BR112016017998A2 - Componente micro mecânico e método para a operação de um componente micro mecânico - Google Patents

Componente micro mecânico e método para a operação de um componente micro mecânico

Info

Publication number
BR112016017998A2
BR112016017998A2 BR112016017998A BR112016017998A BR112016017998A2 BR 112016017998 A2 BR112016017998 A2 BR 112016017998A2 BR 112016017998 A BR112016017998 A BR 112016017998A BR 112016017998 A BR112016017998 A BR 112016017998A BR 112016017998 A2 BR112016017998 A2 BR 112016017998A2
Authority
BR
Brazil
Prior art keywords
region
micro mechanical
mechanical component
operating
component
Prior art date
Application number
BR112016017998A
Other languages
English (en)
Other versions
BR112016017998B1 (pt
Inventor
Spahlinger Günter
Original Assignee
Northrop Grumman Litef Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Northrop Grumman Litef Gmbh filed Critical Northrop Grumman Litef Gmbh
Publication of BR112016017998A2 publication Critical patent/BR112016017998A2/pt
Publication of BR112016017998B1 publication Critical patent/BR112016017998B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/004—Angular deflection
    • B81B3/0045—Improve properties related to angular swinging, e.g. control resonance frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/04—Electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Remote Sensing (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)
  • Pressure Sensors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

COMPONENTE MICRO MECÂNICO E MÉTODO PARA A OPERAÇÃO DE UM COMPONENTE MICRO MECÂNICO. Um componente micro mecânico compreende um substrato e uma estrutura ativa a qual pode ser defletida em pelo menos uma direção relativa ao substrato e a qual tem pelo menos uma primeira região e uma segunda região, em que a primeira região e a segunda região estão eletricamente condutoras e estão rígida e fisicamente conectadas uma à outra ao longo de um primeiro eixo e estão eletricamente isoladas uma a partir da outra por meio de uma região isolante. em um método para a operação do componente, potenciais diferentes são aplicados na primeira região e na segunda região, nas quais as cargas ou as mudanças em capacitância ocorrente devido aos movimentos da estrutura ativa podem ser detectadas.
BR112016017998-6A 2014-02-25 2015-02-11 Componente micro mecânico e método para a operação de um componente micro mecânico BR112016017998B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014002823.2 2014-02-25
DE102014002823.2A DE102014002823B4 (de) 2014-02-25 2014-02-25 Mikromechanisches bauteil mit geteilter, galvanisch isolierter aktiver struktur und verfahren zum betreiben eines solchen bauteils
PCT/EP2015/000303 WO2015128062A1 (de) 2014-02-25 2015-02-11 Mikromechanisches bauteil mit geteilter, galvanisch isolierter aktiver struktur und verfahren zum betreiben eines solchen bauteils

Publications (2)

Publication Number Publication Date
BR112016017998A2 true BR112016017998A2 (pt) 2017-08-08
BR112016017998B1 BR112016017998B1 (pt) 2021-11-23

Family

ID=52472277

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112016017998-6A BR112016017998B1 (pt) 2014-02-25 2015-02-11 Componente micro mecânico e método para a operação de um componente micro mecânico

Country Status (13)

Country Link
US (1) US20160362291A1 (pt)
EP (1) EP3110746B1 (pt)
JP (1) JP6267357B2 (pt)
KR (1) KR101869629B1 (pt)
CN (1) CN106061889B (pt)
AU (1) AU2015222511B2 (pt)
BR (1) BR112016017998B1 (pt)
CA (1) CA2939173C (pt)
DE (1) DE102014002823B4 (pt)
IL (1) IL247017A (pt)
RU (1) RU2653112C2 (pt)
WO (1) WO2015128062A1 (pt)
ZA (1) ZA201605623B (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014002824A1 (de) * 2014-02-25 2015-08-27 Northrop Grumman Litef Gmbh Verfahren zur Herstellung eines Bauteils
DE102014215038A1 (de) * 2014-07-31 2016-02-04 Robert Bosch Gmbh Mikromechanischer Sensor und Verfahren zur Herstellung eines mikromechanischen Sensors
RU192953U1 (ru) * 2018-12-20 2019-10-08 федеральное государственное автономное образовательное учреждение высшего образования "Санкт-Петербургский национальный исследовательский университет информационных технологий, механики и оптики" (Университет ИТМО) Мэмс-акселерометр
US11788840B2 (en) * 2021-11-08 2023-10-17 Northrop Grumman Systems Corporation Vibrating-mass sensor system

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US5992233A (en) * 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
GB2320571B (en) * 1996-12-20 2000-09-27 Aisin Seiki Semiconductor micromachine and manufacturing method thereof
US5959516A (en) * 1998-01-08 1999-09-28 Rockwell Science Center, Llc Tunable-trimmable micro electro mechanical system (MEMS) capacitor
DE19719779A1 (de) * 1997-05-10 1998-11-12 Bosch Gmbh Robert Beschleunigungssensor
DE19827056A1 (de) * 1998-06-18 1999-12-23 Bosch Gmbh Robert Mikromechanischer Magnetfeldsensor
US6291875B1 (en) * 1998-06-24 2001-09-18 Analog Devices Imi, Inc. Microfabricated structures with electrical isolation and interconnections
JP2000018952A (ja) * 1998-07-01 2000-01-21 Aisin Seiki Co Ltd 角速度センサ
JP2000065855A (ja) * 1998-08-17 2000-03-03 Mitsubishi Electric Corp 半導体加速度スイッチ、半導体加速度スイッチの製造方法
US6611168B1 (en) * 2001-12-19 2003-08-26 Analog Devices, Inc. Differential parametric amplifier with physically-coupled electrically-isolated micromachined structures
EP1465832B1 (en) * 2002-01-16 2007-03-14 Matsushita Electric Industrial Co., Ltd. Micro-electromechanical device
JP4292746B2 (ja) * 2002-02-15 2009-07-08 株式会社デンソー 角速度センサ
DE10350037A1 (de) * 2003-10-27 2005-05-25 Robert Bosch Gmbh Drehratensensor
KR100513346B1 (ko) * 2003-12-20 2005-09-07 삼성전기주식회사 보정전극을 갖는 정전용량형 가속도계
JP4161950B2 (ja) * 2004-02-27 2008-10-08 セイコーエプソン株式会社 マイクロメカニカル静電アクチュエータ
JP4524571B2 (ja) * 2004-03-25 2010-08-18 株式会社デンソー 振動型角速度センサ
US7444868B2 (en) * 2006-06-29 2008-11-04 Honeywell International Inc. Force rebalancing for MEMS inertial sensors using time-varying voltages
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WO2008114330A1 (ja) * 2007-02-19 2008-09-25 Fujitsu Limited Ｍｅｍｓデバイスおよび光スイッチ
JP5105949B2 (ja) * 2007-04-27 2012-12-26 キヤノン株式会社 センサ
DE102007030121A1 (de) * 2007-06-29 2009-01-02 Litef Gmbh Verfahren zur Herstellung eines Bauteils und Bauteil
JP5432440B2 (ja) * 2007-07-04 2014-03-05 キヤノン株式会社 揺動体装置
JP5191939B2 (ja) * 2009-03-31 2013-05-08 スタンレー電気株式会社 光偏向器用アクチュエータ装置
DE102009029095B4 (de) * 2009-09-02 2017-05-18 Robert Bosch Gmbh Mikromechanisches Bauelement
US8373522B2 (en) * 2010-02-03 2013-02-12 Harris Corporation High accuracy MEMS-based varactors
US20110198202A1 (en) * 2010-02-18 2011-08-18 Harris Corporation Mems-based ultra-low power devices
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US9496886B2 (en) * 2011-06-16 2016-11-15 Spatial Digital Systems, Inc. System for processing data streams
DE102012200740B4 (de) * 2011-10-27 2024-03-21 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zur Herstellung eines mikromechanischen Bauelements
JP2014011531A (ja) * 2012-06-28 2014-01-20 Seiko Epson Corp 振動デバイス、電子機器
US9046547B2 (en) * 2012-08-13 2015-06-02 Pgs Geophysical As Accelerometer having multiple feedback systems operating on a given proof mass

Also Published As

Publication number Publication date
AU2015222511B2 (en) 2017-05-25
ZA201605623B (en) 2017-09-27
BR112016017998B1 (pt) 2021-11-23
US20160362291A1 (en) 2016-12-15
JP2017509878A (ja) 2017-04-06
DE102014002823B4 (de) 2017-11-02
RU2016131410A (ru) 2018-03-29
AU2015222511A1 (en) 2016-09-22
CA2939173C (en) 2017-03-07
CN106061889A (zh) 2016-10-26
CA2939173A1 (en) 2015-09-03
EP3110746A1 (de) 2017-01-04
DE102014002823A1 (de) 2015-08-27
KR20160112003A (ko) 2016-09-27
KR101869629B1 (ko) 2018-06-20
WO2015128062A1 (de) 2015-09-03
EP3110746B1 (de) 2019-07-03
IL247017A (en) 2017-02-28
JP6267357B2 (ja) 2018-01-24
RU2653112C2 (ru) 2018-05-07
CN106061889B (zh) 2017-12-22
RU2016131410A3 (pt) 2018-03-29

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 11/02/2015, OBSERVADAS AS CONDICOES LEGAIS.