ATE514553T1 - Mehrschichtige folie, verfahren zur deren herstellung und damit hergestellte druckempfindliche klebeschicht - Google Patents

Mehrschichtige folie, verfahren zur deren herstellung und damit hergestellte druckempfindliche klebeschicht

Info

Publication number
ATE514553T1
ATE514553T1 AT06003489T AT06003489T ATE514553T1 AT E514553 T1 ATE514553 T1 AT E514553T1 AT 06003489 T AT06003489 T AT 06003489T AT 06003489 T AT06003489 T AT 06003489T AT E514553 T1 ATE514553 T1 AT E514553T1
Authority
AT
Austria
Prior art keywords
pressure
sensitive adhesive
production
adhesive sheet
produced therefrom
Prior art date
Application number
AT06003489T
Other languages
English (en)
Inventor
Yoshinori Yoshida
Kouji Akazawa
Tomohiro Kontani
Kohei Yano
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Application granted granted Critical
Publication of ATE514553T1 publication Critical patent/ATE514553T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/62—Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6204—Polymers of olefins
    • C08G18/6208—Hydrogenated polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C09J2301/162—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer the carrier being a laminate constituted by plastic layers only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/006—Presence of (meth)acrylic polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31565—Next to polyester [polyethylene terephthalate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31573—Next to addition polymer of ethylenically unsaturated monomer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
AT06003489T 2005-02-23 2006-02-21 Mehrschichtige folie, verfahren zur deren herstellung und damit hergestellte druckempfindliche klebeschicht ATE514553T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005047504 2005-02-23
JP2005233266A JP4592535B2 (ja) 2005-02-23 2005-08-11 多層シートとその製造方法及びこの多層シートを用いた粘着シート

Publications (1)

Publication Number Publication Date
ATE514553T1 true ATE514553T1 (de) 2011-07-15

Family

ID=36540179

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06003489T ATE514553T1 (de) 2005-02-23 2006-02-21 Mehrschichtige folie, verfahren zur deren herstellung und damit hergestellte druckempfindliche klebeschicht

Country Status (6)

