ATE373830T1 - Mehrspitzenfühler - Google Patents
MehrspitzenfühlerInfo
- Publication number
- ATE373830T1 ATE373830T1 AT99932677T AT99932677T ATE373830T1 AT E373830 T1 ATE373830 T1 AT E373830T1 AT 99932677 T AT99932677 T AT 99932677T AT 99932677 T AT99932677 T AT 99932677T AT E373830 T1 ATE373830 T1 AT E373830T1
- Authority
- AT
- Austria
- Prior art keywords
- probe
- probe arms
- arms
- wafer
- conducting
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/14—Measuring resistance by measuring current or voltage obtained from a reference source
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/04—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant in circuits having distributed constants, e.g. having very long conductors or involving high frequencies
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2648—Characterising semiconductor materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP98610023A EP0974845A1 (de) | 1998-07-08 | 1998-07-08 | Vorrichtung zum Testen elektrischer Eigenschaften mittels eines Mehrspitzenfühlers |
DKPA199900378 | 1999-03-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE373830T1 true ATE373830T1 (de) | 2007-10-15 |
Family
ID=26063886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99932677T ATE373830T1 (de) | 1998-07-08 | 1999-07-08 | Mehrspitzenfühler |
Country Status (8)
Country | Link |
---|---|
US (2) | US20010050565A1 (de) |
EP (1) | EP1095282B1 (de) |
JP (1) | JP4685240B2 (de) |
AT (1) | ATE373830T1 (de) |
AU (1) | AU4897399A (de) |
CA (1) | CA2336531A1 (de) |
DE (1) | DE69937147T2 (de) |
WO (1) | WO2000003252A2 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6955078B2 (en) * | 2001-03-30 | 2005-10-18 | Xidex Corporation | Caliper method, system, and apparatus |
ATE519119T1 (de) | 2002-01-07 | 2011-08-15 | Capres As | Elektrisches rückkopplungs-detektionssystem für mehrpunktsonden |
DE10201491C1 (de) * | 2002-01-16 | 2003-08-28 | Gfd Ges Fuer Diamantprodukte M | Meßspitzensystem und Verfahren zu dessen Herstellung |
EP2463668A2 (de) | 2004-06-21 | 2012-06-13 | Capres A/S | Verfahren und Vorrichtung zum Testen elektrischer Eigenschaften |
WO2005124371A1 (en) | 2004-06-21 | 2005-12-29 | Capres A/S | A method for providing alignment of a probe |
US9423693B1 (en) | 2005-05-10 | 2016-08-23 | Victor B. Kley | In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate |
US7571638B1 (en) * | 2005-05-10 | 2009-08-11 | Kley Victor B | Tool tips with scanning probe microscopy and/or atomic force microscopy applications |
ES2265277B1 (es) * | 2005-06-01 | 2008-01-01 | Consejo Superior Investig. Cientificas | Dispositivo sensor y equipo para la medicion de resistividad con el metodo de las cuatro puntas, asi como un metodo para la fabricacion del dispositivo. |
US7511510B2 (en) * | 2005-11-30 | 2009-03-31 | International Business Machines Corporation | Nanoscale fault isolation and measurement system |
WO2007121752A1 (en) | 2006-04-24 | 2007-11-01 | Capres A/S | Method for sheet resistance and leakage current density measurements on shallow semiconductor implants |
WO2008013919A2 (en) * | 2006-07-27 | 2008-01-31 | The Regents Of The University Of California | Sidewall tracing nanoprobes, method for making the same, and method for use |
WO2008065790A1 (en) * | 2006-11-30 | 2008-06-05 | Japan Science And Technology Agency | Metallic probe, method of forming the same and metallic probe forming apparatus |
EP1970714A1 (de) * | 2007-03-12 | 2008-09-17 | Capres Aps | Vorrichtung mit Kontaktdetektor |
JP5100751B2 (ja) * | 2007-07-03 | 2012-12-19 | 株式会社アドバンテスト | プローブおよびプローブカード |
WO2009004721A1 (ja) * | 2007-07-03 | 2009-01-08 | Advantest Corporation | プローブ、プローブカード及びプローブの製造方法 |
US20090201038A1 (en) * | 2008-02-11 | 2009-08-13 | Knickerbocker John U | Test head for functional wafer level testing, system and method therefor |
EP2101181A1 (de) | 2008-03-12 | 2009-09-16 | Capres A/S | Vorrichtung mit Kontaktdetektor |
EP2141503A1 (de) * | 2008-06-30 | 2010-01-06 | Capres A/S | Mehrpunktsonde zum Testen elektrischer Eigenschaften und Verfahren zur Herstellung einer Mehrpunktsonde |
