CA2304844A1 - Dispositif electronique a puce jetable et procede de fabrication - Google Patents

Dispositif electronique a puce jetable et procede de fabrication Download PDF

Info

Publication number
CA2304844A1
CA2304844A1 CA002304844A CA2304844A CA2304844A1 CA 2304844 A1 CA2304844 A1 CA 2304844A1 CA 002304844 A CA002304844 A CA 002304844A CA 2304844 A CA2304844 A CA 2304844A CA 2304844 A1 CA2304844 A1 CA 2304844A1
Authority
CA
Canada
Prior art keywords
film
interface
microcircuit
support
support film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002304844A
Other languages
English (en)
French (fr)
Inventor
Pierre Garnier
Isabelle Desoutter
Philippe Martin
Rene-Paul Blanc
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26233849&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2304844(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from FR9712444A external-priority patent/FR2769108B3/fr
Application filed by Individual filed Critical Individual
Publication of CA2304844A1 publication Critical patent/CA2304844A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Die Bonding (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Wire Bonding (AREA)
CA002304844A 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication Abandoned CA2304844A1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
FR97/12444 1997-09-26
FR9712444A FR2769108B3 (fr) 1997-09-26 1997-09-26 Etiquette souple intelligente et procede de fabrication
FR97/14582 1997-11-14
FR9714582A FR2769109B1 (fr) 1997-09-26 1997-11-14 Dispositif electronique a puce jetable et procede de fabrication
PCT/FR1998/002051 WO1999017252A1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication

Publications (1)

Publication Number Publication Date
CA2304844A1 true CA2304844A1 (fr) 1999-04-08

Family

ID=26233849

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002304844A Abandoned CA2304844A1 (fr) 1997-09-26 1998-09-23 Dispositif electronique a puce jetable et procede de fabrication

Country Status (11)

Country Link
US (2) US6437985B1 (ja)
EP (1) EP1060457B1 (ja)
JP (2) JP4692863B2 (ja)
CN (1) CN1214345C (ja)
AT (1) ATE220468T1 (ja)
AU (1) AU748452B2 (ja)
CA (1) CA2304844A1 (ja)
DE (1) DE69806515T2 (ja)
ES (1) ES2180199T3 (ja)
FR (1) FR2769109B1 (ja)
WO (1) WO1999017252A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6818084B2 (en) * 2001-07-13 2004-11-16 Pittsfield Weaving Co., Inc. Method and apparatus for bonding an additional layer of fabric to a label

