CN100543589C - Decompression dry device - Google Patents
Decompression dry device Download PDFInfo
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- CN100543589C CN100543589C CNB2005101296032A CN200510129603A CN100543589C CN 100543589 C CN100543589 C CN 100543589C CN B2005101296032 A CNB2005101296032 A CN B2005101296032A CN 200510129603 A CN200510129603 A CN 200510129603A CN 100543589 C CN100543589 C CN 100543589C
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- 230000006837 decompression Effects 0.000 title claims abstract description 33
- 239000007789 gas Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000001035 drying Methods 0.000 claims abstract description 26
- 239000011261 inert gas Substances 0.000 claims abstract description 24
- -1 acryl Chemical group 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000000203 mixture Substances 0.000 abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 59
- 229910052757 nitrogen Inorganic materials 0.000 description 30
- 230000009471 action Effects 0.000 description 13
- 230000007246 mechanism Effects 0.000 description 12
- 230000003028 elevating effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000010926 purge Methods 0.000 description 7
- 230000032258 transport Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
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- Physics & Mathematics (AREA)
- Atmospheric Sciences (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The object of the present invention is to provide a kind of composition of films such as photoresist that can prevent attached to the decompression dry device in the off-gas pump.This decompression dry device possesses on every side chamber (10), off-gas pump (50), first open and close valve (41), second open and close valve (42), the 3rd open and close valve (43) of covered substrate (W).By opening first open and close valve (41) (10) in the chamber are carried out exhaust, the photoresist on the interarea that is formed on substrate (W) is carried out drying under reduced pressure after, close first open and close valve (41) and stop the exhaust of aforementioned cavity (10).Then, by opening second open and close valve (42) when off-gas pump (50) is supplied with inert gas, open the 3rd open and close valve (43) and to aforementioned cavity (10) in the supply inert gas.
Description
Technical field
The present invention relates to a kind of decompression dry device.
Background technology
Disclose the decompression dry device that a kind of film to the photoresist that applies on the substrate etc. carries out drying under reduced pressure in the patent documentation 1, described substrate for example is semiconductor wafer, display panels with glass substrate or use in semiconductor manufacturing apparatus mask substrate etc.The decompression dry device that this patent documentation 1 is put down in writing, by with off-gas pumps such as dry vacuum pumps to reducing pressure in the chamber that has been transported into substrate, thereby promote evaporation as the solvent at the center of the composition of liquid against corrosion, make the photoresist can be promptly dry.Using such decompression dry device to come can prevent the influence of external factors such as wind or heat under the situation of dry photoresist, and can dry equably photoresist.
Also have, when using such decompression dry device, after having begun the drying under reduced pressure processing, and then be called as the phenomenon of bumping sometimes.This is because of the solvent composition that is coated in the photoresist on the substrate surface sharply evaporates, and seethes with excitement suddenly and the phenomenon that produces.When such bumping takes place, produce be called as deaeration on the surface of photoresist, form the phenomenon of vesicle, and cause using this substrate.Therefore,, in chamber, carry out the generation that exhaust prevents deaeration, afterwards, by to carrying out powerful exhaust in the chamber, and the whole face of substrate is carried out rapidly and dry uniformly with low speed in the starting stage that drying under reduced pressure is handled.
Patent documentation 1:JP spy opens flat 7-283108 communique.
Constitute in the photoresist of film, for example, colored filter (Color Filter) contains the resist of acryl resin with resist or organic membrane with resist (Organic Resist) etc., has the character of the easy curing along with the variation of time.Therefore, use such colored filter with resist or when containing the resist of acryl resin, occur in the problem of adhering to resist in the off-gas pump as photoresist.
That is, carrying out drying under reduced pressure when handling, at the initial stage in exhaust process, be present in inert gas in the chamber etc. and pass through off-gas pump in large quantities.On the other hand, in the mid-term of exhaust process, the solvent composition in the photoresist begins gasification.At this moment, almost there is not inert gas etc. in the chamber, so the solvent composition of the high concentration that is comprised in the gas is by the inside of pump.
At this moment, generally use dry vacuum pump as off-gas pump.This dry vacuum pump is the pump of screw type, has such structure, that is, by rotary blade in case (ロ-), thus gas is compressed and makes it to move and carry out exhaust.When invading such situation of solvent composition of high concentration in off-gas pump, the solvent composition of photoresist was attached to the impeller part of pump when gas was compressed.And when taking place to pile up attached to the solvent composition on the impeller, the exhaust action of meeting supply and exhaust pump brings obstacle.
