CN100401488C - 具有小回路高度的接线连接的片状模块 - Google Patents

具有小回路高度的接线连接的片状模块 Download PDF

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Publication number
CN100401488C
CN100401488C CNB02800812XA CN02800812A CN100401488C CN 100401488 C CN100401488 C CN 100401488C CN B02800812X A CNB02800812X A CN B02800812XA CN 02800812 A CN02800812 A CN 02800812A CN 100401488 C CN100401488 C CN 100401488C
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Prior art keywords
articulamentum
sheet
wire connection
bracing
strutting arrangement
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CNB02800812XA
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CN1460291A (zh
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J·H·肖伯
M·托斯
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Adeia Semiconductor Solutions LLC
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Koninklijke Philips Electronics NV
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Abstract

在具有片状模块(3)的数据载体(1)中，在其片状连接层(8)的区域中，片状模块(3)的基片(5)具有相应的导线连接装置，该装置由扁平金属层(10)构成，并且，接线(11)的一个楔形连接的端(13)被连接于其上。

Description

具有小回路高度的接线连接的片状模块
技术领域
本发明涉及片状模块及带有片状模块的数据载体，片状模块包含带有支撑装置连接层的支撑装置和带有片状连接层的基片，通过接线将这两个连接层相互连接，每个片状连接层都被连接起来，其设有导线连接装置，接线的以楔形方式连接的一端被连接于该装置上。
背景技术
在专利文件EP0397426A2中有上述片状模块的说明和描述。在已知的片状模块中，每个片状连接层上都具有接线的一个球形连接端，将其作为导线连接装置；通常用技术术语将之称为“球形结”。在具有“球形结”的片状连接层平面图中，这种“球形结”的尺寸比其下面的片状连接层的尺寸小。此外，在垂直于其下面的片状连接层的方向，这种“球形结”的尺寸相对较大，也就是说具有相对较大的高度。“球形结”的这种小面积带来的问题是：在接线的楔形连接端连接到“球形结”的连接操作过程中，必须将接线精确地送到“球形结”上，以保证连接的可靠性。“球形结”的这种较大的高度对片状模块或包含片模块的数据载体具有很不利的影响。例如：根据专利文件EP0397426A2中所述，数据载体可通过将片状模块嵌入到塑料片中制成。导线的连接方法使这种“球形结”需要一个相对长的制作周期，因为该导线的连接方法中必须制作这种“球形结”。
发明内容
本发明的目的是避免上述缺点以得到一种改进的片状模块及一种带有这种片状模块的改进的数据载体。
为了实现上述目的，根据本发明给片状模块提供了几个创造性特征，使得根据本发明的片状模块具有以下特征：
带有支撑装置和与支撑装置相连接的基片的片状模块，其中，基片至少有一个片状连接层；支撑装置至少有一个支撑装置连接层；相连的导线连接装置位于片状连接层上；导线连接装置和支撑装置连接层通过接线相互连接；接线具有连接的第一端和以楔形方式连接的第二端；连接的第一端与支撑装置连接层相连接，以楔形方式连接的第二端与导线连接装置相连接；平行于片状连接层延伸的扁平金属层设置作为导线连接装置，该导线连接装置是由独立于导线连接方法的方式制作的。
为了实现上述目的，根据本发明，给数据载体提供了几个创造性特征，使得根据本发明的数据载体具有以下特征：
包含片状模块的数据载体，片状模块带有支撑装置及与支撑装置相连接的基片，其中，基片至少有一个片状连接层；支撑装置至少有一个支撑装置连接层；相连的导线连接装置位于片状连接层上；导线连接装置和支撑装置连接层通过接线相互连接；接线具有连接的第一端和以楔形方式连接的第二端；连接的第一端与支撑装置连接层相连接，以楔形方式连接的第二端与导线连接装置相连接；平行于片状连接层延伸的扁平金属层设置作为导线连接装置，该导线连接装置是由独立于导线连接方法的方式制作的。
