TWI278260B - Method of manufacturing capacitor-embedded printed circuit board - Google Patents

Method of manufacturing capacitor-embedded printed circuit board Download PDF

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Publication number
TWI278260B
TWI278260B TW093130287A TW93130287A TWI278260B TW I278260 B TWI278260 B TW I278260B TW 093130287 A TW093130287 A TW 093130287A TW 93130287 A TW93130287 A TW 93130287A TW I278260 B TWI278260 B TW I278260B
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Taiwan
Prior art keywords
stage
copper
copper foil
capacitor
prepreg
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TW093130287A
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English (en)
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TW200520651A (en
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Shin-Ki Lee
Young-Joo Ko
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Daeduck Electronics Co Ltd
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Description

1278260 九、發明說明： 【發明所屬之技術領域】 本發明涉及電容益以一體裝入在印刷電路板(PCB; printed Circuit Board)的内置電容器型印刷電路板製造方法，尤其涉及在超 薄膜(5〜10/zm)絕緣塗層銅箔（比如：RCC;微记⑺獅 fml)中解除銅之後再次使用Rcc或者絕緣物質預浸料 (PREPREG)和鋪似絕緣層具有容量性魏而觀電容器的内 置電容器型印刷電路板製造方法。 印刷电路板上内置被動元件(passiveelem_)時，節約被動元 件的製造單價並節約安裝被動元件時候的費用。並且，明顯減少 在被動元件的熱4接接合巾發生的雜音和感應，同時内置被動元 件而減少印刷電路板的面積並節約成本以及使產品小型化。 【先前技術】 另一方面，大韓民國專利第227,528號是内置電容器的印刷電 路^傳統技術。把傳職術_ ZBC_2_綠，上麟統技術 把厚度為1〜2 mil(25〜50/m)的絕緣體設在銅箱之間並形成疊層 板，此疊層板起電容器的作用。 值是’傳統技術把一般性的環氧樹脂作為絕緣體使用，所以 具錢容器的靜電容量小的缺點。為了解決像這樣的傳統技術的 二題’本^凊人冒經在2()()2年1()月％日中請專利的大韓民國申 。月專利弟10-2002-0065114號中提供具備卜2 _絕緣體的把rcc 1278260 豐層在銅落上而形成均勻厚度絕緣層的技術。 但是，根據上述申請專利第⑽〇2_〇〇65n4號的内置電容哭 製造技術’在絲酬dearaneepad，战 pad)或者接地(g職d)_兄下為了形成上述如咖_進行 卜a H以及域鑽孔加工之後把Rcc絕緣體作為防韻塗層 (感gresist)使用並解除銅落。這時，在外層钱刻階段發生I 板電極的熱板或者接地板一起消失的問題。 因此’為了解決上述問題在製造車間作為臨時方法變更譽迭 設計或’事絲分相_位崎決_。但是產品的尺寸大而、事 =區分的部位多或複上述鱗方法的分操 也很長，因操作者失細發生次品的可祕也大。 【發明内容】 因此，本發明的第-目的在於提供最小 並體現高靜電容量值的内置電衮哭耵衣以偏差 型印刷電路板的製造方法。 比^發明的第二目的在於提供附加上述第—目的，在外層钱刻 IW又裏上板電極的熱板或者接地 θ 電路板的製造方法。 不^失的内置電容器型印刷 【實施方式】 見二：’本發明提供形成電極板的内層疊層板上面 4 W㈣層板而製如置電容_物電路板 塗膠 述内層疊層板的鋪表面上岭錢㈣_十《厚度i 1278260 i t 脂銅f_c)而形成疊層板的階段；⑻上述電容器疊層板銅猪中 4钕解除不必要的部分之後解除露出的上述膠脂部位的階段；（C) 進行上述階段（b)之後把剩下_脂作為保護膜（防健層）使 用亚解除路出銅羯的階段；⑷表面作為絕緣體露出的上述内層 且層板上再一人豐層塗膠脂銅箔(RCC)或者預浸料(舰刚G)和銅 箔的階段；（e)再次疊層的疊層板銅針通過隨塗層制定模式 腐敍解除不必要的銅箔而形成板（pattem)的階段；⑴在上述階 奴（e)形成板的再次疊層板銅箔上面把塗膠脂銅箔(^^^)或者預 浸料(PREPREG)和銅箔疊層在内層的階段；（g)上述電容器的電 極板上加工孔（Viahole)或者貫通孔並鍍金上述孔内部的階段； 的内置電容器型印刷電路板的製造方法。 在以下，參照另附的圖la至圖U詳細說明根據本發明的内置 電容器型印刷電路板的製造方法。 圖la至圖lj是根據本發明的内置電容器型印刷電路板製造方 法的操作流水線圖。參照圖la，首先絕緣層内層(1〇〇)裏製作完全 銅箔(101，102)狀態的疊層板。在此，作為内層材料一般使用環氧 樹月旨(epoxy)和玻璃纖維(giass fiber)。 參照圖lb，内層疊層板(1〇〇, 101，1〇2)上疊層超薄膜絕緣體 (103a，104a)。在此，超薄膜絕緣體(1〇3a，104a)的厚度為約5〜1〇 #πι左右，作為實例使用RCC。此外，内層為完全銅箔(ι〇1，1〇2) 而疊層RCC時可最小化樹脂厚度偏差。 1278260 方法加工隱蔽孔（130)和貫通孔（mo)(階段Slj )。 上迷的内容為了更容易理解發明的權利要求更廣泛的陳述了 本發明的特點和技術優點。在以上詳細說明了構成本發明權利要 求的附加特點和伽。該行業的技術人Μ知道本發明概念和特 點的實例是作為執行本發明和類似目的的其他結構的設計或修改 的基礎可立即使用。 、亚且，在本發明的發明概念和實例為了實現本發明的相同目的 作為修改或設計其他結構的基礎可被該行業的技術人員所使用。 而且，被該行業的技術人員如此的修改或者變更的結構在權利要 求中不超出本發明的思想或範圍内可進行不同的變化，置換以及 變更。 、 工業應用性 像這樣’本發明使用超薄膜厚度的絕緣體(5〜1〇卿)此〇美 有銅箔的狀態下疊層而最小化電容器厚度的偏差，為了部分解除 不必要的内層銅箔蝕刻解除外層銅箔之後用鐳射鑽孔解除絕緣體 並剩下的絕緣體使用防蝕塗層解除銅箔之後再次疊層而在外層蝕 刻Ρό ^又防止上板電極的熱板pad)或者接地板一起消失。 並且’根據本發明的内置電容器型印刷電路板製造方法使用超 溥膜絕緣體，所以最小化在鐳射鑽孔階段發生的偏差，使電容器 靜電容量準確，加大射束點（beam spot)尺寸而提高操作性。 10 1278260 I .1 【圖式簡單說明】 圖la至圖lj是根據本發明的内置電容器型印刷電路板製造方 法的操作流水線圖。 【主要元件符號說明】 100-…絕緣層内層 100— 豐層板 101 —完全銅f白 101— 豐層板 101 —板 102 —完全銅麵 102— …疊層板 103a…-超薄膜絕緣體 103a —絕緣膜^ 103b-…銅箔 104a-…超薄膜絕緣體 104b-…銅箔 1〇5…一銅箔 1〇6…—銅箔 110a —絕緣 110a —預浸料 11 Ob—板 11

Claims (1)

  1. I ' " 1278260 I - 十、申請專利範圍： 1、一翻置電容||型_電路板师造方法，其巾包括： U)上述⑽疊層板的銅·面上面疊層驗米至幾十微米 厚度的塗膠脂銅箔(RCC)而形成疊層板的階段； (b)上述電容器疊層板銅箔中腐蝕解除不必要的部分之後解 除露出的上述膠脂部位的階段； 、（C)進行上述階段（b)之後把剩下的膠脂作為保護膜（防 蝕塗層）使用並解除露出銅箔的階段； Φ (d) 表面作為絕緣體露出的上述内層疊層板上再次疊層塗膠 脂銅箔(RCC)或者預浸料(PREpREG)和銅箔的階段； (e) 再-人g層的豐層板銅箔中通過防钱塗層制定模式腐钱解 除不必要的銅、治而形成板（pattern)的階段； (f) 在上述階段（e)形成板的再次疊層板銅箱上面把塗膠脂 銅荡(RCC)或者預浸料(PREpREG)和銅箔疊層在内層的階段； (g) 上述電谷益的電極板上加工孔（Via或者貫通孔 ⑩ 並鑛金上述孔内部的階段； 的内置電容器型印刷電路板的製造方法。 13
TW093130287A 2003-11-21 2004-10-07 Method of manufacturing capacitor-embedded printed circuit board TWI278260B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2003-0082902A KR100512688B1 (ko) 2003-11-21 2003-11-21 캐패시터 내장형 인쇄 회로 기판 제조 방법

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TW200520651A TW200520651A (en) 2005-06-16
TWI278260B true TWI278260B (en) 2007-04-01

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US (1) US20050108874A1 (zh)
KR (1) KR100512688B1 (zh)
CN (1) CN100407879C (zh)
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CN1620226A (zh) 2005-05-25
KR100512688B1 (ko) 2005-09-07

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