ATE527577T1 - Lichtempfindliche polymerzusammensetzung, prozess zur erzeugung einer struktur und elektronisches teil - Google Patents
Lichtempfindliche polymerzusammensetzung, prozess zur erzeugung einer struktur und elektronisches teilInfo
- Publication number
- ATE527577T1 ATE527577T1 AT04807191T AT04807191T ATE527577T1 AT E527577 T1 ATE527577 T1 AT E527577T1 AT 04807191 T AT04807191 T AT 04807191T AT 04807191 T AT04807191 T AT 04807191T AT E527577 T1 ATE527577 T1 AT E527577T1
- Authority
- AT
- Austria
- Prior art keywords
- polymer composition
- photosensitive polymer
- generating
- group
- electronic part
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/138—Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/10—Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004006715 | 2004-01-14 | ||
PCT/JP2004/018832 WO2005069075A1 (ja) | 2004-01-14 | 2004-12-16 | 感光性重合体組成物、パターンの製造法及び電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE527577T1 true ATE527577T1 (de) | 2011-10-15 |
Family
ID=34792153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04807191T ATE527577T1 (de) | 2004-01-14 | 2004-12-16 | Lichtempfindliche polymerzusammensetzung, prozess zur erzeugung einer struktur und elektronisches teil |
Country Status (8)
Country | Link |
---|---|
US (2) | US8231959B2 (de) |
EP (1) | EP1708026B1 (de) |
JP (1) | JP4207960B2 (de) |
KR (1) | KR101122446B1 (de) |
CN (2) | CN1902548A (de) |
AT (1) | ATE527577T1 (de) |
TW (2) | TWI439807B (de) |
WO (1) | WO2005069075A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4726730B2 (ja) * | 2006-07-27 | 2011-07-20 | 旭化成イーマテリアルズ株式会社 | ポジ型感光性樹脂組成物 |
EP1970761B1 (de) * | 2007-03-14 | 2012-02-29 | FUJIFILM Corporation | Lichtempfindliche Zusammensetzung und Herstellungsverfahren für ein gehärtetes Reliefmuster |
KR101522583B1 (ko) * | 2007-06-05 | 2015-05-22 | 닛산 가가쿠 고교 가부시키 가이샤 | 포지티브형 감광성 수지 조성물 및 폴리히드록시아미드 수지 |
KR101759962B1 (ko) * | 2008-07-09 | 2017-07-20 | 닛산 가가쿠 고교 가부시키 가이샤 | 포지티브형 감광성 수지 조성물 및 폴리히드록시아미드 수지 |
JP5446203B2 (ja) * | 2008-10-15 | 2014-03-19 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
WO2016117347A1 (ja) * | 2015-01-23 | 2016-07-28 | 日立化成デュポンマイクロシステムズ株式会社 | ポジ型感光性樹脂組成物、パターン硬化膜の製造方法、パターン硬化膜及び電子部品 |
KR102146294B1 (ko) * | 2017-06-30 | 2020-08-21 | 스미또모 베이크라이트 가부시키가이샤 | 감광성 수지 조성물, 수지막 및 전자 장치 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2157933B1 (de) | 1971-10-26 | 1980-04-18 | Licentia Gmbh | |
NL177718C (nl) * | 1973-02-22 | 1985-11-01 | Siemens Ag | Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren. |
JPS5839437B2 (ja) | 1978-08-24 | 1983-08-30 | 岩崎通信機株式会社 | ボタン電話装置における本電話機接続方式 |
JPS57170929A (en) | 1982-03-19 | 1982-10-21 | Hitachi Ltd | Photosensitive polymeric composition |
JPS6037550A (ja) | 1983-08-09 | 1985-02-26 | Mitsubishi Electric Corp | ポジ型感光性耐熱材料 |
EP0291779B1 (de) | 1987-05-18 | 1994-07-27 | Siemens Aktiengesellschaft | Wärmebeständige Positivresists und Verfahren zur Herstellung wärmebeständiger Reliefstrukturen |
JP3011457B2 (ja) | 1990-11-30 | 2000-02-21 | 株式会社東芝 | 感光性樹脂組成物 |
