AU2001273259A1 - Differentially-pumped material processing system - Google Patents

Differentially-pumped material processing system

Info

Publication number: AU2001273259A1
Authority: AU; Australia
Prior art keywords: differentially; processing system; material processing; pumped material; pumped
Prior art date: 2000-07-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2001273259A

Inventor

Piero Sferlazzo

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Oerlikon USA Inc

Original Assignee

Unaxis USA Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-07-10

Filing date

2001-07-09

Publication date

2002-01-21

2001-07-09 Application filed by Unaxis USA Inc filed Critical Unaxis USA Inc

2002-01-21 Publication of AU2001273259A1 publication Critical patent/AU2001273259A1/en

Status Abandoned legal-status Critical Current

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
- C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)

AU2001273259A 2000-07-10 2001-07-09 Differentially-pumped material processing system Abandoned AU2001273259A1 (en)

Applications Claiming Priority (7)

Application Number	Priority Date	Filing Date	Title
US21704900P	2000-07-10	2000-07-10
US60217049		2000-07-10
US26611401P	2001-02-02	2001-02-02
US60266114		2001-02-02
US09/840,393 US6495010B2 (en)	2000-07-10	2001-04-23	Differentially-pumped material processing system
US09840393		2001-04-23
PCT/US2001/021516 WO2002005324A2 (en)	2000-07-10	2001-07-09	Differentially-pumped material processing system

Publications (1)

Publication Number	Publication Date
AU2001273259A1 true AU2001273259A1 (en)	2002-01-21

Family

ID=27396362

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2001273259A Abandoned AU2001273259A1 (en)	2000-07-10	2001-07-09	Differentially-pumped material processing system

Country Status (6)

Country	Link
US (1)	US6495010B2 (en)
EP (1)	EP1301650A2 (en)
JP (1)	JP2004524435A (en)
CN (1)	CN1208494C (en)
AU (1)	AU2001273259A1 (en)
WO (1)	WO2002005324A2 (en)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6669824B2 (en) *	2000-07-10	2003-12-30	Unaxis Usa, Inc.	Dual-scan thin film processing system
US6635154B2 (en) *	2001-11-03	2003-10-21	Intevac, Inc.	Method and apparatus for multi-target sputtering
JP2003257357A (en) *	2002-03-01	2003-09-12	Nissin Electric Co Ltd	Particle injection device
US7879201B2 (en) *	2003-08-11	2011-02-01	Veeco Instruments Inc.	Method and apparatus for surface processing of a substrate
US9206500B2 (en) *	2003-08-11	2015-12-08	Boris Druz	Method and apparatus for surface processing of a substrate using an energetic particle beam
US7244474B2 (en) *	2004-03-26	2007-07-17	Applied Materials, Inc.	Chemical vapor deposition plasma process using an ion shower grid
US7695590B2 (en)	2004-03-26	2010-04-13	Applied Materials, Inc.	Chemical vapor deposition plasma reactor having plural ion shower grids
US20060054494A1 (en) *	2004-09-16	2006-03-16	Veeco Instruments Inc.	Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films
CN1891848A (en) *	2005-07-01	2007-01-10	鸿富锦精密工业（深圳）有限公司	Optical coating device
US20070151842A1 (en) *	2005-12-15	2007-07-05	Fluens Corporation	Apparatus for reactive sputtering
US20070209932A1 (en) *	2006-03-10	2007-09-13	Veeco Instruments Inc.	Sputter deposition system and methods of use
US20100330787A1 (en) *	2006-08-18	2010-12-30	Piero Sferlazzo	Apparatus and method for ultra-shallow implantation in a semiconductor device
US8092599B2 (en) *	2007-07-10	2012-01-10	Veeco Instruments Inc.	Movable injectors in rotating disc gas reactors
WO2009044473A1 (en) *	2007-10-04	2009-04-09	Canon Anelva Corporation	High frequency sputtering device
US8347814B2 (en) *	2008-01-22	2013-01-08	Raytheon Canada Limited	Method and apparatus for coating a curved surface
US20090258151A1 (en) *	2008-04-10	2009-10-15	Raytheon Company	Method and Apparatus for Coating Curved Surfaces
US8398776B2 (en) *	2008-05-12	2013-03-19	Raytheon Canada Limited	Method and apparatus for supporting workpieces in a coating apparatus
CN102099923B (en)	2008-06-11	2016-04-27	因特瓦克公司	The solar cell injected is used to make
US8246748B2 (en) *	2008-07-09	2012-08-21	Raytheon Canada Limited	Method and apparatus for coating surfaces
US20100221426A1 (en) *	2009-03-02	2010-09-02	Fluens Corporation	Web Substrate Deposition System
US8749053B2 (en)	2009-06-23	2014-06-10	Intevac, Inc.	Plasma grid implant system for use in solar cell fabrications
US20110020623A1 (en) *	2009-07-22	2011-01-27	Raytheon Company	Method and Apparatus for Repairing an Optical Component Substrate Through Coating
WO2011111134A1 (en) *	2010-03-09	2011-09-15	シャープ株式会社	Vapor deposition mask, vapor deposition apparatus and vapor deposition method
WO2011119414A1 (en) *	2010-03-22	2011-09-29	Luxottica Us Holdings Corporation	Ion beam assisted deposition of ophthalmic lens coatings
US8758580B2 (en)	2010-08-23	2014-06-24	Vaeco Inc.	Deposition system with a rotating drum
CN103237916B (en) *	2010-12-03	2015-07-22	夏普株式会社	Deposition apparatus and recovery apparatus
US9324598B2 (en)	2011-11-08	2016-04-26	Intevac, Inc.	Substrate processing system and method
TWI570745B (en)	2012-12-19	2017-02-11	因特瓦克公司	Grid for plasma ion implant
US20140262749A1 (en) *	2013-03-14	2014-09-18	Intermolecular, Inc.	Methods of Plasma Surface Treatment in a PVD Chamber
SG11201606084RA (en)	2014-01-27	2016-08-30	Veeco Instr Inc	Wafer carrier having retention pockets with compound radii for chemical vapor deposition systems
CN109477219B (en) *	2016-09-13	2021-01-12	应用材料公司	Single oxide metal deposition chamber
EP3366804B1 (en) *	2017-02-22	2022-05-11	Satisloh AG	Box coating apparatus for vacuum coating of substrates, in particular spectacle lenses
JP7039234B2 (en) *	2017-09-29	2022-03-22	芝浦メカトロニクス株式会社	Film forming equipment
US20190189465A1 (en) *	2017-12-18	2019-06-20	Applied Materials, Inc.	Methods and apparatus for physical vapor deposition
JP7134009B2 (en) *	2018-07-31	2022-09-09	東京エレクトロン株式会社	Film forming apparatus and film forming method

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1217685A (en)	1967-06-05	1970-12-31	Smiths Industries Ltd	Improvements in or relating to methods and apparatus for sputtering of materials
US3635811A (en)	1967-11-06	1972-01-18	Warner Lambert Co	Method of applying a coating
US3829373A (en)	1973-01-12	1974-08-13	Coulter Information Systems	Thin film deposition apparatus using segmented target means
US4217855A (en)	1974-10-23	1980-08-19	Futaba Denshi Kogyo K.K.	Vaporized-metal cluster ion source and ionized-cluster beam deposition device
AU507748B2 (en)	1976-06-10	1980-02-28	University Of Sydney, The	Reactive sputtering
JPS5399762A (en)	1977-02-12	1978-08-31	Futaba Denshi Kogyo Kk	Device for producing compound semiconductor film
US4151059A (en)	1977-12-27	1979-04-24	Coulter Stork U.S.A., Inc.	Method and apparatus for sputtering multiple cylinders simultaneously
US4142958A (en)	1978-04-13	1979-03-06	Litton Systems, Inc.	Method for fabricating multi-layer optical films
CA1155798A (en)	1981-03-30	1983-10-25	Shmuel Maniv	Reactive deposition method and apparatus
US4424103A (en)	1983-04-04	1984-01-03	Honeywell Inc.	Thin film deposition
EP0122092A3 (en)	1983-04-06	1985-07-10	General Engineering Radcliffe Limited	Vacuum coating apparatus
JPS6052574A (en)	1983-09-02	1985-03-25	Hitachi Ltd	Continuous sputtering device
JPS60141869A (en)	1983-12-29	1985-07-26	Nissin Electric Co Ltd	Method and device for forming film
GB8408023D0 (en)	1984-03-28	1984-05-10	Gen Eng Radcliffe Ltd	Vacuum coating apparatus
US4795656A (en)	1986-08-26	1989-01-03	Kozo Iizuka, Director-General, Agency Of Industrial Science And Technology	Cluster ion plating method for producing electrically conductive carbon film
US4777908A (en)	1986-11-26	1988-10-18	Optical Coating Laboratory, Inc.	System and method for vacuum deposition of thin films
US4793908A (en)	1986-12-29	1988-12-27	Rockwell International Corporation	Multiple ion source method and apparatus for fabricating multilayer optical films
US5798027A (en)	1988-02-08	1998-08-25	Optical Coating Laboratory, Inc.	Process for depositing optical thin films on both planar and non-planar substrates
GB2252333B (en)	1991-01-29	1995-07-19	Spectra Physics Scanning Syst	Improved scanner window
US5356673A (en)	1991-03-18	1994-10-18	Jet Process Corporation	Evaporation system and method for gas jet deposition of thin film materials
JPH05170448A (en) *	1991-12-26	1993-07-09	Matsushita Electric Ind Co Ltd	Production of thin ceramic film
US5240583A (en)	1992-01-14	1993-08-31	Honeywell Inc.	Apparatus to deposit multilayer films
JPH0641733A (en) *	1992-07-28	1994-02-15	Matsushita Electric Ind Co Ltd	Reactive sputtering device
JPH06220621A (en) *	1993-01-26	1994-08-09	Mitsubishi Electric Corp	Device for forming film by sputtering
JPH0790558A (en) *	1993-09-14	1995-04-04	Toshiba Corp	Formation of thin film
JP3452617B2 (en)	1993-12-10	2003-09-29	真空冶金株式会社	Gas deposition equipment
JP2671835B2 (en) *	1994-10-20	1997-11-05	日本電気株式会社	Sputtering apparatus and method for manufacturing semiconductor device using the apparatus
US5571332A (en)	1995-02-10	1996-11-05	Jet Process Corporation	Electron jet vapor deposition system
DE19513918C1 (en) *	1995-04-12	1996-11-07	Fraunhofer Ges Forschung	Method of coating submicrometer structures for highly integrated circuits
JPH1026698A (en) *	1996-07-12	1998-01-27	Nikon Corp	Device for forming thin film under vacuum and method for manufacturing reflector
JPH10219442A (en) *	1996-12-05	1998-08-18	Tokyo Electron Ltd	Sputtering apparatus
JPH11199377A (en) *	1998-01-07	1999-07-27	Mega Chips Corp	Formation of crystalline thin membrane
JP3081844B2 (en) *	1998-08-26	2000-08-28	日本電信電話株式会社	Optical filter manufacturing method

2001
- 2001-04-23 US US09/840,393 patent/US6495010B2/en not_active Expired - Fee Related
- 2001-07-09 AU AU2001273259A patent/AU2001273259A1/en not_active Abandoned
- 2001-07-09 JP JP2002509089A patent/JP2004524435A/en active Pending
- 2001-07-09 CN CN01814637.6A patent/CN1208494C/en not_active Expired - Fee Related
- 2001-07-09 EP EP01952518A patent/EP1301650A2/en not_active Withdrawn
- 2001-07-09 WO PCT/US2001/021516 patent/WO2002005324A2/en active Application Filing

Also Published As

Publication number	Publication date
US6495010B2 (en)	2002-12-17
WO2002005324A3 (en)	2002-06-20
US20020003086A1 (en)	2002-01-10
JP2004524435A (en)	2004-08-12
CN1208494C (en)	2005-06-29
CN1449455A (en)	2003-10-15
WO2002005324A2 (en)	2002-01-17
EP1301650A2 (en)	2003-04-16

Publication	Publication Date	Title
AU2001273259A1 (en)	2002-01-21	Differentially-pumped material processing system
AU4435201A (en)	2001-10-15	Watermarked material processing
AU2001259377A1 (en)	2001-12-17	Material transport system
AU2001268432A1 (en)	2002-01-02	Video processing system
AU2001293671A1 (en)	2002-01-08	Methods for processing crustacean material
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AU2001228692A1 (en)	2001-08-27	Signal processing technique
AU2001268656A1 (en)	2002-01-21	Automated processing system
AU2001294835A1 (en)	2002-04-15	Video processing
AU2001253513A1 (en)	2001-11-12	Substrate processing system
AU4262601A (en)	2001-10-15	Image processing
AU2001288233A1 (en)	2002-02-18	Flexible preamble processing
AU2001279535A1 (en)	2002-05-30	Bone-regeneration material
AU6408601A (en)	2001-12-24	A distributed processing system
AU2993200A (en)	2000-08-29	Multiple processing system
AU2001241521A1 (en)	2001-09-03	Wafer processing system
AU2001284775A1 (en)	2002-02-25	Anti-balling system
AUPR062500A0 (en)	2000-11-02	Message processing
AU2001252656A1 (en)	2001-11-12	Material selling system
AU2001230253A1 (en)	2001-08-14	Processing method
AU2555699A (en)	1999-08-16	Processing unit
AU4682799A (en)	1999-12-30	Processing system
AU2001289885A1 (en)	2002-04-02	Air-preparation system
AU2001274345A1 (en)	2002-01-21	Processing an object
AU2002222256A1 (en)	2002-07-01	Video processing system