BR8000967A - Dispositivo semicondutor - Google Patents
Dispositivo semicondutorInfo
- Publication number
- BR8000967A BR8000967A BR8000967A BR8000967A BR8000967A BR 8000967 A BR8000967 A BR 8000967A BR 8000967 A BR8000967 A BR 8000967A BR 8000967 A BR8000967 A BR 8000967A BR 8000967 A BR8000967 A BR 8000967A
- Authority
- BR
- Brazil
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/926—Elongated lead extending axially through another elongated lead
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE7901535A SE429802B (sv) | 1979-02-21 | 1979-02-21 | Halvledaranordning innefattande en tetande ringformad kropp av en sulfonpolymer eller av polyfenylensulfid |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8000967A true BR8000967A (pt) | 1980-10-29 |
Family
ID=20337353
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8000967A BR8000967A (pt) | 1979-02-21 | 1980-02-15 | Dispositivo semicondutor |
Country Status (7)
Country | Link |
---|---|
US (1) | US4370671A (pt) |
JP (1) | JPS55113354A (pt) |
BR (1) | BR8000967A (pt) |
CA (1) | CA1149084A (pt) |
DE (1) | DE3006023A1 (pt) |
GB (1) | GB2046992B (pt) |
SE (1) | SE429802B (pt) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57143849A (en) * | 1981-03-02 | 1982-09-06 | Toshiba Corp | Flat semiconductor element |
DE3308661A1 (de) * | 1983-03-11 | 1984-09-20 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Halbleiterelement |
JPS6060172U (ja) * | 1983-09-13 | 1985-04-26 | 本田技研工業株式会社 | 整流器付トランス装置 |
DE3421672A1 (de) * | 1984-06-09 | 1985-12-12 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Wechsellastbestaendiges, schaltbares halbleiterbauelement |
GB2162366B (en) * | 1984-07-24 | 1987-09-30 | Westinghouse Brake & Signal | Semiconductor device contact arrangements |
JPS62269322A (ja) * | 1986-05-17 | 1987-11-21 | Toshiba Corp | 電力用半導体装置 |
JPH0760893B2 (ja) * | 1989-11-06 | 1995-06-28 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
JP6535676B2 (ja) * | 2014-01-21 | 2019-06-26 | アーベーベー・シュヴァイツ・アクチエンゲゼルシャフト | 電力半導体装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH506184A (de) * | 1967-11-29 | 1971-04-15 | Ckd Praha | Halbleiterbauelement |
US3772248A (en) * | 1972-10-30 | 1973-11-13 | Minnesota Mining & Mfg | Polyether/polyarylsulfones |
DE2630320A1 (de) * | 1976-07-06 | 1978-01-12 | Licentia Gmbh | Scheibenfoermige halbleiterzelle mit einem ringfoermigen gehaeuse |
US4093958A (en) * | 1976-12-09 | 1978-06-06 | Motorola, Inc. | Semiconductor device assembly with improved fatigue resistance |
US4278784A (en) * | 1980-02-06 | 1981-07-14 | Western Electric Company, Inc. | Encapsulated electronic devices and encapsulating compositions |
-
1979
- 1979-02-21 SE SE7901535A patent/SE429802B/sv unknown
-
1980
- 1980-02-13 US US06/121,155 patent/US4370671A/en not_active Expired - Lifetime
- 1980-02-15 BR BR8000967A patent/BR8000967A/pt unknown
- 1980-02-18 JP JP1893880A patent/JPS55113354A/ja active Pending
- 1980-02-18 DE DE19803006023 patent/DE3006023A1/de not_active Withdrawn
- 1980-02-20 CA CA000346045A patent/CA1149084A/en not_active Expired
- 1980-02-20 GB GB8005777A patent/GB2046992B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2046992A (en) | 1980-11-19 |
US4370671A (en) | 1983-01-25 |
DE3006023A1 (de) | 1980-09-04 |
SE429802B (sv) | 1983-09-26 |
JPS55113354A (en) | 1980-09-01 |
CA1149084A (en) | 1983-06-28 |
GB2046992B (en) | 1983-05-18 |
SE7901535L (sv) | 1980-08-22 |
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