ATE371965T1 - Flexible konforme antenne - Google Patents
Flexible konforme antenneInfo
- Publication number
- ATE371965T1 ATE371965T1 AT04778731T AT04778731T ATE371965T1 AT E371965 T1 ATE371965 T1 AT E371965T1 AT 04778731 T AT04778731 T AT 04778731T AT 04778731 T AT04778731 T AT 04778731T AT E371965 T1 ATE371965 T1 AT E371965T1
- Authority
- AT
- Austria
- Prior art keywords
- electrical communication
- transition
- wave guide
- caged
- flexible compliant
- Prior art date
Links
- 230000007704 transition Effects 0.000 abstract 4
- 230000005540 biological transmission Effects 0.000 abstract 3
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
- H05K1/0222—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/003—Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/085—Coaxial-line/strip-line transitions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45014—Ribbon connectors, e.g. rectangular cross-section
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Connection Structure (AREA)
- Details Of Aerials (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
- Transceivers (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/654,121 US6992629B2 (en) | 2003-09-03 | 2003-09-03 | Embedded RF vertical interconnect for flexible conformal antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE371965T1 true ATE371965T1 (de) | 2007-09-15 |
Family
ID=34218016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04778731T ATE371965T1 (de) | 2003-09-03 | 2004-07-22 | Flexible konforme antenne |
Country Status (12)
Country | Link |
---|---|
US (1) | US6992629B2 (de) |
EP (1) | EP1661207B1 (de) |
JP (1) | JP4571638B2 (de) |
KR (1) | KR100733103B1 (de) |
AT (1) | ATE371965T1 (de) |
AU (1) | AU2004303071B2 (de) |
CA (2) | CA2729740C (de) |
DE (1) | DE602004008653T2 (de) |
DK (1) | DK1661207T3 (de) |
ES (1) | ES2290766T3 (de) |
NO (1) | NO20061449L (de) |
WO (1) | WO2005025001A1 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
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US7098853B2 (en) * | 2004-07-21 | 2006-08-29 | Raytheon Company | Conformal channel monopole array antenna |
US9395718B1 (en) | 2005-06-03 | 2016-07-19 | Sciperio, Inc. | Optimization of unique antenna and RF systems for specific substrates |
EP1784063A1 (de) * | 2005-11-08 | 2007-05-09 | Alcatel Lucent | Leiterplatte mit darauf montierten mikroelektronischen Komponenten und Verfahren zur Herstellung einer solchen Leiterplatte |
US20070210959A1 (en) * | 2006-03-07 | 2007-09-13 | Massachusetts Institute Of Technology | Multi-beam tile array module for phased array systems |
US7671696B1 (en) * | 2006-09-21 | 2010-03-02 | Raytheon Company | Radio frequency interconnect circuits and techniques |
US9019166B2 (en) | 2009-06-15 | 2015-04-28 | Raytheon Company | Active electronically scanned array (AESA) card |
US8279131B2 (en) * | 2006-09-21 | 2012-10-02 | Raytheon Company | Panel array |
US9172145B2 (en) | 2006-09-21 | 2015-10-27 | Raytheon Company | Transmit/receive daughter card with integral circulator |
US7869225B2 (en) * | 2007-04-30 | 2011-01-11 | Freescale Semiconductor, Inc. | Shielding structures for signal paths in electronic devices |
US7631414B2 (en) | 2007-08-13 | 2009-12-15 | Raytheon Company | Methods for producing large flat panel and conformal active array antennas |
US7830301B2 (en) * | 2008-04-04 | 2010-11-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for automotive radars |
US8022861B2 (en) * | 2008-04-04 | 2011-09-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for mm-wave imager and radar |
US7733265B2 (en) * | 2008-04-04 | 2010-06-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Three dimensional integrated automotive radars and methods of manufacturing the same |