JP2787531B2 (ja) * | 1993-02-17 | 1998-08-20 | 信越化学工業株式会社 | 感光性樹脂組成物及び電子部品用保護膜 |
JP3207352B2 (ja) | 1996-05-13 | 2001-09-10 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物 |
JP3846103B2 (ja) | 1999-04-16 | 2006-11-15 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、レリーフパターンの製造法及び電子部品 |
JP4154086B2 (ja) * | 1999-07-29 | 2008-09-24 | 日立化成工業株式会社 | 感光性重合体組成物、パターンの製造法及び電子部品 |
JP4288796B2 (ja) * | 1999-10-29 | 2009-07-01 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物、パターンの製造法及び電子部品 |
JP3799957B2 (ja) | 2000-04-28 | 2006-07-19 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性重合体組成物、パターンの製造法及び電子部品 |
JP4130297B2 (ja) * | 2000-09-14 | 2008-08-06 | 旭化成エレクトロニクス株式会社 | イミドフェノール化合物 |
EP1331517B1 (de) | 2000-10-31 | 2010-08-18 | Sumitomo Bakelite Co., Ltd. | Positive lichtempfindliche harzzusammensetzung, prozess zu ihrer herstellung und halbleiterbauelemente |
JP2002169286A (ja) | 2000-11-30 | 2002-06-14 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物、パターンの製造法及び電子部品 |
JP2002169283A (ja) * | 2000-11-30 | 2002-06-14 | Hitachi Chemical Dupont Microsystems Ltd | 感光性重合体組成物、パターンの製造法及び電子部品 |
JP4082041B2 (ja) | 2001-02-26 | 2008-04-30 | 東レ株式会社 | ポジ型感光性樹脂前駆体組成物及びそれを用いた電子部品ならびに表示装置 |
TW574620B (en) | 2001-02-26 | 2004-02-01 | Toray Industries | Precursor composition of positive photosensitive resin and display device using it |
JP4181791B2 (ja) * | 2002-04-08 | 2008-11-19 | 本州化学工業株式会社 | ヒドロキシメチル置換多官能フェノール類 |
TWI287028B (en) * | 2002-05-17 | 2007-09-21 | Hitachi Chem Dupont Microsys | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment |
-
2004
- 2004-12-16 KR KR1020067015312A patent/KR101122446B1/ko active IP Right Grant
- 2004-12-16 CN CNA2004800401285A patent/CN1902548A/zh active Pending
- 2004-12-16 CN CN201210272318.6A patent/CN102854745B/zh active Active
- 2004-12-16 AT AT04807191T patent/ATE527577T1/de not_active IP Right Cessation
- 2004-12-16 JP JP2005516974A patent/JP4207960B2/ja active Active
- 2004-12-16 EP EP04807191A patent/EP1708026B1/de not_active Not-in-force
- 2004-12-16 WO PCT/JP2004/018832 patent/WO2005069075A1/ja active Application Filing
- 2004-12-16 US US10/585,738 patent/US8231959B2/en active Active
- 2004-12-23 TW TW093140217A patent/TWI439807B/zh active
- 2004-12-23 TW TW101122323A patent/TWI451195B/zh active
-
2012
- 2012-06-21 US US13/528,989 patent/US8852726B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP1708026B1 (de) | 2011-10-05 |
US20120263920A1 (en) | 2012-10-18 |
KR20070007066A (ko) | 2007-01-12 |
US8231959B2 (en) | 2012-07-31 |
US8852726B2 (en) | 2014-10-07 |
TWI439807B (zh) | 2014-06-01 |
CN1902548A (zh) | 2007-01-24 |
TW200523679A (en) | 2005-07-16 |
TWI451195B (zh) | 2014-09-01 |
TW201243498A (en) | 2012-11-01 |
EP1708026A4 (de) | 2011-02-02 |
WO2005069075A1 (ja) | 2005-07-28 |
KR101122446B1 (ko) | 2012-02-29 |
CN102854745B (zh) | 2015-05-27 |
US20080220222A1 (en) | 2008-09-11 |
CN102854745A (zh) | 2013-01-02 |
JP4207960B2 (ja) | 2009-01-14 |
EP1708026A1 (de) | 2006-10-04 |
JPWO2005069075A1 (ja) | 2007-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |