IN2014DN04651A - - Google Patents

Info

Publication number
IN2014DN04651A
IN2014DN04651A IN4651DEN2014A IN2014DN04651A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A IN 4651DEN2014 A IN4651DEN2014 A IN 4651DEN2014A IN 2014DN04651 A IN2014DN04651 A IN 2014DN04651A
Authority
IN
India
Prior art keywords
epoxy
component
adduct
core
disclosed
Prior art date
Application number
Inventor
Umesh C Desai
Tien Chieh Chao
Masayuki Nakajima
Kaliappa G Ragunathan
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of IN2014DN04651A publication Critical patent/IN2014DN04651A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4269—Macromolecular compounds obtained by reactions other than those involving unsaturated carbon-to-carbon bindings
    • C08G59/4276—Polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5006—Amines aliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Abstract

Disclosed herein are compositions including (a) a first component comprising (1) an epoxy adduct that is the reaction product of reactants comprising a first epoxy compound a polyol and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy capped flexibilizer; (b) a heat activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct.
IN4651DEN2014 2011-12-09 2012-12-07 IN2014DN04651A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/315,518 US20120129980A1 (en) 2010-11-19 2011-12-09 Structural adhesive compositions
PCT/US2012/068378 WO2013086277A2 (en) 2011-12-09 2012-12-07 Structural adhesive compositions

Publications (1)

Publication Number Publication Date
IN2014DN04651A true IN2014DN04651A (en) 2015-04-03

Family

ID=47501441

Family Applications (1)

Application Number Title Priority Date Filing Date
IN4651DEN2014 IN2014DN04651A (en) 2011-12-09 2012-12-07

Country Status (12)

Country Link
US (1) US20120129980A1 (en)
EP (1) EP2788397A2 (en)
KR (1) KR101684752B1 (en)
CN (1) CN104053694B (en)
AU (1) AU2012347650B2 (en)
BR (1) BR112014013594B1 (en)
CA (1) CA2858186C (en)
IN (1) IN2014DN04651A (en)
MX (1) MX2014006899A (en)
RU (1) RU2595040C2 (en)
SG (1) SG11201403003SA (en)
WO (1) WO2013086277A2 (en)

