CH621435A5 - Semiconductor module - Google Patents
Semiconductor module Download PDFInfo
- Publication number
- CH621435A5 CH621435A5 CH1036777A CH1036777A CH621435A5 CH 621435 A5 CH621435 A5 CH 621435A5 CH 1036777 A CH1036777 A CH 1036777A CH 1036777 A CH1036777 A CH 1036777A CH 621435 A5 CH621435 A5 CH 621435A5
- Authority
- CH
- Switzerland
- Prior art keywords
- base plate
- semiconductor
- components
- insulating material
- connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19762639979 DE2639979C3 (de) | 1976-09-04 | 1976-09-04 | Halbleiterbaueinheit |
Publications (1)
Publication Number | Publication Date |
---|---|
CH621435A5 true CH621435A5 (en) | 1981-01-30 |
Family
ID=5987203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1036777A CH621435A5 (en) | 1976-09-04 | 1977-08-24 | Semiconductor module |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5332673A (ja) |
AT (1) | AT377386B (ja) |
CH (1) | CH621435A5 (ja) |
DE (1) | DE2639979C3 (ja) |
FR (1) | FR2363893A1 (ja) |
GB (1) | GB1584783A (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2805019C2 (de) * | 1978-02-06 | 1982-04-15 | Siemens AG, 1000 Berlin und 8000 München | Spannungsversorgungsgerät für Werkzeugmaschinenantriebe |
DE2812699C2 (de) * | 1978-03-23 | 1987-04-09 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichter in Brückenschaltung mit einseitig gekühlten Scheibenthyristoren |
DE2819327C2 (de) * | 1978-05-03 | 1984-10-31 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiterbaueinheit |
DE2829300C2 (de) * | 1978-07-04 | 1988-07-28 | Brown, Boveri & Cie Ag, 6800 Mannheim | Umkehrstromrichter-Anordnung |
DE3005313C2 (de) * | 1980-02-13 | 1986-05-28 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
JPS56132760U (ja) * | 1980-03-06 | 1981-10-08 | ||
JPS5710959A (en) * | 1980-06-23 | 1982-01-20 | Mitsubishi Electric Corp | Semiconductor device |
FR2503526A1 (fr) * | 1981-04-03 | 1982-10-08 | Silicium Semiconducteur Ssc | Boitier et procede de montage et d'interconnexion de composants semiconducteurs de moyenne puissance en boitier unique. |
JPS5823469A (ja) * | 1981-08-03 | 1983-02-12 | Mitsubishi Electric Corp | 複合パワ−トランジスタ |
DE3143339C2 (de) * | 1981-10-31 | 1987-05-14 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiteranordnung |
JPS5968958A (ja) * | 1982-10-12 | 1984-04-19 | Mitsubishi Electric Corp | ゲ−トタ−ンオフサイリスタ組立体 |
DE3345285A1 (de) * | 1983-12-14 | 1985-06-27 | Siemens AG, 1000 Berlin und 8000 München | Leistungs-halbleiteranordnung |
KR900003012Y1 (ko) * | 1986-02-21 | 1990-04-10 | 아루프스 덴기 가부시끼가이샤 | Rf 모듈레이터 |
DE3837920A1 (de) * | 1988-11-09 | 1990-05-10 | Semikron Elektronik Gmbh | Halbleiterelement |
DE3915707A1 (de) * | 1989-05-13 | 1990-11-22 | Asea Brown Boveri | Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse |
DE3940933C2 (de) * | 1989-12-12 | 1996-08-01 | Eupec Gmbh & Co Kg | Verfahren zum Verformen einer Basisplatte für Halbleitermodule und Vorrichtung zum Durchführen des Verfahrens |
DE4305439C2 (de) * | 1993-02-23 | 1999-10-21 | Eldo Elektronik Service Gmbh | Umkapselung für einen elektronischen Sensor zur Feldstärkemessung |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5316672B2 (ja) * | 1971-09-16 | 1978-06-02 |
-
1976
- 1976-09-04 DE DE19762639979 patent/DE2639979C3/de not_active Expired
-
1977
- 1977-08-24 CH CH1036777A patent/CH621435A5/de not_active IP Right Cessation
- 1977-08-25 AT AT617777A patent/AT377386B/de not_active IP Right Cessation
- 1977-09-01 JP JP10426877A patent/JPS5332673A/ja active Pending
- 1977-09-02 FR FR7726655A patent/FR2363893A1/fr not_active Withdrawn
- 1977-09-05 GB GB3694077A patent/GB1584783A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
AT377386B (de) | 1985-03-11 |
DE2639979A1 (de) | 1978-03-09 |
JPS5332673A (en) | 1978-03-28 |
ATA617777A (de) | 1984-07-15 |
DE2639979C3 (de) | 1980-05-14 |
FR2363893A1 (fr) | 1978-03-31 |
DE2639979B2 (de) | 1979-08-23 |
GB1584783A (en) | 1981-02-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |