound, can enumerate hexamethylene diisocyanate etc.
As the object lesson of polybasic carboxylic acid compound, can enumerate cyclobutane tetrabasic carboxylic acid, biphenyltetracarboxyacid acid, benzophenone biphenyltetracarboxyacid acid, PMA etc.
As the object lesson of polyepoxy compound, can enumerate bisphenol-type epoxy resin, novolac-type epoxy resin, cyclic aliphatic epoxy resin, dimerization acids 2-glycidyl ester etc.
As the object lesson of many aziridine cpds, can enumerate trimethylolpropane-three β-'-aziridino propionic ester, tetramethylol methane-three β-'-aziridino propionic ester, N, N-hexa-methylene-1,6-pair-1-aziridine formamide.Wherein, from reactive viewpoint, preferred trimethylolpropane-three β-'-aziridino propionic ester.
As the object lesson of organic peroxide etc., can enumerate benzoyl peroxide etc.
Here, as the preferred mode of insulation-coated electroconductive particles of the present invention, the situation that can be listed below: the substituting group that constitutes the insulative resin of insulative resin layer is a carboxyl, and the multi-functional compounds is many aziridine cpds.The surface treatment of this mode is the carboxyl reaction that makes the aziridine group and the insulative resin of polyfunctional aziridines compound.Particularly, the solution (for example ethanolic solution) of polyfunctional aziridines compound can be sprayed to the surface of insulative resin layer usually,, thereby react at 80～140 ℃ of following heat dryings.In addition, can also be by putting in the solution (for example ethanolic solution) of polyfunctional aziridines compound with the conducting particles of insulative resin lining, dispersed with stirring adds thermal agitation with this state and reacts under 30～80 ℃.Thus, the carboxyl of insulative resin laminar surface is crosslinked by aziridine cpd, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free carboxyl, therefore, even use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
For the reaction of '-aziridino and carboxyl, be the item (Encyclopedia ofChemical Technology, Vol.13,142-166 page or leaf (1984) etc.) that is widely known by the people.
The use amount of polyfunctional aziridines compound can be according to the suitably decisions such as degree of the carboxyl equivalent of the number of the aziridine group of aziridine cpd, insulative resin, necessary solvent resistance.
In addition, as preferred other modes of insulation-coated electroconductive particles of the present invention, the situation that can be listed below: the substituting group that constitutes the insulative resin of insulative resin layer is a azoles quinoline base, and the multi-functional compounds is a polybasic carboxylic acid.The surface treatment of this mode is the azoles quinoline radical reaction that makes the carboxyl of polybasic carboxylic acid compound and insulative resin.Particularly, the solution (for example ethanolic solution) of polybasic carboxylic acid compound can be sprayed to the surface of insulative resin layer usually,, thereby react at 80～140 ℃ of following heat dryings.In addition, can also be by putting in the solution (for example ethanolic solution) of polybasic carboxylic acid compound with the conducting particles of insulative resin lining, dispersed with stirring adds thermal agitation with this state and reacts under 30～80 ℃.Thus, the insulative resin laminar surface is crosslinked by the polybasic carboxylic acid compound, therefore can improve the solvent resistance of insulation-coated electroconductive particles and not damage the thermoplasticity of insulative resin layer, and can remove free azoles quinoline base and carboxylic acid, therefore, even use epoxy resin as bonding component, also can improve the keeping quality of anisotropic conductive adhesive.
The reaction of azoles quinoline base and polybasic carboxylic acid compound is the item that is widely known by the people, and is to be accompanied by the open loop of oxazoline ring and can to obtain carboxylic acid amide esters (CO
2CH
2CH
2NHCO-) reaction of key.
The use amount of polybasic carboxylic acid compound can be according to the suitably decisions such as degree of the azoles quinoline base equivalent of the number of the carboxylic acid of polybasic carboxylic acid compound, insulative resin, necessary solvent resistance.
As the conducting particles that uses in the insulation-coated electroconductive particles of the present invention, can use with in the past anisotropic conductive adhesive in the conducting particles of the identical formation of conducting particles used.For example can enumerate the metallic of scolding tin or nickel etc., by resin particle, glass particle or the ceramic particle of metal (nickel, gold, aluminium, copper etc.) coating lining and the particle that these particles are insulation-coated etc.Wherein, can preferably use the coating metal resin particle of easy reply electrode flatness fluctuation, for example nickel gold plating resin particle.In these conducting particless, as required, can use conducting particles with protrusion of surface.At this moment, good to the invasive of electrode, and can improve the conducting reliability.
If the average grain diameter of the conducting particles that uses among the present invention is too little, then conducting reliability reduces, if too big, then insulating reliability reduces, and therefore is preferably 2～10 μ m.
Insulation-coated electroconductive particles of the present invention can be by following method manufacturing: the surface engagement by this insulative resin layer of the conducting particles of insulative resin layer lining have can with the multi-functional compounds of other functional groups of above-mentioned functional group reactions, make the functional group of insulative resin and other compound reactions of multi-functional compounds by heating, wherein said insulative resin layer comprises the insulative resin with functional group.More specifically, can adopt usual way with insulative resin surface-coated with conducting particles, to the solution (for example ethanolic solution) of its surface spray polyfunctional aziridines compound, and at 80～140 ℃ of following heat dryings, thereby react.In addition, can also heat down at 30～80 ℃ while stirring and react by putting in the solution of polyfunctional aziridines compound with the conducting particles of insulative resin lining.At this moment, can after reaction, filter the particle that obtains handling.
Insulation-coated electroconductive particles of the present invention can be preferably uses as the conducting particles of anisotropic conductive adhesive.Such anisotropic conductive adhesive can followingly be made: adopt usual way that insulation-coated electroconductive particles is evenly mixed with organic solvent or inorganic filler as the insulating properties binding agent of bonding component and use as required.This anisotropic conductive adhesive can adopt usual way to make pasty state or membranaceous.
If the use level of insulation-coated electroconductive particles in this anisotropic conductive adhesive very little, then conducting reliability reduces, if too many, then insulating reliability reduces, and therefore is preferably 1～30 capacity %.
As the insulating properties binding agent that uses in this anisotropic conductive adhesive, can use agent of known thermoplastic insulation's cohesive or heat or light-cured type insulating properties binding agent, for example, can use the liquid insulating properties binding agent of the thermohardening type of polymerization compositions such as comprising liquid epoxy resin and curing agent components such as imidazole curing agent or modified amine curing agent, comprise the acrylic resin with the two keys of polymerism and the liquid insulating properties binding agent of curing catalysts, comprise acrylic compounds, SBR, SIS, thermoplastic resins such as polyurethane, the liquid rubber class binding agent of rubber resin etc. etc.
In addition, in the insulating properties binding agent, can also contain as required and not show close-burning film formation property resin, for example phenoxy resin, mylar, polyurethane resin, SEBS resin, SIS resin, NBR resin etc.
As required, can also in anisotropic conductive adhesive, cooperate various additives, for example tackifier, surfactant etc.
Anisotropic conductive adhesive of the present invention can be made by the insulative resin coated electroconductive particles is dispersed in the insulating properties binding agent according to usual way.
Anisotropic conductive adhesive of the present invention can connect sheet material as anisotropy by being shaped to that stratiform is made anisotropic conductive layer and use.The low low viscosity insulating properties adhesive layer of ratio of viscosities anisotropic conductive layer when at this moment, connection being set at least one face of anisotropic conductive layer preferably.When constituting like this, because the viscosity of the ratio of viscosities low viscosity insulating properties adhesive layer of anisotropic conductive layer uprises relatively when connecting, therefore can suppress flowing of anisotropic conductive layer, and can prevent that conducting particles from flowing out between the electrode that will connect, thereby can improve the conducting reliability more.
The viscosity of the ratio of viscosities low viscosity insulating properties adhesive layer of the anisotropic conductive layer during preferred the connection is high at least more than 10 times.
Such low viscosity insulating properties adhesive layer can use by the composition of adjusting the insulating properties binding agent that uses in the above-mentioned anisotropic conductive adhesive and make those that its viscosity reduces.
The thickness of low viscosity insulating properties adhesive layer is preferably set at when connecting and can produce short circuit because of the conducting particles that flows out in the interelectrode gap, and can fill the thickness in gap at least.According to circumstances, by to the excessive filling in gap, around the coupling part, form and overflow portion, can be used as encapsulant or damp-proof material works.
Anisotropy with low viscosity insulating properties adhesive layer connects sheet material can be according to usual way, with anisotropic conductive layer and low viscosity insulating properties adhesive layer by the laminated method of dry type or successively rubbing method carry out lamination and make.
