JP2008129464A - Light emitting device, and display device using the same - Google Patents

Light emitting device, and display device using the same Download PDF

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JP2008129464A
JP2008129464A JP2006316319A JP2006316319A JP2008129464A JP 2008129464 A JP2008129464 A JP 2008129464A JP 2006316319 A JP2006316319 A JP 2006316319A JP 2006316319 A JP2006316319 A JP 2006316319A JP 2008129464 A JP2008129464 A JP 2008129464A
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light emitting
solid
mounting substrate
frame
emitting element
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JP4912844B2 (en
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Shiyuuichi Uchijiyou
秀一 内條
Sadanori Abe
禎典 安部
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Resonac Holdings Corp
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Showa Denko KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Liquid Crystal (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To materialize excellent heat dissipation without increasing a product unit cost and a manufacturing cost in a light emitting device using LEDs. <P>SOLUTION: A light emitting device is equipped with a mounting board 12 provided with light emitting diodes (LEDs) 21, and a backlight frame 11 having a first surface to provide light from the light emitting diodes (LEDs) 21 and a second surface being a rear face of the first surface, and making the mounting board 12 attached thereto from the second surface side. The backlight frame 11 is equipped with through holes 11c. The light emitting diodes (LEDs) 21 provided on the mounting board 12 are aligned to positions of the through holes 11c, and the mounting board 12 is attached thereto from the second surface side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、例えば液晶表示装置などのバックライト装置に代表される各種発光装置、およびこの発光装置を用いた表示装置などに関する。   The present invention relates to various light emitting devices typified by a backlight device such as a liquid crystal display device, and a display device using the light emitting device.

近年、例えば液晶テレビや液晶モニタに代表される液晶表示装置などの表示装置では、表示パネルの背面や側面などから光を照射するために、発光装置としてバックライトが採用されている。このバックライトとしては、例えば液晶パネルの直下（背面）に平面上に光源を配置するいわゆる直下型がある。また、透明な樹脂製の導光板の二辺または一辺にのみ光源を設置し、導光板に入射させた光を導光板の裏面に設けた反射部によって反射させて例えば液晶パネル面を照射させるいわゆるエッジライト型が存在する。ここで、直下型は、高輝度を確保できる点で優れているが、バックライトの薄型化には不利である。また、エッジライト型は、直下型よりも薄くできる点で優れているが、大画面用には輝度の均一化の点で不利である。   In recent years, for example, in a display device such as a liquid crystal display device typified by a liquid crystal television or a liquid crystal monitor, a backlight is employed as a light emitting device in order to irradiate light from the back surface or the side surface of the display panel. As this backlight, for example, there is a so-called direct type in which a light source is arranged on a plane directly under (back) a liquid crystal panel. In addition, a light source is installed only on two sides or one side of a transparent resin light guide plate, and the light incident on the light guide plate is reflected by a reflective portion provided on the back surface of the light guide plate to irradiate, for example, a liquid crystal panel surface. There is an edge light type. Here, the direct type is excellent in that high luminance can be secured, but it is disadvantageous for making the backlight thinner. The edge light type is superior in that it can be made thinner than the direct type, but it is disadvantageous in terms of uniform luminance for large screens.

このようなバックライト装置としては、熱陰極型や冷陰極型などの蛍光管が広く用いられている。その一方で、このような蛍光管を用いたバックライト装置に代わるものとして、近年、固体発光素子の１つである発光ダイオード（ＬＥＤ：Light Emitting Diode）を光源として使用するバックライト装置の技術開発が進められている。   As such a backlight device, a fluorescent tube of a hot cathode type or a cold cathode type is widely used. On the other hand, as an alternative to the backlight device using such a fluorescent tube, in recent years, technological development of a backlight device using a light emitting diode (LED), which is one of solid light emitting elements, as a light source. Is underway.

そして、このＬＥＤを用いれば、例えば携帯電話用液晶ディスプレイ等の小型ディスプレイに用いられるバックライトの場合には低消費電力にて高輝度を確保できる。このＬＥＤを用いた液晶用バックライトは、従来は上述のとおり小型の携帯電話用液晶ディスプレイに適用されていたが、近年は適用範囲が拡大し、カーナビゲーション用液晶ディスプレイから大画面テレビジョン（ＴＶ）にまで至っている。特に、赤、青、緑の３原色に相当する３色のＬＥＤを用いて大画面液晶ＴＶのバックライトを構成した場合には、色再現範囲を広くできるため、高画質を実現することができる点でも注目されている。   When this LED is used, for example, a backlight used for a small display such as a liquid crystal display for a mobile phone, it is possible to ensure high luminance with low power consumption. Conventionally, the backlight for liquid crystal using this LED has been applied to a liquid crystal display for a small mobile phone as described above. However, in recent years, the range of application has expanded, and the liquid crystal display for car navigation has been used for a large screen television (TV). ). In particular, when a backlight of a large-screen liquid crystal TV is configured using three color LEDs corresponding to the three primary colors of red, blue, and green, the color reproduction range can be widened, so that high image quality can be realized. It is also attracting attention.

大画面液晶ＴＶ用のバックライトの場合、大光量を必要とするため直下型で多数のＬＥＤチップを配列しなければならないが、ＬＥＤの発光効率（電気エネルギ ⇒ 光エネルギへの変換効率）が現状ではまだ５０％以下であるため、投入エネルギの過半が熱となってしまう。これによってＬＥＤ光源（チップ）のジャンクション温度上昇がもたらされ、これはさらに発光効率の低下とＬＥＤの短命化を招いている。即ち、ＬＥＤ光源は、発熱により利用効率（ｌｍ/ｗ）が低下し、また、チップ近傍に配置されるダイボンド剤や封止剤、光源パッケージ、導光板などの樹脂部材の劣化により反射率や透過率が低下し、発光強度が低下するため、熱引き（放熱）性の善悪がＬＥＤ光源の性能に大きな影響を与える。   In the case of backlights for large-screen LCD TVs, a large number of LED chips must be arranged directly underneath because a large amount of light is required, but the LED's luminous efficiency (electrical energy ⇒ conversion efficiency to light energy) is currently However, since it is still 50% or less, the majority of the input energy becomes heat. This leads to an increase in the junction temperature of the LED light source (chip), which further reduces the light emission efficiency and shortens the life of the LED. That is, the LED light source has lower utilization efficiency (lm / w) due to heat generation, and the reflectance and transmission due to deterioration of resin members such as die bond agent, sealant, light source package, and light guide plate disposed in the vicinity of the chip. Since the rate is reduced and the emission intensity is reduced, the heat draw (heat dissipation) property greatly affects the performance of the LED light source.

ここで、公報記載の従来技術として、多数個の発光ダイオードからの発生熱を効率的に放熱し、全面に亘って温度分布の均一化を図るために、バックパネルに放熱プレートを取り付け、この放熱プレートに取り付けたヒートパイプとヒートシンクと、このヒートシンクに組み付けられた冷却ファンを備えたものが存在する（例えば、特許文献１参照。）。   Here, as a prior art described in the publication, in order to efficiently dissipate heat generated from a large number of light emitting diodes and to make temperature distribution uniform over the entire surface, a heat dissipating plate is attached to the back panel. There is a heat pipe and a heat sink attached to a plate and a cooling fan assembled to the heat sink (see, for example, Patent Document 1).

特開２００５−３１６３３７号公報JP 2005-316337 A

図４（ａ），（ｂ）は、従来、採用されていた実装基板の取り付け構造の一例について示した図である。図４（ａ），（ｂ）に示す実装基板２００は、絶縁層２０１と、この絶縁層２０１上に形成される取り出し電極（配線回路）２０２とを備えている。また、実装基板２００上にはＬＥＤ２０３が配置され、このＬＥＤ２０３は、絶縁層２０１上の取り出し電極２０２とワイヤ２０４で接続されている。また、実装基板２００は、ＬＥＤ２０３が配置される面（第１面、表面）とは反対側の面（第２面、裏面）に、放熱用経路を形成する金属パターン２０６を備えている。また、実装基板２００には、ＬＥＤ２０３が置かれる直下の第１面と第２面とを結ぶスルーホールやバンプなどの経路２０７が形成されている。この経路２０７は金属パターン２０６に連結しており、ＬＥＤ２０３により発生した熱を金属パターン２０６に伝達している。   FIGS. 4A and 4B are views showing an example of a mounting structure of a mounting board that has been conventionally employed. A mounting substrate 200 shown in FIGS. 4A and 4B includes an insulating layer 201 and a take-out electrode (wiring circuit) 202 formed on the insulating layer 201. An LED 203 is disposed on the mounting substrate 200, and the LED 203 is connected to the extraction electrode 202 on the insulating layer 201 by a wire 204. In addition, the mounting substrate 200 includes a metal pattern 206 that forms a heat dissipation path on a surface (second surface, back surface) opposite to a surface (first surface, front surface) on which the LEDs 203 are disposed. In addition, a path 207 such as a through hole or a bump connecting the first surface and the second surface directly below the LED 203 is formed on the mounting substrate 200. This path 207 is connected to the metal pattern 206 and transfers heat generated by the LED 203 to the metal pattern 206.

そして、図４（ｂ）に示すように、図４（ａ）に示すようなＬＥＤ２０３が取り付けられた実装基板２００が、筐体２１０に取り付けられる。このとき、実装基板２００の第２面に設けられた金属パターン２０６と筐体２１０との間に、熱伝導性の高いシートであるサーマルシート２１１が設けられている。以上の構造によって、ＬＥＤ２０３のチップから発生した熱を外部へ放出している。尚、サーマルシート２１１や放熱グリースなどの放熱層を設けない場合もある。   Then, as shown in FIG. 4B, the mounting substrate 200 to which the LED 203 as shown in FIG. 4A is attached is attached to the housing 210. At this time, a thermal sheet 211 that is a sheet having high thermal conductivity is provided between the metal pattern 206 provided on the second surface of the mounting substrate 200 and the housing 210. With the above structure, heat generated from the chip of the LED 203 is released to the outside. In some cases, a thermal layer 211 or a heat radiation layer such as heat radiation grease is not provided.

しかし、例えば図４に示すような従来の技術では、ＬＥＤ２０３からの熱を逃がす経路２０７を実装基板２００の表面と裏面との間に作る必要があり、基板生成のための費用が増大してしまう。また、裏面に金属パターン２０６を設けることが必要であることから、絶縁層２０１の裏面に制限が生じ、基板の選択に制約が生じることも問題となる。   However, in the conventional technique as shown in FIG. 4, for example, it is necessary to create a path 207 for releasing heat from the LED 203 between the front surface and the back surface of the mounting substrate 200, which increases the cost for generating the substrate. . In addition, since it is necessary to provide the metal pattern 206 on the back surface, the back surface of the insulating layer 201 is limited, and the selection of the substrate is restricted.

本発明は、以上のような技術的課題を解決するためになされたものであって、その目的とするところは、ＬＥＤなどの固体発光素子を用いた発光装置にて、製品単価や製造コストを上昇させることなく、良好な放熱を実現することにある。   The present invention has been made in order to solve the technical problems as described above. The object of the present invention is to provide a light emitting device using a solid light emitting element such as an LED, and to reduce the product unit price and manufacturing cost. The object is to achieve good heat dissipation without increasing.

かかる目的を達成するために、本発明は、画像表示を行う表示パネルと、この表示パネルを背面から照射するバックライトとを含む表示装置であって、このバックライトは、固体発光素子を備えた実装基板と、表示パネル側に向く第１面と、この第１面の裏面となる第２面とを備え、第２面側から実装基板を取り付けるフレームとを備えたことを特徴としている。   In order to achieve such an object, the present invention is a display device that includes a display panel that displays an image and a backlight that irradiates the display panel from the back, and the backlight includes a solid-state light emitting element. A mounting substrate, a first surface facing the display panel, and a second surface serving as a back surface of the first surface, and a frame for mounting the mounting substrate from the second surface side are provided.

ここで、このバックライトの実装基板は、複数の固体発光素子を備え、このバックライトのフレームは、複数の貫通孔を備え、実装基板に設けられた複数の固体発光素子を複数の貫通孔の位置に各々合わせて第２面側から実装基板を取り付けることで、表示パネルに向けて固体発光素子を配置することを特徴とすれば、固体発光素子から発せられた光を表示パネルに良好に提供できる。尚、「貫通孔」の形状としては、円形や楕円形、三角形や四角形などの多角形など、任意に選択することができる。また、この「貫通孔」の孔断面は、傾斜を持たないストレートの形状や、実装基板の面に対して斜めとなる傾斜形状などを選択することができる。   Here, the mounting substrate of the backlight includes a plurality of solid light emitting elements, the frame of the backlight includes a plurality of through holes, and the plurality of solid light emitting elements provided on the mounting substrate are connected to the plurality of through holes. If the mounting board is attached from the second surface side according to the position, and the solid light emitting element is arranged toward the display panel, the light emitted from the solid light emitting element is provided to the display panel satisfactorily. it can. The shape of the “through hole” can be arbitrarily selected from a circle, an ellipse, a polygon such as a triangle and a quadrangle. In addition, as the hole cross section of the “through hole”, a straight shape having no inclination, an inclined shape that is inclined with respect to the surface of the mounting substrate, or the like can be selected.

また、このバックライトの実装基板は、固体発光素子と同一面に設けられ固体発光素子が発する熱を伝えるための熱伝達部を備えたことを特徴とすることができる。この熱伝達部としては、例えば、銅のむき出し領域などが該当する。
更に、このバックライトは、実装基板とフレームとの間に設けられ実装基板の固体発光素子から発せられた熱をフレームへ伝達する熱伝導手段を備えたことを特徴とすれば、より良好に熱を伝達できる点で優れている。
また更に、このバックライトの実装基板は、固体発光素子側に設けられ固体発光素子に接続される配線回路と、固体発光素子に接続される放熱回路と、配線回路と放熱回路を覆う絶縁層とを備えたことを特徴とすることができる。 In addition, the backlight mounting board may include a heat transfer unit that is provided on the same surface as the solid light-emitting element and transmits heat generated by the solid light-emitting element. For example, a copper exposed region corresponds to the heat transfer unit.
Further, the backlight is provided with a heat conduction means that is provided between the mounting board and the frame and transfers heat generated from the solid light emitting element of the mounting board to the frame, so that the heat can be better. It is excellent in that it can be transmitted.
Furthermore, the mounting substrate of the backlight includes a wiring circuit provided on the solid light emitting element side and connected to the solid light emitting element, a heat dissipation circuit connected to the solid light emitting element, and an insulating layer covering the wiring circuit and the heat dissipation circuit. It can be characterized by comprising.

他の観点から捉えると、本発明が適用される発光装置は、固体発光素子を備えた実装基板と、この固体発光素子からの光を提供する第１面と、第１面の裏面となる第２面とを備え、第２面側から実装基板を取り付けるフレームとを備えたことを特徴としている。   From another point of view, the light emitting device to which the present invention is applied includes a mounting substrate including a solid light emitting element, a first surface that provides light from the solid light emitting element, and a back surface that is the back surface of the first surface. And a frame to which the mounting board is attached from the second surface side.

このフレームは、貫通孔を備え、実装基板に設けられた固体発光素子を貫通孔の位置に合わせ、この第２面側から実装基板を取り付けることを特徴とすることができる。また、この実装基板は、一定間隔で配列された複数の固体発光素子を備え、フレームは、貫通孔を複数備えることを特徴としている。   This frame includes a through-hole, and a solid-state light emitting device provided on the mounting board is aligned with the position of the through-hole, and the mounting board is attached from the second surface side. The mounting board includes a plurality of solid state light emitting elements arranged at regular intervals, and the frame includes a plurality of through holes.

更に、フレームの第２面側と実装基板との間に設けられ、実装基板の固体発光素子から発せられた熱をフレームへ伝達する熱伝導手段を備えたことを特徴とすることができる。   Furthermore, it is possible to provide heat conduction means that is provided between the second surface side of the frame and the mounting substrate, and transfers heat generated from the solid light emitting elements of the mounting substrate to the frame.

また、この実装基板は、固体発光素子側に設けられ固体発光素子に接続される配線回路と、配線回路を覆う絶縁層とを備え、この絶縁層を備えた面をフレームの第２面に対峙させることを特徴とすることができる。
更に、この実装基板は、固体発光素子が配置された面に対して裏面となる面に配線回路が設けられ、固体発光素子と配線回路とが接続されるとともに、この固体発光素子が配置された面をフレームの第２面に対峙させることを特徴とすることができる。 The mounting board includes a wiring circuit provided on the solid light emitting element side and connected to the solid light emitting element, and an insulating layer covering the wiring circuit, and the surface including the insulating layer is opposed to the second surface of the frame. It can be characterized by making it.
Further, the mounting substrate is provided with a wiring circuit on a surface which is a back surface with respect to the surface on which the solid light emitting element is disposed, and the solid light emitting element and the wiring circuit are connected to each other, and the solid light emitting element is disposed The surface may be opposed to the second surface of the frame.

