CN100561677C - 晶圆表面平坦化的方法 - Google Patents
晶圆表面平坦化的方法 Download PDFInfo
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- CN100561677C CN100561677C CNB2007100443866A CN200710044386A CN100561677C CN 100561677 C CN100561677 C CN 100561677C CN B2007100443866 A CNB2007100443866 A CN B2007100443866A CN 200710044386 A CN200710044386 A CN 200710044386A CN 100561677 C CN100561677 C CN 100561677C
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- dielectric layer
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CNB2007100443866A CN100561677C (zh) | 2007-07-30 | 2007-07-30 | 晶圆表面平坦化的方法 |
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CNB2007100443866A CN100561677C (zh) | 2007-07-30 | 2007-07-30 | 晶圆表面平坦化的方法 |
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CN101359595A CN101359595A (zh) | 2009-02-04 |
CN100561677C true CN100561677C (zh) | 2009-11-18 |
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CNB2007100443866A Expired - Fee Related CN100561677C (zh) | 2007-07-30 | 2007-07-30 | 晶圆表面平坦化的方法 |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101958276B (zh) * | 2009-07-16 | 2012-11-14 | 中芯国际集成电路制造(上海)有限公司 | 在晶圆上形成互连通孔失败的补救方法 |
CN102034701B (zh) * | 2009-09-25 | 2014-05-07 | 无锡华润上华半导体有限公司 | 一种形成介质层的方法以及抛光方法 |
CN102044482B (zh) * | 2009-10-20 | 2013-03-06 | 中芯国际集成电路制造(上海)有限公司 | 沟槽的形成方法 |
CN102044430A (zh) * | 2009-10-23 | 2011-05-04 | 无锡华润上华半导体有限公司 | 一种抛光晶圆的方法 |
CN102814725B (zh) * | 2011-06-08 | 2015-11-25 | 无锡华润上华科技有限公司 | 一种化学机械研磨方法 |
CN102637238B (zh) * | 2012-05-09 | 2013-12-25 | 中国科学院微电子研究所 | 一种晶圆表面的研磨去除率的计算方法 |
EP2858112A4 (en) * | 2012-05-30 | 2016-04-13 | Olympus Corp | METHODS OF MANUFACTURING IMAGING DEVICE, AND SEMICONDUCTOR DEVICE |
DE102013201663B4 (de) | 2012-12-04 | 2020-04-23 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
CN105097774B (zh) * | 2014-05-14 | 2019-04-09 | 中芯国际集成电路制造(上海)有限公司 | 芯片晶圆及其制作方法 |
CN107344327B (zh) * | 2017-05-05 | 2019-11-22 | 清华大学 | 在线改良晶圆表面平坦度的方法 |
CN108682613B (zh) * | 2018-03-29 | 2021-02-26 | 广东先导先进材料股份有限公司 | 半导体晶片的处理方法 |
JP2019201030A (ja) * | 2018-05-14 | 2019-11-21 | 東芝メモリ株式会社 | 半導体装置の製造方法 |
CN110064984A (zh) * | 2019-05-06 | 2019-07-30 | 西安奕斯伟硅片技术有限公司 | 一种晶圆处理方法及装置 |
CN112992708B (zh) * | 2019-12-16 | 2024-07-05 | 中微半导体设备(上海)股份有限公司 | 一种半导体器件的制作方法 |
CN113436960B (zh) * | 2021-05-13 | 2023-02-28 | 上海新硅聚合半导体有限公司 | 一种提高薄膜cmp抛光厚度均匀性的方法 |
CN117524870B (zh) * | 2023-12-29 | 2024-06-11 | 物元半导体技术(青岛)有限公司 | 一种晶圆加工方法及晶圆 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111124 |
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Effective date of registration: 20111124 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Granted publication date: 20091118 Termination date: 20190730 |