US20110285416A1 (en) * | 2008-06-30 | 2011-11-24 | Petersen Dirch H | Multi-point probe for testing electrical properties and a method of producing a multi-point probe |
US7940067B2 (en) * | 2008-09-08 | 2011-05-10 | Tektronix, Inc. | Probe with printed tip |
EP2237052A1 (de) | 2009-03-31 | 2010-10-06 | Capres A/S | Automatisierte Mehrpunktsondenmanipulation |
EP2498081A1 (de) | 2011-03-08 | 2012-09-12 | Capres A/S | Messung des Hall-Effekts in einer einzigen Position |
SG191251A1 (en) | 2010-12-21 | 2013-07-31 | Capres As | Single-position hall effect measurements |
EP2469271A1 (de) | 2010-12-21 | 2012-06-27 | Capres A/S | Messung des Hall-Effekts in einer einzigen Position |
US8633720B2 (en) | 2011-06-21 | 2014-01-21 | Avalanche Technology Inc. | Method and apparatus for measuring magnetic parameters of magnetic thin film structures |
JP5909020B2 (ja) * | 2012-03-27 | 2016-04-26 | ハイジトロン, インク.Hysitron, Inc. | 顕微鏡対物レンズ機械検査機器 |
US8806284B2 (en) | 2012-05-02 | 2014-08-12 | Avalanche Technology Inc. | Method for bit-error rate testing of resistance-based RAM cells using a reflected signal |
EP2677324A1 (de) | 2012-06-20 | 2013-12-25 | Capres A/S | Tiefgeätzte Mehrpunktsonde |
US9252187B2 (en) | 2013-03-08 | 2016-02-02 | Avalanche Technology, Inc. | Devices and methods for measurement of magnetic characteristics of MRAM wafers using magnetoresistive test strips |
US9778572B1 (en) | 2013-03-15 | 2017-10-03 | Victor B. Kley | In-plane scanning probe microscopy tips and tools for wafers and substrates with diverse designs on one wafer or substrate |
US9844139B2 (en) | 2013-03-16 | 2017-12-12 | Indiana Integrated Circuits, LLC | Method of interconnecting microchips |
KR102080661B1 (ko) * | 2013-08-06 | 2020-02-24 | 삼성전기주식회사 | 두께 측정 장치 및 두께 측정 방법 |
EP2871487A1 (de) | 2013-11-11 | 2015-05-13 | Capres A/S | Miniaturisierte Messungen von anisotropen Flächenleitfähigkeiten |
US9170273B2 (en) * | 2013-12-09 | 2015-10-27 | Globalfoundries U.S. 2 Llc | High frequency capacitance-voltage nanoprobing characterization |
US9201112B2 (en) | 2013-12-09 | 2015-12-01 | International Business Machines Corporation | Atom probe tomography sample preparation for three-dimensional (3D) semiconductor devices |
US10302677B2 (en) * | 2015-04-29 | 2019-05-28 | Kla-Tencor Corporation | Multiple pin probes with support for performing parallel measurements |
TWI567846B (zh) * | 2015-08-19 | 2017-01-21 | 創意電子股份有限公司 | 測試單元與使用其的測試裝置 |
US10896803B2 (en) * | 2016-08-19 | 2021-01-19 | The Regents Of The University Of California | Ion beam mill etch depth monitoring with nanometer-scale resolution |
US10514391B2 (en) | 2016-08-22 | 2019-12-24 | Kla-Tencor Corporation | Resistivity probe having movable needle bodies |
CN110383077B (zh) * | 2017-03-07 | 2022-03-29 | 卡普雷斯股份有限公司 | 用于测试测试样品的电特性的探针 |
TWI645194B (zh) * | 2017-07-12 | 2018-12-21 | 萬潤科技股份有限公司 | 探針模組、探針裝置及使用該探針裝置之電子元件檢測方法及設備 |
US11693028B2 (en) | 2017-11-15 | 2023-07-04 | Kla Corporation | Probe for testing an electrical property of a test sample |
US10411185B1 (en) | 2018-05-30 | 2019-09-10 | Spin Memory, Inc. | Process for creating a high density magnetic tunnel junction array test platform |
US11125779B2 (en) | 2018-11-15 | 2021-09-21 | Rohde & Schwarz Gmbh & Co. Kg | Probe with radio frequency power detector, test system and test method |
KR102137442B1 (ko) * | 2018-12-05 | 2020-07-27 | 전북대학교산학협력단 | 원자력 현미경용 프로브 및 이의 제조 방법 |
CN110190106B (zh) * | 2019-06-13 | 2022-01-28 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、检测方法、显示装置 |
JP2022179066A (ja) * | 2021-05-21 | 2022-12-02 | 富士フイルムビジネスイノベーション株式会社 | シート電気抵抗測定器 |
CN114814314B (zh) * | 2022-04-18 | 2024-02-13 | 苏州伊欧陆***集成有限公司 | 一种多触点高电流高电压测试探针 |
Family Cites Families (27)
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US3984620A (en) * | 1975-06-04 | 1976-10-05 | Raytheon Company | Integrated circuit chip test and assembly package |
US4329642A (en) * | 1979-03-09 | 1982-05-11 | Siliconix, Incorporated | Carrier and test socket for leadless integrated circuit |