以上のように構成された本発明によれば、ＬＥＤなどの固体発光素子を用いた発光装置にて、製品単価や製造コストを上昇させることなく、良好な放熱を実現できる。   According to the present invention configured as described above, good heat dissipation can be realized in a light-emitting device using a solid light-emitting element such as an LED without increasing the product unit price or manufacturing cost.

以下、添付図面を参照して、本発明の実施の形態について詳細に説明する。
図１は、本実施の形態が適用される液晶表示装置の全体構成を示す図である。本実施の形態が適用される液晶表示装置は、大きなモジュールとして、発光装置の一つである直下型のバックライト装置（バックライト）１０と、このバックライト装置１０によって背面から照射される液晶表示モジュール３０とを備えている。このバックライト装置１０は、発光部を収容するバックライトフレーム１１と、発光源として固体発光素子の１つである発光ダイオード（ＬＥＤ）を複数個、配列させた基板である実装基板１２とを備えている。また、バックライト装置１０は、光学フィルムの積層体として、面全体を均一な明るさとするために光を散乱・拡散させる透明な板である拡散板１３と、前方への集光効果を持たせたプリズムシート１４，１５とを備えている。この拡散板１３の上に更に拡散フィルムを置く場合がある。また、輝度を向上させるための拡散・反射型の輝度向上フィルム１６が備えられる。 Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a diagram showing an overall configuration of a liquid crystal display device to which the present embodiment is applied. The liquid crystal display device to which the present embodiment is applied is a large module, a direct-type backlight device (backlight) 10 which is one of light emitting devices, and a liquid crystal display irradiated from the back by the backlight device 10. Module 30. The backlight device 10 includes a backlight frame 11 that houses a light emitting unit, and a mounting substrate 12 that is a substrate on which a plurality of light emitting diodes (LEDs) that are one of solid light emitting elements are arranged as a light emitting source. ing. In addition, the backlight device 10 has a diffusion plate 13 that is a transparent plate that scatters and diffuses light in order to make the entire surface uniform brightness as a laminated body of optical films, and has a forward focusing effect. Prism sheets 14 and 15. In some cases, a diffusion film is further placed on the diffusion plate 13. Further, a diffusion / reflection type brightness enhancement film 16 for improving brightness is provided.

一方、液晶表示モジュール３０として、２枚のガラス基板により液晶が挟まれている液晶パネル３１と、この液晶パネル３１の各々のガラス基板に積層され、光波の振動をある方向に制限するための偏光板（偏光フィルタ）３２，３３とを備えている。更に、液晶表示装置には、図示しない駆動用ＬＳＩなどの周辺部材が配置される。   On the other hand, as a liquid crystal display module 30, a liquid crystal panel 31 in which liquid crystal is sandwiched between two glass substrates, and a polarization layer that is laminated on each glass substrate of the liquid crystal panel 31 to limit light wave vibration in a certain direction. Plates (polarizing filters) 32 and 33 are provided. Further, peripheral members such as a driving LSI (not shown) are arranged in the liquid crystal display device.

この液晶パネル３１は、図示しない各種構成要素を含んで構成されている。例えば、２枚のガラス基板に、図示しない表示電極、薄膜トランジスタ（ＴＦＴ：Thin Film Transistor）などのアクティブ素子、液晶、スペーサ、シール剤、配向膜、共通電極、保護膜、カラーフィルタ等を備えている。
尚、バックライト装置１０の構成単位は任意に選択される。例えば、実装基板１２を有するバックライトフレーム１１だけの単位にて「バックライト装置（バックライト）」と呼び、拡散板１３やプリズムシート１４，１５などの光学フィルムの積層体を含まない流通形態もあり得る。 The liquid crystal panel 31 includes various components not shown. For example, two glass substrates are provided with a display electrode (not shown), an active element such as a thin film transistor (TFT), a liquid crystal, a spacer, a sealant, an alignment film, a common electrode, a protective film, a color filter, and the like. .
Note that the structural unit of the backlight device 10 is arbitrarily selected. For example, a distribution form in which only the backlight frame 11 having the mounting substrate 12 is referred to as a “backlight device (backlight)” and does not include a laminated body of optical films such as the diffusion plate 13 and the prism sheets 14 and 15. possible.

尚、本実施の形態では、バックライトフレーム１１の裏面側（液晶表示モジュール３０に向いている側とは反対側）から実装基板１２を取り付けている点に特徴がある。即ち、バックライトフレーム１１の液晶表示モジュール３０に向いている面を第１面とすると、この第１面の裏面である第２面に実装基板１２のＬＥＤ配置面を対応させ、この実装基板１２を取り付けている。   The present embodiment is characterized in that the mounting substrate 12 is attached from the back side of the backlight frame 11 (the side opposite to the side facing the liquid crystal display module 30). That is, when the surface of the backlight frame 11 facing the liquid crystal display module 30 is the first surface, the LED arrangement surface of the mounting substrate 12 is made to correspond to the second surface which is the back surface of the first surface. Is attached.

図２は、発光装置であるバックライト装置１０における実装基板１２の取り付け部分の構造を説明するための図である。図２に示す例では、液晶表示モジュール３０の背面直下に光源を置く直下型のバックライト構造を採用しており、このバックライト構造では、液晶表示モジュール３０の背面全体に対して所定間隔を隔てて複数のＬＥＤチップが配列されている。   FIG. 2 is a view for explaining the structure of the mounting portion of the mounting substrate 12 in the backlight device 10 which is a light emitting device. In the example shown in FIG. 2, a direct type backlight structure in which a light source is placed directly under the back surface of the liquid crystal display module 30 is employed. In this backlight structure, a predetermined interval is provided with respect to the entire back surface of the liquid crystal display module 30. A plurality of LED chips are arranged.

バックライトフレーム１１は、例えばアルミニウムやマグネシウム、鉄、またはそれらを含む金属合金などで生成される筐体構造を形成している。そして、その筐体構造の内側に、例えば白色高反射の性能を有するポリエステルフィルムなどが貼られ、酸化チタンに代表されるフィラーを含む白色塗料などが塗装され、リフレクタとしての機能を備えている。この筐体構造としては、液晶表示モジュール３０の大きさに対応して設けられるＬＥＤ配置部１１ａと、このＬＥＤ配置部１１ａの四隅を囲う側面部１１ｂを備えている。また、このＬＥＤ配置部１１ａや側面部１１ｂには、排熱のための冷却フィン等からなるヒートシンク構造（図示せず）が必要によって形成される場合がある。   The backlight frame 11 forms a housing structure made of, for example, aluminum, magnesium, iron, or a metal alloy containing them. And the polyester film etc. which have the performance of white high reflection, for example are stuck inside the housing structure, and the white paint containing the filler represented by titanium oxide etc. is painted, and it has a function as a reflector. The casing structure includes an LED arrangement portion 11a provided corresponding to the size of the liquid crystal display module 30, and side portions 11b surrounding the four corners of the LED arrangement portion 11a. In addition, a heat sink structure (not shown) including cooling fins for exhaust heat may be formed on the LED arrangement portion 11a and the side surface portion 11b as necessary.

この図２に示す例では、実装基板１２が複数（図２の例では８枚）設けられ、これらの実装基板１２は、それぞれ複数のネジ（図示せず）によってバックライトフレーム１１のＬＥＤ配置部１１ａの裏側（第２面側）から固定されている。このＬＥＤ配置部１１ａには、実装基板１２に配置された発光ダイオード（ＬＥＤ）２１の位置に対応した切り欠きである貫通孔１１ｃが形成されている。この貫通孔１１ｃから各々の発光ダイオード（ＬＥＤ）２１が頭を出した状態で、ＬＥＤ配置部１１ａの裏側から実装基板１２が取り付けられる。貫通孔１１ｃの形状は、例えば円、楕円、三角や四角などの多角形などを選択できる。また貫通孔１１ｃの孔断面は、テーパを付けたり、テーパを付けずにストレートとすることができる。   In the example shown in FIG. 2, a plurality of mounting boards 12 (eight in the example of FIG. 2) are provided, and these mounting boards 12 are each provided with a plurality of screws (not shown) in the LED arrangement portion of the backlight frame 11. It is fixed from the back side (second surface side) of 11a. The LED placement portion 11 a is formed with a through hole 11 c which is a notch corresponding to the position of the light emitting diode (LED) 21 placed on the mounting substrate 12. With each light emitting diode (LED) 21 protruding from the through hole 11c, the mounting substrate 12 is attached from the back side of the LED placement portion 11a. As the shape of the through hole 11c, for example, a circle, an ellipse, a polygon such as a triangle or a square can be selected. Moreover, the hole cross section of the through-hole 11c can be made straight with or without taper.

図３（ａ），（ｂ）は、実装基板１２上に形成される各要素を示す説明図である。図３（ａ）は実装基板１２の一部についての平面図であり、図３（ｂ）はバックライトフレーム１１におけるＬＥＤ配置部１１ａの裏面（第２面）に、図３（ａ）に示すような実装基板１２を取り付けた際の部分断面を示している。図３（ａ）に示すように、実装基板１２の表面には、発光ダイオード（ＬＥＤ）２１が取り付けられる。そして、実装基板１２の表面には、発光ダイオード（ＬＥＤ）２１に駆動電流を供給する配線回路２２が設けられている。   FIGS. 3A and 3B are explanatory views showing each element formed on the mounting substrate 12. FIG. 3A is a plan view of a part of the mounting substrate 12, and FIG. 3B is a back surface (second surface) of the LED placement portion 11a in the backlight frame 11, and FIG. The partial cross section at the time of mounting such a mounting substrate 12 is shown. As shown in FIG. 3A, a light emitting diode (LED) 21 is attached to the surface of the mounting substrate 12. A wiring circuit 22 for supplying a driving current to the light emitting diode (LED) 21 is provided on the surface of the mounting substrate 12.

この配線回路２２は、例えば銅または銅系金属材料で形成されており、実装基板１２に取り付けられた発光ダイオード（ＬＥＤ）２１が、配線回路２２にワイヤー２３を介してそれぞれ電気的に接続されている。即ち、発光ダイオード（ＬＥＤ）２１の（＋）極および（−）極は、ワイヤーボンディングで配線回路２２に接続されている。そして、その配線回路２２が形成される部位には、バックライトフレーム１１のＬＥＤ配置部１１ａに対峙する部分に対応させて、レジスト等の絶縁層２４が設けられており、配線回路２２とバックライトフレーム１１との電気的なショートを防止している。   The wiring circuit 22 is made of, for example, copper or a copper-based metal material, and light emitting diodes (LEDs) 21 attached to the mounting substrate 12 are electrically connected to the wiring circuit 22 via wires 23, respectively. Yes. That is, the (+) pole and the (−) pole of the light emitting diode (LED) 21 are connected to the wiring circuit 22 by wire bonding. In addition, an insulating layer 24 such as a resist is provided at a portion where the wiring circuit 22 is formed so as to correspond to a portion of the backlight frame 11 facing the LED placement portion 11a. An electrical short circuit with the frame 11 is prevented.

更に、本実施の形態が適用される実装基板１２は、配線回路２２が形成される面に、放熱のための熱伝達部である金属膜領域２５（図の斜線で示す領域）が設けられている。この金属膜領域２５は、例えば配線回路２２と同一材料の金属（例えば銅）から生成され、発光ダイオード（ＬＥＤ）２１および配線回路２２を避けた位置に、その面積をできるだけ広くとれるように設計された状態で設けられている。このように面積をより広くとることで、発光ダイオード（ＬＥＤ）２１から発せられる熱に対する放熱効果をより高めることができる。   Further, the mounting substrate 12 to which the present embodiment is applied has a metal film region 25 (a region indicated by hatching in the drawing) serving as a heat transfer unit for heat dissipation on the surface on which the wiring circuit 22 is formed. Yes. The metal film region 25 is generated from, for example, a metal (for example, copper) of the same material as the wiring circuit 22 and is designed so that the area can be as wide as possible at a position avoiding the light emitting diode (LED) 21 and the wiring circuit 22. It is provided in the state. Thus, by taking a larger area, the heat dissipation effect with respect to the heat | fever emitted from the light emitting diode (LED) 21 can be heightened more.

また、この金属膜領域２５は、配線回路２２の生成と同一の工程によって生成される。例えば、実装基板１２の製造方法として、不要な導体部分をエッチングする方法が広く用いられているが、この方法では、まず、銅張積層板の上にレジストを塗布し、このレジストにて、配線回路２２の部分と金属膜領域２５の領域とをマスキングする。その後、ベイク、露光、現像を経て、エッチングを行い、レジストを剥離することにより、配線回路２２と金属膜領域２５とが実装基板１２上に形成される。このようにして形成される金属膜領域２５は、従来、配線回路２２の生成に際してエッチングにより取り除かれていた部分である。したがって、この金属膜領域２５を新たに形成したことによる特別なコストアップは生じない。   Further, the metal film region 25 is generated by the same process as the generation of the wiring circuit 22. For example, as a method of manufacturing the mounting substrate 12, a method of etching unnecessary conductor portions is widely used. In this method, a resist is first applied on a copper-clad laminate, and a wiring is formed using the resist. The circuit 22 and the metal film region 25 are masked. Thereafter, etching is performed through baking, exposure, and development, and the resist is removed, whereby the wiring circuit 22 and the metal film region 25 are formed on the mounting substrate 12. The metal film region 25 thus formed is a portion that has been removed by etching when the wiring circuit 22 is generated. Therefore, a special increase in cost due to the newly formed metal film region 25 does not occur.

このような金属膜領域２５を有する実装基板１２は、図３（ｂ）に示すように、バックライトフレーム１１のＬＥＤ配置部１１ａの裏面に取り付けられる。即ち、ＬＥＤ配置部１１ａは、表示パネル側（液晶表示モジュール３０側）に向く第１面と、この第１面の裏面となる第２面とを備えているが、この第２面側から実装基板１２が取り付けられる。この取り付けでは、前述のように、貫通孔１１ｃに発光ダイオード（ＬＥＤ）２１を位置合わせし、更に、ＬＥＤ配置部１１ａの第２面側に、熱伝導手段としてのサーマルシート２６を挟んで実装基板１２が取り付けられる。また、この取り付けは、図３（ｂ）に示すように、例えば裏面側からネジ２７によってＬＥＤ配置部１１ａに固定される。尚、図３（ａ）に示す絶縁層２４よりも厚く、更に熱接合性のある層が形成できれば、サーマルシート２６の代わりに他のものを採用することができる。例えば、グリースや金属薄膜などを用いることも可能である。   The mounting substrate 12 having such a metal film region 25 is attached to the back surface of the LED placement portion 11a of the backlight frame 11 as shown in FIG. That is, the LED arrangement portion 11a includes a first surface facing the display panel side (the liquid crystal display module 30 side) and a second surface serving as a back surface of the first surface, and is mounted from the second surface side. A substrate 12 is attached. In this attachment, as described above, the light-emitting diode (LED) 21 is aligned with the through hole 11c, and the mounting board is further sandwiched with the thermal sheet 26 as the heat conducting means on the second surface side of the LED arrangement portion 11a. 12 is attached. In addition, as shown in FIG. 3B, this attachment is fixed to the LED placement portion 11a with screws 27 from the back side, for example. It should be noted that other layers can be used instead of the thermal sheet 26 as long as a thicker layer than the insulating layer 24 shown in FIG. For example, grease or a metal thin film can be used.

ここで、実装基板１２は、樹脂上に金属膜など配線回路２２を形成した片面あるいは両面基板であるので、金属材料に比べて一般に熱伝導率が極めて低いことから、発光ダイオード（ＬＥＤ）２１から発生した熱は実装基板１２に蓄積される傾向にある。そのために、何ら放熱対策を取らない場合には、発光ダイオード（ＬＥＤ）２１の温度上昇が激しくなり、発光ダイオード（ＬＥＤ）２１の発光効率の低下や、発光ダイオード（ＬＥＤ）２１の近傍に配置されるダイボンド剤や封止剤、光源パッケージ、導光板などの樹脂部材の劣化により反射率や透過率が低下し、発光強度が低下するなどの問題が生じる。本実施の形態では、発光ダイオード（ＬＥＤ）２１に近接して熱伝達膜である金属膜領域２５を設け、これによって外部への放熱効果を高めるとともに、金属膜領域２５で吸収した熱を、サーマルシート２６を介してバックライトフレーム１１へ直接、逃がしている。   Here, since the mounting substrate 12 is a single-sided or double-sided substrate in which a wiring circuit 22 such as a metal film is formed on a resin, since the thermal conductivity is generally extremely low as compared with a metal material, the light-emitting diode (LED) 21 The generated heat tends to accumulate on the mounting substrate 12. Therefore, if no heat dissipation measures are taken, the temperature rise of the light emitting diode (LED) 21 becomes severe, the light emitting efficiency of the light emitting diode (LED) 21 decreases, and the light emitting diode (LED) 21 is disposed in the vicinity. Deterioration of resin members such as die bond agents, sealing agents, light source packages, and light guide plates causes problems such as a decrease in reflectance and transmittance and a decrease in light emission intensity. In the present embodiment, a metal film region 25 that is a heat transfer film is provided in the vicinity of the light emitting diode (LED) 21, thereby enhancing the heat dissipation effect to the outside, and the heat absorbed by the metal film region 25 is thermally transferred. It escapes directly to the backlight frame 11 via the seat 26.

