BR112012029464A2 - caixa de decodificação possuindo cargas térmicas de dissipação - Google Patents
caixa de decodificação possuindo cargas térmicas de dissipaçãoInfo
- Publication number
- BR112012029464A2 BR112012029464A2 BR112012029464A BR112012029464A BR112012029464A2 BR 112012029464 A2 BR112012029464 A2 BR 112012029464A2 BR 112012029464 A BR112012029464 A BR 112012029464A BR 112012029464 A BR112012029464 A BR 112012029464A BR 112012029464 A2 BR112012029464 A2 BR 112012029464A2
- Authority
- BR
- Brazil
- Prior art keywords
- thermal dissipation
- decoding box
- loads
- dissipation loads
- decoding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US34607310P | 2010-05-19 | 2010-05-19 | |
| US40076710P | 2010-08-02 | 2010-08-02 | |
| PCT/US2011/036171 WO2011146302A1 (en) | 2010-05-19 | 2011-05-12 | Set-top box having dissipating thermal loads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112012029464A2 true BR112012029464A2 (pt) | 2017-03-01 |
Family
ID=44484817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112012029464A BR112012029464A2 (pt) | 2010-05-19 | 2011-05-12 | caixa de decodificação possuindo cargas térmicas de dissipação |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9220185B2 (pt) |
| EP (1) | EP2572562B1 (pt) |
| JP (1) | JP2013527615A (pt) |
| KR (1) | KR20130077841A (pt) |
| CN (1) | CN103262675B (pt) |
| BR (1) | BR112012029464A2 (pt) |
| WO (1) | WO2011146302A1 (pt) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011071516A1 (en) | 2009-12-09 | 2011-06-16 | Thomson Licensing | Set-top box having microperforations |
| JP5687717B2 (ja) | 2010-02-25 | 2015-03-18 | トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ | 隠れクイックリリーススナップを備えた小形多層放射冷却ケース |
| EP2572562B1 (en) | 2010-05-19 | 2018-05-09 | Thomson Licensing | Set-top box having dissipating thermal loads |
| KR20140061299A (ko) * | 2011-03-09 | 2014-05-21 | 톰슨 라이센싱 | 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버 |
| US8363411B2 (en) | 2011-03-18 | 2013-01-29 | Eldon Technology Limited | Passive, low-profile heat transferring system |
| US8619427B2 (en) | 2011-03-21 | 2013-12-31 | Eldon Technology Limited | Media content device chassis with internal extension members |
| US8681495B2 (en) | 2011-03-29 | 2014-03-25 | Eldon Technology Limited | Media device having a piezoelectric fan |
| US9317079B2 (en) | 2011-03-29 | 2016-04-19 | Echostar Uk Holdings Limited | Media content device with customized panel |
| JP5792386B2 (ja) | 2011-07-14 | 2015-10-14 | トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ | スナップインヒートシンクとスマートカードリーダを有し、ヒートシンク保持用締め具を有するセットトップボックス |
| EP2769554A1 (en) | 2011-10-19 | 2014-08-27 | Thomson Licensing | Remote control with feedback for blind navigation |
| CN103547111B (zh) * | 2012-07-09 | 2016-08-10 | 光宝电子(广州)有限公司 | 平面式散热结构及电子装置 |
| JP2016525278A (ja) | 2013-06-27 | 2016-08-22 | トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ | 温度管理のためのデバイスカバー |
| WO2015023447A2 (en) * | 2013-08-16 | 2015-02-19 | Technicolor Usa, Inc. | Multi-layer heat spreader assembly with isolated convective fins |
| CN103491748B (zh) * | 2013-09-17 | 2016-06-08 | 深圳市九洲电器有限公司 | 散热装置和机顶盒 |
