BRPI0910661A2 - artigo adesivo - Google Patents

artigo adesivo

Info

Publication number
BRPI0910661A2
BRPI0910661A2 BRPI0910661A BRPI0910661A BRPI0910661A2 BR PI0910661 A2 BRPI0910661 A2 BR PI0910661A2 BR PI0910661 A BRPI0910661 A BR PI0910661A BR PI0910661 A BRPI0910661 A BR PI0910661A BR PI0910661 A2 BRPI0910661 A2 BR PI0910661A2
Authority
BR
Brazil
Prior art keywords
adhesive article
article
adhesive
Prior art date
Application number
BRPI0910661A
Other languages
English (en)
Inventor
A Venne Janet
Seth Jayshree
A Boulos Marie
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BRPI0910661A2 publication Critical patent/BRPI0910661A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L12/40006—Architecture of a communication node
    • H04L12/40032—Details regarding a bus interface enhancer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2421/00—Presence of unspecified rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/005—Presence of polyolefin in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/005—Presence of halogenated polymer in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L2012/40208—Bus networks characterized by the use of a particular bus standard
    • H04L2012/40254—Actuator Sensor Interface ASI
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40—Bus networks
    • H04L2012/4026—Bus for use in automation systems
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
BRPI0910661A 2008-04-22 2009-03-27 artigo adesivo BRPI0910661A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4700008P 2008-04-22 2008-04-22
PCT/US2009/038478 WO2009131792A1 (en) 2008-04-22 2009-03-27 Adhesive article

Publications (1)

Publication Number Publication Date
BRPI0910661A2 true BRPI0910661A2 (pt) 2017-05-16

Family

ID=41217124

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0910661A BRPI0910661A2 (pt) 2008-04-22 2009-03-27 artigo adesivo

Country Status (7)

Country Link
US (1) US9065675B2 (pt)
EP (1) EP2285924B1 (pt)
JP (2) JP2011518063A (pt)
CN (1) CN102015938B (pt)
BR (1) BRPI0910661A2 (pt)
PL (1) PL2285924T3 (pt)
WO (1) WO2009131792A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8302366B2 (en) * 2009-03-09 2012-11-06 Custom Building Products, Inc. Mortarless tile installation system and method for installing tiles
US8490356B2 (en) * 2009-03-09 2013-07-23 Custom Building Products, Inc. Mortarless tile installation system and method for installing tiles
TWM411562U (en) * 2010-09-16 2011-09-11 Tung-Yuan Tsaur System for measuring peeling force of adhesives
EP2652020A1 (en) 2010-12-16 2013-10-23 3M Innovative Properties Company Interpenetrated polymer layer
US20150104601A1 (en) * 2012-05-31 2015-04-16 3M Innovative Properties Company Adhesive article
DE102013218985A1 (de) * 2013-09-20 2015-03-26 Tesa Se Trennbeschichtung mit definierter Oberflächenstruktur
US20160324241A2 (en) * 2014-08-08 2016-11-10 Yo Han Lee An adhesive device for attaching a false eyelash and a false eyelash kit
GB2544335A (en) 2015-11-13 2017-05-17 Oculus Vr Llc A method and apparatus for use in the manufacture of a display element
JP6779820B2 (ja) 2017-03-24 2020-11-04 株式会社東芝 電極、二次電池、電池パック及び車両
KR102568434B1 (ko) * 2018-06-22 2023-08-18 산진 옵토일렉트로닉스 (쑤저우) 컴퍼니 리미티드 편광판의 적정 재단 조건 도출 방법
EP3587527A1 (en) 2018-06-30 2020-01-01 3M Innovative Properties Company Full (per)fluoro polymer liner for adhesive tapes
TWI808228B (zh) 2018-07-29 2023-07-11 瑞士商Ｂｖｗ控股公司 具有吸力的圖案化表面
DK3838591T3 (da) 2019-12-20 2024-05-21 Mondi Ag Slipforing til repositionerbare klæbemiddelartikler
EP4019602A1 (en) * 2020-12-27 2022-06-29 3M Innovative Properties Company Low tack structural adhesive for shear bonding of magnets in electrical motors

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5154974A (en) * 1986-06-23 1992-10-13 Norman Alfred W Adhesive composition having improved cutting properties
US5290842A (en) * 1991-09-03 1994-03-01 Avery Dennison Corporation Pressure-sensitive adhesives based on preferentially tackified immiscible elastomers
JPH05732A (ja) 1991-03-29 1993-01-08 Fuji Photo Film Co Ltd 用紙捌き機能を備えた自動給紙装置
JP2519775Y2 (ja) * 1991-06-14 1996-12-11 新王子製紙株式会社 ダブル粘着シート
JPH0734045A (ja) * 1993-07-21 1995-02-03 Sekisui Chem Co Ltd 粘着テープの側面処理方法
WO1995011945A1 (en) * 1993-10-29 1995-05-04 Minnesota Mining And Manufacturing Company Pressure-sensitive adhesives having microstructured surfaces
US6440880B2 (en) * 1993-10-29 2002-08-27 3M Innovative Properties Company Pressure-sensitive adhesives having microstructured surfaces
US5468815A (en) * 1994-01-12 1995-11-21 Minnesota Mining And Manufacturing Low coefficient of friction silicone release formulations incorporating higher alkenyl-functional silicone gums
US6074747A (en) * 1995-06-06 2000-06-13 Avery Dennison Corporation Ink-imprintable release coatings, and pressure sensitive adhesive constructions
US6312800B1 (en) * 1997-02-10 2001-11-06 Lintec Corporation Pressure sensitive adhesive sheet for producing a chip
US6524675B1 (en) * 1999-05-13 2003-02-25 3M Innovative Properties Company Adhesive-back articles
US6521309B1 (en) * 1999-11-11 2003-02-18 Tyco Adhesives Lp Double-sided single-liner pressure-sensitive adhesive tape
US20010052384A1 (en) * 2000-04-24 2001-12-20 Michael Hannington Adhesive articles with improved air egress and methods of making the same
US6579941B1 (en) * 2000-06-12 2003-06-17 Avery Dennison Corporatoin Adhesive compositions and constructions with outstanding cutting performance
DE60111530T2 (de) * 2000-06-27 2006-05-11 Exxonmobil Chemical Patents Inc., Baytown Klebstoffe mit verbesserter stanzleistung
US20030017291A1 (en) * 2001-03-14 2003-01-23 Fleming Danny L. Adhesive layers and release liners with pyramidal structures
US6805933B2 (en) * 2001-07-31 2004-10-19 3M Innovative Properties Company Articles comprising a release liner having a high coefficient of friction and good roll stability
JP4398629B2 (ja) 2002-05-24 2010-01-13 リンテック株式会社 粘着シート
JP4723508B2 (ja) * 2003-11-21 2011-07-13 スリーエム イノベイティブ プロパティズ カンパニー 構造的紙剥離ライナ、接着剤付き物品組み立て品およびその製造方法
US8252407B2 (en) * 2005-01-12 2012-08-28 Avery Dennison Corporation Adhesive article having improved application properties
US20060228480A1 (en) * 2005-03-30 2006-10-12 David Lin Method of manufacturing a release liner
US7687126B2 (en) * 2005-08-22 2010-03-30 3M Innovative Properties Company Adhesive articles and release liners
US7279210B2 (en) * 2005-09-07 2007-10-09 3M Innovative Properties Company Curable compositions, methods of making and using the same, and articles therefrom
EP1946365A2 (en) * 2005-10-13 2008-07-23 CPFilms Inc. An electrically conductive release liner
DE102005061766A1 (de) * 2005-12-23 2007-06-28 Lohmann Gmbh & Co Kg Abdeckung mit feinen Oberflächenstrukturen zur Verminderung der Luftblasenbildung bei der Applikation klebender Erzeugnisse
DE102006043259A1 (de) * 2006-09-11 2008-06-19 Tesa Ag Verfahren zur Herstellung eines doppelseitigen Haftklebebandes und seine Verwendung
US20080226698A1 (en) * 2007-03-16 2008-09-18 Mylan Technologies, Inc. Amorphous drug transdermal systems, manufacturing methods, and stabilization
US8334037B2 (en) * 2007-05-11 2012-12-18 3M Innovative Properties Company Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same
US8309207B2 (en) * 2009-02-05 2012-11-13 Avery Dennison Corporation Adhesive articles with improved air egress

Also Published As

Publication number Publication date
CN102015938B (zh) 2014-12-17
JP2011518063A (ja) 2011-06-23
PL2285924T3 (pl) 2014-11-28
JP2014177123A (ja) 2014-09-25
US20110039067A1 (en) 2011-02-17
WO2009131792A1 (en) 2009-10-29
US9065675B2 (en) 2015-06-23
EP2285924B1 (en) 2014-06-11
EP2285924A1 (en) 2011-02-23
CN102015938A (zh) 2011-04-13

Similar Documents

Publication Publication Date Title
BRPI0907755A2 (pt) Artigo multimarcas
BRPI0914895A2 (pt) artigo absorvente
BRPI0918372A2 (pt) artigo absorvente
BRPI0820241A2 (pt) artigo absorvente
BRPI0821175A2 (pt) artigo absorvente
BRPI0910661A2 (pt) artigo adesivo
BRPI0814037A2 (pt) artigo absorvente
BRPI0813572A2 (pt) Artigo absorvente
DE602008003371D1 (de) ewandelter Artikel
BRPI0816040A2 (pt) artigos
BRPI0822612A2 (pt) artigo absorvente
DK2245079T3 (da) Klæbestof
BRPI0905779A2 (pt) artigo absorvente
DK2174873T3 (da) Etiketteringsindretning
BRPI1010720A2 (pt) artigo
IT1393103B1 (it) Etichettatrice
BRPI0906304A2 (pt) artigo absorvente
BR112012000496A2 (pt) fecho adesivo
GB0817395D0 (en) Adhesive article
FR2952940B1 (fr) Revetement adhesif
TH96779B (th) สิ่งของดูดซับ
TH0801003202A (th) สิ่งของดูดซับ
TH103044B (th) Abbsorbent Article
UA17293S (uk) Етикетка
UA16964S (uk) Етикетка

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]