Anisotropic conductive adhesive of the present invention or anisotropy connect sheet material can be preferred for following situation: guarantee the interelectrode conducting of electrode with substrate grade in an imperial examination 2 electronic units that are used to load the substrate of semiconductor chip or be used for liquid crystal drive of semiconductor chip or liquid crystal display cells grade in an imperial examination 1 electronic unit, simultaneously these electrodes are bondd mutually.At this moment, be clipped between opposed these electrodes anisotropic conductive adhesive or anisotropy connection sheet material and pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles that contacts with the both sides of these electrodes, thereby can guarantee opposed interelectrode conducting, simultaneously electrode be bondd.Therefore, the electrode of the electrode of the 1st electronic unit and the 2nd electronic unit is connected and the syndeton body that obtains shows good conducting reliability.
Embodiment
Below, specifically describe the present invention by embodiment.
Comparative example 1
Adopt usual way will form the conducting particles (AU204 of Ni/Au electroless plating on the surface of the styrene resin particle of diameter 4 μ m, ponding chemical industrial company) the thick acrylic acid styrol copolymer (PP-2000S of surface-coated 0.2 μ m, Dainippon Ink. ﹠ Chemicals Inc), obtain the insulation-coated electroconductive particles of comparative example 1.
Embodiment 1
5 weight portion trimethylolpropane-three β-'-aziridino propionic ester (TAZM) is dissolved in 95 parts by weight of ethanol, the solution that obtains is sprayed on the insulation-coated electroconductive particles that comparative example 1 obtains with having no to omit, at 100 ℃ of following heat dryings, carry out cross-linking reaction, obtain the insulation-coated electroconductive particles of embodiment 1.
Embodiment 2
The insulation-coated electroconductive particles that 100 weight portion comparative examples 1 are obtained is dispersed in 100 parts by weight of ethanol, in this dispersion liquid, add 2 weight portion trimethylolpropane-three β-'-aziridino propionic ester (TAZM) and dispersed with stirring, under 65 ℃, added thermal agitation 4 hours, after carrying out cross-linking reaction, isolated by filtration, drying is 30 minutes under 80 ℃, obtains the insulation-coated electroconductive particles of embodiment 2.
Embodiment 3
Except use tetramethylol methane-three β-'-aziridino propionic ester (TAZO) replaces trimethylolpropane-three β-'-aziridino propionic ester (TAZM), carry out operation similarly to Example 2, obtain the insulation-coated electroconductive particles of embodiment 3.
Embodiment 4
Except use N, N-hexa-methylene-1,6-pair-1-aziridine formamide (HDU) replaces trimethylolpropane-three β-'-aziridino propionic ester (TAZM) in addition, carries out operation similarly to Example 2, obtains the insulation-coated electroconductive particles of embodiment 4.
(evaluation)
Each insulation-coated electroconductive particles of 10 weight portion comparative examples 1 and embodiment 1～4 is put in 3 kinds of solvents of 90 parts by weight of toluene, MEK or ethyl acetate, at room temperature placed 100 hours, make the insulation-coated electroconductive particles sedimentation, take its supernatant.With the supernatant heating of taking, remove volatile ingredient, measure the weight of fixedness composition.This fixedness composition is equivalent to be dissolved in the weight of the insulative resin in the solvent.The ratio (weight %) that is dissolved in the solvent in the insulative resin is as shown in table 1.
With the insulation-coated electroconductive particles drying of sedimentation, the dry insulation-coated electroconductive particles that will obtain again is filled into (φ 6mm * 125 μ m) between a pair of copper electrode, applies voltage between electrode, measures the voltage (proof voltage) that leaks.The result who obtains is as shown in table 1.
In addition, adhesive composition is coated on the PETG film that lift-off processing crosses, and to make dry thickness be 25 μ m, drying is 5 minutes under 80 ℃, form tack coat, make bonding sheet, described adhesive composition comprises 35 weight portion phenoxy resin (YP50, Dongdu changes into (strain)), 30 weight portion epoxy resin (YL980, japan epoxy resin, epoxide equivalent 185g/eq), 35 weight portion epoxies disperse imidazole curing agent (HX3941HP, Asahi Chemical Industry's (strain)), 20 weight portion conducting particless (conducting particles of embodiment 1～4 or comparative example 1), 40 parts by weight of toluene and 40 weight portion ethyl acetate.Arrive on short circuit evaluation that the ITO wiring that will be arranged on the broach shape under 210 ℃ of temperature, the condition in 10 seconds of crimping time on the glass substrate had is crimped on this bonding sheet with the TEG (chip size 25 * 2.5mm, several 8376 of salient point, bump size 35 * 55 μ m, salient point gap 10 μ m) that insulate the face of tack coat with bonding machine.And the insulation resistance between the mensuration salient point, calculate the short circuit incidence.The result who obtains is as shown in table 1.