FR2930374B1 (fr) * | 2008-04-18 | 2011-08-26 | Thales Sa | Circulateur radiofrequence a base de mems. |
FR2936610B1 (fr) * | 2008-09-30 | 2011-11-25 | Thales Sa | Module d'emission et de reception de signaux hyperfrequences en bande x sur circuit multicouche et antenne active |
US7990237B2 (en) * | 2009-01-16 | 2011-08-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | System and method for improving performance of coplanar waveguide bends at mm-wave frequencies |
US7876263B2 (en) * | 2009-02-24 | 2011-01-25 | Raytheon Company | Asymmetrically thinned active array TR module and antenna architecture |
US7965235B2 (en) * | 2009-02-24 | 2011-06-21 | Raytheon Company | Multi-channel thinned TR module architecture |
US8538071B2 (en) * | 2009-03-18 | 2013-09-17 | Raytheon Company | System and method for target separation of closely spaced targets in automatic target recognition |
IL197906A (en) * | 2009-04-05 | 2014-09-30 | Elta Systems Ltd | Antenna arrays and method for creating them |
US20110024160A1 (en) * | 2009-07-31 | 2011-02-03 | Clifton Quan | Multi-layer microwave corrugated printed circuit board and method |
US20110031246A1 (en) * | 2009-08-07 | 2011-02-10 | Massey Jr Raymond C | Tamper-Resistant Storage Container |
US8043464B2 (en) * | 2009-11-17 | 2011-10-25 | Raytheon Company | Systems and methods for assembling lightweight RF antenna structures |
US8127432B2 (en) | 2009-11-17 | 2012-03-06 | Raytheon Company | Process for fabricating an origami formed antenna radiating structure |
US8362856B2 (en) * | 2009-11-17 | 2013-01-29 | Raytheon Company | RF transition with 3-dimensional molded RF structure |
US9072164B2 (en) * | 2009-11-17 | 2015-06-30 | Raytheon Company | Process for fabricating a three dimensional molded feed structure |
US8537059B2 (en) * | 2009-11-20 | 2013-09-17 | Raytheon Company | Cooling system for panel array antenna |
US8786496B2 (en) | 2010-07-28 | 2014-07-22 | Toyota Motor Engineering & Manufacturing North America, Inc. | Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications |
RU2488220C1 (ru) * | 2011-12-28 | 2013-07-20 | Аслан Юсуфович Хуако | Приемопередатчик |
WO2015000594A1 (en) * | 2013-07-03 | 2015-01-08 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | An interconnect system comprising an interconnect having a plurality of metal cores at least partially surrounded by a dielectric layer |
US10109920B2 (en) | 2015-09-09 | 2018-10-23 | The Johns Hopkins University | Metasurface antenna |
KR102384505B1 (ko) * | 2016-01-12 | 2022-04-08 | 삼성전자주식회사 | 칩 간 무선 통신을 제공하기 위한 방법 및 장치 |
DE102016007052A1 (de) * | 2016-06-06 | 2017-12-07 | Kathrein-Werke Kg | Leiterplattenanordnung zur Signalversorgung eines Strahlers |
CN111226348B (zh) * | 2017-10-17 | 2022-03-11 | 康普技术有限责任公司 | 用于具有多层基板的微波和毫米波通信***的垂直过渡 |
WO2020218643A1 (ko) * | 2019-04-25 | 2020-10-29 | 엘지전자 주식회사 | 커넥터를 구비하는 전자 기기 |
DE102019110840A1 (de) * | 2019-04-26 | 2020-10-29 | Infineon Technologies Ag | Rf-vorrichtungen mit konformen antennen und verfahren zu deren herstellung |
CN111586965B (zh) * | 2020-05-25 | 2022-03-22 | 上海航天电子通讯设备研究所 | 基于lcp基材的高功率共形组件制备方法及共形组件 |
CN111640682B (zh) * | 2020-05-31 | 2022-07-08 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 分离器件金丝键合过渡结构 |
TWI749580B (zh) * | 2020-06-08 | 2021-12-11 | 星河半導體股份有限公司 | 多通道天線晶片測試系統及方法 |
Family Cites Families (18)
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JPS636884Y2 (de) * | 1981-01-16 | 1988-02-27 | ||
US5416453A (en) | 1989-09-29 | 1995-05-16 | Hughes Aircraft Company | Coaxial-to-microstrip orthogonal launchers having troughline convertors |
