CN100407879C - 电容器内置型印刷电路板制造方法 - Google Patents

电容器内置型印刷电路板制造方法 Download PDF

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CN100407879C
CN100407879C CN2004100861736A CN200410086173A CN100407879C CN 100407879 C CN100407879 C CN 100407879C CN 2004100861736 A CN2004100861736 A CN 2004100861736A CN 200410086173 A CN200410086173 A CN 200410086173A CN 100407879 C CN100407879 C CN 100407879C
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capacitor
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李信基
高永周
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DAI-DUK ELECTRONICS Co Ltd
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    • H05K2201/0335—Layered conductors or foils
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
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    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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Abstract

本发明涉及电容器以一体地内置在印刷电路板的电容器内置型印刷电路板制造方法，使用具备超薄膜厚度的绝缘体的涂有树脂的铜箔，形成电容器叠层板，从而防止在外层蚀刻步骤中上板电极的导热板或者接地板一起消失。而且，根据本发明的电容器内置型印刷电路板制造方法使用超薄膜绝缘体，因此使激光钻孔步骤中发生的偏差最小化，可准确地体现电容器静电容量，可加大射束点尺寸而提高作业性。

Description

电容器内置型印刷电路板制造方法
技术领域
本发明涉及电容器以一体地内置在印刷电路板(PCB；Printed CircuitBoard)的电容器内置型印刷电路板制造方法，特别涉及在超薄膜5～10μm的涂绝缘层的铜箔(比如，涂有树脂的铜箔/resin coated copper foil，以下简称为RCC)中去除铜箔之后，再次使用RCC或者绝缘物质预浸料坯(PREPREG)和铜箔，使其绝缘层具有容量性功能而制造电容器的电容器内置型印刷电路板制造方法。
背景技术
印刷电路板上内置无源元件(passive elements)时，能节约无源元件的制造单价，还能节约安装无源元件时候的安装费用。并且，明显减少在无源元件的热焊接接合中发生的杂音和自感应，同时由于将无源元件变换为内置型，从而可致力于减少印刷电路板的面积而节约成本以及产品的小型化。
另一方面，作为电容器内置在印刷电路板的现有技术有大韩民国专利第227,528号。现有技术被称为ZBC-2000方法，上述现有技术是将具有1～2mil(25～50μm)厚度的绝缘体装入在铜箔之间而形成叠层板，该叠层板起着电容器的作用。
但是，由于现有技术将一般性的环氧树脂作为绝缘体使用，所以具有电容器的静电容量小的缺点。为了解决如这样的现有技术具有的问题，本申请人曾经在2002年10月24日申请专利的大韩民国专利申请第10-2002-0065114号中提出过将具备1～2mil的绝缘体的RCC层叠在铜箔上而形成均匀厚度的绝缘层的技术。
但是，根据上述专利申请第10-2002-0065114号所公开的电容器内置制造技术，在底板电极为隔板(clearance pad)、上板电极为导热板(thermal pad)或者接地板(ground)的状况下，为了形成上述隔板，在进行外层蚀刻以及激光钻孔加工之后，将RCC绝缘体作为防蚀涂层(etching resist)使用去除铜箔。这时，在外层蚀刻步骤中发生上板电极的导热板或接地板一起消失的问题。
因此，为了解决上述问题，在制造现场中作为便利的方法，通过变更制作上设计、或者事先一一区分相关部位来解决。但是，在产品的尺寸大而事先需要一一区分的部位多或复杂时，利用上述便利的方法区分时，操作时间变长，因操作者失误而发生不良产品的可能性变大。
发明内容
因此，本发明的第一目的在于，提供最小化电容器的制造偏差并可体现高静电容量值的电容器内置型印刷电路板制造方法。
本发明的第二目的在于，附加于上述第一目的，提供在外层蚀刻步骤中上板电极的导热板或者接地板不会消失的电容器内置型印刷电路板制造方法。
为了实现上述目的，本发明提供在形成电极图案的内层叠层板上面层叠电容器叠层板而制造电容器内置型印刷电路板的方法，该电容器内置型印刷电路板制造方法包括：步骤a，在上述内层叠层板的铜箔表面上面，层叠涂有几微米至几十微米厚度的树脂的铜箔RCC而形成叠层板；步骤b，在腐蚀去除上述电容器叠层板的铜箔中的不必要的部分之后，去除露出的上述树脂部位；步骤c，在进行上述步骤b之后，以剩下的树脂绝缘体作为保护膜(防蚀涂层)去除露出的铜箔；步骤d，在表面以绝缘体露出的上述内层叠层板上，二次层叠涂有树脂的铜箔或者预浸料坯和铜箔；步骤e，通过防蚀涂层制作图案，腐蚀去除二次层叠的叠层板的铜箔中不必要的铜箔而形成图案(pattern)；步骤f，在上述步骤e形成图案的二次叠层板的铜箔上面，在完成的内层上层叠涂有树脂的铜箔或者预浸料坯和铜箔；步骤g，加工直到上述电容器的电极板上的导通孔或者贯通孔并镀金上述导通孔内部而使其导通。
附图说明
图1a至图1j是示出根据本发明的电容器内置型印刷电路板制造方法的作业流程的图。
其中，附图标记说明如下：
100           内层叠层板的绝缘层
101、102      电容器的底板电极
103a、104a    超薄膜(5～10μm)绝缘体
110b、111b     电容器上板电极
130            导通孔
具体实施方式
在以下，参照附图1a至附图1j详细说明根据本发明的电容器内置型印刷电路板制造方法。
图1a至图1j是示出根据本发明的电容器内置型印刷电路板制造方法的作业流程的图。参照图1a，首先制作在绝缘层内层100上完全铜箔101、102状态的叠层板。在此，作为内层100材料一般使用环氧树脂(epoxy)和玻璃纤维(glass fiber)。
参照图1b，内层叠层板100、101、102上层叠超薄膜绝缘体103a、104a。在此，超薄膜绝缘体103a、104a的厚度维持在约5～10μm左右，作为良好的实施例可使用RCC。另外，由于内层为完全铜箔101、102，所以在层叠RCC时可使树脂厚度偏差最小化。
参照图1c，根据腐蚀去除不必要部分的铜箔105、106之后，利用激光钻孔选择性地去除绝缘层。此时，由于对超薄膜5～10μm绝缘层进行激光钻孔，所以可使用比较大的光束尺寸(beam size)来执行钻孔工程。根据本发明的良好地实施例，可使用几mm大小的光束尺寸。此时，由激光钻孔去除的绝缘体部分的上部和下部的长度之差出现得很小，这是因为绝缘膜的厚度为超薄膜的原因。即，被去除的上面和下面部分的长度几乎相同，所以构成偏差小的底板电极。
其结果，可使电容器的静电容量的偏差最小化。而且，本发明可将激光光束尺寸最大化到几mm左右，因此可提高作业性，与目前使用中的100～400μm大小的光束尺寸比较时，至少可改善10～50倍的作业性。
再参照图1c，底板电极为隔板、上板电极为导热板或者接地板时，上板电极由蚀刻而消失。接着，参照图1d，使用防蚀涂层去除RCC绝缘体的铜箔103b、104b部分。此时，就不需要如干膜(dry film)这样的另外的防蚀涂层。
参照图1e，二次层叠RCC或者预浸料坯110a、111a和铜箔110b、111b。接着，如图1f所示，使用干膜115或者相应于此的防蚀涂层来保护必要部分的铜箔。
参照图1g以及图1h，部分地去除表面的不必要的部分铜箔，接着剥离干膜。由此，电容器以绝缘膜103a、110a为中间层，形成两个板110b、101。参照图1i，将RCC或者预浸料坯120a、121a和铜箔120b、121b层叠在完成的内层电容器层上，用与一般PCB相同的方法加工导通孔130和贯通孔140(步骤S1j)。
上述的内容为了更好地理解后述发明的权利要求范围，更广泛地示出了本发明的特征和技术优点。以下将详细说明构成本发明的权利要求范围的附加特征和优点。该技术领域中的人员应知道所示出的本发明概念和特征实施例作为执行本发明和类似目的的其它结构的设计或修改的基础可立即使用。
而且，在本发明中所示的发明概念和实施例作为为了实现本发明的相同目的而修改或设计成其它结构的基础，将由该技术领域的人员所使用。而且，由该技术领域的人员的如此的修改或变更的结构是，在不超出权利要求中记载的发明的思想或范围的限度内，可进行多样变化、置换以及变更。
如上所述，本发明使用超薄膜厚度的绝缘体5～10μm RCC在完全具有铜箔的状态下层叠而使电容器厚度偏差最小化，为了不必要的内层的铜箔部分的去除，在蚀刻去除外层铜箔之后用激光钻孔去除绝缘体，使用防蚀涂层去除铜箔之后将剩下的绝缘体二次层叠，由此可防止在外层蚀刻步骤中上板电极的导热板或者接地板一起消失。
而且，根据本发明的电容器内置型印刷电路板制造方法，由于使用超薄膜绝缘体，所以将在激光钻孔步骤中发生的偏差最小化，因此可使电容器静电容量准确，加大射束点(beam spot)尺寸而提高作业性。

Claims (1)

1.一种电容器内置型印刷电路板制造方法，在形成电极板的内层叠层板上面层叠电容器叠层板而制造电容器内置型印刷电路板，该方法包括：
步骤(a)，在上述内层叠层板的铜箔表面上面，层叠涂有几微米至几十微米厚度的树脂的铜箔而形成电容器叠层板；
步骤(b)，在腐蚀去除上述电容器叠层板的铜箔中的不必要的部分之后，去除露出的上述树脂部位；
步骤(c)，在进行上述步骤(b)之后，以剩下的树脂绝缘体作为保护膜去除露出的铜箔；
步骤(d)，在表面以绝缘体露出的上述内层叠层板上，二次层叠涂有树脂的铜箔或者预浸料坯和铜箔；
步骤(e)，通过防蚀涂层制定图案，腐蚀去除二次层叠的叠层板的铜箔中不必要的铜箔而形成图案；
步骤(f)，在上述步骤(e)形成图案的二次叠层板的铜箔上面，在完成的内层上层叠涂有树脂的铜箔或者预浸料坯和铜箔；
步骤(g)，加工直到上述电容器的电极板上的导通孔或者贯通孔并镀金上述导通孔内部而使其导通。
CN2004100861736A 2003-11-21 2004-10-22 电容器内置型印刷电路板制造方法 Expired - Fee Related CN100407879C (zh)

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