以上、詳述したように、本実施の形態によれば、熱引きの経路を実装基板１２の上下間に作る必要がないので、両面基板を採用する必要がなく、実装基板１２を片面基板で形成できる。その結果、コストを大幅に低減することができる。また、実装基板１２にて裏面の制限がないことから、例えばガラス布基材エポキシ樹脂（ガラエポ樹脂）をベースとしたものや金属をベースとしたものを採用することが可能となる。更に、バックライトフレーム１１の裏面（第２面）から実装基板１２を取り付けることから、バックライトフレーム１１の表面（第１面）における凹凸を減らすことができる。これによって、例えば、バックライトフレーム１１の表面（第１面）に反射シートなどの貼り付けや、チタンに代表されるフィラーを含む白色塗料などの塗装が容易になり、バックライトフレーム１１内の反射層の形成が簡易になる。   As described above in detail, according to the present embodiment, since it is not necessary to create a heat sink path between the upper and lower sides of the mounting board 12, it is not necessary to employ a double-sided board, and the mounting board 12 is a single-sided board. Can be formed. As a result, the cost can be greatly reduced. Moreover, since there is no restriction | limiting of a back surface in the mounting board | substrate 12, it becomes possible to employ | adopt the thing based on a glass cloth base-material epoxy resin (glass epoxy resin), for example, and a metal base. Furthermore, since the mounting substrate 12 is attached from the back surface (second surface) of the backlight frame 11, unevenness on the surface (first surface) of the backlight frame 11 can be reduced. As a result, for example, a reflection sheet or the like can be easily applied to the surface (first surface) of the backlight frame 11 or a white paint containing a filler typified by titanium can be easily applied. Layer formation is simplified.

尚、前述（図３に示す）の例では、実装基板１２の発光ダイオード（ＬＥＤ）２１が取り付けられる表面に、発光ダイオード（ＬＥＤ）２１に駆動電流を供給する配線回路２２を設けている。しかしながら、コストを低減するという課題には不利な点はあるが、発光ダイオード（ＬＥＤ）２１が取り付けられていない裏面に配線回路を設けるように構成することもできる。かかる場合には、バックライトフレーム１１と対峙する表面には、発光ダイオード（ＬＥＤ）２１のチップ部分を除いて例えば銅を用いた金属膜領域２５がむき出しとなる。また、発光ダイオード（ＬＥＤ）２１の取り出し部分と裏面の配線回路とが例えばスルーホールで結ばれる。この場合には、バックライトフレーム１１と対峙する面には配線が存在しない。   In the example described above (shown in FIG. 3), the wiring circuit 22 that supplies the drive current to the light emitting diode (LED) 21 is provided on the surface of the mounting substrate 12 to which the light emitting diode (LED) 21 is attached. However, although there is a disadvantage in reducing the cost, a wiring circuit may be provided on the back surface to which the light emitting diode (LED) 21 is not attached. In such a case, a metal film region 25 using, for example, copper is exposed on the surface facing the backlight frame 11 except for the chip portion of the light emitting diode (LED) 21. Moreover, the extraction part of the light emitting diode (LED) 21 and the wiring circuit on the back surface are connected by, for example, a through hole. In this case, no wiring exists on the surface facing the backlight frame 11.

本実施の形態が適用される液晶表示装置の全体構成を示す図である。It is a figure which shows the whole structure of the liquid crystal display device with which this Embodiment is applied. バックライト装置における実装基板の取り付け部分の構造を説明するための図である。It is a figure for demonstrating the structure of the attachment part of the mounting board | substrate in a backlight apparatus. （ａ），（ｂ）は、実装基板上に形成される各要素を示す説明図である。(A), (b) is explanatory drawing which shows each element formed on a mounting substrate. （ａ），（ｂ）は、従来、採用されていた実装基板の取り付け構造の一例について示した図である。(A), (b) is the figure shown about an example of the attachment structure of the mounting board | substrate conventionally employ | adopted.

符号の説明Explanation of symbols

１０…バックライト装置（バックライト）、１１…バックライトフレーム、１１ａ…ＬＥＤ配置部、１１ｃ…貫通孔、１２…実装基板、１３…拡散板、１４，１５…プリズムシート、１６…輝度向上フィルム、２１…発光ダイオード（ＬＥＤ）、２４…絶縁層、２５…金属膜領域、２６…サーマルシート、３０…液晶表示モジュール、３１…液晶パネル、３２，３３…偏光板（偏光フィルタ） DESCRIPTION OF SYMBOLS 10 ... Backlight apparatus (backlight), 11 ... Backlight frame, 11a ... LED arrangement part, 11c ... Through-hole, 12 ... Mounting board, 13 ... Diffusing plate, 14, 15 ... Prism sheet, 16 ... Brightness improvement film, DESCRIPTION OF SYMBOLS 21 ... Light emitting diode (LED), 24 ... Insulating layer, 25 ... Metal film area | region, 26 ... Thermal sheet, 30 ... Liquid crystal display module, 31 ... Liquid crystal panel, 32, 33 ... Polarizing plate (polarizing filter)

Claims (11)

