ATE519227T1 - Zusammengesetzte led-module - Google Patents

Zusammengesetzte led-module

Info

Publication number
ATE519227T1
ATE519227T1 AT05804145T AT05804145T ATE519227T1 AT E519227 T1 ATE519227 T1 AT E519227T1 AT 05804145 T AT05804145 T AT 05804145T AT 05804145 T AT05804145 T AT 05804145T AT E519227 T1 ATE519227 T1 AT E519227T1
Authority
AT
Austria
Prior art keywords
light emitting
emitting diode
diode unit
led modules
composite led
Prior art date
Application number
AT05804145T
Other languages
English (en)
Inventor
Lingli Wang
Os Koen Van
Johannes Ansems
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of ATE519227T1 publication Critical patent/ATE519227T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
AT05804145T 2004-11-19 2005-11-15 Zusammengesetzte led-module ATE519227T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04105910 2004-11-19
PCT/IB2005/053756 WO2006054236A2 (en) 2004-11-19 2005-11-15 Composite led modules

Publications (1)

Publication Number Publication Date
ATE519227T1 true ATE519227T1 (de) 2011-08-15

Family

ID=36407519

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05804145T ATE519227T1 (de) 2004-11-19 2005-11-15 Zusammengesetzte led-module

Country Status (8)

Country Link
US (1) US8017955B2 (de)
EP (1) EP1815534B1 (de)
JP (1) JP2008521239A (de)
KR (1) KR101170401B1 (de)
CN (1) CN101438408B (de)
AT (1) ATE519227T1 (de)
TW (1) TW200633265A (de)
WO (1) WO2006054236A2 (de)

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US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
DE102007011637A1 (de) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Lichtemissionsvorrichtung
DE102007041896A1 (de) * 2007-09-04 2009-03-05 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
TWI404230B (zh) * 2008-07-15 2013-08-01 Epileds Technologies Inc Light emitting diodes with multi-layer stacking structure
DE102008047579B4 (de) * 2008-09-17 2020-02-06 Osram Opto Semiconductors Gmbh Leuchtmittel
US8125344B2 (en) 2008-10-13 2012-02-28 Apple Inc. Portable computer battery indicator
US9425172B2 (en) 2008-10-24 2016-08-23 Cree, Inc. Light emitter array
CN101859757B (zh) * 2009-04-07 2014-04-09 裕星企业有限公司 堆栈发光二极管芯片结构及其制造方法
US8319247B2 (en) 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) * 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
JP2011249460A (ja) * 2010-05-25 2011-12-08 Meijo University 白色発光ダイオード
US9786811B2 (en) 2011-02-04 2017-10-10 Cree, Inc. Tilted emission LED array
US8735913B2 (en) * 2011-04-01 2014-05-27 Visera Technologies Company Limited Light emitting semiconductor structure
US10842016B2 (en) 2011-07-06 2020-11-17 Cree, Inc. Compact optically efficient solid state light source with integrated thermal management
US9582697B2 (en) 2013-05-28 2017-02-28 Sicpa Holding Sa Sequenced illumination in mark reading devices
KR20150019828A (ko) * 2013-08-16 2015-02-25 삼성전자주식회사 발광소자 패키지 및 그 제조방법
TWI619273B (zh) * 2014-08-08 2018-03-21 High heat dissipation LED package module
JP7221052B2 (ja) * 2016-04-29 2023-02-13 ルミレッズ ホールディング ベーフェー 高輝度明白色ｌｅｄ光源
CN105761633A (zh) * 2016-05-24 2016-07-13 王德平 一种四基色led显示屏及其配色方法
DE102017102619B4 (de) * 2017-02-09 2022-10-06 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung LED-Einheit und LED-Modul
KR101931315B1 (ko) 2017-07-21 2019-03-13 한국광기술원 복합 픽셀 구조를 갖는 디스플레이 제조방법
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10892296B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US10748881B2 (en) 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11522006B2 (en) * 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552061B2 (en) 2017-12-22 2023-01-10 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11114499B2 (en) 2018-01-02 2021-09-07 Seoul Viosys Co., Ltd. Display device having light emitting stacked structure
US10784240B2 (en) 2018-01-03 2020-09-22 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
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Also Published As

Publication number Publication date
TW200633265A (en) 2006-09-16
KR20070089172A (ko) 2007-08-30
US8017955B2 (en) 2011-09-13
JP2008521239A (ja) 2008-06-19
US20090134409A1 (en) 2009-05-28
EP1815534B1 (de) 2011-08-03
KR101170401B1 (ko) 2012-08-02
EP1815534A2 (de) 2007-08-08
CN101438408B (zh) 2011-04-20
WO2006054236A2 (en) 2006-05-26
CN101438408A (zh) 2009-05-20
WO2006054236A3 (en) 2009-07-30

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Legal Events

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