DE602007005661D1 - Härtbare silikonzusammensetzung und elektronikbauteil - Google Patents

Härtbare silikonzusammensetzung und elektronikbauteil

Info

Publication number
DE602007005661D1
DE602007005661D1 DE200760005661 DE602007005661T DE602007005661D1 DE 602007005661 D1 DE602007005661 D1 DE 602007005661D1 DE 200760005661 DE200760005661 DE 200760005661 DE 602007005661 T DE602007005661 T DE 602007005661T DE 602007005661 D1 DE602007005661 D1 DE 602007005661D1
Authority
DE
Germany
Prior art keywords
electronic component
silicone composition
thermally conductive
cured
cured body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200760005661
Other languages
English (en)
Inventor
Yoshitsugu Morita
Minoru Isshiki
Tomoko Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Publication of DE602007005661D1 publication Critical patent/DE602007005661D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Details Of Resistors (AREA)
DE200760005661 2006-09-11 2007-08-23 Härtbare silikonzusammensetzung und elektronikbauteil Active DE602007005661D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006246080A JP5285846B2 (ja) 2006-09-11 2006-09-11 硬化性シリコーン組成物および電子部品
PCT/JP2007/066829 WO2008032575A1 (en) 2006-09-11 2007-08-23 Curable silicone composition and electronic component

Publications (1)

Publication Number Publication Date
DE602007005661D1 true DE602007005661D1 (de) 2010-05-12

Family

ID=38721758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200760005661 Active DE602007005661D1 (de) 2006-09-11 2007-08-23 Härtbare silikonzusammensetzung und elektronikbauteil

Country Status (9)

Country Link
US (1) US8273815B2 (de)
EP (1) EP2061839B1 (de)
JP (1) JP5285846B2 (de)
KR (1) KR20090057244A (de)
CN (1) CN101511942A (de)
AT (1) ATE462763T1 (de)
DE (1) DE602007005661D1 (de)
TW (1) TWI412563B (de)
WO (1) WO2008032575A1 (de)

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JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
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WO2014092182A1 (ja) * 2012-12-13 2014-06-19 Watanabe Kayo 充填剤、シーリング構造およびその製法
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CN105441016B (zh) * 2015-12-25 2018-10-02 安徽锐视光电技术有限公司 一种应用于色选机电磁阀上的密封填充复合胶水
WO2017159252A1 (ja) * 2016-03-18 2017-09-21 信越化学工業株式会社 熱伝導性シリコーン組成物及び半導体装置
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JP7122528B2 (ja) * 2017-08-09 2022-08-22 パナソニックＩｐマネジメント株式会社 熱伝導性組成物及び半導体装置
CN112166155A (zh) * 2018-05-31 2021-01-01 昭和电工材料株式会社 复合物、成形体及电子部件
CN113789143B (zh) * 2021-10-18 2022-12-27 东莞市雄驰电子有限公司 一种室温可固化有机硅改性环氧树脂灌封胶及其制备方法
CN113881377B (zh) * 2021-10-18 2022-12-20 东莞市雄驰电子有限公司 一种酸酐可固化有机硅改性环氧树脂灌封胶及其制备方法
WO2024033980A1 (ja) * 2022-08-08 2024-02-15 日本電信電話株式会社 光変調装置
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JP4931366B2 (ja) 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5004433B2 (ja) 2005-04-27 2012-08-22 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
JP5207591B2 (ja) 2006-02-23 2013-06-12 東レ・ダウコーニング株式会社 半導体装置の製造方法および半導体装置
JP5285846B2 (ja) 2006-09-11 2013-09-11 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5238157B2 (ja) 2006-12-25 2013-07-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP5248012B2 (ja) 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物

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WO2008032575A1 (en) 2008-03-20
EP2061839B1 (de) 2010-03-31
JP2008063542A (ja) 2008-03-21
US20100113667A1 (en) 2010-05-06
TW200817472A (en) 2008-04-16
TWI412563B (zh) 2013-10-21
ATE462763T1 (de) 2010-04-15
KR20090057244A (ko) 2009-06-04
US8273815B2 (en) 2012-09-25
EP2061839A1 (de) 2009-05-27

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