ATE549795T1 - Oberflächenwellen-bauelement und verfahren zu seiner herstellung - Google Patents
Oberflächenwellen-bauelement und verfahren zu seiner herstellungInfo
- Publication number
- ATE549795T1 ATE549795T1 AT03291298T AT03291298T ATE549795T1 AT E549795 T1 ATE549795 T1 AT E549795T1 AT 03291298 T AT03291298 T AT 03291298T AT 03291298 T AT03291298 T AT 03291298T AT E549795 T1 ATE549795 T1 AT E549795T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- electrode
- surface wave
- wave component
- insulating layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 238000010897 surface acoustic wave method Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02929—Means for compensation or elimination of undesirable effects of ageing changes of characteristics, e.g. electro-acousto-migration
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
- H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
- Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002215614 | 2002-07-24 | ||
JP2003041480A JP3841053B2 (ja) | 2002-07-24 | 2003-02-19 | 弾性表面波装置及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE549795T1 true ATE549795T1 (de) | 2012-03-15 |
Family
ID=31190289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03291298T ATE549795T1 (de) | 2002-07-24 | 2003-05-30 | Oberflächenwellen-bauelement und verfahren zu seiner herstellung |
Country Status (5)
Country | Link |
---|---|
US (3) | US7230365B2 (de) |
EP (4) | EP2288025B1 (de) |
JP (1) | JP3841053B2 (de) |
KR (1) | KR100681692B1 (de) |
AT (1) | ATE549795T1 (de) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3841053B2 (ja) * | 2002-07-24 | 2006-11-01 | 株式会社村田製作所 | 弾性表面波装置及びその製造方法 |
US7642693B2 (en) * | 2003-05-15 | 2010-01-05 | National Institute Of Advanced Industrial Science And Technology | Wurtzite thin film, laminate containing wurtzite crystalline layer and their manufacturing methods |
JP2005117151A (ja) * | 2003-10-03 | 2005-04-28 | Murata Mfg Co Ltd | 弾性表面波装置の製造方法及び弾性表面波装置 |
WO2005034347A1 (ja) * | 2003-10-03 | 2005-04-14 | Murata Manufacturing Co., Ltd. | 弾性表面波装置 |
JP2005176152A (ja) * | 2003-12-15 | 2005-06-30 | Alps Electric Co Ltd | 弾性表面波素子及びその製造方法 |
US7737603B2 (en) * | 2003-12-16 | 2010-06-15 | Murata Manufacturiing Co., Ltd. | Boundary acoustic wave device |
CN100563100C (zh) | 2004-03-02 | 2009-11-25 | 株式会社村田制作所 | 表面声波装置 |
WO2005088836A1 (ja) * | 2004-03-12 | 2005-09-22 | Murata Manufacturing Co., Ltd. | 弾性表面波装置 |
JP4483865B2 (ja) | 2004-07-26 | 2010-06-16 | 株式会社村田製作所 | 弾性表面波装置 |
JP4359551B2 (ja) * | 2004-10-08 | 2009-11-04 | アルプス電気株式会社 | 弾性表面波素子の製造方法 |
JP4657002B2 (ja) * | 2005-05-12 | 2011-03-23 | 信越化学工業株式会社 | 複合圧電基板 |
EP1988630A4 (de) * | 2006-02-20 | 2010-03-24 | Murata Manufacturing Co | Elastische oberflächenwellenvorrichtung |
WO2007099742A1 (ja) * | 2006-03-02 | 2007-09-07 | Murata Manufacturing Co., Ltd. | 弾性波装置及びその製造方法 |
DE102006019961B4 (de) * | 2006-04-28 | 2008-01-10 | Epcos Ag | Elektroakustisches Bauelement |
WO2007145056A1 (ja) * | 2006-06-16 | 2007-12-21 | Murata Manufacturing Co., Ltd. | 弾性表面波装置 |
CN101485086B (zh) * | 2006-07-05 | 2012-06-13 | 株式会社村田制作所 | 声表面波装置 |
EP2056456B1 (de) * | 2006-10-12 | 2013-03-13 | Murata Manufacturing Co. Ltd. | Elastische grenzwelleneinrichtung |
EP2099129A4 (de) * | 2006-12-27 | 2014-03-26 | Murata Manufacturing Co | Oberflächenwellenbauelement |
WO2008108215A1 (ja) * | 2007-03-06 | 2008-09-12 | Murata Manufacturing Co., Ltd. | 弾性境界波装置 |
CN101682308B (zh) | 2007-06-06 | 2013-07-17 | 株式会社村田制作所 | 弹性表面波装置 |
CN101796723B (zh) | 2007-10-30 | 2013-07-17 | 太阳诱电株式会社 | 弹性波元件、双工器、通信模块、以及通信装置 |