| KR20160075530A (ko) * | 2013-10-24 | 2016-06-29 | 톰슨 라이센싱 | 정전기 방전 보호를 구비한 컴팩트 무선 안테나 |
| US20160135282A1 (en) * | 2014-11-07 | 2016-05-12 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| KR101491833B1 (ko) * | 2014-11-16 | 2015-02-11 | 가온미디어 주식회사 | 포집 분산형 히트싱크 |
| JP6601055B2 (ja) * | 2015-08-20 | 2019-11-06 | 富士通株式会社 | プリント配線板、電子機器及び実装方法 |
| US10356948B2 (en) | 2015-12-31 | 2019-07-16 | DISH Technologies L.L.C. | Self-adjustable heat spreader system for set-top box assemblies |
| KR101794007B1 (ko) | 2016-04-06 | 2017-11-07 | (주)휴맥스 | 방열모듈 조립체 및 이를 갖는 셋탑박스 |
| CN106848539B (zh) * | 2017-01-19 | 2019-10-25 | 努比亚技术有限公司 | 一种天线装置 |
| US11425843B2 (en) * | 2017-08-08 | 2022-08-23 | Nec Platforms, Ltd. | Heat radiation structure |
| JP2019057656A (ja) * | 2017-09-22 | 2019-04-11 | ダイヤモンド電機株式会社 | 空冷機構付き電子機器 |
| US10721840B2 (en) | 2017-10-11 | 2020-07-21 | DISH Technologies L.L.C. | Heat spreader assembly |
| US11122707B2 (en) * | 2018-07-12 | 2021-09-14 | Arris Enterprises Llc | Raised pathway heat sink |
| KR20220041291A (ko) | 2020-09-24 | 2022-04-01 | 삼성디스플레이 주식회사 | 표시 장치 및 이를 구비한 전자 기기 |
| WO2022132244A1 (en) * | 2020-12-15 | 2022-06-23 | Arris Enterprises Llc | Multisided heat spreader |
| US11800687B2 (en) * | 2021-08-26 | 2023-10-24 | Dish Network L.L.C. | Heat transfer assembly |
| US20230345675A1 (en) * | 2022-04-26 | 2023-10-26 | Dish Network, L.L.C. | Electronic assembly having thermal pad with polymer layer |
Family Cites Families (81)
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| US4887147A (en) | 1987-07-01 | 1989-12-12 | Digital Equipment Corporation | Thermal package for electronic components |
| JPH02307182A (ja) | 1989-05-23 | 1990-12-20 | Hitachi Maxell Ltd | Ｉｃカードリーダ・ライタ |
| JP2758283B2 (ja) | 1991-06-17 | 1998-05-28 | 株式会社東芝 | ハードディスクパックの脱着機構 |
| US6850252B1 (en) | 1999-10-05 | 2005-02-01 | Steven M. Hoffberg | Intelligent electronic appliance system and method |
| JPH06227553A (ja) | 1993-01-28 | 1994-08-16 | Yazaki Corp | ロック構造 |
| US5620242A (en) | 1993-04-19 | 1997-04-15 | Motorola, Inc. | Portable radio battery latch |
| JP3251734B2 (ja) | 1993-08-18 | 2002-01-28 | 株式会社日立テレコムテクノロジー | 電子装置の筐体構造 |
| JPH0786471A (ja) | 1993-09-20 | 1995-03-31 | Hitachi Ltd | 半導体モジュ−ル |
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| JP3776169B2 (ja) | 1996-06-13 | 2006-05-17 | 任天堂株式会社 | 電子機器の放熱構造 |
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| JP2000269675A (ja) | 1999-03-19 | 2000-09-29 | Sony Corp | 放熱装置およびセット・トップ・ボックス |
| JP2000269671A (ja) | 1999-03-19 | 2000-09-29 | Toshiba Corp | 電子機器 |
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| JP3982941B2 (ja) | 1999-04-12 | 2007-09-26 | 富士通株式会社 | 記憶装置 |
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| DE69937103T2 (de) | 1999-06-08 | 2008-06-12 | Molex Inc., Lisle | Tragbare Chipkarten-Leseanordnung |
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| JP2001358482A (ja) | 2000-04-14 | 2001-12-26 | Matsushita Refrig Co Ltd | 放熱モジュール |
| FR2809871B1 (fr) | 2000-06-05 | 2002-07-19 | Itt Mfg Entpr S Inc | Connecteur electrique a lames de contact perfectionnees pour le raccordement d'une carte a circuit(s) integre(s) |