FR2681946A1 (fr) | 1991-09-27 | 1993-04-02 | Thomson Csf | Dispositif pour tests hyperfrequences a large bande realises in situ. |
JPH06268414A (ja) * | 1993-03-12 | 1994-09-22 | Nec Corp | マイクロストリップ線路型サーキュレータ |
JP2912158B2 (ja) * | 1994-05-17 | 1999-06-28 | 日本電気アイシーマイコンシステム株式会社 | 信号線切替回路 |
JPH08250912A (ja) * | 1995-03-14 | 1996-09-27 | Japan Radio Co Ltd | ストリップラインの垂直給電部 |
US5570068A (en) * | 1995-05-26 | 1996-10-29 | Hughes Aircraft Company | Coaxial-to-coplanar-waveguide transmission line connector using integrated slabline transition |
US5668509A (en) | 1996-03-25 | 1997-09-16 | Hughes Electronics | Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies |
US6127978A (en) | 1997-03-28 | 2000-10-03 | Honda Giken Kogyo Kabushiki Kaisha | Planar antenna module |
JP3635873B2 (ja) * | 1997-06-26 | 2005-04-06 | 三菱電機株式会社 | ストリップライン給電装置 |
JP3149831B2 (ja) | 1997-11-07 | 2001-03-26 | 日本電気株式会社 | 高周波集積回路およびその製造方法 |
US6154176A (en) | 1998-08-07 | 2000-11-28 | Sarnoff Corporation | Antennas formed using multilayer ceramic substrates |
US6356245B2 (en) | 1999-04-01 | 2002-03-12 | Space Systems/Loral, Inc. | Microwave strip transmission lines, beamforming networks and antennas and methods for preparing the same |
US6236287B1 (en) | 1999-05-12 | 2001-05-22 | Raytheon Company | Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities |
JP3710652B2 (ja) * | 1999-08-03 | 2005-10-26 | 三菱電機株式会社 | ストリップライン給電装置 |
JP2001144511A (ja) * | 1999-11-17 | 2001-05-25 | Mitsubishi Electric Corp | 平面型導波路の接続用変換器 |
US6683570B2 (en) * | 2001-03-29 | 2004-01-27 | Tyco Electronics Corporation | Compact multi-band antenna |
US6815739B2 (en) | 2001-05-18 | 2004-11-09 | Corporation For National Research Initiatives | Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates |
-
2003
- 2003-09-03 US US10/654,121 patent/US6992629B2/en not_active Expired - Lifetime
-
2004
- 2004-07-22 AT AT04778731T patent/ATE371965T1/de not_active IP Right Cessation
- 2004-07-22 KR KR1020067004285A patent/KR100733103B1/ko not_active IP Right Cessation
- 2004-07-22 JP JP2006525326A patent/JP4571638B2/ja not_active Expired - Fee Related
- 2004-07-22 DE DE602004008653T patent/DE602004008653T2/de not_active Expired - Lifetime
- 2004-07-22 CA CA2729740A patent/CA2729740C/en not_active Expired - Fee Related
- 2004-07-22 ES ES04778731T patent/ES2290766T3/es not_active Expired - Lifetime
- 2004-07-22 WO PCT/US2004/023358 patent/WO2005025001A1/en active IP Right Grant
- 2004-07-22 DK DK04778731T patent/DK1661207T3/da active
- 2004-07-22 CA CA2525620A patent/CA2525620C/en not_active Expired - Fee Related
- 2004-07-22 AU AU2004303071A patent/AU2004303071B2/en not_active Ceased
- 2004-07-22 EP EP04778731A patent/EP1661207B1/de not_active Expired - Lifetime
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2006
- 2006-03-30 NO NO20061449A patent/NO20061449L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
KR100733103B1 (ko) | 2007-06-28 |
DE602004008653D1 (de) | 2007-10-11 |
US6992629B2 (en) | 2006-01-31 |
CA2729740A1 (en) | 2005-03-17 |
ES2290766T3 (es) | 2008-02-16 |
CA2729740C (en) | 2013-04-02 |
JP4571638B2 (ja) | 2010-10-27 |
EP1661207A1 (de) | 2006-05-31 |
NO20061449L (no) | 2006-03-30 |
AU2004303071A1 (en) | 2005-03-17 |
DK1661207T3 (da) | 2007-09-24 |
AU2004303071B2 (en) | 2008-02-28 |
JP2007504749A (ja) | 2007-03-01 |
EP1661207B1 (de) | 2007-08-29 |
DE602004008653T2 (de) | 2008-06-05 |
CA2525620C (en) | 2011-02-08 |
CA2525620A1 (en) | 2005-03-17 |
KR20060083200A (ko) | 2006-07-20 |
US20050046510A1 (en) | 2005-03-03 |
WO2005025001A1 (en) | 2005-03-17 |
WO2005025001A8 (en) | 2005-10-27 |
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