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JP2010118580A (en) 2008-11-14 2010-05-27 Toshiba Corp Non-volatile semiconductor memory device
US20120128499A1 (en) * 2010-11-19 2012-05-24 Desai Umesh C Structural adhesive compositions
US20140150970A1 (en) * 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US10294375B2 (en) * 2011-09-30 2019-05-21 Ppg Industries Ohio, Inc. Electrically conductive coatings containing graphenic carbon particles
WO2014022845A1 (en) * 2012-08-03 2014-02-06 Ocv Intellectual Capital, Llc Improved fiberglass reinforced composites
CN105008754B (en) * 2013-03-04 2017-03-22 新日铁住金株式会社 Impact-absorbing component
SG11201510248YA (en) * 2013-06-14 2016-01-28 Ppg Ind Ohio Inc Structural adhesive compositions
EP3024908B1 (en) * 2013-07-24 2020-12-16 Blue Cube IP LLC Curable compositions
CN104004482A (en) * 2014-06-13 2014-08-27 江苏悦达新材料科技有限公司 Epoxy/organic silicon/graphene hybridization high heat conductivity adhesive and preparation method thereof
GB201411586D0 (en) * 2014-06-30 2014-08-13 Hexcel Composites Ltd Adhesive composition
DE102014226826A1 (en) * 2014-12-22 2016-06-23 Henkel Ag & Co. Kgaa The epoxy resin composition
US11242427B2 (en) 2015-10-20 2022-02-08 Ppg Industries Ohio, Inc. Structural adhesive compositions
US10351661B2 (en) 2015-12-10 2019-07-16 Ppg Industries Ohio, Inc. Method for producing an aminimide
US10377928B2 (en) 2015-12-10 2019-08-13 Ppg Industries Ohio, Inc. Structural adhesive compositions
CN106118571A (en) * 2016-06-28 2016-11-16 四川东树新材料有限公司 Wind electricity blade graphene-containing structural adhesive and preparation method thereof
EP3532527A1 (en) * 2016-10-28 2019-09-04 Dow Global Technologies, LLC Crash durable epoxy adhesive having improved low-temperature impact resistance
KR102454520B1 (en) 2017-06-23 2022-10-17 디디피 스페셜티 일렉트로닉 머티리얼즈 유에스, 엘엘씨 High Temperature Epoxy Adhesive Formulation
US20200248050A1 (en) 2017-09-20 2020-08-06 Ppg Industries Ohio, Inc. Two-Component Structural Adhesives
WO2019164568A1 (en) 2018-02-09 2019-08-29 Ppg Industries Ohio, Inc. Coating compositions
US20210355272A1 (en) 2018-09-20 2021-11-18 Ppg Industries Ohio, Inc. Thiol-containing composition
MX2021004184A (en) 2018-10-12 2021-09-08 Ppg Ind Ohio Inc Compositions containing thermally conductive fillers.
EP3873964A1 (en) * 2018-10-29 2021-09-08 Zephyros, Inc. Improved structural bonding adhesive
FR3098817A1 (en) 2019-07-16 2021-01-22 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
WO2021040868A1 (en) 2019-08-23 2021-03-04 Ppg Industries Ohio, Inc. Systems and methods for improved lap shear strength and displacement of two-component structural adhesives
KR20220050188A (en) 2019-08-23 2022-04-22 피알시-데소토 인터내쇼날, 인코포레이티드 coating composition
CA3147442A1 (en) 2019-08-23 2021-03-04 Ppg Industries Ohio, Inc. Coating compositions
KR20220051217A (en) 2019-08-23 2022-04-26 피피지 인더스트리즈 오하이오 인코포레이티드 Systems and Methods for Improved Lap Shear Strength and Displacement of Two-Component Structural Adhesives
US20220372207A1 (en) 2019-09-23 2022-11-24 Ppg Industries Ohio, Inc. Curable compositions
US20230019038A1 (en) 2019-12-11 2023-01-19 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
EP4110872A1 (en) 2020-02-26 2023-01-04 PPG Industries Ohio Inc. Two-layer dielectric coating
US20230167311A1 (en) 2020-02-26 2023-06-01 Ppg Industries Ohio, Inc. Coated substrates and methods of preparing the same
EP4110873A1 (en) 2020-02-26 2023-01-04 PPG Industries Ohio Inc. Thermally conductive and electrically insulating powder coating compositions
WO2021211185A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
MX2022012902A (en) 2020-04-15 2023-01-24 Ppg Ind Ohio Inc Compositions containing thermally conductive fillers.
KR20230008089A (en) 2020-04-15 2023-01-13 피피지 인더스트리즈 오하이오 인코포레이티드 Compositions containing thermally conductive fillers
MX2022012971A (en) 2020-04-15 2023-01-18 Ppg Ind Ohio Inc Compositions containing thermally conductive fillers.
WO2021211182A1 (en) 2020-04-15 2021-10-21 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
US20230183445A1 (en) 2020-04-15 2023-06-15 Ppg Industries Ohio, Inc. Compositions containing thermally conductive fillers
CA3199506A1 (en) 2020-12-18 2022-06-23 Corey James DEDOMENIC Thermally conductive and electrically insulating and/or fire-retardant electrodepositable coating compositions
WO2022204686A1 (en) 2021-03-26 2022-09-29 Ppg Industries Ohio, Inc. Coating compositions
WO2023102525A1 (en) 2021-12-02 2023-06-08 Ppg Industries Ohio, Inc. Coating compositions
CN114752334B (en) * 2022-04-11 2023-10-20 中国航发北京航空材料研究院 Medium-temperature cured epoxy structural adhesive film with stable humidity and heat resistance and storage and preparation method thereof
WO2023240057A1 (en) 2022-06-06 2023-12-14 Ppg Industries Ohio, Inc. Coating compositions
WO2024040260A1 (en) * 2022-08-19 2024-02-22 Ppg Industries Ohio, Inc. Coating compositions
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Also Published As

Publication number Publication date
WO2013086277A3 (en) 2013-08-15
EP2788397A2 (en) 2014-10-15
BR112014013594A8 (en) 2017-06-13
CA2858186C (en) 2016-06-07
RU2595040C2 (en) 2016-08-20
RU2014127905A (en) 2016-02-10
AU2012347650A1 (en) 2014-06-26
BR112014013594B1 (en) 2021-01-05
KR20140101838A (en) 2014-08-20
CA2858186A1 (en) 2013-06-13
KR101684752B1 (en) 2016-12-08
BR112014013594A2 (en) 2017-06-13
SG11201403003SA (en) 2014-07-30
CN104053694A (en) 2014-09-17
AU2012347650B2 (en) 2015-09-17
US20120129980A1 (en) 2012-05-24
WO2013086277A2 (en) 2013-06-13
MX2014006899A (en) 2015-05-15
CN104053694B (en) 2016-08-17

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