由于具有根据本发明的这些特征，从而实现了结构上的简化并且可适合再生产。接线的楔形连接端与导线连接装置之间制造的楔形粘接，与上述已知的解决方案相比，在将接线送到作为导线连接装置的金属层时，可以以不得多的精度制造。此外，由于采取了根据本发明的步骤，每个导线连接装置在垂直于导线连接层下面的片状连接层的方向上，与上述已知的现有技术相比，占用了显著减小的空间。此外，在根据本发明的片状模块中，以及在根据本发明的数据载体中，还具有以下优点：每个导线连接装置可以用独立于导线连接方法的方式制作，并且可在导线连接方法之前执行，从而得到的优点是：与上述的已知的片状模块的制作情况相比，这种导线连接方法的执行周期要短的多；因此，与已知的方法相比，在根据本发明的片状模块生产中，所谓的生产量或工序期可以大大缩短。
在根据本发明的片状模块中，以及在根据本发明的数据载体中，给定片状连接层适当尺寸的面积，位于片状连接层上面的金属层只覆盖片状连接层的一部分，然而这样做仍然会在将楔形连接的端送到作为导线连接装置的金属层时占据足够大的面积以保证不复杂化。但是，根据权利要求2或权利要求5中的附加技术特征，可证明本发明具有显著优势。这样做使金属层可以获得有利的尽量最大的面积，此外还进一步实现了对整个片状连接层的保护功能。
在根据本发明的片状模块中，以及在根据本发明的数据载体中，作为导线连接装置的每个金属层可由银或锡制成。但是，已经证明，当作为导线连接装置的金属层由金制成时，具有更显著的优势。
下述的典型实施例可以展现本发明的上述特征及其它特征，应用这些典型实施例对本发明进行说明。
附图说明
下面借助图中显示的两个典型的实施例对本发明进行进一步的描述，但是，本发明并不局限于此。
图1是根据本发明的第一个示例性实施例的数据载体的横截面简图。
图2显示了类似于图1的根据本发明的第二个示例性实施例的数据载体。
具体实施方式
图1中示出数据载体1，数据载体1有一个数据载体主体2，此主体是用塑料注塑方法制成的。但是，此卡主体2也可以用任何其它已知的方法制成，例如，用所谓层压处理方法。
数据载体1中装有一个片状模块3，与数据载体1类似，图中只显示了此模块的一部分。片状模块3有一个支撑板4，此支撑板是片状模块3的基片5的支撑装置。基片5通过连接层6与支撑板4相连接。在其与连接层6相对的边缘7处，基片5有两个片状连接层8，而图1中只显示了一个片状连接层8。但是，众所周知，这种基片5也可以有两个以上的片状连接层。在片状模块3中，与具有两个片状连接层的基片5类似，支撑板4也有两个支撑板连接层9，图1中只显示了其中的一个支撑装置连接层9。在这种情况下，虽然不需要一定如此，支撑装置连接层9构成传送线圈，传送线圈是通过导体道磁迹实现的，从而形成数据载体1的一个成分，设置用于应用适当的通讯台实现数据载体1的无连接通讯。支撑装置连接层9也可以由称为导体架的部分形成，支撑装置连接层9以及导体架的其余部分由一个整体或一种材料特别是金属组成。
两个片状连接层8中的每个连接层上都有一个与之相连的导线连接装置10，根据图1，在片状模块3中，用扁平金属层10，通过一种特别有利的方法构成此导线连接装置，扁平金属层10与相连的片状连接层8平行，并且有利地由黄金制成。两个导线连接装置10中的每一个，即两个金属层10中的每一个都通过接线11连接到支撑板连接层9上。
每个接线11都有一个球形连接的第一端12和一个楔形连接的第二端13。然后将每个球形连接的第一端12连接到支撑板连接层9，将每个楔形连接的第二端13连接到导线连接装置10，即扁平金属层10。根据图1中的设计，每个金属层10只覆盖位于其下面的片装连接层8的一部分。
关于图2中的数据载体1，每个金属层10完全覆盖了位于其下面的片状连接层8；这样做的优点是：金属层10的面积可以尽量大，并且金属层10可以有效地保护片状连接层8。根据图2，在数据载体1的改进方式中，片状连接层8的面积可以小于放置于其上的金属层10；这样做的优点是：连接层8的面积可以尽量小；并且有利的是可以得到尽量小的片状表面。尽管片状连接层8的面积小，但是应用金属层10可以保证与接线11的良好的电连接，与片状连接层8相比，金属层10具有较大的面积。
在根据图1和2的数据载体1中，有利地实现了将导线连接装置10设计为具有很低的总高度并具有较大的表面积；其优点在于：数据载体1和/或片状模块3获得了尽量小的总高度，并实现了金属层10区域中尽量简单的连接。
在本行业中，上述的片状连接层8也通常称为“垫片”，上述金属层10通常称为“直壁块”或“直壁金块”。实际上，这种垫片的厚度约为1.0μm，而与接线的球形连接端相比较时，直壁块的厚度范围在10.0μm和18.0μm之间，球形连接端的厚度或高度至少为30.0μm；这意味着根据本发明的设计可实现有利的总高度降低至少12.0μm。

Claims (10)

1.带有支撑装置(4)和与支撑装置(4)相连接的基片(5)的片状模块(3)，其中，
基片(5)至少有一个片状连接层(8)，
支撑装置(4)至少有一个支撑装置连接层(9)，
相连的导线连接装置(10)位于片状连接层(8)上，
导线连接装置(10)和支撑装置连接层(9)通过接线(11)相互连接，
接线(11)具有连接的第一端(12)和楔形连接的第二端(13)，
连接的第一端(12)与支撑装置连接层(9)相连接，楔形连接的第二端(13)与导线连接装置(10)相连接，
平行于片状连接层(8)延伸的扁平金属层(10)被设置作为导线连接装置(10)，该导线连接装置(10)是由独立于导线连接方法的方式制作的。
2.如权利要求1所述的片状模块(3)，其特征在于，所述导线连接装置(10)是由一直壁块而制成的。
3.如权利要求2所述的片状模块(3)，其特征在于，所述直壁块具有厚度范围在10.0μm至18.0μm之间。
4.如权利要求1所述的片状模块(3)，其特征在于，设置在片状连接层(8)上的扁平金属层(10)完全覆盖片状连接层(8)。
5.如权利要求1所述的片状模块(3)，其特征在于，扁平金属层(10)包括由金制成。
6.包含片状模块(3)的数据载体(1)，片状模块(3)中带有支撑装置(4)及与支撑装置(4)相连接的基片(5)，其中，
基片(5)至少有一个片状连接层(8)，
支撑装置(4)至少有一个支撑装置连接层(9)，
相连的导线连接装置(10)位于片状连接层(8)上，
导线连接装置(10)和支撑装置连接层(9)通过接线(11)相互连接，
接线(11)具有连接的第一端(12)和楔形连接的第二端(13)，
连接的第一端(12)与支撑装置连接层(9)相连接，楔形连接的第二端(13)与导线连接装置(10)相连接，
平行于片状连接层(8)延伸的扁平金属层(10)被设置作为导线连接装置，该导电连接装置(10)是由独立于导线连接方法的方式制作的。
7.如权利要求6所述的数据载体，其特征在于，所述导线连接装置(10)是由一直壁块而制成的。
8.如权利要求9的所述的数据，其特征在于，所述直壁块具有厚度范围在10.0μm之间。
9.如权利要求6所述的数据载体(1)，其特征在于，设置在片状连接层(8)上的扁平金属层(10)完全覆盖片状连接层(8)。
10.如权利要求6所述的数据载体(1)，其特征在于，扁平金属层(10)包括由金制成。
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JP2004519860A (ja) 2004-07-02
CN1460291A (zh) 2003-12-03

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