DE60210135D1 - Elektronischer schaltungsmodul und verfahren zu dessen bestückung - Google Patents

Elektronischer schaltungsmodul und verfahren zu dessen bestückung

Info

Publication number
DE60210135D1
DE60210135D1 DE60210135T DE60210135T DE60210135D1 DE 60210135 D1 DE60210135 D1 DE 60210135D1 DE 60210135 T DE60210135 T DE 60210135T DE 60210135 T DE60210135 T DE 60210135T DE 60210135 D1 DE60210135 D1 DE 60210135D1
Authority
DE
Germany
Prior art keywords
circuit module
boat
electronic circuit
equipping
baseplate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60210135T
Other languages
English (en)
Other versions
DE60210135T2 (de
Inventor
Reinhold Schmitt
Willibald Konrath
Klaus Scholl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson AB
Original Assignee
Marconi Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Communications GmbH filed Critical Marconi Communications GmbH
Application granted granted Critical
Publication of DE60210135D1 publication Critical patent/DE60210135D1/de
Publication of DE60210135T2 publication Critical patent/DE60210135T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Credit Cards Or The Like (AREA)
  • Automatic Assembly (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE60210135T 2001-12-06 2002-12-06 Elektronischer schaltungsmodul und verfahren zu dessen bestückung Expired - Lifetime DE60210135T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10160041A DE10160041A1 (de) 2001-12-06 2001-12-06 Elektronisches Schaltungsmodul und Verfahren zu dessen Montage
DE10160041 2001-12-06
PCT/IB2002/005720 WO2003049513A1 (en) 2001-12-06 2002-12-06 Electric circuit module and method for its assembly

Publications (2)

Publication Number Publication Date
DE60210135D1 true DE60210135D1 (de) 2006-05-11
DE60210135T2 DE60210135T2 (de) 2007-04-12

Family

ID=7708313

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10160041A Withdrawn DE10160041A1 (de) 2001-12-06 2001-12-06 Elektronisches Schaltungsmodul und Verfahren zu dessen Montage
DE60210135T Expired - Lifetime DE60210135T2 (de) 2001-12-06 2002-12-06 Elektronischer schaltungsmodul und verfahren zu dessen bestückung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10160041A Withdrawn DE10160041A1 (de) 2001-12-06 2001-12-06 Elektronisches Schaltungsmodul und Verfahren zu dessen Montage

Country Status (7)

Country Link
US (2) US20050128692A1 (de)
EP (1) EP1464211B8 (de)
CN (1) CN100475000C (de)
AT (1) ATE321438T1 (de)
AU (1) AU2002365778A1 (de)
DE (2) DE10160041A1 (de)
WO (1) WO2003049513A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10327767A1 (de) * 2003-06-18 2005-01-05 Marconi Communications Gmbh Schaltungsbaugruppe und Herstellungsverfahren dafür
DE102006021569A1 (de) * 2006-02-09 2007-08-16 Rohde & Schwarz Gmbh & Co. Kg Prüfsystem für einen Schaltungsträger
EP2635097B1 (de) * 2012-02-28 2021-07-07 Electrolux Home Products Corporation N.V. Elektrischer und/oder elektronischer Schaltkreis mit Leiterplatte, einer separaten Leiterplatte und einem Netzanschluss
USD745476S1 (en) * 2012-10-19 2015-12-15 Solumatics CVBA Print board
US8872328B2 (en) * 2012-12-19 2014-10-28 General Electric Company Integrated power module package
USD753073S1 (en) * 2014-12-30 2016-04-05 Altia Systems, Inc. Printed circuit board
CN107770956A (zh) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 电路板结构
USD804437S1 (en) * 2016-09-30 2017-12-05 Norton (Waterford) Limited Circuit board
TWD189070S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189066S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189071S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189069S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD190983S (zh) * 2017-02-17 2018-06-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189065S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189068S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
TWD189067S (zh) * 2017-02-17 2018-03-11 三星電子股份有限公司 固態硬碟儲存裝置
USD894018S1 (en) 2017-05-31 2020-08-25 D6 Inc. Container
USD848383S1 (en) * 2017-07-13 2019-05-14 Fat Shark Technology SEZC Printed circuit board
USD869470S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD869469S1 (en) * 2018-04-09 2019-12-10 Samsung Electronics Co., Ltd. SSD storage device
USD915310S1 (en) * 2019-02-12 2021-04-06 Analog Devices, Inc. Circuit board
USD918836S1 (en) * 2019-06-17 2021-05-11 Sang Hoon Shin Ionizing coil frame locating ribs
USD909319S1 (en) * 2020-07-08 2021-02-02 Impact Ip, Llc Circuit board

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DE3113031A1 (de) * 1981-04-01 1982-10-21 Hagenuk GmbH, 2300 Kiel "handhabungsvorrichtung fuer leiterplatten"
US4426773A (en) * 1981-05-15 1984-01-24 General Electric Ceramics, Inc. Array of electronic packaging substrates
US5044615A (en) * 1991-02-08 1991-09-03 International Business Machines Corporation Dual purpose work board holder
US5142239A (en) * 1991-05-20 1992-08-25 Motorola, Inc. High frequency linear amplifier assembly
US6219908B1 (en) * 1991-06-04 2001-04-24 Micron Technology, Inc. Method and apparatus for manufacturing known good semiconductor die
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US5479694A (en) * 1993-04-13 1996-01-02 Micron Technology, Inc. Method for mounting integrated circuits onto printed circuit boards and testing
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
US5457605A (en) * 1993-11-23 1995-10-10 Motorola, Inc. Electronic device having coplanar heatsink and electrical contacts
JP3225457B2 (ja) * 1995-02-28 2001-11-05 株式会社日立製作所 半導体装置
DE19511486A1 (de) * 1995-03-29 1996-10-02 Bosch Gmbh Robert Verfahren zur Herstellung einer Leiterplattenanordnung
JP2001244279A (ja) * 2000-02-25 2001-09-07 Nec Niigata Ltd 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置
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Also Published As

Publication number Publication date
EP1464211B1 (de) 2006-03-22
ATE321438T1 (de) 2006-04-15
WO2003049513A1 (en) 2003-06-12
US20050128692A1 (en) 2005-06-16
EP1464211A1 (de) 2004-10-06
US20070294889A1 (en) 2007-12-27
CN100475000C (zh) 2009-04-01
CN1618261A (zh) 2005-05-18
DE60210135T2 (de) 2007-04-12
AU2002365778A1 (en) 2003-06-17
DE10160041A1 (de) 2003-09-25
EP1464211B8 (de) 2006-08-16

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Legal Events

Date Code Title Description
8381 Inventor (new situation)

Inventor name: MUELLER, ULF, DR., 71522 BACKNANG, DE

Inventor name: SCHMITT, REINHOLD, 71546 ASPACH, DE

Inventor name: KONRATH, WILLIBALD, 71554 COTTENWEILLER, DE

Inventor name: SCHOLL, KLAUS, 71522 BACKNANG, DE

8332 No legal effect for de
8370 Indication related to discontinuation of the patent is to be deleted
8327 Change in the person/name/address of the patent owner

Owner name: ERICSSON AB, STOCKHOLM, SE

8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: 2K PATENTANWAELTE BLASBERG KEWITZ & REICHEL, PARTN