ATE209849T1 - Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten - Google Patents

Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten

Info

Publication number
ATE209849T1
ATE209849T1 AT98919231T AT98919231T ATE209849T1 AT E209849 T1 ATE209849 T1 AT E209849T1 AT 98919231 T AT98919231 T AT 98919231T AT 98919231 T AT98919231 T AT 98919231T AT E209849 T1 ATE209849 T1 AT E209849T1
Authority
AT
Austria
Prior art keywords
printed circuit
circuit boards
circuit board
turning station
coating plate
Prior art date
Application number
AT98919231T
Other languages
English (en)
Inventor
Kaspar Kuster
Original Assignee
Vantico Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vantico Ag filed Critical Vantico Ag
Application granted granted Critical
Publication of ATE209849T1 publication Critical patent/ATE209849T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1563—Reversing the PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT98919231T 1997-04-24 1998-04-07 Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten ATE209849T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP97106808 1997-04-24
PCT/EP1998/002019 WO1998048605A1 (en) 1997-04-24 1998-04-07 Apparatus for the coating of flat-form substrates, especially of printed circuit boards

Publications (1)

Publication Number Publication Date
ATE209849T1 true ATE209849T1 (de) 2001-12-15

Family

ID=8226727

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98919231T ATE209849T1 (de) 1997-04-24 1998-04-07 Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten

Country Status (11)

Country Link
US (1) US6063191A (de)
EP (1) EP0978225B1 (de)
JP (1) JP2001521679A (de)
KR (1) KR20010012088A (de)
CN (1) CN1253708A (de)
AT (1) ATE209849T1 (de)
CA (1) CA2286017A1 (de)
DE (1) DE69802676T2 (de)
HK (1) HK1023907A1 (de)
TW (1) TW504104U (de)
WO (1) WO1998048605A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1310557B1 (it) * 1999-04-02 2002-02-18 Gisulfo Baccini Apparecchiatura per la produzione di circuiti elettronicimultistrato
DE10131808A1 (de) * 2001-06-30 2003-06-05 Patrizius Payarolla Aufnahmevorrichtung für Profilrahmen
US7008483B2 (en) * 2002-04-19 2006-03-07 Hewlett-Packard Development Company, L.P. Curing printed circuit board coatings
EP1755993B1 (de) * 2004-05-02 2010-01-06 K.J. Maskinfabriken A/S System zum umdrehen von fleischstücken mit einer unregelmässigen geometrischen form
US20060273138A1 (en) * 2005-06-07 2006-12-07 Samsung Electronics Co., Ltd. Soldering apparatus for printed circuit board, soldering method for printed circuit board and soldering cream printing unit for soldering printed circuit board
GB2452320B (en) * 2007-09-03 2012-04-11 Dek Int Gmbh Workpiece processing system and method
KR100988235B1 (ko) * 2008-05-07 2010-10-18 주식회사 유비셀 인쇄회로기판 공급장치
KR100988229B1 (ko) * 2008-05-07 2010-10-18 주식회사 유비셀 인쇄회로기판 공급시스템
JP5553803B2 (ja) * 2011-08-01 2014-07-16 株式会社日立製作所 パネルの印刷装置
JP5242824B1 (ja) * 2012-02-29 2013-07-24 株式会社エヌ・ピー・シー 導電性ペースト塗布機構及びセル配線装置
CN104289380B (zh) * 2014-09-30 2016-09-21 东莞新爱荣机械自动化设备有限公司 一种印制电路板表面喷涂或点胶类的设备
CN104941863B (zh) * 2015-06-03 2017-11-17 喜健环球科技有限公司 一种全自动水平灌涂式pcb板双面涂布机

