BR112014013594A8 - composição e substrato revestido - Google Patents

composição e substrato revestido

Info

Publication number
BR112014013594A8
BR112014013594A8 BR112014013594A BR112014013594A BR112014013594A8 BR 112014013594 A8 BR112014013594 A8 BR 112014013594A8 BR 112014013594 A BR112014013594 A BR 112014013594A BR 112014013594 A BR112014013594 A BR 112014013594A BR 112014013594 A8 BR112014013594 A8 BR 112014013594A8
Authority
BR
Brazil
Prior art keywords
composition
coated substrate
coated
substrate
Prior art date
Application number
BR112014013594A
Other languages
English (en)
Other versions
BR112014013594A2 (pt
BR112014013594B1 (pt
Inventor
G Ragunathan Kaliappa
Nakajima Masayuki
Chao Tien-Chieh
C Desai Umesh
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of BR112014013594A2 publication Critical patent/BR112014013594A2/pt
Publication of BR112014013594A8 publication Critical patent/BR112014013594A8/pt
Publication of BR112014013594B1 publication Critical patent/BR112014013594B1/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276Polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5006Amines aliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00Adhesives based on inorganic constituents
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
BR112014013594-0A 2011-12-09 2012-12-07 composição adesiva estrutural e substrato revestido BR112014013594B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
US13/315,518 2011-12-09
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (3)

Publication Number Publication Date
BR112014013594A2 BR112014013594A2 (pt) 2017-06-13
BR112014013594A8 true BR112014013594A8 (pt) 2017-06-13
BR112014013594B1 BR112014013594B1 (pt) 2021-01-05

Family

ID=47501441

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014013594-0A BR112014013594B1 (pt) 2011-12-09 2012-12-07 composição adesiva estrutural e substrato revestido

Country Status (12)

Country Link
US (1) US20120129980A1 (pt)
EP (1) EP2788397A2 (pt)
KR (1) KR101684752B1 (pt)
CN (1) CN104053694B (pt)
AU (1) AU2012347650B2 (pt)
BR (1) BR112014013594B1 (pt)
CA (1) CA2858186C (pt)
IN (1) IN2014DN04651A (pt)
MX (1) MX2014006899A (pt)
RU (1) RU2595040C2 (pt)
SG (1) SG11201403003SA (pt)
WO (1) WO2013086277A2 (pt)

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JP2010118580A (ja) 2008-11-14 2010-05-27 Toshiba Corp 不揮発性半導体記憶装置
US20120128499A1 (en) * 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
BR112015002386A2 (pt) * 2012-08-03 2017-07-04 Ocv Intellectual Capital Llc compósitos reforçados de fibra de vidro aperfeiçoados
WO2014136733A1 (ja) * 2013-03-04 2014-09-12 新日鐵住金株式会社 衝撃吸収部品
CA2915352C (en) * 2013-06-14 2018-03-20 Ppg Industries Ohio, Inc. Structural adhesive compositions
CA2917693A1 (en) * 2013-07-24 2015-01-29 Dow Global Technologies Llc Curable compositions
CN104004482A (zh) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 一种环氧/有机硅/石墨烯杂化高导热胶粘剂及其制备方法
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (de) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa Epoxidharz-Zusammensetzung
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
CN106118571A (zh) * 2016-06-28 2016-11-16 四川东树新材料有限公司 风电叶片用含石墨烯结构胶黏剂及其制备方法
CN110072915A (zh) * 2016-10-28 2019-07-30 陶氏环球技术有限责任公司 具有改善的低温耐冲击性的耐碰撞环氧粘合剂
KR102454520B1 (ko) 2017-06-23 2022-10-17 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 고온 에폭시 접착 제형
MX2020003105A (es) 2017-09-20 2020-10-12 Ppg Ind Ohio Inc Adhesivo estructural de dos componentes.
CN111727211A (zh) * 2018-02-09 2020-09-29 Ppg工业俄亥俄公司 涂料组合物
WO2020061431A2 (en) 2018-09-20 2020-03-26 Ppg Industries Ohio, Inc. Thiol-containing composition
WO2020077333A1 (en) 2018-10-12 2020-04-16 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
US20210380755A1 (en) * 2018-10-29 2021-12-09 Zephyros, Inc. Improved Structural Bonding Adhesive
FR3098817A1 (fr) 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions contenant des charges thermiquement conductrices
US20220282115A1 (en) 2019-08-23 2022-09-08 Ppg Industries Ohio, Inc. Systems and methods for improved lap shear strength and displacement of two-component structural adhesives
CN114502672B (zh) * 2019-08-23 2023-06-06 Prc-迪索托国际公司 涂料组合物
KR20220051217A (ko) * 2019-08-23 2022-04-26 피피지 인더스트리즈 오하이오 인코포레이티드 2-성분 구조적 접착제의 개선된 중첩전단강도 및 변위를 위한 시스템 및 방법
EP4017896B1 (en) 2019-08-23 2024-06-12 PPG Industries Ohio Inc. Coating compositions
MX2022003390A (es) 2019-09-23 2022-04-19 Ppg Ind Ohio Inc Composiciones curables.
CN114829476B (zh) 2019-12-11 2024-04-12 Ppg工业俄亥俄公司 含有导热填料的组合物
JP2023516156A (ja) 2020-02-26 2023-04-18 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド 熱伝導性かつ電気絶縁性の粉末コーティング組成物
EP4110871A1 (en) 2020-02-26 2023-01-04 PPG Industries Ohio Inc. Coated substrates and methods of preparing the same
WO2021173991A1 (en) 2020-02-26 2021-09-02 Ppg Industries Ohio, Inc. Two-layer dielectric coating
CN115916882A (zh) 2020-04-15 2023-04-04 Ppg工业俄亥俄公司 含有导热填料的组合物
WO2021211182A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
KR20230008089A (ko) 2020-04-15 2023-01-13 피피지 인더스트리즈 오하이오 인코포레이티드 열전도성 충전제를 함유하는 조성물
WO2021211185A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
EP4136139A1 (en) 2020-04-15 2023-02-22 PPG Industries Ohio Inc. Compositions containing thermally conductive fillers
WO2021211722A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
EP4263727A1 (en) 2020-12-18 2023-10-25 PPG Industries Ohio Inc. Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions
EP4314187A1 (en) 2021-03-26 2024-02-07 PPG Industries Ohio Inc. Coating compositions
WO2023102525A1 (en) 2021-12-02 2023-06-08 Ppg Industries Ohio, Inc. Coating compositions
CN114752334B (zh) * 2022-04-11 2023-10-20 中国航发北京航空材料研究院 一种耐湿热贮存稳定的中温固化环氧结构胶膜及制备方法
WO2023240057A1 (en) 2022-06-06 2023-12-14 Ppg Industries Ohio, Inc. Coating compositions
WO2024040260A1 (en) * 2022-08-19 2024-02-22 Ppg Industries Ohio, Inc. Coating compositions
WO2024044576A1 (en) 2022-08-22 2024-02-29 Ppg Industries Ohio, Inc. Coating compositions
CN116042150A (zh) * 2022-12-30 2023-05-02 浙江抟原复合材料有限公司 一种lng船围护***用低温环氧树脂及其制备方法

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Also Published As

Publication number Publication date
CN104053694A (zh) 2014-09-17
BR112014013594A2 (pt) 2017-06-13
SG11201403003SA (en) 2014-07-30
KR20140101838A (ko) 2014-08-20
WO2013086277A3 (en) 2013-08-15
IN2014DN04651A (pt) 2015-04-03
MX2014006899A (es) 2015-05-15
CA2858186C (en) 2016-06-07
CA2858186A1 (en) 2013-06-13
AU2012347650A1 (en) 2014-06-26
AU2012347650B2 (en) 2015-09-17
US20120129980A1 (en) 2012-05-24
BR112014013594B1 (pt) 2021-01-05
EP2788397A2 (en) 2014-10-15
KR101684752B1 (ko) 2016-12-08
RU2014127905A (ru) 2016-02-10
CN104053694B (zh) 2016-08-17
RU2595040C2 (ru) 2016-08-20
WO2013086277A2 (en) 2013-06-13

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/12/2012, OBSERVADAS AS CONDICOES LEGAIS.