JP3560633B2 - Heat treatment equipment - Google Patents

Heat treatment equipment Download PDF

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JP3560633B2
JP3560633B2 JP4355794A JP4355794A JP3560633B2 JP 3560633 B2 JP3560633 B2 JP 3560633B2 JP 4355794 A JP4355794 A JP 4355794A JP 4355794 A JP4355794 A JP 4355794A JP 3560633 B2 JP3560633 B2 JP 3560633B2
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sample
chamber
cooling
heat treatment
container
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JPH07254538A (en
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泰山 後藤
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Shibaura Machine Co Ltd
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Toshiba Machine Co Ltd
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Description

【０００１】
【産業上の利用分野】
本発明は、半導体、液晶等の製造装置に適用される加熱処理装置に係るもので、特に枚葉状の試料を加熱状態で処理する枚葉式処理方式の加熱処理装置に関する。
【０００２】
【従来の技術】
従来、枚葉式処理方式の加熱処理装置の１つとして、クラスター方式が多用されている。
クラスター方式の構造は、図１０に示すように、試料Ｗを所定位置に搬送するための試料搬送手段としてのロボット１を主とした搬送室２を中心に、試料Ｗを格納した試料格納容器としてのカセット３，４を収容するカセット室５，６と、試料Ｗを加熱状態で処理する処理室としてのプロセス室７，８等を周囲に配置し、減圧中で試料Ｗが搬送されることを特徴とする。
【０００３】
プロセス室７，８で処理されるプロセスとしては、エッチング，成膜等があるが、概して加熱高温処理をするものが多い。高温処理を施した試料Ｗをカセット室５，６のカセット３，４に格納する際には、プラスチック系が多いカセット３，４への熱影響を避けるために試料Ｗの冷却が必要である。
【０００４】
従来、試料Ｗの冷却には、図に示すように、カセット室５とプロセス室７との間に冷却室９を設け、この冷却室９において、プロセス室７，８で処理された高温の試料Ｗを水冷板等の上に載置し、熱伝導で冷却するようにしていた。
【０００５】
【発明が解決しようとする課題】
しかしながら、上記のように、冷却室９を別に設けるということは、
１．試料Ｗの搬送経路が長くなり、搬送時間の増加となるため、スループットが下がる。
２．冷却室９への試料Ｗの出入れのために、この冷却室９にプロセス室７，８に設けられているのと同等の例えば上下動する３本のピン等からなる試料上下動駆動機構（図示せず）を設けるか、或いは、ロボット１側での上下動機能が必要となる。このため、装置構造の複雑化を招くと共に、コストアップにつながる。
等の問題があった。
【０００６】
本発明は、上記事情に基づきなされたもので、スループット、コスト等への悪影響を最小限に抑えた状態で、処理室で加熱状態で処理された後の試料を冷却して試料格納容器に格納することがきるようにした加熱処理装置を提供することを目的とする。
【０００７】
【課題を解決するための手段】
本発明は、上記課題を解決するための手段として、枚葉状の試料を加熱処理する加熱処理装置であって、前記試料を載置する試料載置部を有し前記試料を所定位置に搬送するための試料搬送手段と、この試料搬送手段の搬送領域内に配設され前記試料を格納した試料格納容器を収容すると共に前記試料格納容器を上下動させる上下動駆動機構を備えた容器収容室と、この容器収容室内の前記試料格納容器から前記試料搬送手段を介して取出された試料を加熱状態で処理する処理室と、前記容器収容室内の前記試料格納容器に隣接して設けられ前記上下動駆動機構にて移動可能であり、前記処理室で加熱状態で処理された試料を冷却するための試料冷却手段と、前記処理室で加熱状態で処理された後の試料を前記試料冷却手段を中継した後、試料格納容器に格納するように前記試料搬送手段を制御する制御手段とを具備してなる構成としたものである。
【０００８】
【作用】
上記手段の加熱処理装置によれば、容器収容室内の試料格納容器に隣接して試料冷却手段を設けたから、処理室で加熱状態で処理された試料を直接的に容器収容室内に搬入して試料冷却手段に送込むことができ、従来のように容器収容室とは別の位置に冷却室を設けるものに比べて、試料の搬送経路が短く、搬送時間の短縮化が図れ、スループットを上げることが可能となる。
【０００９】
また、試料冷却手段を収容する専用の室を設ける必要がなく、しかも、試料格納容器への試料の出入の際に使用する上下動駆動機構と、試料冷却手段への試料の出入の際に使用する上下動駆動機構とを兼用として、従来のように試料冷却手段専用の上下動駆動機構を設けたり、試料搬送手段側に上下動機能を持たせる必要がないようにしたから、装置構造の簡素化と、低コスト化が可能となる。
【００１０】
【実施例】
以下、本発明の一実施例を図１〜図６を参照して説明する。
図１に示すように、加熱処理装置１０は、試料（ウエハ）Ｗを所定位置に搬送するための試料搬送手段としてのロボット１を主とした搬送室２を中心に、試料Ｗを格納した試料格納容器としてのカセット３，４を収容する容器収容室としてのカセット室５，６と、試料Ｗを加熱状態で処理する処理室としてのプロセス室７，８等が周囲に配置されたものとなっている。
【００１１】
また、カセット室５，６には、カセット室５，６を大気に対して開閉し、カセット３，４を交換するための第１ゲートバルブ２０，２１が付設されている。また、カセット室５，６と搬送室２との間には、これらの間を開閉するための第２ゲートバルブ２２，２３が設けられている。この図においては第２ゲートバルブ２２は開いた状態にある。さらに、プロセス室７，８と搬送室２との間を開閉するための第３ゲートバルブ２４，２５が設けられている。
【００１２】
また、図２に示すように、カセット室５内にはモータ３０を含む上下動駆動機構３１によって所望の位置決め可能に上下動される昇降台３２が設けられている。また、もう一つのカセット室６内にも同様なモータ３３を含む上下動駆動機構３４により移動可能な同様な昇降台３５が設けられている。
【００１３】
昇降台３２，３５上には、試料冷却手段としての試料冷却部４０，４１が設置され、これらの上にカセット３，４が交換可能に設置されるようになっている。試料冷却部４０，４１は同一の構造であるため、試料冷却部４０について以下により具体的に説明する。
【００１４】
図３は、昇降台３２、試料冷却部４０、カセット３の拡大斜視図である。試料冷却部４０は、図１及び図２に示すロボット１の旋回中心軸５０に向かって伸びる偏平な空間４１が設けられ、その底面４１ａには同じく旋回中心軸５０に向かって伸びる溝４２（図５、図６参照）が設けられている。試料冷却部４０は、アルミニウムなどの熱良導体で形成することが好ましく、試料Ｗの金属汚染を嫌う場合には、全体または底面４１ａの表面を石英やセラミックで形成することが好ましい。
【００１５】
ロボット１は、図１に示すように、軸５２を中心に対称的に配置された２つの試料載置部としてのピック５１Ａ、５１Ｂを有し、これらのピック５１Ａ、５１Ｂを軸５２の回りに１８０°旋回させることにより交互に試料冷却部４０の空間４１および溝４２内に出入させるようになっている。
【００１６】
試料冷却部４０の底部４１ａの下には、図３、図６に示すように、冷却流体の流路４３が設けられ、螺旋状などの伸縮自在な管４４、４５により冷却流体を流すようになっている。
【００１７】
底部４１ａは溝４２を除いて平面に形成され、試料Ｗを接触した状態で支持するようになっている。
また、図２に示すように制御手段である制御装置６０が設けられており、加熱処理装置１０を制御するようになっている。そして、制御装置６０は、カセット室５，６内に配設された昇降台３２，３５の上下動駆動機構３１，３４のモータ３０，３３と接続していると共に、ロボット１を駆動するための駆動装置６１と接続している。
【００１８】
次いで本装置の作用について説明する。第１ゲートバルブ２０を開き、処理済みの試料Ｗが入っているカセット３をカセット室５から取出し、代わりに未処理の試料Ｗを入れたカセット３を試料冷却部４０の上に設置する。
【００１９】
次に、第１ゲートバルブ２０を閉じてカセット室５を搬送室２と同じ減圧状態ないし同じ雰囲気状態にした後、第２ゲートバルブ２２を開き、カセット３の上下動とロボット１の動作によってカセット３内の試料Ｗを１枚ずつ取出してプロセス室７または８へ１枚ずつ搬入し、加熱を伴う処理を行なう。
【００２０】
処理された試料Ｗはロボット１によりプロセス室７または８から取出され、試料冷却部４０の空間４１内に搬送される。次いで、昇降台３２を上昇させ、ロボット１のピック５１Ａに載置されている処理済みの高温の試料Ｗを底部４１ａで支持する。
【００２１】
なお、このとき、先行している試料Ｗが底部４１ａ上に載置され、すでにある程度降温した状態におかれている場合には、他方のピック５１Ｂによって先行している試料Ｗを試料冷却部４０から取出した後、ピック５１Ａ、５１Ｂを１８０°旋回させてピック５１Ａ上の後続の試料Ｗを上記のように底部４１ａ上に載置する。
【００２２】
ピック５１Ｂが先行している試料Ｗを載置している場合には、これをカセット３に戻し、カセット３から未処理の試料Ｗを取出し、以下プロセス室７、８から処理済み試料Ｗの搬出と、該プロセス室７、８への未処理の試料Ｗの搬入を順次行ない、かつ処理済みの試料Ｗを試料冷却部４０を経由させてカセット３へ戻す動作を繰返す。
【００２３】
なお、カセット３の試料Ｗの処理中に、他側のカセット室６の第１ゲートバルブ２１を開いてカセット４を交換する。
なお、本発明は上記一実施例に限らず、種々変形実施可能なことは勿論である。
【００２４】
すなわち、前述した実施例は、先に記載したように、試料冷却部４０、４１をカセット３、４の下に配置した例を示したが、図７に示すように、カセット３、４の上になるように配置してもよい。なお、この他の実施例の説明において、前述の実施例と同一部分は同一の符号を付して重複説明は省略する。
【００２５】
また、図８に示すように、昇降台３２（３５）の上面にカセット３（４）と試料冷却部４０（４１）を横並び（図８においては試料冷却部４０（４１）を手前側）に配置するようにしてもよい。なお、この他の実施例の説明において、前述の実施例と同一部分は同一の符号を付して重複説明は省略する。
【００２６】
また、前述した実施例は、試料冷却部４０、４１に試料Ｗを１枚のみ収納する例を示したが、図９に示すように、２枚またはそれ以上収納するようにして搬入した順序で順次搬出するようにしてもよい。さらにまた、試料冷却部４０、４１は必ずしも冷却水などの特別な冷却流体により積極的に冷却せずに、カセット室５，６を不活性ガス雰囲気にするために、これらのカセット室５，６に供給される不活性ガスにより冷却するか、または、単なる自然冷却としてもよい。なお、上記他の実施例の説明において、最初の実施例と同一部分は同一の符号を付して重複説明は省略する。
【００２７】
【発明の効果】
容器収容室内の試料格納容器に隣接して試料冷却手段を設けたから、処理室で加熱状態で処理された試料を直接的に容器収容室内に搬入して試料冷却手段に送込むことができ、従来のように容器収容室とは別の位置に冷却室を設けるものに比べて、試料の搬送経路が短く、搬送時間の短縮化が図れ、スループットを上げることができる。
【００２８】
また、試料冷却手段を収容する専用の室を設ける必要がなく、しかも、試料格納容器への試料の出入の際に使用する上下動駆動機構と、試料冷却手段への試料の出入の際に使用する上下動駆動機構とを兼用として、従来のように試料冷却手段専用の上下動駆動機構を設けたり、試料搬送手段側に上下動機能を持たせる必要がないようにしたから、装置構造の簡素化と、低コスト化が可能となる。
【図面の簡単な説明】
【図１】本発明の一実施例を示す平面断面図。
【図２】図１のＡ−Ａ線断面図。
【図３】図１に示した装置のうち本発明の要部の拡大斜視図。
【図４】試料冷却部の拡大断面図。
【図５】同上平面図。
【図６】図５のＢ−Ｂ線断面図。
【図７】本発明の第１の他の実施例を示す平面断面図。
【図８】本発明の第２の他の実施例を示す平面断面図。
【図９】本発明の要部である試料冷却部の変形例を示す断面図。
【図１０】従来装置の平面断面図。
【符号の説明】
Ｗ…試料、１…ロボット（試料搬送手段）、２…搬送室、３，４…カセット（試料格納容器）、５，６…カセット室（容器収容室）、７，８…プロセス室（処理室）、１０…加熱処理装置、２０，２１…第１ゲートバルブ、２２，２３…第２ゲートバルブ、２４，２５…第３ゲートバルブ、３０，３３…モータ、３１，３４…上下動駆動機構、３２，３５…昇降台、４０，４１…試料冷却部（試料冷却手段）、４１ａ…底面、４２…溝、５０…旋回中心軸、５１Ａ、５１Ｂ…ピック（試料載置部）、５２…軸、６０…制御装置（制御手段）、６１…駆動装置。[0001]
[Industrial applications]
The present invention relates to a heat treatment apparatus applied to an apparatus for manufacturing semiconductors, liquid crystals, and the like, and more particularly to a heat treatment apparatus of a single-wafer processing method for treating a single-wafer sample in a heated state.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a cluster method has been frequently used as one of heat treatment apparatuses of a single-wafer processing method.
As shown in FIG. 10, the cluster type structure has a sample storage container storing the sample W centered on a transfer chamber 2 mainly including a robot 1 as a sample transfer unit for transferring the sample W to a predetermined position. The cassette chambers 5 and 6 accommodating the cassettes 3 and 4 and the process chambers 7 and 8 serving as processing chambers for processing the sample W in a heated state are arranged around the cassette chambers 5 and 6 so that the sample W is transported under reduced pressure. Features.
[0003]
The processes to be processed in the process chambers 7 and 8 include etching, film formation, and the like. When storing the sample W subjected to the high-temperature treatment in the cassettes 3 and 4 of the cassette chambers 5 and 6, it is necessary to cool the sample W in order to avoid a thermal influence on the cassettes 3 and 4 having a large amount of plastic.
[0004]
Conventionally, for cooling the sample W, as shown in the figure, a cooling chamber 9 is provided between the cassette chamber 5 and the process chamber 7, and the high-temperature sample processed in the process chambers 7, 8 is provided in the cooling chamber 9. W was placed on a water-cooled plate or the like and cooled by heat conduction.
[0005]
[Problems to be solved by the invention]
However, providing the cooling chamber 9 separately as described above means that:
1. Since the transport path of the sample W becomes longer and the transport time increases, the throughput decreases.
2. In order to move the sample W into and out of the cooling chamber 9, a sample vertical movement driving mechanism (for example, three pins that move up and down) equivalent to those provided in the process chambers 7 and 8 in the cooling chamber 9 ( (Not shown)) or a function of vertically moving the robot 1 is required. For this reason, the structure of the device is complicated, and the cost is increased.
And so on.
[0006]
The present invention has been made based on the above circumstances, and cools a sample that has been processed in a heating state in a processing chamber and stores the sample in a sample storage container while minimizing adverse effects on throughput, cost, and the like. It is an object of the present invention to provide a heat treatment apparatus capable of performing heat treatment.
[0007]
[Means for Solving the Problems]
The present invention, as a means for solving the above-mentioned problem, is a heat treatment apparatus that heat-treats a single-wafer-shaped sample, and has a sample placement portion on which the sample is placed, and transports the sample to a predetermined position. A sample storage means for storing a sample storage container which is disposed in a transfer area of the sample transfer means and stores the sample, and which has a vertical movement driving mechanism for vertically moving the sample storage container; A processing chamber for processing, in a heated state, a sample taken out from the sample storage container via the sample transport means in the container storage chamber, and the vertical movement provided adjacent to the sample storage container in the container storage chamber. A sample cooling unit that is movable by a driving mechanism and cools the sample processed in the processing chamber in the heated state, and relays the sample that has been processed in the processing chamber in the heated state to the sample cooling unit. After that, try It is obtained by a composed and a control means for controlling the sample transfer unit to store the containment configuration.
[0008]
[Action]
According to the heat treatment apparatus of the above means, since the sample cooling means is provided adjacent to the sample storage container in the container storage chamber, the sample processed in a heated state in the processing chamber is directly carried into the container storage chamber and the sample is cooled. It can be sent to the cooling means, and the sample transfer path is shorter, the transfer time can be shortened, and the throughput can be increased as compared with the conventional case where the cooling chamber is provided at a position different from the container storage chamber. Becomes possible.
[0009]
Also, there is no need to provide a dedicated chamber for accommodating the sample cooling means, and a vertical drive mechanism used when moving the sample into and out of the sample storage container, and a mechanism used when moving the sample into and out of the sample cooling means. It is not necessary to provide a vertical drive mechanism dedicated to the sample cooling means as in the past, nor to provide a vertical movement function on the sample transfer means side, as in the past. And cost reduction can be achieved.
[0010]
【Example】
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, a heat treatment apparatus 10 includes a sample W in which a sample W is stored around a transfer chamber 2 mainly including a robot 1 as a sample transfer unit for transferring a sample (wafer) W to a predetermined position. Cassette chambers 5 and 6 as container storage chambers for storing the cassettes 3 and 4 as storage containers, and process chambers 7 and 8 as processing chambers for processing the sample W in a heated state are arranged around. ing.
[0011]
The cassette chambers 5 and 6 are provided with first gate valves 20 and 21 for opening and closing the cassette chambers 5 and 6 with respect to the atmosphere and exchanging the cassettes 3 and 4. Further, between the cassette chambers 5, 6 and the transfer chamber 2, there are provided second gate valves 22, 23 for opening and closing between them. In this figure, the second gate valve 22 is open. Further, third gate valves 24 and 25 for opening and closing between the process chambers 7 and 8 and the transfer chamber 2 are provided.
[0012]
As shown in FIG. 2, an elevating table 32 is provided in the cassette chamber 5 and is vertically moved by a vertical drive mechanism 31 including a motor 30 so as to be able to perform a desired positioning. Further, a similar lifting table 35 movable by a vertical drive mechanism 34 including a similar motor 33 is provided in another cassette chamber 6.
[0013]
Sample cooling units 40 and 41 as sample cooling means are installed on the elevating tables 32 and 35, and the cassettes 3 and 4 are exchangeably installed on these. Since the sample cooling units 40 and 41 have the same structure, the sample cooling unit 40 will be described more specifically below.
[0014]
FIG. 3 is an enlarged perspective view of the lifting table 32, the sample cooling unit 40, and the cassette 3. The sample cooling unit 40 is provided with a flat space 41 extending toward the turning center axis 50 of the robot 1 shown in FIGS. 1 and 2, and a groove 42 (see FIG. 5, see FIG. 6). The sample cooling unit 40 is preferably formed of a good heat conductor such as aluminum. When metal contamination of the sample W is not desired, the entire surface or the surface of the bottom surface 41a is preferably formed of quartz or ceramic.
[0015]
As shown in FIG. 1, the robot 1 has picks 51A and 51B as two sample mounting portions symmetrically arranged about an axis 52, and these picks 51A and 51B are moved around the axis 52. By rotating by 180 °, the sample is alternately moved into and out of the space 41 and the groove 42 of the sample cooling unit 40.
[0016]
As shown in FIGS. 3 and 6, a cooling fluid flow path 43 is provided below the bottom 41 a of the sample cooling unit 40 so that the cooling fluid flows through helically expandable and contractible tubes 44 and 45. Has become.
[0017]
The bottom portion 41a is formed flat except for the groove 42, and supports the sample W in a contact state.
Further, as shown in FIG. 2, a control device 60 as a control means is provided to control the heat treatment device 10. The control device 60 is connected to the motors 30 and 33 of the vertical drive mechanisms 31 and 34 of the elevating tables 32 and 35 provided in the cassette chambers 5 and 6 and drives the robot 1. It is connected to the driving device 61.
[0018]
Next, the operation of the present apparatus will be described. The first gate valve 20 is opened, the cassette 3 containing the processed sample W is taken out from the cassette chamber 5, and the cassette 3 containing the unprocessed sample W is placed on the sample cooling unit 40 instead.
[0019]
Next, the first gate valve 20 is closed to bring the cassette chamber 5 into the same reduced pressure state or the same atmospheric state as the transfer chamber 2, and then the second gate valve 22 is opened, and the cassette 3 is moved up and down and the robot 1 operates. The sample W in 3 is taken out one by one and is carried one by one into the process chamber 7 or 8 to perform a process involving heating.
[0020]
The processed sample W is taken out of the process chamber 7 or 8 by the robot 1 and transported into the space 41 of the sample cooling unit 40. Next, the lift 32 is raised, and the processed high-temperature sample W placed on the pick 51A of the robot 1 is supported by the bottom 41a.
[0021]
At this time, if the preceding sample W is placed on the bottom portion 41a and has already been cooled to some extent, the preceding sample W is moved by the other pick 51B to the sample cooling unit 40. After that, the picks 51A and 51B are turned by 180 °, and the subsequent sample W on the pick 51A is placed on the bottom 41a as described above.
[0022]
When the pick 51B has loaded the preceding sample W, it is returned to the cassette 3, the unprocessed sample W is taken out from the cassette 3, and the unprocessed sample W is unloaded from the process chambers 7 and 8 hereinafter. Then, the operation of sequentially carrying the unprocessed sample W into the process chambers 7 and 8 and returning the processed sample W to the cassette 3 via the sample cooling unit 40 is repeated.
[0023]
During the processing of the sample W in the cassette 3, the first gate valve 21 of the other cassette chamber 6 is opened to exchange the cassette 4.
The present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made.
[0024]
That is, the above-described embodiment shows an example in which the sample cooling units 40 and 41 are arranged below the cassettes 3 and 4 as described above. However, as shown in FIG. May be arranged. In the description of the other embodiments, the same parts as those in the above-described embodiment are denoted by the same reference numerals, and the duplicate description will be omitted.
[0025]
As shown in FIG. 8, the cassette 3 (4) and the sample cooling unit 40 (41) are arranged side by side on the upper surface of the lifting table 32 (35) (in FIG. 8, the sample cooling unit 40 (41) is located on the near side). It may be arranged. In the description of the other embodiments, the same parts as those in the above-described embodiment are denoted by the same reference numerals, and the duplicate description will be omitted.
[0026]
Further, in the above-described embodiment, an example in which only one sample W is stored in the sample cooling units 40 and 41 is shown. However, as shown in FIG. You may make it carry out sequentially. Furthermore, the sample cooling units 40 and 41 do not necessarily actively cool by a special cooling fluid such as cooling water, but in order to make the cassette chambers 5 and 6 have an inert gas atmosphere, these cassette chambers 5 and 6 are not necessarily cooled. The cooling may be performed by an inert gas supplied to the furnace, or may be simply natural cooling. In the description of the other embodiments, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.
[0027]
【The invention's effect】
Since the sample cooling means is provided adjacent to the sample storage container in the container storage chamber, the sample processed in a heated state in the processing chamber can be directly carried into the container storage chamber and sent to the sample cooling means. As compared with the case where the cooling chamber is provided at a position different from the container accommodating chamber, the transport path of the sample is shorter, the transport time can be shortened, and the throughput can be increased.
[0028]
Also, there is no need to provide a dedicated chamber for accommodating the sample cooling means, and a vertical drive mechanism used when moving the sample into and out of the sample storage container, and a mechanism used when moving the sample into and out of the sample cooling means. It is not necessary to provide a vertical drive mechanism dedicated to the sample cooling means as in the past, nor to provide a vertical movement function on the sample transfer means side, as in the past. And cost reduction can be achieved.
[Brief description of the drawings]
FIG. 1 is a plan sectional view showing an embodiment of the present invention.
FIG. 2 is a sectional view taken along line AA of FIG.
FIG. 3 is an enlarged perspective view of a main part of the present invention in the apparatus shown in FIG.
FIG. 4 is an enlarged sectional view of a sample cooling unit.
FIG. 5 is a plan view of the same.
FIG. 6 is a sectional view taken along line BB of FIG. 5;
FIG. 7 is a sectional plan view showing a first other embodiment of the present invention.
FIG. 8 is a plan sectional view showing a second other embodiment of the present invention.
FIG. 9 is a cross-sectional view showing a modification of the sample cooling unit which is a main part of the present invention.
FIG. 10 is a plan sectional view of a conventional device.
[Explanation of symbols]
W: sample, 1 ... robot (sample transfer means), 2 ... transfer chamber, 3, 4 ... cassette (sample storage container), 5, 6 ... cassette room (container storage chamber), 7, 8 ... process chamber (processing chamber) 10) Heat treatment device, 20, 21 ... First gate valve, 22, 23 ... Second gate valve, 24, 25 ... Third gate valve, 30, 33 ... Motor, 31, 34 ... Vertical movement drive mechanism, 32, 35 ... elevating table, 40, 41 ... sample cooling part (sample cooling means), 41a ... bottom surface, 42 ... groove, 50 ... turning center axis, 51A, 51B ... pick (sample mounting part), 52 ... axis, 60: control device (control means), 61: drive device.

Claims (2)

枚葉状の試料を加熱処理する加熱処理装置であって、
前記試料を載置する試料載置部を有し前記試料を所定位置に搬送するための試料搬送手段と、
この試料搬送手段の搬送領域内に配設され前記試料を格納した試料格納容器を収容すると共に前記試料格納容器を上下動させる上下動駆動機構を備えた容器収容室と、
この容器収容室内の前記試料格納容器から前記試料搬送手段を介して取出された試料を加熱状態で処理する処理室と、
前記容器収容室内の前記試料格納容器に隣接して設けられ前記上下動駆動機構にて移動可能であり、前記処理室で加熱状態で処理された試料を冷却するための試料冷却手段と、
前記処理室で加熱状態で処理された後の試料を前記試料冷却手段を中継した後、試料格納容器に格納するように前記試料搬送手段を制御する制御手段と、
を具備してなることを特徴とする加熱処理装置。A heat treatment apparatus that heat-treats a sheet-like sample,
A sample transporting unit for transporting the sample to a predetermined position, having a sample mounting unit for mounting the sample,
A container storage chamber provided with a vertical drive mechanism for vertically moving the sample storage container while storing the sample storage container disposed in the transfer area of the sample transfer means and storing the sample,
A processing chamber for processing a sample taken out from the sample storage container in the container storage chamber via the sample transfer means in a heated state,
A sample cooling means for cooling a sample processed in a heating state in the processing chamber, the sample cooling means being provided adjacent to the sample storage container in the container storage chamber and movable by the vertical drive mechanism;
After relaying the sample that has been processed in the processing chamber in a heated state to the sample cooling unit, a control unit that controls the sample transport unit to store the sample in a sample storage container,
A heat treatment apparatus comprising: 試料搬送手段は、試料を載置する試料載置部を複数有していることを特徴とする請求項１記載の加熱処理装置。2. The heat treatment apparatus according to claim 1, wherein the sample transport means has a plurality of sample mounting portions for mounting the sample.
JP4355794A 1994-03-15 1994-03-15 Heat treatment equipment Expired - Lifetime JP3560633B2 (en)

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JPH10189685A (en) * 1996-12-26 1998-07-21 Dainippon Screen Mfg Co Ltd Substrate treatment equipment
JP3263684B2 (en) * 1999-07-26 2002-03-04 株式会社ジェーイーエル Substrate transfer robot
US6395648B1 (en) * 2000-02-25 2002-05-28 Wafermasters, Inc. Wafer processing system
KR100625337B1 (en) * 2004-12-28 2006-09-20 동부일렉트로닉스 주식회사 Equipment for manufacturing semiconductor and method using the same
JP2008153690A (en) * 2008-02-21 2008-07-03 Hitachi Ltd Vacuum processing method, and vacuum processing apparatus
WO2011114677A1 (en) * 2010-03-19 2011-09-22 パナソニック株式会社 Plasma-treatment apparatus and plasma-treatment method
JP5550600B2 (en) * 2011-04-13 2014-07-16 パナソニック株式会社 Plasma processing apparatus and plasma processing method
CN107665868B (en) * 2016-07-29 2020-03-31 北京北方华创微电子装备有限公司 Wafer cooling method and wafer cooling apparatus

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