JP2009147818A (ja) * | 2007-12-17 | 2009-07-02 | Fujitsu Ltd | 弾性波素子、フィルタ素子、通信モジュール、および通信装置 |
JP5110091B2 (ja) * | 2007-12-20 | 2012-12-26 | 株式会社村田製作所 | 弾性表面波装置 |
WO2009090715A1 (ja) | 2008-01-17 | 2009-07-23 | Murata Manufacturing Co., Ltd. | 弾性表面波装置 |
WO2009090714A1 (ja) | 2008-01-17 | 2009-07-23 | Murata Manufacturing Co., Ltd. | 弾性表面波装置 |
CN102017407B (zh) * | 2008-04-30 | 2014-03-19 | 株式会社村田制作所 | 弹性边界波装置 |
JP2010011440A (ja) * | 2008-05-30 | 2010-01-14 | Hitachi Ltd | 弾性波装置及びそれを用いた高周波フィルタ |
JP2010045533A (ja) | 2008-08-11 | 2010-02-25 | Fujitsu Ltd | 弾性波デバイスの製造方法 |
JP2010109894A (ja) | 2008-10-31 | 2010-05-13 | Fujitsu Ltd | 弾性波フィルタ、デュープレクサ、通信モジュール、および通信装置 |
DE102008062605B4 (de) | 2008-12-17 | 2018-10-18 | Snaptrack, Inc. | Bauelement, welches mit akustischen Wellen arbeitet, und Verfahren zu dessen Herstellung |
JP4943462B2 (ja) * | 2009-02-27 | 2012-05-30 | 太陽誘電株式会社 | 弾性波デバイス、デュープレクサ、通信モジュール、通信装置、弾性波デバイスの製造方法 |
CN102334290B (zh) * | 2009-03-04 | 2014-09-17 | 株式会社村田制作所 | 表面声波元件及其制造方法 |
US8294330B1 (en) | 2009-03-31 | 2012-10-23 | Triquint Semiconductor, Inc. | High coupling, low loss saw filter and associated method |
JP2011041134A (ja) * | 2009-08-17 | 2011-02-24 | Taiyo Yuden Co Ltd | 弾性波デバイスおよびその製造方法 |
US8044553B2 (en) * | 2010-02-22 | 2011-10-25 | Triquint Semiconductor, Inc. | Temperature compensated surface acoustic wave device and method having buried interdigital transducers for providing an improved insertion loss and quality factor |
JP2011182117A (ja) * | 2010-02-26 | 2011-09-15 | Taiyo Yuden Co Ltd | 弾性波デバイスおよびその製造方法 |
DE102010014919B4 (de) | 2010-04-14 | 2015-07-02 | Epcos Ag | Verfahren zur Herstellung einer dielektrischen Schicht auf einem Bauelement |
US8378553B1 (en) * | 2010-07-01 | 2013-02-19 | Triquint Semiconductor, Inc. | Buried idt SAW filter having low propagation loss |
WO2012020649A1 (ja) * | 2010-08-10 | 2012-02-16 | 株式会社村田製作所 | 弾性表面波デバイス |
DE102010041973B4 (de) * | 2010-10-05 | 2015-04-16 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Bauelement auf der Basis akustischer Oberflächenwellen |
CN103119847B (zh) | 2010-12-28 | 2016-01-20 | 京瓷株式会社 | 弹性波元件及使用该弹性波元件的弹性波装置 |
DE112011104653B4 (de) * | 2010-12-29 | 2016-07-21 | Murata Manufacturing Co., Ltd. | Oberflächenschallwellen-Bauelement |
US8723392B2 (en) * | 2011-07-15 | 2014-05-13 | International Business Machines Corporation | Saw filter having planar barrier layer and method of making |
US8552819B2 (en) | 2011-10-26 | 2013-10-08 | Triquint Semiconductor, Inc. | High coupling, low loss saw filter and associated method |
JP5976096B2 (ja) * | 2012-03-02 | 2016-08-23 | 太陽誘電株式会社 | 弾性波フィルタ |
US9236849B2 (en) | 2012-04-19 | 2016-01-12 | Triquint Semiconductor, Inc. | High coupling, low loss PBAW device and associated method |
JP6304369B2 (ja) * | 2014-03-13 | 2018-04-04 | 株式会社村田製作所 | 弾性波装置 |
US10648868B2 (en) * | 2014-12-24 | 2020-05-12 | Citizen Watch Co., Ltd. | Surface acoustic wave device |
CN104868873A (zh) * | 2015-05-27 | 2015-08-26 | 上海交通大学 | 一种多层复合结构声表面波器件基底 |
JP6601503B2 (ja) * | 2015-10-23 | 2019-11-06 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
KR102095213B1 (ko) * | 2016-06-07 | 2020-03-31 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
WO2018135489A1 (ja) | 2017-01-17 | 2018-07-26 | 株式会社村田製作所 | 弾性波装置、高周波フロントエンド回路及び通信装置 |
US11522515B2 (en) | 2017-03-16 | 2022-12-06 | Skyworks Solutions, Inc. | Acoustic wave device including interdigital electrodes covered by silicon oxynitride film |
US10615772B2 (en) * | 2017-06-30 | 2020-04-07 | Texas Instruments Incorporated | Acoustic wave resonators having Fresnel surfaces |
US10686425B2 (en) | 2017-06-30 | 2020-06-16 | Texas Instruments Incorporated | Bulk acoustic wave resonators having convex surfaces, and methods of forming the same |
US10622966B2 (en) | 2017-07-26 | 2020-04-14 | Texas Instruments Incorporated | Bulk acoustic wave resonators having a phononic crystal acoustic mirror |
US10855251B2 (en) | 2017-08-08 | 2020-12-01 | Texas Instruments Incorporated | Unreleased plane acoustic wave resonators |
JP2019114986A (ja) * | 2017-12-25 | 2019-07-11 | 株式会社村田製作所 | 弾性波装置 |
JP7175503B2 (ja) * | 2019-04-05 | 2022-11-21 | 三安ジャパンテクノロジー株式会社 | 表面弾性波デバイス及びその製造方法 |
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JPH09223944A (ja) | 1995-12-13 | 1997-08-26 | Fujitsu Ltd | 弾性表面波素子及びその製造方法 |
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JP3458573B2 (ja) * | 1996-01-16 | 2003-10-20 | 株式会社村田製作所 | 端面反射型表面波装置の製造方法 |
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KR19980013868A (ko) * | 1996-08-05 | 1998-05-15 | 우덕창 | 박막 압전 소자(thin film type piezolectric element) |
JP3781435B2 (ja) | 1997-05-08 | 2006-05-31 | 株式会社東芝 | 弾性境界波デバイス及びその製造方法 |
JP3470031B2 (ja) | 1997-12-22 | 2003-11-25 | 京セラ株式会社 | 弾性表面波装置の製造方法 |
US6336717B1 (en) * | 1998-06-08 | 2002-01-08 | Seiko Epson Corporation | Ink jet recording head and ink jet recording apparatus |
JP2000269771A (ja) | 1999-03-12 | 2000-09-29 | Nec Corp | 弾性表面波デバイス及びその製造方法 |
JP3391309B2 (ja) | 1999-09-02 | 2003-03-31 | 株式会社村田製作所 | 表面波装置及び通信機装置 |
JP2001148618A (ja) | 1999-11-18 | 2001-05-29 | Nec Corp | 弾性表面波装置 |
CN1159843C (zh) * | 1999-11-30 | 2004-07-28 | Tdk株式会社 | 表面声波器件及其制造工艺 |
JP3414371B2 (ja) * | 2000-07-31 | 2003-06-09 | 株式会社村田製作所 | 弾性表面波装置及びその製造方法 |
JP2004507960A (ja) * | 2000-08-31 | 2004-03-11 | ソーテック・インコーポレーテッド | 圧電性基板の非対称最適カットを用いた弾性表面波デバイス |
JP3521864B2 (ja) * | 2000-10-26 | 2004-04-26 | 株式会社村田製作所 | 弾性表面波素子 |
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JP4060090B2 (ja) * | 2002-02-15 | 2008-03-12 | 沖電気工業株式会社 | 弾性表面波素子 |
JP3841053B2 (ja) * | 2002-07-24 | 2006-11-01 | 株式会社村田製作所 | 弾性表面波装置及びその製造方法 |
-
2003
- 2003-02-19 JP JP2003041480A patent/JP3841053B2/ja not_active Expired - Lifetime
- 2003-05-29 KR KR1020030034334A patent/KR100681692B1/ko active IP Right Grant
- 2003-05-30 EP EP10178784.4A patent/EP2288025B1/de not_active Expired - Lifetime
- 2003-05-30 EP EP10178782A patent/EP2288024B1/de not_active Expired - Lifetime
- 2003-05-30 AT AT03291298T patent/ATE549795T1/de active
- 2003-05-30 EP EP10178787A patent/EP2288026A1/de not_active Withdrawn
- 2003-05-30 EP EP03291298A patent/EP1391988B1/de not_active Expired - Lifetime
- 2003-05-30 US US10/448,061 patent/US7230365B2/en not_active Expired - Lifetime
-
2007
- 2007-02-14 US US11/674,928 patent/US7411334B2/en not_active Expired - Lifetime
- 2007-05-03 US US11/743,793 patent/US7418772B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1391988A3 (de) | 2004-06-09 |
EP2288024B1 (de) | 2012-07-04 |
EP1391988B1 (de) | 2012-03-14 |
EP2288024A1 (de) | 2011-02-23 |
US7230365B2 (en) | 2007-06-12 |
US7411334B2 (en) | 2008-08-12 |
EP2288025A1 (de) | 2011-02-23 |
KR100681692B1 (ko) | 2007-02-09 |
KR20040010108A (ko) | 2004-01-31 |
US20040164644A1 (en) | 2004-08-26 |
EP1391988A2 (de) | 2004-02-25 |
US7418772B2 (en) | 2008-09-02 |
US20070132339A1 (en) | 2007-06-14 |
EP2288025B1 (de) | 2016-01-06 |
EP2288026A1 (de) | 2011-02-23 |
JP3841053B2 (ja) | 2006-11-01 |
US20070214622A1 (en) | 2007-09-20 |
JP2004112748A (ja) | 2004-04-08 |
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