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3610397A (en) * 1969-03-05 1971-10-05 Epec Systems Corp Method and apparatus for turning over a plate
IT1215384B (it) * 1987-03-13 1990-02-08 Pola E Massa S N C Di Pola C E Dispositivo per il trattamento dipiastre per circuiti stampati, in particolare per pulitura a pomice e sbavatura.
CA2035881C (en) * 1989-07-04 1999-10-12 Sigeru Fukai Apparatus for preparing data recording cards
DE3937071A1 (de) * 1989-11-07 1991-05-08 Kopperschmidt Mueller & Co Vorrichtung und verfahren zum beschichten von plattenfoermigen substraten, wie leiterplatten
DE4107464A1 (de) * 1991-03-08 1992-09-10 Schmid Gmbh & Co Geb Verfahren und vorrichtung zum einseitigen behandeln von plattenfoermigen gegenstaenden
US5240104A (en) * 1992-01-31 1993-08-31 Douglas John J Printed circuit board belt conveyor
EP0637561A1 (de) * 1993-08-04 1995-02-08 Siemens Nixdorf Informationssysteme AG Verfahren und Anordnung zum Umsetzen von Leiterplatten von einer ersten Transportebene auf eine zweite mit etwa gleichem Niveau
JPH08127157A (ja) * 1994-10-28 1996-05-21 Nisca Corp 両面プリンタ及び両面印刷方法
JPH08185461A (ja) * 1994-12-28 1996-07-16 Nisca Corp カード作成機における発行不良カードの処理方法及び装置
DE19527264A1 (de) * 1995-07-26 1997-01-30 Heidelberger Druckmasch Ag Druckmaschine mit geradliniger Substratführung und Wendeeinrichtungen dafür
US5927713A (en) * 1997-09-18 1999-07-27 Bell & Howell Mail Processing Systems Apparatus and method for inverting, staging and diverting sheet articles

Also Published As

Publication number Publication date
CN1253708A (zh) 2000-05-17
DE69802676T2 (de) 2002-05-08
KR20010012088A (ko) 2001-02-15
EP0978225A1 (de) 2000-02-09
WO1998048605A1 (en) 1998-10-29
DE69802676D1 (de) 2002-01-10
CA2286017A1 (en) 1998-10-29
EP0978225B1 (de) 2001-11-28
TW504104U (en) 2002-09-21
JP2001521679A (ja) 2001-11-06
HK1023907A1 (en) 2000-09-22
US6063191A (en) 2000-05-16

Similar Documents

Publication Publication Date Title
DE59705982D1 (de) Vorrichtung zum Transport von Substraten
DE69822528D1 (de) Vorrichtung zum Transportieren und Bearbeiten von Substraten
ATE209849T1 (de) Vorrichtung zum beschichten von plattenförmigen substraten, insbesondere von leiterplatten
AU2529800A (en) Method for the verification of the polarity, presence, alignment of components and short circuits on a printed circuit board
DE59202991D1 (de) Vorrichtung zum Bestücken von Leiterplatten.
IL72040A (en) Flexible,fast processing,photopolymerizable material,and processes for preparing printed circuit boards and for chemical machining based on it
DE69118301T2 (de) Vorrichtung zur Förderung von Leiterplatten
DE69106601D1 (de) Vorrichtung und System zum Stanzen von gedruckten Schaltplatten.
DE60210135D1 (de) Elektronischer schaltungsmodul und verfahren zu dessen bestückung
TW372929B (en) Transport apparatus for thin, board-shaped substrates
DE59700993D1 (de) Einrichtung zur Behandlung von Gegenständen insbesondere Galvanisiereinrichtung für Leiterplatten
DE69328387D1 (de) Leiterplatte mit stützender Randverbinder-Einrichtung, Verfahren für deren Zusammenbau sowie Verbinder zu deren Aufnahme
DE59701790D1 (de) Vorrichtung zum Transport von Substraten
ATE269185T1 (de) Vorrichtung zum laserbearbeiten von werkstücken
FR2770962B1 (fr) Dispositif de maintien pour panneaux de circuit imprime
HK1033737A1 (en) Apparatus for transporting thin boards, in particular printed circuit boards
DE59607923D1 (de) Vorrichtung zum Behandeln von flexiblen platten- bzw. blattförmigen Gegenständen, insbesondere Leiterplatten
DK0760023T3 (da) Indretning til behandling af pladeformede emner, især af printplader
DE9317228U1 (de) Vorrichtung zum Handhaben von Leiterplatten
DK1066209T3 (da) Indretning til behandling af pladeformede arbejdsemner, især printplader
DE59202101D1 (de) Vorrichtung zum Bestücken von Leiterplatten.
DE59300709D1 (de) Vorrichtung zum Überführen von im Schuppenstrom geförderten Druckprodukten.
DE29705707U1 (de) Vorrichtung zum Handling von Leiterplatten
DK0772048T3 (da) Anordning til prøvning af printplader og/eller flade moduler
DE3685688D1 (de) Vorrichtung zum schwall-loeten, insbesondere fuer gedruckte leiterplatten.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee