CN1624915A - LED luminous module - Google Patents
LED luminous module Download PDFInfo
- Publication number
- CN1624915A CN1624915A CNA2003101197540A CN200310119754A CN1624915A CN 1624915 A CN1624915 A CN 1624915A CN A2003101197540 A CNA2003101197540 A CN A2003101197540A CN 200310119754 A CN200310119754 A CN 200310119754A CN 1624915 A CN1624915 A CN 1624915A
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- Prior art keywords
- emitting diode
- lumination
- framework
- light emitting
- light
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention provides a luminous module of luminous diode, including a frame with multi-heat fins, a soft heat conductor and a luminous group of LED. The inner wall of the frame has a groove, the luminous group of the LED is set in the groove, and the soft heat conductor sticks to the wall of the groove, the luminous group matched stick to the soft heat conductor in the groove, so as to conduct the heat produced by the luminous group of LED to the frame with the heat fins through the soft heat conductor and make use of the frame with heat fins to radiate the heat from the luminous group of the luminous diode.
Description
Technical field
The present invention relates to a kind of lumination of light emitting diode module, particularly relate to a kind of light emitting module that utilizes light-emitting diode for light emitting source.
Background technology
See also shown in Figure 1, wherein known many uses cold-cathode tube (CCFL) 41a is used for LCD as back light, and be arranged at the light guide plate 10a side of this LCD, and the bottom surface of this light guide plate 10a attaches a reflecting plate 20a, this reflecting plate 20a is converted into cell body 21a in the side Curved Continuous of this light guide plate 10a, and its opening is towards the side of this light guide plate 10a, so that this cold cathode fluorescent lamp 41a is arranged in the cell body 21a of reflector plate 20a of dual side-edge of this light guide plate 10a, and utilize rubber 50a to fix this cold cathode fluorescent lamp 41a in the cell body 21a of this reflecting plate 20a side, therefore can utilize the cell body 21a wall of this reflector plate 20a as reflecting surface, so that the light-emitting line of this cold cathode fluorescent lamp 41a reflects in opening direction through three faces of facing the wall and meditating of cell body 21a, and be incident in this light guide plate 10a, and cooperate so that light reflects in same direction with reflector plate 20a.
But this LCD utilizes cold-cathode tube (CCFL) still to have following shortcoming as light emitting source:
1. wherein have the mercury of severe contamination in this cold-cathode tube, therefore very big to environmental injury after scrapping;
2. this cold-cathode tube need utilize high drive, lighting this cold-cathode tube, therefore has Danger Electric shock risk, and needs 3~5 minutes from activating this cold-cathode tube to lighting fully, and the time of lighting this cold-cathode tube changes with ambient temperature;
3. this cold-cathode tube is that glass tubing is made, and therefore still has risk of rupture in manufacturing process or in using;
The electrode of this cold-cathode tube be electrically connected on lead still need be with the manual mode welding processing, so manufacturing cost increases relatively.
Summary of the invention
Purpose of the present invention is to provide a kind of lumination of light emitting diode module,, utilizes the light of the framework reflection light-emitting diode with radiating fin and disperses the heat of this light-emitting diode as light source with light-emitting diode.
According to above-mentioned purpose of the present invention, the invention provides a kind of lumination of light emitting diode module, it comprises that one has the framework of a plurality of radiating fins, at least one soft heat conductor and at least one lumination of light emitting diode group, this framework inboard with a plurality of radiating fins has a cell body, this soft heat conductor adheres on the wall of the cell body of this framework, and this lumination of light emitting diode group adheres on the soft heat conductor in the cell body of this framework accordingly.
In order to enable further to understand feature of the present invention and technology contents, see also following relevant detailed description of the present invention and accompanying drawing, yet appended graphic reference and the explanation usefulness of only providing not is to be used for the present invention is limited.
Description of drawings
Fig. 1 is known LCD backlight device schematic diagram;
Fig. 2 is a lumination of light emitting diode module three-dimensional exploded view of the present invention;
Fig. 3 is a lumination of light emitting diode module three-dimensional combination figure of the present invention;
Fig. 4 is a lumination of light emitting diode module cutaway view of the present invention;
Fig. 5 and Fig. 6 are the framework embodiment stereogram with radiating fin of the present invention;
Fig. 7 is a LCD backlight device schematic diagram of the present invention;
Fig. 8 is another embodiment cutaway view of lumination of light emitting diode module of the present invention.
Wherein, description of reference numerals is as follows:
10a light guide plate 10 frameworks
41a cold cathode fluorescent lamp 20 soft heat conductor
31 printed circuit board (PCB)s, 34 control chips
32 light-emitting diodes, 40 light guide plate
33 resistance, 50 reflecting plates
Embodiment
See also Fig. 2 to shown in Figure 8, the present invention is a kind of lumination of light emitting diode module, it comprises the framework 10 with a plurality of radiating fins 11, soft heat conductor 20 and lumination of light emitting diode group 30, wherein this soft heat conductor 20 is attached to this 10 inboards of framework with a plurality of radiating fins 11, and lumination of light emitting diode group 30 is arranged on the soft heat conductor 20 of these 10 inboards of framework with a plurality of radiating fins 11, to utilize lumination of light emitting diode group 30 to emit beam, and reflect the light of this lumination of light emitting diode group 30 in same direction by these framework 10 madial walls, and the heating heat by this soft heat conductor 20 these lumination of light emitting diode groups 30 of conduction is on this framework 10, thereby utilizes described radiating fin 11 and framework 10 to disperse heat.
See also Fig. 2 to shown in Figure 6, wherein this lumination of light emitting diode group 30 comprises strip printed circuit board (PCB) 31, light-emitting diode 32, resistance 33 and control chip 34, this printed circuit board (PCB) 31 can be soft board, and this light-emitting diode 32, resistance 33 and control chip 34 are electrically connected on the side of this printed circuit board (PCB) 31; This framework 10 with radiating fin 11 is made for copper material or aluminium, this framework 10 can be strip, and be U type cross section, therefore described radiating fin 11 can be shaped in this framework 10 outside front end faces (as Fig. 5 and shown in Figure 6), and be parallel to the longitudinal direction of this framework 10 or perpendicular to the longitudinal direction of this framework 10, these framework 10 inboards have cell body 12; This soft heat conductor 20 adheres on cell body 12 diapires of this framework 10; The opposite side of the printed circuit board (PCB) 31 of this lumination of light emitting diode group 30 is attached on this soft heat conductor 20, therefore when this seal circuit board 31 conducts electricity and lights light-emitting diode 32, evenly conduct the heat of this light-emitting diode 32 in this framework 10 by this soft heat conductor 20, and the radiating fin 11 that utilizes this framework 10 and back thereof is dispersed heat to reduce the heat of described light-emitting diode 32, to avoid the high-power light emitting of described light-emitting diode 32, cause the heat that produces too high and reduce the problem of its life-span and luminous efficiency, and can promote the luminous efficiency of described light-emitting diode 32 and increase its life-span, and this radiating fin 11 has increased the area of dissipation of this framework 10, disperses the heat of this framework 10 according to this effectively.
Consult shown in Figure 7, this lumination of light emitting diode module 30 can be used on the backlight module of tyrode crystal display, the lumination of light emitting diode module is arranged at the dual side-edge of this light guide plate 40, light with guiding lumination of light emitting diode module 30, and cooperate with same direction that light is led with reflecting plate 50, and this light-emitting diode 32 places cell body 12 diapires of these framework 10 inboards, and it is luminous towards the opening direction of this cell body 12, to increase the light service efficiency of this light-emitting diode 32, and these light-emitting diode 32 contaminatives are lower with respect to the cold-cathode tube of known technology, and driving voltage is low, therefore has fail safe, and activate to the complete bright time short, and can utilize surface adhering technology (SMT) with light-emitting diode 32, resistance 33 and control chip 34 are arranged on the printed circuit board (PCB), but therefore automated production, and the color rendering of this light-emitting diode 32 significantly promotes about 30% than cold-cathode tube, and has an adjustment color function, the advantage that can not break is arranged, and therefore comparing cold-cathode tube has preferable service condition.
See also shown in Figure 8, wherein this has on cell body 12 diapires in the framework 10 of radiating fin 11 and attaches multi-group light-emitting diode light emitting module 30, and make a plurality of these soft heat conductor 20 be attached at lumination of light emitting diode module 30 accordingly and have 10 of the frameworks of radiating fin 11, with the heat of even conduction light-emitting diode 32 to framework 10 with radiating fin 11, and by this radiating fin 11 and 10 heat radiations of this framework, and can be used as the illuminating lamp source.
In sum, by the light emitting module of light-emitting diode of the present invention, can utilize light-emitting diode to be light source, and the framework by having radiating fin is to disperse the heat that light-emitting diode produces, with the advantage of performance light-emitting diode, and solved the problem of this LED heat radiating.
But the above only is a preferable possible embodiments of the present invention; be not in order to limit scope of patent protection of the present invention; therefore the equivalent structure done of all utilizations specification of the present invention and accompanying drawing content changes, and all should be included within claims of the present invention scope required for protection.
Claims (10)
1. lumination of light emitting diode module is characterized in that comprising:
One has the framework of a plurality of radiating fins, and this framework inboard has a cell body;
At least one soft heat conductor, it adheres on the wall of the cell body of this framework; And
At least one lumination of light emitting diode group, it adheres on the soft heat conductor in the cell body of this framework accordingly.
2. lumination of light emitting diode module as claimed in claim 1 is characterized in that this lumination of light emitting diode group comprises:
One strip printed circuit board (PCB); And
A plurality of light-emitting diodes, it is electrically connected on this printed circuit board (PCB).
3. lumination of light emitting diode module as claimed in claim 2 is characterized in that also comprising a plurality of resistance, and it is arranged on this printed circuit board (PCB).
4. lumination of light emitting diode module as claimed in claim 2 is characterized in that also comprising control chip, and it is arranged on this printed circuit board (PCB).
5. lumination of light emitting diode module as claimed in claim 2 is characterized in that this strip printed circuit board (PCB) is a soft board.
6. lumination of light emitting diode module as claimed in claim 1 is characterized in that described radiating fin is arranged at this framework lateral surface.
7. lumination of light emitting diode module as claimed in claim 1, the cross section that it is characterized in that described framework is the U profile.
8. lumination of light emitting diode module as claimed in claim 1 is characterized in that described radiating fin is arranged on this framework lateral surface, and parallel with the longitudinal direction of this framework.
9. lumination of light emitting diode module as claimed in claim 1 is characterized in that described radiating fin is arranged on this framework lateral surface, and vertical with the longitudinal direction of this framework.
10. lumination of light emitting diode module as claimed in claim 1, it is characterized in that this framework with a plurality of radiating fins be copper material and aluminium one of them make.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2003101197540A CN1624915A (en) | 2003-12-03 | 2003-12-03 | LED luminous module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNA2003101197540A CN1624915A (en) | 2003-12-03 | 2003-12-03 | LED luminous module |
Publications (1)
Publication Number | Publication Date |
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CN1624915A true CN1624915A (en) | 2005-06-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNA2003101197540A Pending CN1624915A (en) | 2003-12-03 | 2003-12-03 | LED luminous module |
Country Status (1)
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CN (1) | CN1624915A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100399137C (en) * | 2005-12-21 | 2008-07-02 | 友达光电股份有限公司 | Heat radiation structure for display |
CN100423257C (en) * | 2006-12-20 | 2008-10-01 | 黄虎钧 | Lighting stick with LBD wafer |
CN100520153C (en) * | 2006-05-31 | 2009-07-29 | 张仲生 | Method for producing light-alltenuation proof high-power semiconductor lighting lamp |
WO2010099679A1 (en) * | 2009-03-05 | 2010-09-10 | Qiu Chunyun | Heat dissipation device for lighting device |
CN101408299B (en) * | 2007-10-10 | 2011-02-09 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
CN101441357B (en) * | 2007-11-23 | 2011-03-16 | 联茂电子股份有限公司 | Luminous module, molding mode |
CN102194809A (en) * | 2010-03-11 | 2011-09-21 | 许凯淳 | Large-area light-emitting diode module and packaging method thereof |
CN101587883B (en) * | 2008-05-23 | 2011-09-28 | 宏齐科技股份有限公司 | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
CN101603672B (en) * | 2008-06-13 | 2012-07-18 | 上海宝康电子控制工程有限公司 | Heat dissipation type light emitting diode (LED) street lamp |
CN102954418A (en) * | 2011-08-19 | 2013-03-06 | Lg伊诺特有限公司 | Light emitting module and head lamp with same |
CN103176303A (en) * | 2011-12-23 | 2013-06-26 | 三星电子株式会社 | Display module and display apparatus having the same |
CN104423093A (en) * | 2013-08-30 | 2015-03-18 | 鸿富锦精密工业(深圳)有限公司 | Display device |
CN104885897A (en) * | 2015-06-25 | 2015-09-09 | 周晚来 | Hydroponic groove |
JP2017130663A (en) * | 2016-01-20 | 2017-07-27 | 大日本印刷株式会社 | LED backlight |
-
2003
- 2003-12-03 CN CNA2003101197540A patent/CN1624915A/en active Pending
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100399137C (en) * | 2005-12-21 | 2008-07-02 | 友达光电股份有限公司 | Heat radiation structure for display |
CN100520153C (en) * | 2006-05-31 | 2009-07-29 | 张仲生 | Method for producing light-alltenuation proof high-power semiconductor lighting lamp |
CN100423257C (en) * | 2006-12-20 | 2008-10-01 | 黄虎钧 | Lighting stick with LBD wafer |
CN101408299B (en) * | 2007-10-10 | 2011-02-09 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
CN101441357B (en) * | 2007-11-23 | 2011-03-16 | 联茂电子股份有限公司 | Luminous module, molding mode |
CN101587883B (en) * | 2008-05-23 | 2011-09-28 | 宏齐科技股份有限公司 | Chip packaging structure of light emitting diode using substrate as lamp cover and manufacturing method thereof |
CN101603672B (en) * | 2008-06-13 | 2012-07-18 | 上海宝康电子控制工程有限公司 | Heat dissipation type light emitting diode (LED) street lamp |
WO2010099679A1 (en) * | 2009-03-05 | 2010-09-10 | Qiu Chunyun | Heat dissipation device for lighting device |
CN102194809A (en) * | 2010-03-11 | 2011-09-21 | 许凯淳 | Large-area light-emitting diode module and packaging method thereof |
CN102954418A (en) * | 2011-08-19 | 2013-03-06 | Lg伊诺特有限公司 | Light emitting module and head lamp with same |
US9478526B2 (en) | 2011-08-19 | 2016-10-25 | Lg Innotek Co., Ltd. | Light emitting module |
CN103176303A (en) * | 2011-12-23 | 2013-06-26 | 三星电子株式会社 | Display module and display apparatus having the same |
CN104423093A (en) * | 2013-08-30 | 2015-03-18 | 鸿富锦精密工业(深圳)有限公司 | Display device |
CN104885897A (en) * | 2015-06-25 | 2015-09-09 | 周晚来 | Hydroponic groove |
JP2017130663A (en) * | 2016-01-20 | 2017-07-27 | 大日本印刷株式会社 | LED backlight |
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