画像表示を行う表示パネルと、当該表示パネルを背面から照射するバックライトとを含む表示装置であって、
前記バックライトは、
固体発光素子を備えた実装基板と、
前記表示パネル側に向く第１面と、当該第１面の裏面となる第２面とを備え、当該第２面側から前記実装基板を取り付けるフレームと
を備えたことを特徴とする表示装置。 A display device including a display panel for displaying an image and a backlight for illuminating the display panel from the back,
The backlight is
A mounting board equipped with a solid state light emitting device;
A display device comprising: a first surface facing the display panel; and a second surface serving as a back surface of the first surface, and a frame to which the mounting substrate is attached from the second surface side. 前記バックライトの前記実装基板は、複数の固体発光素子を備え、
前記バックライトの前記フレームは、複数の貫通孔を備え、前記実装基板に設けられた複数の前記固体発光素子を複数の当該貫通孔の位置に各々合わせて前記第２面側から当該実装基板を取り付けることで、前記表示パネルに向けて前記固体発光素子を配置することを特徴とする請求項１記載の表示装置。 The mounting substrate of the backlight includes a plurality of solid state light emitting elements,
The frame of the backlight includes a plurality of through-holes, and the plurality of solid-state light emitting elements provided on the mounting substrate are respectively aligned with the positions of the plurality of through-holes, and the mounting substrate is mounted from the second surface side. The display device according to claim 1, wherein the solid-state light emitting element is arranged toward the display panel by being attached. 前記バックライトの前記実装基板は、前記固体発光素子と同一面に設けられ当該固体発光素子が発する熱を伝えるための熱伝達部を備えたことを特徴とする請求項１または２記載の表示装置。   The display device according to claim 1, wherein the mounting substrate of the backlight includes a heat transfer unit that is provided on the same surface as the solid light emitting element and transmits heat generated by the solid light emitting element. . 前記バックライトは、前記実装基板と前記フレームとの間に設けられ当該実装基板の前記固体発光素子から発せられた熱を当該フレームへ伝達する熱伝導手段を更に備えたことを特徴とする請求項１乃至３何れか１項記載の表示装置。   The back light further includes heat conduction means provided between the mounting board and the frame, and transferring heat generated from the solid light emitting element of the mounting board to the frame. The display device according to any one of 1 to 3. 前記バックライトの前記実装基板は、前記固体発光素子側に設けられ当該固体発光素子に接続される配線回路と、当該配線回路を覆う絶縁層とを備えたことを特徴とする請求項１乃至４何れか１項記載の表示装置。   5. The mounting substrate of the backlight includes a wiring circuit provided on the solid light emitting element side and connected to the solid light emitting element, and an insulating layer covering the wiring circuit. The display device according to any one of the preceding claims. 固体発光素子を備えた実装基板と、
前記固体発光素子からの光を提供する第１面と、当該第１面の裏面となる第２面とを備え、当該第２面側から前記実装基板を取り付けるフレームと
を備えた発光装置。 A mounting board equipped with a solid state light emitting device;
A light-emitting device comprising: a first surface that provides light from the solid-state light-emitting element; and a second surface that is a back surface of the first surface, and a frame to which the mounting substrate is attached from the second surface side. 前記フレームは、貫通孔を備え、前記実装基板に設けられた前記固体発光素子を当該貫通孔の位置に合わせ、前記第２面側から当該実装基板を取り付けることを特徴とする請求項６記載の発光装置。   7. The frame according to claim 6, wherein the frame includes a through hole, the solid-state light emitting element provided on the mounting substrate is aligned with the position of the through hole, and the mounting substrate is attached from the second surface side. Light emitting device. 前記実装基板は、一定間隔で配列された複数の前記固体発光素子を備え、
前記フレームは、前記貫通孔を複数備えることを特徴とする請求項７記載の発光装置。 The mounting board includes a plurality of the solid-state light emitting elements arranged at regular intervals,
The light emitting device according to claim 7, wherein the frame includes a plurality of the through holes. 前記フレームの前記第２面側と前記実装基板との間に設けられ、当該実装基板の前記固体発光素子から発せられた熱を当該フレームへ伝達する熱伝導手段を更に備えたことを特徴とする請求項６乃至８何れか１項記載の発光装置。   It further comprises heat conduction means provided between the second surface side of the frame and the mounting substrate, and transferring heat generated from the solid state light emitting device of the mounting substrate to the frame. The light emitting device according to any one of claims 6 to 8. 前記実装基板は、前記固体発光素子側に設けられ当該固体発光素子に接続される配線回路と、当該配線回路を覆う絶縁層とを備え、当該絶縁層を備えた面を前記フレームの前記第２面に対峙させることを特徴とする請求項６乃至９何れか１項記載の発光装置。   The mounting substrate includes a wiring circuit provided on the solid-state light-emitting element side and connected to the solid-state light-emitting element, and an insulating layer that covers the wiring circuit, and the surface including the insulating layer is disposed on the second surface of the frame. The light-emitting device according to claim 6, wherein the light-emitting device faces the surface. 前記実装基板は、前記固体発光素子が配置された面に対して裏面となる面に配線回路が設けられ、当該固体発光素子と当該配線回路とが接続されるとともに、当該固体発光素子が配置された面を前記フレームの前記第２面に対峙させることを特徴とする請求項６乃至９何れか１項記載の発光装置。   The mounting substrate is provided with a wiring circuit on a surface which is a back surface with respect to a surface on which the solid light emitting element is disposed, the solid light emitting element and the wiring circuit are connected, and the solid light emitting element is disposed. The light emitting device according to any one of claims 6 to 9, wherein the surface is opposed to the second surface of the frame.
JP2006316319A 2006-11-22 2006-11-22 LIGHT EMITTING DEVICE AND DISPLAY DEVICE USING THE SAME Expired - Fee Related JP4912844B2 (en)

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JP2010177428A (en) * 2009-01-29 2010-08-12 Kyocera Corp Light-emitting device, and lighting device using the same
US7997749B2 (en) 2009-03-02 2011-08-16 Lg Innotek Co., Ltd. Light emitting module and light unit having the same
JP2012077988A (en) * 2010-09-30 2012-04-19 Fujitsu Ltd Heat relay mechanism, and heat-dissipating fin unit
JP2016015443A (en) * 2014-07-03 2016-01-28 Ｋｉｓｃｏ株式会社 Light-emitting module and luminaire

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