[table 1]
| Solvent | Assessment item | Comparative example | Embodiment | |||
| 1 | 1 | 2 | 3 | 4 | ||
| Toluene | Dissolving share (weight %) | 26.9 | 7.5 | 3.8 | 4.0 | 8.3 |
| Proof voltage (kV) | 0.4 | 2.0 | 2.4 | 2.3 | 1.8 | |
| MEK | Dissolving share (weight %) | 27.4 | 8.2 | 4.4 | 6.1 | 8.7 |
| Proof voltage (kV) | 0.5 | 1.9 | 2.2 | 2.0 | 1.5 | |
| Ethyl acetate | Dissolving share (weight %) | 26.6 | 7.2 | 4.0 | 5.8 | 7.9 |
| Proof voltage (kV) | 0.6 | 2.1 | 2.6 | 2.1 | 1.6 | |
| Short circuit incidence (%) | 6.2 | 0.3 | 0.0 | 0.0 | 0.5 | |
As shown in Table 1, compare with the insulation-coated electroconductive particles of the comparative example of not handling with aziridine cpd 1, for any solvent, the solvent resistance of the insulation-coated electroconductive particles of embodiment 1～4 and proof voltage are all excellent.Therefore, conducting reliability also is improved.And the incidence of short circuit is very little, can expect good storage stability.
Embodiment 5
(1) formation of anisotropic conductive layer
Following blended resin composition is dissolved in MEK and the mixed solvent of toluene with the identical weight mixing, obtain the resin solution of 40 weight %, described blended resin composition comprises: 50 weight portion phenoxy resin (YP50, Dongdu company that changes into makes), 25 weight portion solid epoxy resin (EP1009, japan epoxy resin company), 25 weight portions contain the liquid-state epoxy resin (HX3941HP, company of Asahi Chemical Industry makes) of microcapsule-type potentiality curing agent.
The thick nickel of lining 0.2 μ m on the polystyrene particle of average grain diameter 3 μ m, use azoles quinoline modified polystyrene resin (エ Port Network ロ ス RPS again, Japan catalyst company) will the be covered surface of coating metal resin particle of the thick gold of 0.02 μ m is covered, and it is thick to make it to reach 0.2～0.5 μ m, handle with BTCA again, make insulation-coated electroconductive particles, the insulation-coated electroconductive particles that obtains is dispersed in the resin solution of previous preparation with 10 volume %.
With roll coater the dispersion liquid that obtains is coated on polysiloxanes and has carried out on the lift-off processing face of PETG (PET) film of lift-off processing, and to make dry thickness be that 5 μ m are thick, drying is 5 minutes under 80 ℃, forms anisotropic conductive layer on PET.
(2) formation of low viscosity insulating properties adhesive layer
Following blended resin composition is dissolved in MEK and the mixed solvent of toluene with the identical weight mixing, obtain the resin solution of 40 weight %, described blended resin composition comprises: 50 weight portion solid epoxy resin (EP1009, japan epoxy resin company) and 50 weight portions contain the liquid-state epoxy resin (HX3941HP, company of Asahi Chemical Industry make) of microcapsule-type potentiality curing agent.The resin solution that use obtains according to operation same when forming anisotropic conductive layer, is made thick low viscosity insulative resin layer and the thick low viscosity insulative resin layer of 3 μ m of 12 μ m that does not contain conducting particles on the PET of lift-off processing film.
(3) anisotropic conductive sheet material
Formerly the anisotropic conductive layer of Zhi Zuoing thick low viscosity insulating resin layer of face superimposed layer 12 μ m at the thick low viscosity insulative resin layer of another face superimposed layer 3 μ m, is made the anisotropic conductive sheet material of embodiment 1.
Comparative example 2
Except replace similarly to Example 5, making the anisotropic conductive sheet material beyond azoles quinoline modified styrene resin is covered to the surface of conducting particles with the thick polystyrene resin of 0.2～0.5 μ m (G100C, Japan ス チ ロ Le company).
Comparative example 3
Except using the liquid-state epoxy resin (HX3941HP that contains microcapsule-type potentiality curing agent, company of Asahi Chemical Industry) solidfied material (0.2～0.5 μ m is thick) replaces beyond azoles quinoline modified styrene resin is covered to the surface of conducting particles, similarly to Example 5, make the anisotropic conductive sheet material.
(4) estimate
(4a) the conducting particles number of each electrode of IC chip (salient point)
Before estimating, prepare the IC chip and the circuit substrate that are used to connect.The specification of the IC chip that is used to estimate is: chip size 2.5mm is square, several 8376 of salient point, gold-plated bump size 35 * 55 μ m, salient point gap 10 μ m, bump height 15 μ m.Circuit substrate is provided with the ITO wiring on glass substrate.The anisotropic conductive sheet material is clipped between this IC chip and the circuit substrate, under 210 ℃ of temperature of arrival, the condition of 10 seconds crimping time, carries out thermo-compressed, obtain the syndeton body with bonding machine.Use circuit substrate unilateral observation 200 salient points of the light microscope of 340 times of multiplying powers, count the conducting particles number on the salient point that remains in the IC chip from this syndeton body.The result who obtains is as shown in table 2.From the viewpoint of conducting reliability, wish at residual conducting particles more than 5 on the salient point.
(4b) conducting reliability
Make and the same sample of sample that is used to estimate the conducting particles number on each salient point of IC chip, working pressure cooking test device (EHS-411, バ ィ エ ス ペ Star Network company) is implemented 24 hours etching to this sample.After etching finishes, measure the opposed interelectrode conducting resistance of sample.The result who obtains is as shown in table 2.With conducting resistance is that average evaluation below 20 Ω is " G " (well), will be " NG " (bad) above the average evaluation of 20 Ω.
(4c) insulating reliability
The same sample of sample that uses in the evaluation of making and conducting reliability is measured the adjacent interelectrode insulation resistance of this sample.The result who obtains is as shown in table 2.With insulation resistance less than 1 * 10
8The average evaluation of Ω is " NG " (bad), is 1 * 10 with insulation resistance
8The above average evaluation of Ω is " G " (well).
[table 2]
| Conducting particles number on the salient point | The conducting reliability | Insulating reliability | |
| Embodiment 5 | 20 | G | G |
| Comparative example 2 | 19 | G | NG |
| Comparative example 3 | 22 | NG | G |
By the result of the embodiment 5 of table 2 as can be known, if low viscosity insulating properties adhesive layer is set on anisotropic conductive layer, then the conducting particles that remains in when connecting on the salient point increases, and therefore enter into adjacent interelectrode conducting particles number and reduce relatively, thereby insulating reliability improves.
In addition, do not have under the situation of material as the comparative example 2 of the insulative resin of insulation-coated electroconductive particles of functional group in use, owing to can not obtain surface-crosslinked structure, therefore measurable reduction to solvent resistance, in fact, its insulating reliability is poor.In addition we know, the situation of comparative example 3, though promptly have functional group as the insulative resin of insulation-coated electroconductive particles, self is full solidification, the not reaction of expectability and BTCA has problems on the conducting reliability.
Industrial applicability
The solvent resistance of insulation-coated electroconductive particles of the present invention and proof voltage are excellent, the conducting reliability is improved, and the incidence of short circuit is very little, can expect good storage stability, therefore, the conducting particles as anisotropic conductive adhesive is useful.
Claims (13)
1. insulation-coated electroconductive particles, it is the insulative resin layer lining of insulative resin with functional group of conducting particles surperficial involved and the insulation-coated electroconductive particles that forms, wherein, this insulative resin layer by have in a part more than 2 can with multi-functional compounds's surface treatment of other functional groups of its functional group reactions.
2. the described insulation-coated electroconductive particles of claim 1, wherein, the functional group of insulative resin is carboxyl, azoles quinoline base, amino, epoxy radicals, sulfydryl or the substituting group with the hydrogen that can be taken off by living radical.
3. the described insulation-coated electroconductive particles of claim 1, wherein, the multi-functional compounds is polyol compound, polyamine compounds, polyisocyanate compound, polybasic carboxylic acid compound, polyepoxy compound, many aziridine cpds or organic peroxide.
4. the described insulation-coated electroconductive particles of claim 1, wherein, the functional group of insulative resin is a carboxyl, the multi-functional compounds is many aziridine cpds.
5. claim 3 or 4 described insulation-coated electroconductive particles, wherein, aziridine cpd is trimethylolpropane-three β-'-aziridino propionic ester, tetramethylol methane-three β-'-aziridino propionic ester or N, N-hexa-methylene-1,6-pair-1-aziridine formamide.
6. each described insulation-coated electroconductive particles in the claim 1～4, wherein, this insulative resin layer is by the insulative resin with acrylic monomers unit or methacrylic acid monomer unit.
7. the described insulation-coated electroconductive particles of claim 6, wherein, this insulative resin is the acrylic acid styrol copolymer.
8. the manufacture method of insulation-coated electroconductive particles, wherein, with the multi-functional compounds surface treatment is carried out on the surface of this insulative resin layer of the conducting particles of the insulative resin layer lining that comprise the insulative resin with functional group, wherein said multi-functional compounds in a part, have more than 2 can with other functional groups of this functional group reactions.
9. anisotropic conductive adhesive, it is that each described insulation-coated electroconductive particles of claim 1-7 is dispersed in the insulating properties binding agent and forms.
10. the described anisotropic conductive adhesive of claim 9, wherein, the insulating properties binding agent contains epoxy resin.
11. anisotropy connects sheet material, it has the anisotropic conductive layer that comprises claim 9 or 10 described anisotropic conductive adhesive, the low low viscosity insulating properties adhesive layer of this anisotropic conductive layer of ratio of viscosities when wherein, on the one side at least of this anisotropic conductive layer, connection being set.
12. method of attachment, this method is guaranteed the conducting between the electrode of the electrode of the 1st electronic unit and the 2nd electronic unit, simultaneously these electrodes are bondd mutually, wherein, by making the described anisotropy connection of claim 9 or 10 described anisotropic conductive adhesive or claim 11 sheet material be clipped between opposed these electrodes and carrying out pressurized, heated, the insulative resin layer of getting rid of this contact portion of the insulation-coated electroconductive particles that contacts with the both sides of these electrodes, thereby guarantee the conducting between the opposed electrode, simultaneously electrode is bondd.
13. the syndeton body, it is by the described method of attachment of claim 12 electrode of the 1st electronic unit and the electrode of the 2nd electronic unit to be formed by connecting.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005048948A JP5099284B2 (en) | 2005-02-24 | 2005-02-24 | Anisotropic connection sheet material |
| JP048948/2005 | 2005-02-24 | ||
| PCT/JP2005/003115 WO2006090467A1 (en) | 2005-02-24 | 2005-02-25 | Insulation-coated electroconductive particles |
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| CN101128886B CN101128886B (en) | 2014-03-26 |
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| KR (2) | KR101163436B1 (en) |
| CN (1) | CN101128886B (en) |
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| CN106318244A (en) * | 2015-07-02 | 2017-01-11 | 玮锋科技股份有限公司 | Nuclear layer technology anisotropic conductive film |
| CN106688051A (en) * | 2014-11-20 | 2017-05-17 | 积水化学工业株式会社 | Conductive particles, method for manufacturing conductive particles, conductive material, and connection structure |
| CN110875101A (en) * | 2018-08-31 | 2020-03-10 | 玮锋科技股份有限公司 | Anisotropic conductive film structure and manufacturing method thereof |
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| EP2079084A4 (en) * | 2006-10-17 | 2010-09-08 | Hitachi Chemical Co Ltd | Coated particle and method for producing the same, anisotropic conductive adhesive composition using coated particle, and anisotropic conductive adhesive film |
| JP4957695B2 (en) * | 2007-10-02 | 2012-06-20 | 日立化成工業株式会社 | Conductive particle, method for producing the same, method for producing insulating coated conductive particle, and anisotropic conductive adhesive film |
| KR101148143B1 (en) * | 2008-12-17 | 2012-05-23 | 제일모직주식회사 | Insulated conductive particles and anisotropic conductive film composition using the same |
| JP5788130B2 (en) * | 2008-12-26 | 2015-09-30 | 日本発條株式会社 | Conductive resin film and method for producing the same |
| JP4957838B2 (en) | 2009-08-06 | 2012-06-20 | 日立化成工業株式会社 | Conductive fine particles and anisotropic conductive materials |
| JP5398455B2 (en) * | 2009-09-30 | 2014-01-29 | デクセリアルズ株式会社 | Anisotropic conductive film and manufacturing method thereof |
| JP6518101B2 (en) * | 2014-03-26 | 2019-05-22 | 積水化学工業株式会社 | PHOTO-CURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE |
| JP6592350B2 (en) * | 2014-12-26 | 2019-10-16 | 積水化学工業株式会社 | Anisotropic conductive material, connection structure, and manufacturing method of connection structure |
| CN107077914B (en) * | 2015-02-19 | 2019-05-31 | 积水化学工业株式会社 | Conductive paste and connection structural bodies |
| JP6294973B2 (en) * | 2015-08-24 | 2018-03-14 | 積水化学工業株式会社 | Conductive material and connection structure |
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| JPH0559338A (en) * | 1991-08-30 | 1993-03-09 | Sekisui Chem Co Ltd | Tack agent composition, tack processed product and its production |
| JP4080573B2 (en) * | 1997-08-01 | 2008-04-23 | ソニー株式会社 | Planar lens, method of manufacturing the same, and screen for rear projection projector |
| JP3296306B2 (en) * | 1997-10-28 | 2002-06-24 | ソニーケミカル株式会社 | Anisotropic conductive adhesive and adhesive film |
| US5965064A (en) * | 1997-10-28 | 1999-10-12 | Sony Chemicals Corporation | Anisotropically electroconductive adhesive and adhesive film |
| JP2000305181A (en) * | 1999-04-23 | 2000-11-02 | Sony Corp | Planar lens, its manufacture and screen for rear projection type projector |
| JP2001106928A (en) * | 1999-07-30 | 2001-04-17 | Dainippon Ink & Chem Inc | Conductive material-capsuled resin particle and its product ion |
| DE10016041A1 (en) * | 2000-03-31 | 2001-10-04 | Stockhausen Chem Fab Gmbh | Powdery surface crosslinked polymers |
| KR20030051732A (en) * | 2000-10-23 | 2003-06-25 | 세키스이가가쿠 고교가부시키가이샤 | Coated particle |
| JP5060692B2 (en) * | 2001-07-13 | 2012-10-31 | 株式会社日本触媒 | Anisotropic conductive material |
| TW557237B (en) * | 2001-09-14 | 2003-10-11 | Sekisui Chemical Co Ltd | Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| JP4050086B2 (en) * | 2002-04-24 | 2008-02-20 | ナトコ株式会社 | Conductive particles, conductive materials, and anisotropic conductive films |
| JP2005063804A (en) * | 2003-08-12 | 2005-03-10 | Matsushita Electric Works Ltd | Illuminance sensor device of remote monitoring control system |
| JP4539813B2 (en) * | 2003-08-19 | 2010-09-08 | ソニーケミカル＆インフォメーションデバイス株式会社 | Insulation coated conductive particles |
| JP5177439B2 (en) * | 2009-06-23 | 2013-04-03 | デクセリアルズ株式会社 | Insulation coated conductive particles |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106688051A (en) * | 2014-11-20 | 2017-05-17 | 积水化学工业株式会社 | Conductive particles, method for manufacturing conductive particles, conductive material, and connection structure |
| CN106688051B (en) * | 2014-11-20 | 2019-03-29 | 积水化学工业株式会社 | Electroconductive particle, the manufacturing method of electroconductive particle, conductive material and connection structural bodies |
| CN106318244A (en) * | 2015-07-02 | 2017-01-11 | 玮锋科技股份有限公司 | Nuclear layer technology anisotropic conductive film |
| CN110875101A (en) * | 2018-08-31 | 2020-03-10 | 玮锋科技股份有限公司 | Anisotropic conductive film structure and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
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| TWI257741B (en) | 2006-07-01 |
| KR101163436B1 (en) | 2012-07-13 |
| HK1116595A1 (en) | 2008-12-24 |
| KR20110134946A (en) | 2011-12-15 |
| KR101246516B1 (en) | 2013-03-26 |
| TW200631240A (en) | 2006-09-01 |
| JP5099284B2 (en) | 2012-12-19 |
| CN101128886B (en) | 2014-03-26 |
| JP2006236759A (en) | 2006-09-07 |
| WO2006090467A1 (en) | 2006-08-31 |
| KR20070105972A (en) | 2007-10-31 |
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