BRPI1016058A2 - "composição de resina de poliamida e artigo moldado" - Google Patents
"composição de resina de poliamida e artigo moldado"Info
- Publication number
- BRPI1016058A2 BRPI1016058A2 BRPI1016058A BRPI1016058A BRPI1016058A2 BR PI1016058 A2 BRPI1016058 A2 BR PI1016058A2 BR PI1016058 A BRPI1016058 A BR PI1016058A BR PI1016058 A BRPI1016058 A BR PI1016058A BR PI1016058 A2 BRPI1016058 A2 BR PI1016058A2
- Authority
- BR
- Brazil
- Prior art keywords
- resin composition
- molded article
- polyamide resin
- polyamide
- molded
- Prior art date
Links
- 229920006122 polyamide resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/372—Sulfides, e.g. R-(S)x-R'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/37—Thiols
- C08K5/378—Thiols containing heterocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyamides (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009129218 | 2009-05-28 | ||
| PCT/JP2010/059138 WO2010137704A1 (ja) | 2009-05-28 | 2010-05-28 | ポリアミド樹脂組成物及び成形品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI1016058A2 true BRPI1016058A2 (pt) | 2016-05-10 |
Family
ID=43222807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI1016058A BRPI1016058A2 (pt) | 2009-05-28 | 2010-05-28 | "composição de resina de poliamida e artigo moldado" |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8569404B2 (pt) |
| EP (1) | EP2436733B1 (pt) |
| JP (1) | JP5708485B2 (pt) |
| KR (1) | KR101663851B1 (pt) |
| CN (1) | CN102449068B (pt) |
| BR (1) | BRPI1016058A2 (pt) |
| ES (1) | ES2621970T3 (pt) |
| RU (1) | RU2557626C2 (pt) |
| SG (1) | SG176233A1 (pt) |
| WO (1) | WO2010137704A1 (pt) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2327737B1 (en) | 2008-09-18 | 2016-07-20 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin |
| US10273359B2 (en) | 2009-09-14 | 2019-04-30 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin composition |
| WO2012014772A1 (ja) * | 2010-07-27 | 2012-02-02 | 三菱瓦斯化学株式会社 | ポリアミド樹脂 |
| CN103154088B (zh) * | 2011-09-12 | 2014-06-25 | 三菱瓦斯化学株式会社 | 薄壁成型品 |
| JP6024142B2 (ja) * | 2012-03-23 | 2016-11-09 | 三菱瓦斯化学株式会社 | ポリアミド樹脂組成物および成形品 |
| JP5911382B2 (ja) * | 2012-06-18 | 2016-04-27 | 旭化成ケミカルズ株式会社 | ポリアミド及びその成形品 |
| JP6468783B2 (ja) * | 2014-10-06 | 2019-02-13 | 三菱エンジニアリングプラスチックス株式会社 | ポリアミド樹脂組成物、成形品、および、成形品の製造方法 |
| CN104672444B (zh) * | 2015-03-26 | 2016-08-24 | 珠海万通特种工程塑料有限公司 | 一种聚酰胺树脂和由其组成的聚酰胺组合物 |
| CN107383365A (zh) * | 2017-08-09 | 2017-11-24 | 无锡殷达尼龙有限公司 | 一种半芳香族聚酰胺树脂及其制备方法 |
| FR3101879B1 (fr) * | 2019-10-11 | 2022-03-25 | Arkema France | Poudres de polyamide et leur utilisation dans les procedes d’agglomeration de poudres par fusion |
| CN111534089B (zh) * | 2020-05-28 | 2022-03-11 | 苏州梅克兰包装材料有限公司 | 一种抗静电手机电池装载盒的制备方法 |
| CN113527875B (zh) * | 2021-08-23 | 2022-05-13 | 安徽农业大学 | 一种生物基尼龙复合材料及其制备方法 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE608269A (pt) * | 1961-09-18 | |||
| JPS5927948A (ja) * | 1982-08-06 | 1984-02-14 | Toray Ind Inc | 樹脂組成物 |
| JPH07107127B2 (ja) | 1986-10-21 | 1995-11-15 | 三井石油化学工業株式会社 | ポリアミド組成物 |
| JPH055060A (ja) | 1990-12-05 | 1993-01-14 | Mitsui Petrochem Ind Ltd | 芳香族ポリアミド樹脂組成物 |
| JPH06136263A (ja) | 1992-10-28 | 1994-05-17 | Mitsubishi Kasei Corp | ポリアミド樹脂組成物 |
| JPH07228768A (ja) | 1994-02-17 | 1995-08-29 | Kuraray Co Ltd | 耐熱老化性ポリアミド組成物 |
| JPH08311336A (ja) * | 1995-05-19 | 1996-11-26 | Tosoh Corp | エステルアミド共重合体組成物 |
| JP3650858B2 (ja) * | 1996-06-07 | 2005-05-25 | 東ソー株式会社 | 高粘度変性ポリエステルアミドエラストマー組成物、その組成物の製造方法及びその組成物よりなる成形体 |
| JPH10158461A (ja) * | 1996-11-29 | 1998-06-16 | Dainippon Ink & Chem Inc | 熱可塑性樹脂組成物及びその被覆物 |
| SG68701A1 (en) * | 1997-12-05 | 1999-11-16 | Ciba Sc Holding Ag | Stabilisation of polyamide polyester and polyacetal |
| JP2000080270A (ja) | 1998-07-02 | 2000-03-21 | Mitsui Chemicals Inc | 半芳香族ポリアミド樹脂組成物 |
| US6319986B1 (en) * | 1998-07-02 | 2001-11-20 | Mitsui Chemicals | Semiaromatic polyamide resin composition |
| JP2001329169A (ja) * | 2000-05-19 | 2001-11-27 | Mitsubishi Gas Chem Co Inc | ポリアミド複合材料の製造法 |
| RU2200744C2 (ru) * | 2000-06-27 | 2003-03-20 | Гродненское производственное объединение "Химволокно" | Огнестойкая полиамидная композиция |
| JP4843876B2 (ja) * | 2001-07-19 | 2011-12-21 | 三菱瓦斯化学株式会社 | キシリレン基含有ポリアミド樹脂 |
| JP2006028327A (ja) | 2004-07-15 | 2006-02-02 | Unitika Ltd | 精密部品用成形材料 |
| JP5216187B2 (ja) * | 2005-08-04 | 2013-06-19 | クオドラントポリペンコジャパン株式会社 | 耐熱性が向上された帯電防止性ポリアミド樹脂成形体 |
| JP4695667B2 (ja) | 2008-04-21 | 2011-06-08 | Ｎｔｎ株式会社 | 複写機またはプリンター用すべり軸受装置 |
| BRPI0918857A2 (pt) | 2008-09-18 | 2015-12-01 | Mitsubishi Gas Chemical Co | método de produção de poliamida |
| EP2327737B1 (en) | 2008-09-18 | 2016-07-20 | Mitsubishi Gas Chemical Company, Inc. | Polyamide resin |
-
2010
- 2010-05-28 US US13/322,499 patent/US8569404B2/en active Active
- 2010-05-28 BR BRPI1016058A patent/BRPI1016058A2/pt not_active Application Discontinuation
- 2010-05-28 SG SG2011087210A patent/SG176233A1/en unknown
- 2010-05-28 RU RU2011153711/05A patent/RU2557626C2/ru active
- 2010-05-28 EP EP10780658.0A patent/EP2436733B1/en active Active
- 2010-05-28 CN CN201080023523.8A patent/CN102449068B/zh active Active
- 2010-05-28 ES ES10780658.0T patent/ES2621970T3/es active Active
- 2010-05-28 JP JP2011516079A patent/JP5708485B2/ja active Active
- 2010-05-28 WO PCT/JP2010/059138 patent/WO2010137704A1/ja active Application Filing
- 2010-05-28 KR KR1020117028326A patent/KR101663851B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| CN102449068A (zh) | 2012-05-09 |
| KR20120046105A (ko) | 2012-05-09 |
| KR101663851B1 (ko) | 2016-10-07 |
| RU2557626C2 (ru) | 2015-07-27 |
| RU2011153711A (ru) | 2013-07-10 |
| US20120065303A1 (en) | 2012-03-15 |
| EP2436733B1 (en) | 2017-01-11 |
| WO2010137704A1 (ja) | 2010-12-02 |
| EP2436733A4 (en) | 2012-11-21 |
| ES2621970T3 (es) | 2017-07-05 |
| CN102449068B (zh) | 2014-05-07 |
| JP5708485B2 (ja) | 2015-04-30 |
| SG176233A1 (en) | 2011-12-29 |
| US8569404B2 (en) | 2013-10-29 |
| EP2436733A1 (en) | 2012-04-04 |
| JPWO2010137704A1 (ja) | 2012-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] | ||
| B09B | Patent application refused [chapter 9.2 patent gazette] |
Free format text: MANTIDO O INDEFERIMENTO UMA VEZ QUE NAO FOI APRESENTADO RECURSO DENTRO DO PRAZO LEGAL |