AU2001241521A1 - Wafer processing system - Google Patents

Wafer processing system

Info

Publication number
AU2001241521A1
AU2001241521A1 AU2001241521A AU4152101A AU2001241521A1 AU 2001241521 A1 AU2001241521 A1 AU 2001241521A1 AU 2001241521 A AU2001241521 A AU 2001241521A AU 4152101 A AU4152101 A AU 4152101A AU 2001241521 A1 AU2001241521 A1 AU 2001241521A1
Authority
AU
Australia
Prior art keywords
processing system
wafer processing
wafer
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001241521A
Inventor
Woo Sik Yoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WaferMasters Inc
Original Assignee
WaferMasters Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WaferMasters Inc filed Critical WaferMasters Inc
Publication of AU2001241521A1 publication Critical patent/AU2001241521A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
AU2001241521A 2000-02-25 2001-02-16 Wafer processing system Abandoned AU2001241521A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/513,106 US6395648B1 (en) 2000-02-25 2000-02-25 Wafer processing system
US09513106 2000-02-25
PCT/US2001/005050 WO2001063651A2 (en) 2000-02-25 2001-02-16 Wafer processing system

Publications (1)

Publication Number Publication Date
AU2001241521A1 true AU2001241521A1 (en) 2001-09-03

Family

ID=24041913

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001241521A Abandoned AU2001241521A1 (en) 2000-02-25 2001-02-16 Wafer processing system

Country Status (6)

Country Link
US (2) US6395648B1 (en)
EP (1) EP1258028A2 (en)
JP (1) JP2003524897A (en)
KR (1) KR100757142B1 (en)
AU (1) AU2001241521A1 (en)
WO (1) WO2001063651A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101894778A (en) * 2003-08-29 2010-11-24 交叉自动控制公司 The method and apparatus that is used for semiconductor processes
JP4719010B2 (en) * 2005-01-21 2011-07-06 日本電産サンキョー株式会社 Industrial robot
US7467916B2 (en) * 2005-03-08 2008-12-23 Asm Japan K.K. Semiconductor-manufacturing apparatus equipped with cooling stage and semiconductor-manufacturing method using same
JP4789551B2 (en) * 2005-09-06 2011-10-12 株式会社半導体エネルギー研究所 Organic EL film forming equipment
JP5537947B2 (en) * 2006-11-27 2014-07-02 テック・セム アーゲー Conveyor for overhead transport system
KR100867825B1 (en) 2006-12-12 2008-11-10 현대자동차주식회사 Emergency start-up control method for fuel cell hybrid electric vehicle
US7750645B2 (en) * 2007-08-15 2010-07-06 Applied Materials, Inc. Method of wafer level transient sensing, threshold comparison and arc flag generation/deactivation
US7733095B2 (en) 2007-08-15 2010-06-08 Applied Materials, Inc. Apparatus for wafer level arc detection at an RF bias impedance match to the pedestal electrode
US7768269B2 (en) * 2007-08-15 2010-08-03 Applied Materials, Inc. Method of multi-location ARC sensing with adaptive threshold comparison
US7737702B2 (en) * 2007-08-15 2010-06-15 Applied Materials, Inc. Apparatus for wafer level arc detection at an electrostatic chuck electrode
US7750644B2 (en) * 2007-08-15 2010-07-06 Applied Materials, Inc. System with multi-location arc threshold comparators and communication channels for carrying arc detection flags and threshold updating
KR101917335B1 (en) * 2010-10-08 2018-11-09 브룩스 오토메이션 인코퍼레이티드 Coaxial drive vacuum robot
JP2014093489A (en) * 2012-11-06 2014-05-19 Tokyo Electron Ltd Substrate processing device
JP6493339B2 (en) * 2016-08-26 2019-04-03 村田機械株式会社 Transport container and method for transferring contents
DE102018102762B3 (en) * 2018-02-07 2019-08-01 Uwe Beier Load lock for a substrate container, device with a load lock and method for operating a load lock

Family Cites Families (27)

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Publication number Priority date Publication date Assignee Title
US4680451A (en) 1985-07-29 1987-07-14 A. G. Associates Apparatus using high intensity CW lamps for improved heat treating of semiconductor wafers
JPH0636582Y2 (en) * 1987-07-10 1994-09-21 株式会社日立製作所 Etching equipment
JPH0184428U (en) * 1987-11-27 1989-06-05
US4886954A (en) 1988-04-15 1989-12-12 Thermco Systems, Inc. Hot wall diffusion furnace and method for operating the furnace
US5155336A (en) 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5208643A (en) 1990-10-05 1993-05-04 Varian Associates, Inc. Method of and apparatus for non-contact temperature measurement
US5114242A (en) 1990-12-07 1992-05-19 Ag Processing Technologies, Inc. Bichannel radiation detection method
US5165796A (en) 1990-12-07 1992-11-24 Ag Processing Technologies, Inc. Bichannel radiation detection apparatus
KR0162102B1 (en) 1991-05-29 1999-02-01 이노우에 아키라 Semiconductor manufacturing apparatus
US5257323A (en) 1991-05-29 1993-10-26 Canon Kabushiki Kaisha Selection agent for a symbol determination system with multiple character recognition processors
US5443382A (en) * 1992-08-27 1995-08-22 Matsushita Electric Industrial Co., Ltd. Atmospheric oven
US5418885A (en) 1992-12-29 1995-05-23 North Carolina State University Three-zone rapid thermal processing system utilizing wafer edge heating means
TW276353B (en) * 1993-07-15 1996-05-21 Hitachi Seisakusyo Kk
JP3560633B2 (en) * 1994-03-15 2004-09-02 東芝機械株式会社 Heat treatment equipment
US5645419A (en) * 1994-03-29 1997-07-08 Tokyo Electron Kabushiki Kaisha Heat treatment method and device
US5654904A (en) 1994-05-18 1997-08-05 Micron Technology, Inc. Control and 3-dimensional simulation model of temperature variations in a rapid thermal processing machine
JP3196917B2 (en) 1994-06-17 2001-08-06 大日本スクリーン製造株式会社 Substrate processing equipment
JPH08213442A (en) * 1995-02-06 1996-08-20 Hitachi Ltd Multi-chamber processing device
US5715361A (en) 1995-04-13 1998-02-03 Cvc Products, Inc. Rapid thermal processing high-performance multizone illuminator for wafer backside heating
US5654417A (en) 1995-04-14 1997-08-05 Children's Hospital And Medical Center Nucleic acid probes for detecting E. coli O157:H7
US5830277A (en) 1995-05-26 1998-11-03 Mattson Technology, Inc. Thermal processing system with supplemental resistive heater and shielded optical pyrometry
US5584936A (en) 1995-12-14 1996-12-17 Cvd, Incorporated Susceptor for semiconductor wafer processing
US5837555A (en) 1996-04-12 1998-11-17 Ast Electronik Apparatus and method for rapid thermal processing
JPH1064973A (en) * 1996-08-22 1998-03-06 Kokusai Electric Co Ltd Semiconductor manufacturing device
JP3774283B2 (en) 1996-11-19 2006-05-10 東京エレクトロン株式会社 Processing system
GB9625186D0 (en) 1996-12-04 1997-01-22 Smiths Industries Plc Manufacture
JPH11163075A (en) * 1997-12-01 1999-06-18 Hitachi Ltd Method and device for manufacturing semiconductor device

Also Published As

Publication number Publication date
WO2001063651A3 (en) 2001-12-06
KR20020086574A (en) 2002-11-18
JP2003524897A (en) 2003-08-19
WO2001063651A2 (en) 2001-08-30
EP1258028A2 (en) 2002-11-20
US6395648B1 (en) 2002-05-28
US20020090836A1 (en) 2002-07-11
US6840763B2 (en) 2005-01-11
KR100757142B1 (en) 2007-09-10

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