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| DE10051159C2 (de) | 2000-10-16 | 2002-09-19 | Osram Opto Semiconductors Gmbh | LED-Modul, z.B. Weißlichtquelle |
| US6524361B1 (en) | 2000-10-26 | 2003-02-25 | Hubbell Incorporated | Micro-porous filter |
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| EP1248507A1 (de) | 2001-04-04 | 2002-10-09 | Siemens Aktiengesellschaft | Hochfrequenzmodul eines Audio-Gerätes mit optimierter Wärmeableitung |
| JP2002324989A (ja) * | 2001-04-26 | 2002-11-08 | Murata Mach Ltd | 印刷回路基板の放熱構造 |
| JP4057796B2 (ja) | 2001-07-03 | 2008-03-05 | 株式会社東芝 | 非水電解質空気電池 |
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| JP2004186294A (ja) * | 2002-12-02 | 2004-07-02 | Denso Corp | 電子装置 |
| JP4039316B2 (ja) * | 2003-06-09 | 2008-01-30 | 株式会社明電舎 | 電子機器の冷却構造 |
| DE60319523T2 (de) | 2003-08-07 | 2009-03-26 | Harman Becker Automotive Systems Gmbh | Vorrichtung zur Kühlung von Halbleiterbauteilen auf Leiterplatten |
| US7203065B1 (en) * | 2003-11-24 | 2007-04-10 | Ciena Corporation | Heatsink assembly |
| US20050128710A1 (en) * | 2003-12-15 | 2005-06-16 | Beiteimal Abdlmonem H. | Cooling system for electronic components |
| TWI256192B (en) | 2004-04-15 | 2006-06-01 | Acbel Polytech Inc | Power adapter with heat sink device |
| FR2871022B1 (fr) | 2004-05-25 | 2006-11-03 | Valeo Electronique Sys Liaison | Boitier pour circuits electriques ou electroniques |
| GB0413340D0 (en) | 2004-06-15 | 2004-07-21 | Pace Micro Tech Plc | Improvements to electrical apparatus |
| US7215551B2 (en) * | 2004-09-29 | 2007-05-08 | Super Talent Electronics, Inc. | Memory module assembly including heat sink attached to integrated circuits by adhesive |
| FR2875917B3 (fr) | 2004-09-29 | 2007-01-05 | Alvaro Lemos | Dispositif d'aeration pliable pour la protection de micro-ordinateurs portables |
| TWI247574B (en) | 2004-11-30 | 2006-01-11 | Silicon Integrated Sys Corp | Heat dissipation mechanism for electronic device |
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| JP2006229046A (ja) | 2005-02-18 | 2006-08-31 | Toshiba Corp | 電子機器の放熱装置及び放熱方法 |
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| US7158380B2 (en) | 2005-03-25 | 2007-01-02 | Scientific-Atlanta, Inc. | Heatsink for digital video recorder |
| US7350705B1 (en) | 2005-03-28 | 2008-04-01 | International Technologies & Systems Corp. | Compact robust smart card reader |
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| US7272001B2 (en) | 2005-09-09 | 2007-09-18 | King Young Technology Co., Ltd. | External conductive heat dissipating device for microcomputers |
| US8009426B2 (en) | 2005-11-23 | 2011-08-30 | Comcast Cable Holdings Llc | Housing for protecting electronic components having vents |
| US20070177356A1 (en) * | 2006-02-01 | 2007-08-02 | Jeffrey Panek | Three-dimensional cold plate and method of manufacturing same |
| JP4742893B2 (ja) * | 2006-02-03 | 2011-08-10 | 日本電気株式会社 | 発熱デバイスの実装装置およびその放熱装置 |
| US7450387B2 (en) | 2006-03-02 | 2008-11-11 | Tdk Innoveta Technologies, Inc. | System for cooling electronic components |
| GB2436170A (en) | 2006-03-17 | 2007-09-19 | Amstrad Plc | Cooling or heating device in a chip card reader |
| US7664198B2 (en) | 2006-03-21 | 2010-02-16 | Kyocera Corporation | System and method for broadcasting data over a wireless network using rateless codes |
| JP2008034474A (ja) * | 2006-07-26 | 2008-02-14 | Sharp Corp | 伝熱シート及び基板装置 |
| US7518875B2 (en) | 2006-12-14 | 2009-04-14 | International Business Machines Corporation | Securing heat sinks to a device under test |
| EP2145284B1 (en) | 2007-05-04 | 2013-04-17 | Thomson Licensing | Smart card heat sink |
| DE202007006626U1 (de) | 2007-05-09 | 2007-10-04 | Hamburg Industries Co., Ltd., Shen Keng | Verbindungseinrichtung |
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| WO2009057124A2 (en) | 2007-11-01 | 2009-05-07 | Innomedia Technologies Pvt. Ltd. | A set-top-box cabinet for natural cooling of internal electronics |
| JP4857252B2 (ja) | 2007-12-07 | 2012-01-18 | 株式会社日立製作所 | 電子機器 |
| JP4473923B2 (ja) | 2008-10-22 | 2010-06-02 | 株式会社東芝 | 電子機器 |
| CN201352820Y (zh) | 2009-02-10 | 2009-11-25 | 深圳创维数字技术股份有限公司 | 机顶盒机箱 |
| FR2944408B1 (fr) | 2009-04-14 | 2012-09-21 | Eads Europ Aeronautic Defence | Boitier pour carte electronique embarquee |
| KR101552357B1 (ko) | 2009-05-29 | 2015-09-11 | 엘지이노텍 주식회사 | 튜너 모듈 |
| CN201515429U (zh) | 2009-09-22 | 2010-06-23 | 重庆迪特尔数字电视有限公司 | 数字电视机顶盒 |
| WO2011071516A1 (en) | 2009-12-09 | 2011-06-16 | Thomson Licensing | Set-top box having microperforations |
| CN201571126U (zh) | 2009-12-14 | 2010-09-01 | 福建创频数码科技有限公司 | 一种新型机顶盒外壳 |
| JP5687717B2 (ja) | 2010-02-25 | 2015-03-18 | トムソン ライセンシングＴｈｏｍｓｏｎ Ｌｉｃｅｎｓｉｎｇ | 隠れクイックリリーススナップを備えた小形多層放射冷却ケース |
| US8620162B2 (en) | 2010-03-25 | 2013-12-31 | Apple Inc. | Handheld electronic device with integrated transmitters |
| EP2572562B1 (en) | 2010-05-19 | 2018-05-09 | Thomson Licensing | Set-top box having dissipating thermal loads |
| USD631449S1 (en) | 2010-08-02 | 2011-01-25 | Thomson Licensing | Set top box |
| GB201016047D0 (en) | 2010-09-24 | 2010-11-10 | Pace Plc | Means for heating dissipation for electrical and/or electronic apparatus |
| KR20140061299A (ko) | 2011-03-09 | 2014-05-21 | 톰슨 라이센싱 | 스냅-인 히트 싱크 및 스마트 카드 판독기를 갖는 셋톱 박스 또는 서버 |
-
2011
- 2011-05-12 EP EP11724317.0A patent/EP2572562B1/en not_active Not-in-force
- 2011-05-12 BR BR112012029464A patent/BR112012029464A2/pt not_active Application Discontinuation
- 2011-05-12 US US13/698,868 patent/US9220185B2/en not_active Expired - Fee Related
- 2011-05-12 KR KR1020127033169A patent/KR20130077841A/ko not_active Application Discontinuation
- 2011-05-12 CN CN201180032238.7A patent/CN103262675B/zh not_active Expired - Fee Related
- 2011-05-12 JP JP2013511224A patent/JP2013527615A/ja active Pending
- 2011-05-12 WO PCT/US2011/036171 patent/WO2011146302A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| EP2572562B1 (en) | 2018-05-09 |
| WO2011146302A1 (en) | 2011-11-24 |
| US9220185B2 (en) | 2015-12-22 |
| CN103262675B (zh) | 2016-03-30 |
| KR20130077841A (ko) | 2013-07-09 |
| EP2572562A1 (en) | 2013-03-27 |
| CN103262675A (zh) | 2013-08-21 |
| JP2013527615A (ja) | 2013-06-27 |
| US20130063895A1 (en) | 2013-03-14 |
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