Country Link
US (1) US7976952B2 (de)
EP (1) EP1695820B1 (de)
JP (1) JP4592535B2 (de)
KR (1) KR20060094034A (de)
AT (1) ATE514553T1 (de)
TW (1) TW200636009A (de)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
US20080193728A1 (en) * 2002-07-26 2008-08-14 Nitto Denko Corporation Pressure-sensitive adhesive sheet, method for producing the same and method for using the same as well as a multi-layer sheet for use in the pressure-sensitive adhesive sheet and method for producing the same
JP4800778B2 (ja) * 2005-05-16 2011-10-26 日東電工株式会社 ダイシング用粘着シート及びそれを用いた被加工物の加工方法
JP2007070432A (ja) * 2005-09-06 2007-03-22 Nitto Denko Corp 粘着シート及びこの粘着シートを用いた製品の加工方法
JP2007084722A (ja) * 2005-09-22 2007-04-05 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP5049620B2 (ja) * 2007-03-20 2012-10-17 リンテック株式会社 粘着シート
US8096508B2 (en) * 2007-08-10 2012-01-17 3M Innovative Properties Company Erosion resistant films for use on heated aerodynamic surfaces
JP5399625B2 (ja) * 2007-11-13 2014-01-29 日東電工株式会社 複合フィルム
EP2242614A4 (de) * 2007-12-31 2013-01-16 Innopad Inc Chemisch-mechanisches planarisierungskissen
DE102008000419A1 (de) * 2008-02-27 2009-09-03 Basf Se Mehrschichtige Verbundmaterialien, die ein textiles Flächengebilde umfassen, Verfahren zu ihrer Herstellung und ihre Verwendung
JP2009275060A (ja) 2008-05-12 2009-11-26 Nitto Denko Corp 粘着シート、その粘着シートを使用した被着体の加工方法、及び粘着シート剥離装置
JPWO2009144985A1 (ja) * 2008-05-29 2011-10-06 電気化学工業株式会社 ダイシング方法
JP5232736B2 (ja) 2008-09-02 2013-07-10 日東電工株式会社 複合フィルム
EP2322583A4 (de) * 2008-09-05 2014-08-20 Asahi Glass Co Ltd Haftmaterial, haftfolie und verwendung davon
KR101648221B1 (ko) * 2009-04-14 2016-08-12 린텍 가부시키가이샤 요철 추종성 적층부재 및 그것을 이용한 터치 패널 부착 표시장치
WO2010131685A1 (ja) * 2009-05-13 2010-11-18 日東電工株式会社 複合フィルムおよびその製造方法
JP5783540B2 (ja) 2009-06-15 2015-09-24 エルジー・ケム・リミテッド ウェーハ加工用基材
EP2463316B1 (de) * 2009-08-04 2016-06-08 Idemitsu Kosan Co., Ltd. Acrylatzusammensetzung
JP2011105858A (ja) * 2009-11-18 2011-06-02 Nitto Denko Corp 粘着シート
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
JP5859193B2 (ja) 2010-07-14 2016-02-10 デンカ株式会社 多層粘着シート及び電子部品の製造方法
JP5161284B2 (ja) 2010-10-14 2013-03-13 電気化学工業株式会社 電子部品の製造方法
JP5161283B2 (ja) * 2010-10-14 2013-03-13 電気化学工業株式会社 電子部品の製造方法
JP5282113B2 (ja) * 2011-03-22 2013-09-04 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
JP5762781B2 (ja) 2011-03-22 2015-08-12 リンテック株式会社 基材フィルムおよび該基材フィルムを備えた粘着シート
JP2014132043A (ja) * 2011-04-15 2014-07-17 Nissha Printing Co Ltd 図柄層に対する接着性がよいハードコート樹脂組成物
KR20120133890A (ko) * 2011-06-01 2012-12-11 동우 화인켐 주식회사 유리 접합용 접착제 조성물, 이를 이용한 유리 접합체 및 화상표시장치
JP2013079303A (ja) * 2011-10-03 2013-05-02 Nitto Denko Corp 粘着剤組成物および粘着テープ
JP2013079304A (ja) * 2011-10-03 2013-05-02 Nitto Denko Corp 粘着剤組成物の製造方法
JP2013176973A (ja) * 2012-02-04 2013-09-09 Mitsubishi Plastics Inc 積層ポリエステルフィルム
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
CN102942830A (zh) * 2012-12-06 2013-02-27 浙江工商大学 一种建筑用防水防脱涂料及其制备方法
WO2015019726A1 (ja) * 2013-08-05 2015-02-12 日東電工株式会社 粘着シート
US10338291B2 (en) * 2013-12-27 2019-07-02 Zeon Corporation Multilayer film, polarization plate, and multilayer film production method
DE112015001075T5 (de) * 2014-03-03 2016-11-24 Lintec Corporation Verarbeitungsfolie für ein halbleiterbezogenes Element und Verfahren zur Herstellung von Chips unter Verwendung der Folie
KR101716543B1 (ko) * 2014-04-30 2017-03-15 제일모직주식회사 점착필름 및 이를 포함하는 광학표시장치
US9970303B2 (en) 2014-05-13 2018-05-15 Entrotech, Inc. Erosion protection sleeve
US10293585B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US10293584B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US10195826B2 (en) 2016-03-11 2019-02-05 Solutia Inc. Cellulose ester multilayer interlayers
US10293579B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US10293583B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US10300682B2 (en) 2016-03-11 2019-05-28 Solutia Inc. Cellulose ester multilayer interplayers
US10293582B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US10293580B2 (en) 2016-03-11 2019-05-21 Solutia Inc. Cellulose ester multilayer interlayers
US11794452B2 (en) 2017-11-16 2023-10-24 Argotec, LLC Thermoplastic polymer film with interpenetrating polymer network
EP3786246A4 (de) * 2018-04-24 2022-01-19 Mitsui Chemicals Tohcello, Inc. Haftklebefolie und verfahren zur herstellung einer elektronischen vorrichtung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5876414A (ja) * 1981-10-30 1983-05-09 Okura Ind Co Ltd 嫌気硬化性組成物及びその製造方法
JPS5986045A (ja) 1982-11-05 1984-05-18 Nippon Soda Co Ltd 永久レジスト用光硬化性樹脂組成物
JPH0618190B2 (ja) 1984-05-29 1994-03-09 三井東圧化学株式会社 ウエハ加工用フイルム
JPH0789546B2 (ja) 1985-05-15 1995-09-27 三井東圧化学株式会社 ウエハ加工用フィルム
JP2797281B2 (ja) * 1989-06-16 1998-09-17 大日本印刷株式会社 ソフトコートフィルム
JPH0631788A (ja) * 1992-07-21 1994-02-08 Dainippon Ink & Chem Inc 包装材料の製造方法
JP3177149B2 (ja) 1996-03-15 2001-06-18 リンテック株式会社 粘着テープ用基材、該基材を用いた粘着テープ、および該基材の製造方法
US5672653A (en) * 1996-05-13 1997-09-30 Elf Atochem North America, Inc. Anionic waterborne polyurethane dispersions
JP2000038556A (ja) 1998-07-22 2000-02-08 Nitto Denko Corp 半導体ウエハ保持保護用ホットメルトシート及びその貼り付け方法
JP3383227B2 (ja) 1998-11-06 2003-03-04 リンテック株式会社 半導体ウエハの裏面研削方法
JP2002069396A (ja) 2000-08-29 2002-03-08 Mitsui Chemicals Inc 半導体ウエハ保護用粘着フィルム及びそれを用いる半導体ウエハの裏面加工方法
JP2002322454A (ja) * 2001-04-26 2002-11-08 Toppan Forms Co Ltd 放射線硬化型再剥離性感圧接着剤
JP3908929B2 (ja) 2001-06-25 2007-04-25 日東電工株式会社 半導体ウエハ加工用粘着シート及びそれに用いる粘着剤組成物
JP4095794B2 (ja) * 2001-12-03 2008-06-04 日東電工株式会社 複合フィルム及び半導体製品保持シート
US6566024B1 (en) * 2001-12-21 2003-05-20 Eastman Kodak Company Quintessential pictorial label and its distribution
JP4726405B2 (ja) * 2002-07-26 2011-07-20 日東電工株式会社 加工用粘着シートとその製造方法
JP4493296B2 (ja) * 2002-07-26 2010-06-30 日東電工株式会社 加工用粘着シートとその製造方法
KR101016081B1 (ko) * 2002-07-26 2011-02-17 닛토덴코 가부시키가이샤 점착 시트와 그의 제조방법, 상기 점착 시트의 사용방법,및 상기 점착 시트에 사용되는 다층 시트와 그의 제조방법
JP4195646B2 (ja) * 2002-07-26 2008-12-10 日東電工株式会社 多層シートとその製造方法及びこの多層シートを用いた粘着シート

Also Published As

Publication number Publication date
KR20060094034A (ko) 2006-08-28
US7976952B2 (en) 2011-07-12
JP2006264296A (ja) 2006-10-05
JP4592535B2 (ja) 2010-12-01
US20060188725A1 (en) 2006-08-24
TW200636009A (en) 2006-10-16
EP1695820B1 (de) 2011-06-29
EP1695820A1 (de) 2006-08-30

Similar Documents

Publication Publication Date Title
ATE514553T1 (de) Mehrschichtige folie, verfahren zur deren herstellung und damit hergestellte druckempfindliche klebeschicht
TW200609108A (en) Method for making multilayer film, sheet and articles therefrom
KR101215105B1 (ko) 스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법
WO2007005600A3 (en) Method for manufacturing inflatable footwear or bladders for use in inflatable articles
ATE528132T1 (de) Anhand mehrerer dehnschritte hergestellte elastische filmlaminate und verfahren zu deren herstellung
WO2008008381A3 (en) Multilayer sealant film
WO2007048563A3 (de) Verfahren zum transfer eines mehrschichtkörpers sowie transferfolie
WO2009066704A1 (ja) はんだ材料及びその製造方法、接合体及びその製造方法、並びにパワー半導体モジュール及びその製造方法
WO2008129712A1 (ja) 表示パネルの製造装置及び製造方法、並びにその製造方法により製造された表示パネル
ATE540809T1 (de) Verfahren zur herstellung wasserabweisender schichtstoffe
DE502005007781D1 (de) Verfahren zur Herstellung einer elastischen Verbundstoffbahn
TW200639580A (en) Pellicles having low adhesive residue
SG11201808212XA (en) Film adhesive, semiconductor processing sheet, and method for manufacturing semiconductor apparatus
EP2017055A4 (de) Verfahren zur herstellung einer polymer-dünnschicht sowie polymerdünnschicht
KR20160127079A (ko) 가스 배리어성 필름 및 그 제조 방법과, 이것을 사용한 전자 디바이스 및 그 제조 방법
WO2009063793A1 (ja) 半導体ウエハ加工用粘着テープ
KR100818696B1 (ko) Ｃｐｐ필름을 사용한 시트의 제조방법 및 그에 의해 제조된시트
TW200515499A (en) Dicing adhesive sheet, dicing method, and manufacturing method of semiconductor device
DE60221547D1 (de) Klebefolie aus vernetztem silikon, verfahren zur herstellung derselben sowie die folie enthaltende vorrichtung
MX2010004451A (es) Pelicula de etiqueta para etiquetas completas.
JP2008260540A (ja) シート状光学フィルム包装体
TWI586545B (zh) Laminated body
PH12021551200A1 (en) Adhesive, packaging material, packaging container, and production method for recycled substrate
KR101924445B1 (ko) 실리콘계 점착 테이프 및 이의 제조 방법
KR102324557B1 (ko) 재박리성 점착 시트

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties