BR8000967A - Dispositivo semicondutor - Google Patents

Dispositivo semicondutor

Info

Publication number: BR8000967A
Authority: BR; Brazil
Prior art keywords: semiconductor device; semiconductor
Prior art date: 1979-02-21

Application number

BR8000967A

Other languages

English (en)

Inventor

G Eriksson

A Nilarp

Original Assignee

Asea Ab

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-02-21

Filing date

1980-02-15

Publication date

1980-10-29

1980-02-15 Application filed by Asea Ab filed Critical Asea Ab

1980-10-29 Publication of BR8000967A publication Critical patent/BR8000967A/pt

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/926—Elongated lead extending axially through another elongated lead

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

BR8000967A 1979-02-21 1980-02-15 Dispositivo semicondutor BR8000967A (pt)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
SE7901535A SE429802B (sv)	1979-02-21	1979-02-21	Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid

Publications (1)

Publication Number	Publication Date
BR8000967A true BR8000967A (pt)	1980-10-29

Family

ID=20337353

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BR8000967A BR8000967A (pt)	1979-02-21	1980-02-15	Dispositivo semicondutor

Country Status (7)

Country	Link
US (1)	US4370671A (pt)
JP (1)	JPS55113354A (pt)
BR (1)	BR8000967A (pt)
CA (1)	CA1149084A (pt)
DE (1)	DE3006023A1 (pt)
GB (1)	GB2046992B (pt)
SE (1)	SE429802B (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57143849A (en) *	1981-03-02	1982-09-06	Toshiba Corp	Flat semiconductor element
DE3308661A1 (de) *	1983-03-11	1984-09-20	SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg	Halbleiterelement
JPS6060172U (ja) *	1983-09-13	1985-04-26	本田技研工業株式会社	整流器付トランス装置
DE3421672A1 (de) *	1984-06-09	1985-12-12	SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg	Wechsellastbestaendiges, schaltbares halbleiterbauelement
GB2162366B (en) *	1984-07-24	1987-09-30	Westinghouse Brake & Signal	Semiconductor device contact arrangements
JPS62269322A (ja) *	1986-05-17	1987-11-21	Toshiba Corp	電力用半導体装置
JPH0760893B2 (ja) *	1989-11-06	1995-06-28	三菱電機株式会社	半導体装置およびその製造方法
JP6535676B2 (ja) *	2014-01-21	2019-06-26	アーベーベー・シュヴァイツ・アクチエンゲゼルシャフト	電力半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CH506184A (de) *	1967-11-29	1971-04-15	Ckd Praha	Halbleiterbauelement
US3772248A (en) *	1972-10-30	1973-11-13	Minnesota Mining & Mfg	Polyether/polyarylsulfones
DE2630320A1 (de) *	1976-07-06	1978-01-12	Licentia Gmbh	Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse
US4093958A (en) *	1976-12-09	1978-06-06	Motorola, Inc.	Semiconductor device assembly with improved fatigue resistance
US4278784A (en) *	1980-02-06	1981-07-14	Western Electric Company, Inc.	Encapsulated electronic devices and encapsulating compositions

1979
- 1979-02-21 SE SE7901535A patent/SE429802B/sv unknown
1980
- 1980-02-13 US US06/121,155 patent/US4370671A/en not_active Expired - Lifetime
- 1980-02-15 BR BR8000967A patent/BR8000967A/pt unknown
- 1980-02-18 JP JP1893880A patent/JPS55113354A/ja active Pending
- 1980-02-18 DE DE19803006023 patent/DE3006023A1/de not_active Withdrawn
- 1980-02-20 CA CA000346045A patent/CA1149084A/en not_active Expired
- 1980-02-20 GB GB8005777A patent/GB2046992B/en not_active Expired

Also Published As

Publication number	Publication date
GB2046992A (en)	1980-11-19
US4370671A (en)	1983-01-25
DE3006023A1 (de)	1980-09-04
SE429802B (sv)	1983-09-26
JPS55113354A (en)	1980-09-01
CA1149084A (en)	1983-06-28
GB2046992B (en)	1983-05-18
SE7901535L (sv)	1980-08-22

Publication	Publication Date	Title
BR7900229A (pt)	1979-08-14	Dispositivo semicondutor
SE8105257L (sv)	1982-03-09	Halvledaranordning
SE7900083L (sv)	1979-07-14	Halvledaranordning
DE3382802D1 (de)	1996-03-28	Halbleiterspeichergerät
SE7701434L (sv)	1977-08-13	Halvledaranordning
BR7808124A (pt)	1979-07-31	Dispositivo semicondutor
SE7701316L (sv)	1977-08-10	Halvledaranordning
BR7803561A (pt)	1979-03-20	Dispositivo e conjunto semicondutor
BR8005483A (pt)	1981-03-10	Dispositivo semicondutor e tiristor semicondutor
IT8322373A0 (it)	1983-08-02	Dispositivo semiconduttore.
BR7705488A (pt)	1978-06-06	Dispositivo semicondutor
SE7709146L (sv)	1978-02-17	Halvledaranordning
BR7702421A (pt)	1977-12-20	Transdutor semicondutor
DK525979A (da)	1980-06-20	Halvleder-ladnngsoverfoeringsanordning
SE7902980L (sv)	1979-10-08	Halvledaranordning
DE3022122A1 (de)	1980-12-18	Halbleitervorrichtung
BR7800627A (pt)	1978-10-10	Dispositivo semicondutor
IT8124803A0 (it)	1981-10-30	Dispositivo semiconduttore
SE7709019L (sv)	1978-03-01	Halvledaranordning
IT1141373B (it)	1986-10-01	Dispositivo a semiconduttore
BR8000967A (pt)	1980-10-29	Dispositivo semicondutor
IT7919985A0 (it)	1979-02-07	Dispositivo semiconduttore.
KR840005919A (ko)	1984-11-19	반도체 장치
BR7904692A (pt)	1980-04-15	Dispositivo semicondutor
SE8001042L (sv)	1980-08-15	Halvledaranordning