ATE398148T1 - Vernetzungsbeschleuniger - Google Patents

Vernetzungsbeschleuniger

Info

Publication number
ATE398148T1
ATE398148T1 AT05253231T AT05253231T ATE398148T1 AT E398148 T1 ATE398148 T1 AT E398148T1 AT 05253231 T AT05253231 T AT 05253231T AT 05253231 T AT05253231 T AT 05253231T AT E398148 T1 ATE398148 T1 AT E398148T1
Authority
AT
Austria
Prior art keywords
accelerator
epoxy resin
networking
networking accelerator
imidazoles
Prior art date
Application number
AT05253231T
Other languages
English (en)
Inventor
Philip C Hadley
Michelle M Irons
John Cawse
Original Assignee
Hexcel Composites Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Composites Ltd filed Critical Hexcel Composites Ltd
Application granted granted Critical
Publication of ATE398148T1 publication Critical patent/ATE398148T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Particle Accelerators (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
AT05253231T 2004-06-02 2005-05-26 Vernetzungsbeschleuniger ATE398148T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0412196.8A GB0412196D0 (en) 2004-06-02 2004-06-02 Cure accelerators

Publications (1)

Publication Number Publication Date
ATE398148T1 true ATE398148T1 (de) 2008-07-15

Family

ID=32696459

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05253231T ATE398148T1 (de) 2004-06-02 2005-05-26 Vernetzungsbeschleuniger

Country Status (8)

Country Link
US (2) US7781542B2 (de)
EP (1) EP1602678B9 (de)
JP (1) JP4843256B2 (de)
AT (1) ATE398148T1 (de)
DE (1) DE602005007422D1 (de)
DK (1) DK1602678T3 (de)
ES (1) ES2307120T3 (de)
GB (1) GB0412196D0 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103201320B (zh) 2010-08-20 2015-05-13 3M创新有限公司 低温可固化环氧带材和其制备方法
DE102012025256A1 (de) 2012-12-21 2014-06-26 Heinrich-Heine-Universität Diepoxide und deren Verwendung in Füllmaterialmischungen
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
GB201508510D0 (en) 2015-05-18 2015-07-01 Aqdot Ltd Curling compositions
GB2566269A (en) * 2017-09-06 2019-03-13 Hexcel Composites Ltd A resin composition and materials containing a resin composition
DE102017221072A1 (de) * 2017-11-24 2019-05-29 Tesa Se Verfahren zur Herstellung haftklebriger Reaktivklebebänder
WO2020033036A1 (en) * 2018-08-08 2020-02-13 Dow Global Technologies Llc Epoxy resin composition
EP3950866A4 (de) * 2019-05-31 2023-01-25 Sekisui Chemical Co., Ltd. Klebstoffzusammensetzung, optische komponente, elektronische komponente und elektronisches modul

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FR2568576B1 (fr) * 1984-08-01 1987-06-19 Toho Beslon Co Preimpregnes constitues par des fibres et une composition de resine d'impregnation epoxy et leur procede de fabrication par impregnation au moyen de la composition epoxy fondue
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US4618526A (en) * 1985-07-22 1986-10-21 The Dow Chemical Company Curable compositions containing multiglycidyl ethers and a sulfonic acid amide
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JPH09165494A (ja) * 1995-11-16 1997-06-24 Yuka Shell Epoxy Kk 硬化性エポキシ樹脂組成物およびその使用
TW340967B (en) * 1996-02-19 1998-09-21 Toray Industries An adhesive sheet for a semiconductor to connect with a substrate, and adhesive sticking tape for tab, an adhesive sticking tape for wire bonding connection, a substrate for connecting with a semiconductor and a semiconductor device
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US6136944A (en) * 1998-09-21 2000-10-24 Shell Oil Company Adhesive of epoxy resin, amine-terminated polyamide and polyamine
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DE60011199T2 (de) * 1999-10-06 2004-09-30 Nitto Denko Corp., Ibaraki Harzzusammensetzung zur Einkapselung von Halbleitern, Halbleiteranordnungen die diese enthalten und Verfahren für die Herstellung von diesen Halbleiteranordnungen
JP4112863B2 (ja) * 2000-03-28 2008-07-02 富士通株式会社 接着剤組成物
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DE10358932A1 (de) * 2002-12-17 2005-07-28 Henkel Kgaa Verfahren zur Herstellung von Polyurethan-Prepolymeren in Gegenwart eines Katalysators

Also Published As

Publication number Publication date
US20050272883A1 (en) 2005-12-08
JP2005344112A (ja) 2005-12-15
US7781542B2 (en) 2010-08-24
DK1602678T3 (da) 2008-08-25
EP1602678A1 (de) 2005-12-07
DE602005007422D1 (de) 2008-07-24
GB0412196D0 (en) 2004-07-07
JP4843256B2 (ja) 2011-12-21
US8859694B2 (en) 2014-10-14
US20110067812A1 (en) 2011-03-24
ES2307120T3 (es) 2008-11-16
EP1602678B9 (de) 2008-11-05
EP1602678B1 (de) 2008-06-11

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