CN100399137C

CN100399137C - Heat radiation structure for display

Info

Publication number: CN100399137C
Application number: CNB2005101361012A
Authority: CN
Inventors: 吴孟斋
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2005-12-21
Filing date: 2005-12-21
Publication date: 2008-07-02
Anticipated expiration: 2025-12-21
Also published as: CN1790117A

Abstract

The present invention discloses a heat radiating structure used for a display, which comprises a back board, a circuit board and at least one light emitting assembly, wherein the circuit board is arranged on the back board and provided with at least one opening; the light emitting assembly is arranged on the circuit board and comprises a metal base. At least part of the lower surface of the metal base forms surface contact with a metal board via the opening, and in this way, heat emitted by the light emitting assembly is directly emitted to air via the metal board; thereby, the heat radiating efficiency can be effectively enhanced.

Description

The radiator structure of display

Technical field

The present invention relates to a kind of radiator structure, relate in particular to a kind of radiator structure that is used for the LCD luminescence component.

Background technology

Along with the evolution of technology, display device is from the continuous evolution of traditional cathode ray tube (CRT) flat-panel screens extremely now.Wherein, advantages such as liquid crystal indicator (LCD) is frivolous because of possessing, power saving, low radiation, therefore become one of common now display device gradually, can be widely used in communication, information or the consumption electronic products such as notebook computer, digital camera, Video Camera, mobile phone.

Liquid crystal indicator mainly is to show with liquid crystal panel (LCD panel), because liquid crystal panel itself can't be luminous, therefore must provide the light source that brightness is sufficient and be evenly distributed, and makes liquid crystal panel show image correctly.The function of this supply light source is promptly carried out by (backlight) backlight module.

In described backlight module, often use light emitting diode (LED) as light source, but because light emitting diode can produce heat when luminous, therefore, light emitting diode need possess cooling mechanism usually.As Fig. 1, Fig. 2 and shown in Figure 3, backlight module comprises backboard 80 at least, be arranged at the light guide plate 90 on the backboard 80, and be arranged at light guide plate 90 1 sides and fit in the circuit board 70 of backboard 80 1 sides, circuit board 70 is provided with a plurality of light emitting diodes 60, wherein, light emitting diode 60 can produce heat when luminous, so existing circuit board 70 is made of the metal substrate with high thermal conductivity coefficient, the heat that light emitting diode 60 is dispersed conducts to the backboard 80 of backlight module via circuit board 70, by backboard 80 heat is dissipated in the air again, heat is dispersed so as to forming cooling mechanism.

But in described structure, owing to use the circuit board that metal substrate constituted 70 with high thermal conductivity coefficient, it costs an arm and a leg, and has certain thickness, so under two big requirements of " thin typeization " and reduction manufacturing cost, existing structure can't meet the up-to-date design specifications and the market demand gradually in the backlight module size.In addition, this kind structure needs to conduct via circuit board because of the heat of light emitting diode, so its heat disperse the form that still belongs to indirect conduction, and circuit board and backboard are all rigid objects, surface of contact between the two still unavoidably has the space, can't reach closed state, so still there is inevitable defective in it on radiating efficiency.

Summary of the invention

The object of the present invention is to provide a kind of radiator structure of LCD luminescence component, by luminescence component is directly contacted with the metal backing of light emitting module, can improve radiating efficiency significantly, and can effectively reduce manufacturing cost, reduce the size of LCD.

For realizing described purpose, the radiator structure that is used for display provided by the present invention comprises: backboard; Be arranged at the circuit board on the backboard, this circuit board is provided with a perforate at least; And be located at least one luminescence component on the circuit board, this luminescence component comprises metal pedestal with lower surface, be located on this metal pedestal and electrically connect with circuit board heat-generating units and insulator seal piece installing, it is coated on the circuit board top in the lump with metal pedestal and heat-generating units, in addition, the part of metal pedestal lower surface contacts with backboard formation face by described at least one perforate.

In radiator structure of the present invention, utilize perforate make luminescence component and backboard directly touch to, reach the purpose that improves radiating efficiency in the mode of direct heat radiation.In addition, also can utilize heat-conductive assembly to make that luminescence component and backboard are tightr to be contacted, the thermal resistance between luminescence component and the backboard is reduced, heat conduction efficiency is improved.Heat-conductive assembly can be solid-state heat conductive pad or liquid heat conductive cream.No matter heat conductive pad or heat-conducting cream all can closely be incorporated between backboard and the luminescence component, make not have the space between the two, and be difficult for causing luminescence component to damage.

In the present invention, luminescence component directly contacts with the metal backing of light emitting module, backboard can have at least one teat that stretches into perforate accordingly, and this teat contacts with the lower surface of metal pedestal, also can make the metal pedestal comprise the projection that stretches out and contact with backboard accordingly in perforate.

Description of drawings

For above and other objects of the present invention, feature and advantage are become apparent, hereinafter the spy enumerates some preferred implementations and the present invention is described in detail in conjunction with the accompanying drawings.

Fig. 1 is the perspective exploded view of existing display backlight module;

Fig. 2 is the part combination synoptic diagram of backlight module shown in Figure 1;

The diagrammatic cross-section of Fig. 3 for dissecing along A-A line among Fig. 2;

Fig. 4 is the part section schematic top plan view of the backlight module of first embodiment of the invention;

Fig. 5 is the part section schematic side view of the backlight module of first embodiment of the invention;

Fig. 6 is the part section schematic top plan view of the backlight module of second embodiment of the invention;

Fig. 7 is the part section schematic top plan view of the backlight module of third embodiment of the invention.

Description of reference numerals

Backboard 10

Teat 101

Circuit board 20

Copper foil layer 201

Heat resistant plastice layer 202

Perforate 203

Luminescence component 30

Metal pedestal 301

Lower surface 3011

Projection 3012

Heat-generating units 302

Insulator seal piece installing 303

Heat-conductive assembly 40

Light guide plate 50

A plurality of light emitting diodes 60

Circuit board 70

Backboard 80

Light guide plate 90

Embodiment

Please consult Fig. 4 and first embodiment shown in Figure 5 simultaneously, they show the radiator structure of display of the present invention.The radiator structure of display of the present invention comprises backboard 10, circuit board 20 and at least one luminescence component 30, and wherein, circuit board 20 is set on the backboard 10, and luminescence component 30 is set on the circuit board 20 and towards the light guide plate 50 of display.Luminescence component 30 also comprises metal pedestal 301, heat-generating units 302 and insulator seal piece installing 303, wherein, metal pedestal 301 has lower surface 3011, heat-generating units 302 is set on the metal pedestal 301, and electrically connect with circuit board 20,303 of this insulator seal piece installings are coated on metal pedestal 301 and heat-generating units 302 on the circuit board 20 in the lump.

Circuit board 20 comprises one deck copper foil layer 201 and one deck heat resistant plastice layer 202 at least at least.Heat-generating units 302 electrically connects with the described copper foil layer of one deck at least 201, and the described heat resistant plastice of one deck at least layer 202 then contacts with backboard 10, and circuit board 20 is provided with at least one perforate 203.In addition, backboard 10 has at least one teat 101, and described teat stretches in the perforate 203 accordingly, and touches the lower surface that is butted on metal pedestal 301, directly touches to improving heat conduction efficiency by the teat 101 of metal pedestal 301 with backboard 10.In this way, the heat that the heat-generating units 302 of luminescence component 30 is produced can be directly conducted to backboard 10 via metal pedestal 301, directly is dissipated into the outside by means of the metal backing 10 that has big area usually again, thereby can reaches the purpose that effectively shifts out heat.Preferred described heat resistant plastice layer 202 is polyimide (polyimide, PI) layer, metal pedestal 301 is a copper billet, heat-generating units 302 is light emitting diode (LED) chip, circuit board 20 is soft (flexible) circuit board, and this flexible circuit board be suitable for as required circuit layout and flexible extension on backboard 10.

Though, what described embodiment was described is that display radiator structure of the present invention has the situation of at least one luminescence component 30, but the present invention also can comprise a plurality of luminescence components 30, and also can be provided with a plurality of perforates 203 continuously on the circuit board 20, described a plurality of luminescence component 30 is corresponding to a plurality of perforates 203, and they are set on the circuit board 20 and form a plurality of with backboard 10 and contact.

In addition, see also Fig. 6.As shown in Figure 6, the present invention also can be pressed from both sides between the lower surface of teat 101 and metal pedestal 301 and establish at least one heat-conductive assembly 40, it is arranged in perforate 203, heat-conductive assembly 40 can be solid-state soft heat conductive pad or is liquid heat conductive cream, by teat 101 is closely contacted with the lower surface of metal pedestal 301, can reduce the thermal resistance between heat-generating units 302 and the backboard 10, and then improve heat conduction efficiency more.

Obviously, the invention is characterized in, utilize perforate 203 make luminescence component 30 and backboard 10 directly touch to, and utilize heat-conductive assembly 40 that luminescence component 30 is closely contacted with backboard 10.But the present invention only is not restricted to and forms teat 101 by backboard 10, in other words, also can form projection 3012 by metal pedestal 301 and reach this purpose, sees also Fig. 7.As shown in Figure 7, metal pedestal 301 comprises projection 3012, and it stretches out in perforate 203 accordingly and contacts with backboard 10, and

projection

3012 and 10 of backboards also can press from both sides and establish heat-conductive assembly 40, closely contact by making between projection 3012 and the backboard 10, can improve heat conduction efficiency.

Radiator structure of the present invention is except that improving heat conduction efficiency and improving the radiating efficiency, by means of adopting flexible circuit board, make circuit layout that it can be as required and flexible extension on backboard, can suitably solve the relevant issues such as assembly obstruction that run in the assembling, and can make product reach the requirement of size thin typeization, also improved the surcharge of product virtually.

Though in conjunction with preferred implementation the present invention is disclosed above; but this is not to be limitation of the present invention; the any technician in this area is under the prerequisite that does not exceed design of the present invention and protection domain; also can make some conversion and retouching; therefore, protection scope of the present invention should be as the criterion with the claims restricted portion.

Claims

1. a display radiator structure comprises backboard; Be set at the circuit board on this backboard, this circuit board is provided with at least one perforate; Be located at least one luminescence component on this circuit board, it comprises:

The metal pedestal, it has lower surface, the part of this lower surface by described at least one perforate and described backboard directly formation face contact;

Heat-generating units, it is located on the described metal pedestal and with described circuit board and electrically connects; And

Described metal pedestal and described heat-generating units are coated in the lump the insulator seal piece installing of described circuit board top.

2. display radiator structure as claimed in claim 1, wherein, comprise a plurality of luminescence components, be provided with a plurality of perforates on the described circuit board continuously, described a plurality of luminescence component is corresponding to described a plurality of perforates and be set on the described circuit board, contacts and form a plurality of with described backboard.

3. display radiator structure as claimed in claim 1, wherein, described circuit board comprises one deck copper foil layer and one deck heat resistant plastice layer at least at least, and described heat-generating units and the described copper foil layer of one deck at least electrically connect, and the described heat resistant plastice of one deck at least layer then contacts with described backboard.

4. display radiator structure as claimed in claim 3, wherein, the described heat resistant plastice of one deck at least layer is a polyimide layer.

5. display radiator structure as claimed in claim 1, wherein, described backboard has at least one teat, and it stretches into accordingly in described at least one perforate and with the lower surface of described metal pedestal and contacts.

6. display radiator structure as claimed in claim 1 wherein, also comprises at least one heat-conductive assembly, and it is arranged in described at least one perforate, and is located between the lower surface and described backboard of described metal pedestal.

7. display radiator structure as claimed in claim 5 wherein, also comprises at least one heat-conductive assembly, and it is arranged in described at least one perforate, and is located between the lower surface and described at least one teat of described metal pedestal.

8. display radiator structure as claimed in claim 1, wherein, described metal pedestal comprises projection, it stretches out in described at least one perforate accordingly and contacts with described backboard.

9. display radiator structure as claimed in claim 8 wherein, also comprises at least one heat-conductive assembly, and it is arranged in described at least one perforate, and is located between described projection and the described backboard.

10. display radiator structure as claimed in claim 1, wherein, each described metal pedestal is a copper billet.

11. display radiator structure as claimed in claim 1, wherein, each described heat-generating units is a light-emitting diode chip for backlight unit.

12. display radiator structure as claimed in claim 1, wherein, described circuit board is a flexible circuit board.

13. display radiator structure as claimed in claim 12, wherein, described flexible circuit board be suitable for as required circuit layout and flexible extension on described backboard.