In addition, in such dry vacuum pump, in the middle of being maintained, impeller and case have the contactless state at very little interval, so a spot of purge gas that circulating in the pump.Therefore, can prevent adhering to of solvent composition by the flow that increases this purge gas, if but when adopting such structure, the problem that the exhaust performance that produces off-gas pump reduces, the vacuum tightness of chamber reduces.
Summary of the invention
The present invention proposes for addressing the above problem, and its purpose is to provide a kind of decompression dry device that can prevent to adhere in the off-gas pump composition of films such as photoresist.
(1), the present invention is a kind of decompression dry device, and the film on the interarea that is formed on substrate is carried out drying under reduced pressure, it is characterized in that having: chamber, around its covered substrate; Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity; First open and close valve, it is configured between aforementioned off-gas pump and the aforementioned cavity, by opening aforementioned first open and close valve to carrying out exhaust in the aforementioned cavity, thereby the film on the interarea that is formed on substrate is carried out drying under reduced pressure, after stopping the exhaust of aforementioned cavity, in the pipeline that connects aforementioned first open and close valve and aforementioned off-gas pump, supply with inert gas closing aforementioned first open and close valve.
(2), the present invention is a kind of decompression dry device, and the film on the interarea that is formed on substrate is carried out drying under reduced pressure, it is characterized in that having: chamber, around its covered substrate; Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity; First open and close valve, it is arranged between aforementioned off-gas pump and the aforementioned cavity; Second open and close valve, it is connected with the pipeline that is connected aforementioned first open and close valve and aforementioned off-gas pump, is used for importing inert gas to this pipeline; The 3rd open and close valve, it is used for supplying with inert gas in aforementioned cavity; Control device, it is by opening aforementioned first open and close valve to carrying out exhaust in the aforementioned cavity, thereby the film on the interarea that is formed on substrate is carried out drying under reduced pressure, closing aforementioned first open and close valve after stopping the exhaust of aforementioned cavity, open aforementioned second open and close valve and in the pipeline that connects aforementioned first open and close valve and aforementioned off-gas pump, supply with inert gas, and, open aforementioned the 3rd open and close valve and in aforementioned cavity, supply with inert gas.
(3), as in above-mentioned (2) described invention, aforementioned control part is opened aforementioned second open and close valve and the 3rd open and close valve simultaneously.
(4), the present invention is a kind of decompression dry device, and the film on the interarea that is formed on substrate is carried out drying under reduced pressure, it is characterized in that having: chamber, around its covered substrate; Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity; First open and close valve, it is arranged between aforementioned off-gas pump and the aforementioned cavity; The inert gas feedway, it supplies with inert gas to aforementioned off-gas pump; Control device, it is controlled in following such mode: reach in the chamber by the exhaust of being undertaken by aforementioned off-gas pump after the predefined vacuum tightness, close aforementioned first open and close valve, increase simultaneously by the flow of aforementioned inert gas feedway to the inert gas of off-gas pump supply.
(5), as each described invention in above-mentioned (1)～(4), wherein, aforementioned film is to be made of with resist or the resist that contains acryl resin colored filter.
(6), as each described invention in above-mentioned (1)～(4), wherein, aforementioned off-gas pump is a dry vacuum pump.
According to above-mentioned (1), (2) and (4) described invention, because behind drying under reduced pressure, supply with inert gas to the pipeline that connects first open and close valve and off-gas pump, supply with inert gas to off-gas pump, thereby can prevent to adhere in the off-gas pump composition of film such as photoresist via this pipeline.
According to above-mentioned (3) described invention, owing to open second open and close valve and the 3rd open and close valve simultaneously, so that the structure that control device is used becomes is simple.
According to above-mentioned (4) described invention, can prevent the colored filter that easily solidifies with resist or the composition of resist that contains acryl resin attached in the off-gas pump.
According to above-mentioned (5) described invention, when gas is compressed, can prevent from easily to take place the resist that solidifies attached to dry vacuum pump in.
Description of drawings
Fig. 1 is the synoptic diagram of decompression dry device of the present invention.
Fig. 2 is the block scheme of the main electrical structure of expression decompression dry device of the present invention.
Fig. 3 is the process flow diagram of the dry action of expression.
Fig. 4 is the process flow diagram of the dry action of expression.
Fig. 5 is the process flow diagram of the dry action of expression.
Fig. 6 is the process flow diagram of the dry action of expression.
Embodiment
Below, based on the description of drawings embodiments of the present invention.Fig. 1 is the synoptic diagram of decompression dry device of the present invention.
This decompression dry device has: the chamber 10 that is made of cap 11, seal 12, base 13; Setting is arranged on the fulcrum post 15 on the base 13 in this chamber 10; Setting is provided with the support plate 22 of a plurality of lifter pins 21.On its interarea, applied as the colored filter of film with resist or organic membrane substrate W with the resist that contains acryl resin of resist etc., in chamber 10, with the flat-hand position of its interarea, supporting by fulcrum post 15 or lifter pin 21 towards the top.
Be formed with exhausr port 31 on the base 13 in chamber 10.This exhausr port 31 is connected with off-gas pump 50 via pipeline 53, first open and close valve 41 and pipeline 51.This off-gas pump 50 moves it and the dry vacuum pump that carries out the screw type of exhaust constitutes when by rotary blade gas being compressed.Dispose purge gas on this off-gas pump 50 and supply with the pipeline 54 of usefulness.A spot of nitrogen always supplies in this off-gas pump 50 via this pipeline 54, and cleans in this off-gas pump 50.
Also have, this off-gas pump 50 is connected with gas-liquid separation portion 56 via pipeline 55.Gas from off-gas pump 50 is discharged after liquid component is removed by gas-liquid separation portion 56, is discharged in the atmosphere or exhaust gas region.
On the pipeline 51 that connects first open and close valve 41 and off-gas pump 50, be connected with second open and close valve 42 via pipeline 52.This second open and close valve 42 is used for supplying with nitrogen by pipeline 51,52 to off-gas pump 50, is connected with the supply source of not shown nitrogen.
In addition, sometimes adhere to the chromatic colour optical filter in the pipeline 51 with resist or contain the resist of acryl resin, but remove cleaning, so make optimum seeking site that pipeline 52 is connected with pipeline 51 near first open and close valve 41 attached to the resists in this pipeline 51 by nitrogen.
On the base 13 in chamber 10, be formed with nitrogen input port 32.On this nitrogen input port 32, be connected with the 3rd open and close valve 43 via pipeline 57.The 3rd open and close valve 43 is used for supplying with nitrogen via pipeline 57 in chamber 10, is connected with the supply source of not shown nitrogen.
Fig. 2 is the block scheme of the main electrical structure of expression decompression dry device of the present invention.
This decompression dry device has control part 60, this control part 60 by memory storage control needed operation program ROM61, constitute at the RAM62 of when control temporary storaging data etc., the CPU63 that carries out K-theoretic operation K.This control part 60 is connected with above-mentioned first open and close valve 41, second open and close valve 42 and the 3rd open and close valve 43 via interface 64.In addition, this control part 60 also is connected with other driving mechanisms 65 that comprise above-mentioned elevating mechanism 25 and be used for driving mechanism that the cap 11 to chamber 10 opens and closes etc.
Then, describe at the film on the interarea that is formed on substrate being carried out dry drying action by this decompression dry device.Fig. 3 and Fig. 4 are the process flow diagrams that the drying of the decompression dry device of this invention of expression is moved.
When the film on the interarea that is formed on substrate W is carried out drying,, close first, second, third open and close valve 41,42,43 at first.Under this state, make cap 11 risings in the chamber 10 open chamber 10 (step S11) by not shown elevating mechanism.Then, the not shown arm that transports of supporting substrates W enters in the chamber 10 (step S12).
Then, by the driving of elevating mechanism 25, lifter pin 21 rises to the delivery position (step S13) of substrate W with support plate 22.Thus, the substrate W that transports arm and supported is supported by lifter pin 21.Thereby transport arm and in chamber 10, withdraw from (step S14).
Then, by the driving of elevating mechanism 25, lifter pin 21 drops to dry place (step S15) with support plate 22.Thus, its lower surface is arrived fulcrum post 15 by the substrate W that lifter pin supports by transfer.And,, the cap 11 of chamber 10 is descended, thereby closes chamber 10 (step S16) by not shown elevating mechanism.
Under this state, open first open and close valve 41, carry out a spot of exhaust (step S17) by the effect of off-gas pump 50.Like this, when carrying out drying under reduced pressure, utilize, can under the state of the deaeration that prevents to cause, carry out suitable drying under reduced pressure by bumping from the central extrorse airflow slowly of the interarea of substrate W by a spot of air capacity.
After process regular hour (step S18) under this state, the driving of switching off-gas pump 50 makes from the air capacity of exhausr port 31 to increase (step S19).At this moment, at the interarea of substrate W, produce from its extrorse bigger airflow of central authorities.Like this, when carrying out drying under reduced pressure, drying is carried out in the whole zone of the interarea of substrate W rapidly by bigger air capacity.And owing in the dry engineering that small amount of exhaust gas carries out film has been carried out drying to a certain degree above-mentioned passing through, so can be owing to bumping causes the deaeration generation.
Under this state,, just open the 3rd open and close valve 43 and in chamber 10, supply with nitrogen, with in the nitrogen purge chamber 10 (step S21) if the vacuum tightness that goes out in the chamber 10 by not shown sensor reaches predefined value (step S20).And, meanwhile, carry out the valve change action (step S22) of closing first open and close valve 41 and opening second open and close valve 42.
Under this state, a large amount of nitrogen from second open and close valve 42 via pipeline 52 and pipeline 51 and flow into the off-gas pump 50.That is, the flow of nitrogen is increased to ormal weight from zero.Thus, colored filter is flowed out to gas-liquid separation portion 56 with nitrogen with resist or the solvent composition that contains the resist of acryl resin.Thereby, can prevent to be attached with on the off-gas pump 50 colored filter with resist or contain the composition of the resist of acryl resin.And, at this moment, when can carry out the removing of the resist that adheres on the off-gas pump 50, also can carry out removing of the resist that adheres on the pipeline 51.
In addition, even make a large amount of nitrogen flow into off-gas pump 50 like this, because the vacuum tightness in the chamber 10 reaches predefined value, and is the state of closing first open and close valve 41, can carry out the dried of substrate well so also do not influence the vacuum tightness in the chamber 10.
In addition, in this embodiment, carry out the on-off action of first, second, third open and close valve 41,42,43 simultaneously.In view of the above, can make and carry out timer that on-off action uses etc. and become simple, also the structure that control device is used becomes simple.
If become atmospheric pressure (step S23) by cleaning in the chamber 10 from the nitrogen of the 3rd open and close valve 43, stop with regard to closing second open and close valve 42 supplying with nitrogen, close the 3rd open and close valve 43 simultaneously and stop nitrogen purge (step S24) chamber 10 to off-gas pump 50.In addition, also carry out the on-off action of second, third open and close valve 42,43 this moment simultaneously.Thus, can make and carry out timer that on-off action uses etc. and become simple, also the structure that control device is used becomes simple.
Then, make the cap 11 of chamber 10 rise open chamber 10 (step S25) by not shown elevating mechanism.Then, by the driving of elevating mechanism 25, make lifter pin 21 rise to the delivery position (step S26) of substrate W with support plate 22.
Under this state, the not shown arm that transports enters in the chamber 10 (step S27).And by the driving of elevating mechanism 25, fulcrum post 21 is with support plate 22 declines (step S28).In view of the above, the substrate W that lifter pin 21 is supported supports by transporting arm.And the arm that transports that is supporting substrate W withdraws from (step S29) in chamber 10.
Then, other embodiments that move at the drying of this decompression dry device describe.Fig. 5 and Fig. 6 are the process flow diagrams that the drying of the decompression dry device of this invention of expression is moved.
In the above-described embodiment, if become atmospheric pressure (step S23) by cleaning in the chamber 10 from the nitrogen of the 3rd open and close valve 43, then stop when off-gas pump 50 is supplied with nitrogen by closing second open and close valve 42, stop nitrogen purge (step S24) by closing open and close valve 43 to chamber 10, in view of the above, can make and carry out timer that on-off action uses etc. and become simple, also the structure that control device is used becomes simple.
With respect to this, in the present embodiment, open the supply of second open and close valve, 42 beginnings to off-gas pump 50, through after the predefined time, close second open and close valve 42 and stop to supply with nitrogen to off-gas pump 50.Other action is identical with above-mentioned embodiment.
Promptly, in this embodiment, in chamber 10, supply with nitrogen by opening the 3rd open and close valve 43, and utilize nitrogen that chamber 10 is cleaned back (step S21), if become atmospheric pressure (step S23a) in the chamber 10, stop to supply with nitrogen (step S24a) to chamber 10 with regard to closing the 3rd open and close valve 43.On the other hand, meanwhile, open second open and close valve 42 and beginning after off-gas pump 50 is supplied with nitrogen (step S22), and through (step S23b) after the predefined regular hour, close second open and close valve 42 and stop to supply with nitrogen (step S24b) to off-gas pump 50.According to present embodiment, can make service time from nitrogen to off-gas pump 50 that supply with, be attached to the time of off-gas pump 50 with resist or the composition that contains the resist of acryl resin for being fit to prevent colored filter.
In addition, in the above-mentioned embodiment, all be such structure: the pipeline 52 that the pipeline 51 that is connected with off-gas pump 50 is connected with the supply source of nitrogen by connection, and supply with a large amount of nitrogen to off-gas pump 50.But, also can adopt following structure: on pipeline 54 from purge gas to off-gas pump 50 that supply with, flow control valve is set, and after the vacuum tightnesss in the chamber 10 reach predefined value and close first open and close valve 41, flow into a large amount of nitrogen by pipeline 54 to off-gas pump 50, prevent from off-gas pump 50, to adhere to colored filter thus with resist or contain the composition of the resist of acryl resin.
Claims (10)
1. a decompression dry device carries out drying under reduced pressure to the film on the interarea that is formed on substrate, it is characterized in that having:
Chamber is around its covered substrate;
Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity;
First open and close valve, it is configured between aforementioned off-gas pump and the aforementioned cavity,
By opening aforementioned first open and close valve to carrying out exhaust in the aforementioned cavity, thereby the film on the interarea that is formed on substrate is carried out drying under reduced pressure, after stopping the exhaust of aforementioned cavity, in the pipeline that connects aforementioned first open and close valve and aforementioned off-gas pump, supply with inert gas closing aforementioned first open and close valve.
2. decompression dry device as claimed in claim 1 is characterized in that, aforementioned film is to be made of with resist or the resist that contains acryl resin colored filter.
3. decompression dry device as claimed in claim 1 is characterized in that, aforementioned off-gas pump is a dry vacuum pump.
4. a decompression dry device carries out drying under reduced pressure to the film on the interarea that is formed on substrate, it is characterized in that having:
Chamber is around its covered substrate;
Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity;
First open and close valve, it is arranged between aforementioned off-gas pump and the aforementioned cavity;
Second open and close valve, it is connected with the pipeline that is connected aforementioned first open and close valve and aforementioned off-gas pump, is used for importing inert gas to this pipeline;
The 3rd open and close valve, it is used for supplying with inert gas in aforementioned cavity;
Control device, it is by opening aforementioned first open and close valve to carrying out exhaust in the aforementioned cavity, thereby the film on the interarea that is formed on substrate is carried out drying under reduced pressure, closing aforementioned first open and close valve after stopping the exhaust of aforementioned cavity, open aforementioned second open and close valve and in the pipeline that connects aforementioned first open and close valve and aforementioned off-gas pump, supply with inert gas, and, open aforementioned the 3rd open and close valve and in aforementioned cavity, supply with inert gas.
5. decompression dry device as claimed in claim 4 is characterized in that, aforementioned control part is opened aforementioned second open and close valve and aforementioned the 3rd open and close valve simultaneously.
6. as claim 4 or 5 described decompression dry devices, it is characterized in that aforementioned film is to be made of with resist or the resist that contains acryl resin colored filter.
7. as claim 4 or 5 described decompression dry devices, it is characterized in that aforementioned off-gas pump is a dry vacuum pump.
8. a decompression dry device carries out drying under reduced pressure to the film on the interarea that is formed on substrate, it is characterized in that having:
Chamber is around its covered substrate;
Off-gas pump, it carries out exhaust to the environment in the aforementioned cavity;
First open and close valve, it is arranged between aforementioned off-gas pump and the aforementioned cavity;
The inert gas feedway, it supplies with inert gas to aforementioned off-gas pump;
Control device, it is controlled in following such mode: reach in the chamber by the exhaust of being undertaken by aforementioned off-gas pump after the predefined vacuum tightness, close aforementioned first open and close valve, increase simultaneously by the flow of aforementioned inert gas feedway to the inert gas of off-gas pump supply.
9. decompression dry device as claimed in claim 8 is characterized in that, aforementioned film is to be made of with resist or the resist that contains acryl resin colored filter.
10. decompression dry device as claimed in claim 8 is characterized in that, aforementioned off-gas pump is a dry vacuum pump.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005070283A JP2006253517A (en) | 2005-03-14 | 2005-03-14 | Reduced-pressure dryer |
| JP2005070283 | 2005-03-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1834791A CN1834791A (en) | 2006-09-20 |
| CN100543589C true CN100543589C (en) | 2009-09-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101296032A Expired - Fee Related CN100543589C (en) | 2005-03-14 | 2005-12-16 | Decompression dry device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006253517A (en) |
| KR (1) | KR100730449B1 (en) |
| CN (1) | CN100543589C (en) |
| TW (1) | TWI272650B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903959A (en) * | 2012-12-26 | 2014-07-02 | 大日本网屏制造株式会社 | Decompression drying device and decompression drying method |
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| TWI283005B (en) * | 2005-12-28 | 2007-06-21 | Au Optronics Corp | Low-pressure process apparatus |
| JP5089288B2 (en) * | 2007-01-26 | 2012-12-05 | 大日本スクリーン製造株式会社 | Vacuum dryer |
| JP2008192642A (en) | 2007-01-31 | 2008-08-21 | Tokyo Electron Ltd | Substrate processing apparatus |
| JP5371605B2 (en) * | 2008-09-25 | 2013-12-18 | 東京エレクトロン株式会社 | Vacuum drying apparatus and vacuum drying method |
| JP5298041B2 (en) * | 2010-02-03 | 2013-09-25 | 株式会社カワタ | Drying apparatus and inert gas replacement method |
| JP6141479B1 (en) * | 2016-03-18 | 2017-06-07 | エスペック株式会社 | Drying equipment |
| JP6872328B2 (en) * | 2016-09-06 | 2021-05-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Vacuum drying device, vacuum drying system, vacuum drying method |
| CN106526915B (en) * | 2016-11-28 | 2019-04-30 | 武汉华星光电技术有限公司 | Board cleaning drying device and its maintaining method |
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| JPS6236530U (en) * | 1985-08-21 | 1987-03-04 | ||
| JPS63260028A (en) * | 1986-11-19 | 1988-10-27 | Tokyo Ohka Kogyo Co Ltd | Heat stabilizer for photoresist |
| JPS63291624A (en) * | 1987-05-23 | 1988-11-29 | Showa Denko Kk | Treatment of exhaust gas in dry etching of gallium-arsenide wafer |
| US5025571A (en) * | 1990-04-25 | 1991-06-25 | Savant Instruments, Inc. | Vacuum pump with heated vapor pre-trap |
| JP3029767B2 (en) * | 1994-04-07 | 2000-04-04 | 大日本スクリーン製造株式会社 | Thin film forming equipment |
| JPH11294957A (en) * | 1998-04-07 | 1999-10-29 | Takaoka Electric Mfg Co Ltd | Drying device of electric machinery and apparatus |
| JP2000199480A (en) * | 1998-12-25 | 2000-07-18 | Kissei Pharmaceut Co Ltd | Safety mechanism for vacuum system |
| JP4328436B2 (en) * | 1999-12-20 | 2009-09-09 | 三菱電機株式会社 | Degreasing and cleaning method and cleaning apparatus |
| JP3739287B2 (en) * | 2001-02-14 | 2006-01-25 | 東京エレクトロン株式会社 | Vacuum drying method and coating film forming apparatus |
| JP4153686B2 (en) * | 2001-09-26 | 2008-09-24 | 大日本スクリーン製造株式会社 | Film forming liquid drying equipment |
| KR100464853B1 (en) * | 2002-06-20 | 2005-01-06 | 삼성전자주식회사 | Method and apparatus for drying wafer by instant decompressing and heating |
| JP4335786B2 (en) * | 2004-11-29 | 2009-09-30 | 大日本スクリーン製造株式会社 | Vacuum dryer |
-
2005
- 2005-03-14 JP JP2005070283A patent/JP2006253517A/en active Pending
- 2005-11-25 TW TW094141626A patent/TWI272650B/en active
- 2005-12-16 CN CNB2005101296032A patent/CN100543589C/en not_active Expired - Fee Related
- 2005-12-20 KR KR1020050126415A patent/KR100730449B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103903959A (en) * | 2012-12-26 | 2014-07-02 | 大日本网屏制造株式会社 | Decompression drying device and decompression drying method |
| CN103903959B (en) * | 2012-12-26 | 2017-04-26 | 斯克林集团公司 | Decompression drying device and decompression drying method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1834791A (en) | 2006-09-20 |
| KR20060100916A (en) | 2006-09-21 |
| JP2006253517A (en) | 2006-09-21 |
| TWI272650B (en) | 2007-02-01 |
| TW200632990A (en) | 2006-09-16 |
| KR100730449B1 (en) | 2007-06-19 |
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