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2778769B1 (fr) * 1998-05-15 2001-11-02 Gemplus Sca Carte a circuit integre comportant un bornier d'interface et procede de fabrication d'une telle carte
DE19850353C1 (de) * 1998-11-02 2000-03-16 David Finn Identifikationslabel sowie Verfahren zur Herstellung eines Indentifikationslabels
DE69941548D1 (de) * 1998-11-30 2009-11-26 Hitachi Ltd Verfahren zur Montage eines elektronischen Schaltungschips
DE19942932C2 (de) * 1999-09-08 2002-01-24 Giesecke & Devrient Gmbh Verfahren zum Herstellen von Chipkarten
JP2003529163A (ja) * 2000-03-28 2003-09-30 ルカトロン アーゲー 共振周波数を調整する部材を有するｒｆｉｄラベル
DE60123004T2 (de) * 2000-05-12 2006-12-21 Dai Nippon Printing Co., Ltd. Kontaktloser datenträger
US6588098B1 (en) * 2000-11-13 2003-07-08 Semiconductor Components Industries Llc Method for manufacturing an electronic device package
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use
CA2454897A1 (en) 2001-08-29 2003-03-06 Tesa Ag Machine-detectable adhesive tape
JP2003099746A (ja) * 2001-09-25 2003-04-04 Nec Tokin Corp 非接触通信媒体
JP2003108961A (ja) 2001-09-28 2003-04-11 Hitachi Ltd 電子タグおよびその製造方法
BRPI0213069B1 (pt) * 2001-10-01 2015-08-18 Nagraid Sa Circuito eletrônico compreendendo pontes condutoras e método para fazer essas pontes
FR2841023B1 (fr) * 2002-06-14 2005-10-21 Store Electronic Systems Techn Antenne pour etiquette electronique
DE10229168A1 (de) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminat mit einer als Antennenstruktur ausgebildeten elektrisch leitfähigen Schicht
US7930815B2 (en) * 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
FR2855637B1 (fr) * 2003-05-26 2005-11-18 A S K Procede de fabrication d'un ticket sans contact et ticket obtenu a partir de ce procede
US20050183990A1 (en) * 2004-01-12 2005-08-25 Corbett Bradford G.Jr. Textile identification system with RFID tracking
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
US20060108674A1 (en) * 2004-11-24 2006-05-25 Jhyy-Cheng Liou Package structure of memory card and packaging method for the structure
US7196626B2 (en) * 2005-01-28 2007-03-27 Wha Yu Industrial Co., Ltd. Radio frequency identification RFID tag
EP1864266A2 (en) * 2005-03-29 2007-12-12 Symbol Technologies, Inc. Smart radio frequency identification (rfid) items
US7523546B2 (en) * 2005-05-04 2009-04-28 Nokia Corporation Method for manufacturing a composite layer for an electronic device
JP4768379B2 (ja) * 2005-09-28 2011-09-07 富士通株式会社 Ｒｆｉｄタグ
US7224278B2 (en) * 2005-10-18 2007-05-29 Avery Dennison Corporation Label with electronic components and method of making same
EP1887497B1 (en) * 2006-08-10 2015-05-27 Fujitsu Limited RFID tag
WO2008050535A1 (fr) * 2006-09-26 2008-05-02 Murata Manufacturing Co., Ltd. Module couplé électromagnétiquement et article muni de celui-ci
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
CA2678556C (en) * 2007-02-23 2012-01-31 Newpage Wisconsin System Inc. Multifunctional paper identification label
EP2053544A1 (de) * 2007-10-23 2009-04-29 F. Hoffman-la Roche AG Verfahren zur Herstellung eines Smart Labels mit laserbeschriftbarem Klebeetikett
US8966749B2 (en) * 2008-10-28 2015-03-03 Samsung Sdi Co., Ltd. Manufacturing method for protection circuit module of secondary battery
DE102009019378A1 (de) * 2009-04-29 2010-11-11 Giesecke & Devrient Gmbh Einbettung elektronischer Bauteile durch Extrusionsbeschichtung
DE102009023405A1 (de) 2009-05-29 2010-12-02 Giesecke & Devrient Gmbh Verfahren zur Herstellung tragbarer Datenträger
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
JP4637969B1 (ja) 2009-12-31 2011-02-23 株式会社Ｔａｇｇｙ ウェブページの主意，およびユーザの嗜好を適切に把握して，最善の情報をリアルタイムに推奨する方法
WO2012014005A1 (en) * 2010-07-26 2012-02-02 Fci Rfid tag and method for manufacturing such a rfid tag
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
WO2015131185A1 (en) * 2014-02-28 2015-09-03 Intellipaper, Llc Integrated circuitry and methods for manufacturing same
USD776070S1 (en) * 2014-03-18 2017-01-10 Sony Corporation Non-contact type data carrier
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
JP6801370B2 (ja) 2016-10-28 2020-12-16 富士通株式会社 センサ装置
JP6780578B2 (ja) * 2017-05-12 2020-11-04 株式会社村田製作所 テーピング電子部品連
CN109310010B (zh) * 2018-10-29 2019-12-20 南京溧航仿生产业研究院有限公司 一种具有自动清理及防误碰功能的智能蚀刻机
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
US11895777B2 (en) * 2021-09-24 2024-02-06 Idex Biometrics Asa Flexible inlay and manufacturing method thereof

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0655554B2 (ja) * 1984-12-13 1994-07-27 松下電器産業株式会社 Ｉｃカードおよびその製造方法
US4977441A (en) * 1985-12-25 1990-12-11 Hitachi, Ltd. Semiconductor device and tape carrier
JPH0530874U (ja) * 1991-10-02 1993-04-23 三菱重工業株式会社 フレキシブルｉｃタグ
GB9222460D0 (en) * 1992-10-26 1992-12-09 Hughes Microelectronics Europa Radio frequency baggage tag
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE4431604A1 (de) * 1994-09-05 1996-03-07 Siemens Ag Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule
DE4431605C2 (de) * 1994-09-05 1998-06-04 Siemens Ag Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
JP3144455B2 (ja) * 1994-12-27 2001-03-12 ローム株式会社 非接触型ｉｃカード
JPH0890966A (ja) * 1994-09-22 1996-04-09 Rohm Co Ltd 非接触型ｉｃカードの構造
KR100355209B1 (ko) * 1994-09-22 2003-02-11 로무 가부시키가이샤 비접촉형ic카드및그제조방법
DE4437721A1 (de) * 1994-10-21 1996-04-25 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
JP3505238B2 (ja) * 1994-10-26 2004-03-08 日立マクセル株式会社 情報記憶担体及びその製造方法
JP3521586B2 (ja) * 1995-01-19 2004-04-19 株式会社デンソー Ｉｃカードの製造方法
JP2814477B2 (ja) * 1995-04-13 1998-10-22 ソニーケミカル株式会社 非接触式ｉｃカード及びその製造方法
JPH08310172A (ja) * 1995-05-23 1996-11-26 Hitachi Ltd 半導体装置
JPH09131987A (ja) * 1995-11-10 1997-05-20 Toshiba Corp Ｉｃカードの製造方法および製造装置
US6160526A (en) * 1997-06-23 2000-12-12 Rohm Co., Ltd. IC module and IC card
US6037879A (en) * 1997-10-02 2000-03-14 Micron Technology, Inc. Wireless identification device, RFID device, and method of manufacturing wireless identification device
US6095416A (en) * 1998-02-24 2000-08-01 Privicom, Inc. Method and device for preventing unauthorized use of credit cards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6818084B2 (en) * 2001-07-13 2004-11-16 Pittsfield Weaving Co., Inc. Method and apparatus for bonding an additional layer of fabric to a label

Also Published As

Publication number Publication date
WO1999017252A1 (fr) 1999-04-08
JP2002517807A (ja) 2002-06-18
CN1214345C (zh) 2005-08-10
FR2769109A1 (fr) 1999-04-02
JP4692863B2 (ja) 2011-06-01
ATE220468T1 (de) 2002-07-15
DE69806515D1 (de) 2002-08-14
FR2769109B1 (fr) 1999-11-19
CN1280692A (zh) 2001-01-17
ES2180199T3 (es) 2003-02-01
JP2009259258A (ja) 2009-11-05
JP4618462B2 (ja) 2011-01-26
AU9353398A (en) 1999-04-23
EP1060457A1 (fr) 2000-12-20
EP1060457B1 (fr) 2002-07-10
US6437985B1 (en) 2002-08-20
US20020148110A1 (en) 2002-10-17
DE69806515T2 (de) 2003-03-27
AU748452B2 (en) 2002-06-06

Similar Documents

Publication Publication Date Title
EP1060457B1 (fr) Dispositif electronique a puce jetable et procede de fabrication
EP1040448B1 (fr) Carte a puce munie d'une etiquette de garantie
EP1745419B1 (fr) Structure comportant un dispositif électronique, notamment pour la fabrication d'un document de sécurité ou de valeur
CA2702286C (fr) Support de dispositif d'identification radiofrequence pour passeport et son procede de fabrication
CA2321893A1 (fr) Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
FR2827986A1 (fr) Procede de fabrication d'un article comportant une couche fibreuse et au moins une puce electronique, et article ainsi obtenu
EP2415001B1 (fr) Insert formant antenne et carte à puce le comportant
EP1373941B1 (fr) Document autocollant incorporant un dispositif d'identification radiofrequence
EP2235668B1 (fr) Procède de réalisation d'éléments d'identification radiofrequence et elements d'identification radiofrequence susceptibles d'etre obtenus par un tel procede
EP2545503B1 (fr) Dispositif électronique à puce et procédé de fabrication par bobines
FR2802001A1 (fr) Corps support d'information comprenant un element de securite comportant une puce de circuit integre
EP2156375B1 (fr) Vignette adhesive souple de securite dotee d'au moins un microcircuit sans contact pour document officiel
EP1924961B1 (fr) Document d'identite et de securite qui consiste en une etiquette adhesive
WO2006123065A1 (fr) Vignette adhesive souple de securite anti-falsification, document officiel comprenant une telle vignette et procede de fabrication de cette vignette
EP2298571B1 (fr) Document de sécurité et procédé de fabrication de ce document
FR2802684A1 (fr) Dispositif a puce de circuit integre jetable et procede de fabrication d'un tel procede
FR2769108A1 (fr) Etiquette souple intelligente et procede de fabrication
EP1837811B1 (fr) Procédé de fabrication d'une étiquette éléctronique RFID
WO2016083403A1 (fr) Procede de fabrication de dispositifs electroniques avec information de personnalisation
WO2013034759A1 (fr) Dispositif électronique à puce et procédé de fabrication par bobines
FR2995709A1 (fr) Procede de fabrication d'une structure a puce electronique et structure ainsi fabriquee.
CA2653409A1 (fr) Support de dispositif d'identification radiofrequence et son procede de fabrication

Legal Events

Date Code Title Description
FZDE Discontinued