EP0078339B1 (de) * | 1981-10-30 | 1986-07-30 | Ibm Deutschland Gmbh | Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf |
US5917707A (en) * | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US4989154A (en) | 1987-07-13 | 1991-01-29 | Mitsubishi Petrochemical Company Ltd. | Method of measuring resistivity, and apparatus therefor |
JPH01147374A (ja) * | 1987-12-04 | 1989-06-09 | Hitachi Ltd | マイクロプローバ |
EP0466274B1 (de) * | 1990-07-09 | 1996-10-16 | Interuniversitair Micro-Elektronica Centrum vzw | Verfahren und Apparat zur Wiederstandsmessung in Halbleiterelementen |
US5171992A (en) * | 1990-10-31 | 1992-12-15 | International Business Machines Corporation | Nanometer scale probe for an atomic force microscope, and method for making same |
JPH081382B2 (ja) * | 1990-10-31 | 1996-01-10 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ナノメートル・スケールのプローブ及びその製造方法 |
WO1994011745A1 (en) | 1992-11-10 | 1994-05-26 | David Cheng | Method and apparatus for measuring film thickness |
US5347226A (en) * | 1992-11-16 | 1994-09-13 | National Semiconductor Corporation | Array spreading resistance probe (ASRP) method for profile extraction from semiconductor chips of cellular construction |
DE4301420C2 (de) * | 1993-01-20 | 2002-04-25 | Advantest Corp | Kontaktierungsvorrichtung |
US5475318A (en) * | 1993-10-29 | 1995-12-12 | Robert B. Marcus | Microprobe |
US6482013B2 (en) * | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US5383354A (en) * | 1993-12-27 | 1995-01-24 | Motorola, Inc. | Process for measuring surface topography using atomic force microscopy |
JPH07199219A (ja) * | 1993-12-28 | 1995-08-04 | Mitsui Eng & Shipbuild Co Ltd | 液晶表示装置検査用プローブカード |
JP2599895B2 (ja) * | 1994-06-23 | 1997-04-16 | 山一電機株式会社 | プローブユニットとその製法 |
US5565788A (en) * | 1994-07-20 | 1996-10-15 | Cascade Microtech, Inc. | Coaxial wafer probe with tip shielding |
US5540958A (en) * | 1994-12-14 | 1996-07-30 | Vlsi Technology, Inc. | Method of making microscope probe tips |
US5557214A (en) * | 1995-02-06 | 1996-09-17 | Barnett; C. Kenneth | Micro beam probe semiconductor test interface |
JPH08330369A (ja) * | 1995-05-31 | 1996-12-13 | Hewlett Packard Japan Ltd | プローバ用インターフェースカード |
US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
JP3838381B2 (ja) * | 1995-11-22 | 2006-10-25 | 株式会社アドバンテスト | プローブカード |
US5734176A (en) * | 1996-02-26 | 1998-03-31 | Wiltron Company | Impedance controlled test fixture for multi-lead surface mounted integrated circuits |
EP0899538B1 (de) * | 1997-08-27 | 2003-05-14 | IMEC vzw | Taststift-Konfiguration sowie Herstellungsverfahren und Verwendung von Taststiften |
DE19945178C2 (de) * | 1999-09-21 | 2003-05-28 | Rosenberger Hochfrequenztech | Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung |
US6496026B1 (en) * | 2000-02-25 | 2002-12-17 | Microconnect, Inc. | Method of manufacturing and testing an electronic device using a contact device having fingers and a mechanical ground |
-
1999
- 1999-07-08 AT AT99932677T patent/ATE373830T1/de not_active IP Right Cessation
- 1999-07-08 JP JP2000559436A patent/JP4685240B2/ja not_active Expired - Lifetime
- 1999-07-08 AU AU48973/99A patent/AU4897399A/en not_active Abandoned
- 1999-07-08 WO PCT/DK1999/000391 patent/WO2000003252A2/en active IP Right Grant
- 1999-07-08 DE DE69937147T patent/DE69937147T2/de not_active Expired - Lifetime
- 1999-07-08 EP EP99932677A patent/EP1095282B1/de not_active Revoked
- 1999-07-08 CA CA002336531A patent/CA2336531A1/en not_active Abandoned
-
2000
- 2000-12-28 US US09/750,645 patent/US20010050565A1/en not_active Abandoned
-
2003
- 2003-09-30 US US10/675,886 patent/US7323890B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69937147T2 (de) | 2008-06-19 |
JP4685240B2 (ja) | 2011-05-18 |
JP2002520596A (ja) | 2002-07-09 |
WO2000003252A3 (en) | 2000-04-13 |
CA2336531A1 (en) | 2000-01-20 |
US7323890B2 (en) | 2008-01-29 |
WO2000003252A2 (en) | 2000-01-20 |
US20010050565A1 (en) | 2001-12-13 |
EP1095282B1 (de) | 2007-09-19 |
AU4897399A (en) | 2000-02-01 |
DE69937147D1 (de) | 2007-10-31 |
EP1095282A2 (de) | 2001-05-02 |
US20040056674A1 (en) | 2004-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |