BRPI0413775A - material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas - Google Patents
material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhasInfo
- Publication number
- BRPI0413775A BRPI0413775A BRPI0413775A BRPI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A BR PI0413775 A BRPI0413775 A BR PI0413775A
- Authority
- BR
- Brazil
- Prior art keywords
- thermal expansion
- flow performance
- expansion coefficient
- filler material
- welding flow
- Prior art date
Links
- 239000000945 filler Substances 0.000 title abstract 4
- 230000009969 flowable effect Effects 0.000 title abstract 2
- 239000000463 material Substances 0.000 title abstract 2
- 238000003466 welding Methods 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 3
- 239000004593 Epoxy Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003153 chemical reaction reagent Substances 0.000 abstract 2
- 239000008119 colloidal silica Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 239000002318 adhesion promoter Substances 0.000 abstract 1
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 239000003063 flame retardant Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000000178 monomer Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01066—Dysprosium [Dy]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Sealing Material Composition (AREA)
Abstract
"MATERIAL DE ENCHIMENTO NãO FLUIVEL TENDO BAIXO COEFICIENTE DE EXPANSãO TéRMICA E BOA PERFORMANCE DE FLUXO DE SOLDAGEM EM BOLHAS". Uma composição de enchimento não fluivel compreendendo uma resina epóxi em combinação com um endurecedor epóxi e reagentes opcionais e um enchimento de sílica coloidal tendo um tamanho de partícula variando de 1 mm a em torno de 250 nm. A sílica coloidal é funcionalizada com ao menos um agente de funcionalização organoacolxisilano e subseqüentemente funcionalizado com ao menos um agente de capeamento. O endurecedor epóxi inclui agentes de cura anidrido. Os reagentes opcionais incluem catalizadores de cura e monómeros contendo hidroxil. Os promotores de adesão, retardadores de chama e agentes desformantes também podem ser adicionados a composição. Um desenvolvimento adicional da presente descrição inclui dispositivos de estado sólido empacotados compreendendo as composições de enchimento.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/653,371 US20050048700A1 (en) | 2003-09-02 | 2003-09-02 | No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
PCT/US2004/028404 WO2005021647A1 (en) | 2003-09-02 | 2004-09-01 | No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0413775A true BRPI0413775A (pt) | 2006-10-31 |
Family
ID=34217877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0413775 BRPI0413775A (pt) | 2003-09-02 | 2004-09-01 | material de enchimento não fluivel tendo baixo coeficiente de expansão térmica e boa performance de fluxo de soldagem em bolhas |
Country Status (12)
Country | Link |
---|---|
US (1) | US20050048700A1 (pt) |
EP (1) | EP1664192A1 (pt) |
JP (1) | JP2007504336A (pt) |
KR (1) | KR20060132799A (pt) |
CN (1) | CN1875068A (pt) |
AU (1) | AU2004268147A1 (pt) |
BR (1) | BRPI0413775A (pt) |
CA (1) | CA2537688A1 (pt) |
MX (1) | MXPA06002463A (pt) |
RU (1) | RU2006110560A (pt) |
WO (1) | WO2005021647A1 (pt) |
ZA (1) | ZA200602272B (pt) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050170188A1 (en) * | 2003-09-03 | 2005-08-04 | General Electric Company | Resin compositions and methods of use thereof |
US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
US20050266263A1 (en) * | 2002-11-22 | 2005-12-01 | General Electric Company | Refractory solid, adhesive composition, and device, and associated method |
MXPA06002594A (es) * | 2003-09-03 | 2006-06-05 | Gen Electric | Composiciones de resina modificadas con solvente y sus metodos de uso. |
TW200604269A (en) * | 2004-04-06 | 2006-02-01 | Showa Denko Kk | Thermosetting composition and curing method thereof |
US7446136B2 (en) * | 2005-04-05 | 2008-11-04 | Momentive Performance Materials Inc. | Method for producing cure system, adhesive system, and electronic device |
US10041176B2 (en) | 2005-04-07 | 2018-08-07 | Momentive Performance Materials Inc. | No-rinse pretreatment methods and compositions |
GB0512610D0 (en) * | 2005-06-18 | 2005-07-27 | Hexcel Composites Ltd | Composite material |
US8048819B2 (en) * | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
KR100833568B1 (ko) | 2006-12-28 | 2008-05-30 | 제일모직주식회사 | 플립칩 패키지용 비도전성 페이스트 조성물 |
KR20100022960A (ko) * | 2007-04-27 | 2010-03-03 | 스미토모 베이클리트 컴퍼니 리미티드 | 반도체 웨이퍼의 접합 방법 및 반도체 장치의 제조 방법 |
EP2199339B1 (en) * | 2007-09-25 | 2014-11-05 | Hitachi Chemical Co., Ltd. | Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device |
JP5493327B2 (ja) * | 2007-12-18 | 2014-05-14 | 日立化成株式会社 | 封止充てん用樹脂組成物、並びに半導体装置及びその製造方法 |
JP5152656B2 (ja) * | 2008-03-26 | 2013-02-27 | 荒川化学工業株式会社 | 表面被覆シリカオルガノゾルの製造方法、および表面被覆シリカ粒子含有エポキシ樹脂組成物の製造方法 |
US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
TW201329145A (zh) | 2011-11-28 | 2013-07-16 | Nitto Denko Corp | 底層充填材料及半導體裝置之製造方法 |
KR101867955B1 (ko) * | 2012-04-13 | 2018-06-15 | 삼성전자주식회사 | 패키지 온 패키지 장치 및 이의 제조 방법 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4217438A (en) * | 1978-12-15 | 1980-08-12 | General Electric Company | Polycarbonate transesterification process |
JPH07100766B2 (ja) * | 1987-06-25 | 1995-11-01 | ソマール株式会社 | エポキシ樹脂粉体塗料組成物 |
CA2010331A1 (en) * | 1989-03-02 | 1990-09-02 | James O. Peterson | Low stress epoxy encapsulant compositions |
JP3098663B2 (ja) * | 1993-09-28 | 2000-10-16 | 日東電工株式会社 | 熱硬化性樹脂組成物およびその製法 |
US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
US6576718B1 (en) * | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
MY126953A (en) * | 1999-10-06 | 2006-11-30 | Nitto Denko Corp | Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same |
JP4633214B2 (ja) * | 1999-12-08 | 2011-02-16 | 富士通株式会社 | エポキシ樹脂組成物 |
US6664318B1 (en) * | 1999-12-20 | 2003-12-16 | 3M Innovative Properties Company | Encapsulant compositions with thermal shock resistance |
JP3707534B2 (ja) * | 2000-12-15 | 2005-10-19 | 信越化学工業株式会社 | 半導体スクリーン印刷封止用液状エポキシ樹脂組成物 |
JP2003105168A (ja) * | 2001-09-28 | 2003-04-09 | Nitto Denko Corp | 半導体封止用樹脂組成物およびそれを用いた半導体装置 |
US6548189B1 (en) * | 2001-10-26 | 2003-04-15 | General Electric Company | Epoxy adhesive |
US20040101688A1 (en) * | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
JP4176619B2 (ja) * | 2003-07-18 | 2008-11-05 | 信越化学工業株式会社 | フリップチップ実装用サイドフィル材及び半導体装置 |
JP3925803B2 (ja) * | 2003-07-18 | 2007-06-06 | 信越化学工業株式会社 | フリップチップ実装用サイドフィル材及び半導体装置 |
-
2003
- 2003-09-02 US US10/653,371 patent/US20050048700A1/en not_active Abandoned
-
2004
- 2004-09-01 WO PCT/US2004/028404 patent/WO2005021647A1/en active Application Filing
- 2004-09-01 AU AU2004268147A patent/AU2004268147A1/en not_active Abandoned
- 2004-09-01 MX MXPA06002463A patent/MXPA06002463A/es unknown
- 2004-09-01 CN CNA2004800318358A patent/CN1875068A/zh active Pending
- 2004-09-01 KR KR1020067004355A patent/KR20060132799A/ko not_active Application Discontinuation
- 2004-09-01 JP JP2006526161A patent/JP2007504336A/ja active Pending
- 2004-09-01 EP EP04782820A patent/EP1664192A1/en not_active Withdrawn
- 2004-09-01 BR BRPI0413775 patent/BRPI0413775A/pt not_active IP Right Cessation
- 2004-09-01 RU RU2006110560/04A patent/RU2006110560A/ru not_active Application Discontinuation
- 2004-09-01 CA CA 2537688 patent/CA2537688A1/en not_active Abandoned
-
2006
- 2006-03-17 ZA ZA200602272A patent/ZA200602272B/en unknown
Also Published As
Publication number | Publication date |
---|---|
AU2004268147A1 (en) | 2005-03-10 |
EP1664192A1 (en) | 2006-06-07 |
ZA200602272B (en) | 2007-06-27 |
CN1875068A (zh) | 2006-12-06 |
RU2006110560A (ru) | 2007-10-10 |
JP2007504336A (ja) | 2007-03-01 |
WO2005021647A1 (en) | 2005-03-10 |
MXPA06002463A (es) | 2006-06-20 |
US20050048700A1 (en) | 2005-03-03 |
CA2537688A1 (en) | 2005-03-10 |
KR20060132799A (ko) | 2006-12-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 6A E 7A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012. |