DE69822528D1 - Vorrichtung zum Transportieren und Bearbeiten von Substraten - Google Patents
Vorrichtung zum Transportieren und Bearbeiten von SubstratenInfo
- Publication number
- DE69822528D1 DE69822528D1 DE69822528T DE69822528T DE69822528D1 DE 69822528 D1 DE69822528 D1 DE 69822528D1 DE 69822528 T DE69822528 T DE 69822528T DE 69822528 T DE69822528 T DE 69822528T DE 69822528 D1 DE69822528 D1 DE 69822528D1
- Authority
- DE
- Germany
- Prior art keywords
- transporting
- processing substrates
- substrates
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2210997 | 1997-01-21 | ||
JP2210997 | 1997-01-21 | ||
JP2950697 | 1997-01-29 | ||
JP02950697A JP3341978B2 (ja) | 1997-01-29 | 1997-01-29 | 洗浄システム |
JP11657197A JP3248129B2 (ja) | 1997-01-21 | 1997-04-18 | 基板搬送処理装置 |
JP11657197 | 1997-04-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69822528D1 true DE69822528D1 (de) | 2004-04-29 |
DE69822528T2 DE69822528T2 (de) | 2005-02-03 |
Family
ID=27283718
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69822528T Expired - Lifetime DE69822528T2 (de) | 1997-01-21 | 1998-01-20 | Vorrichtung zum Transportieren und Bearbeiten von Substraten |
Country Status (5)
Country | Link |
---|---|
US (1) | US6009890A (de) |
EP (1) | EP0854499B1 (de) |
KR (1) | KR100406337B1 (de) |
DE (1) | DE69822528T2 (de) |
TW (1) | TW411490B (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6799932B2 (en) | 1994-04-28 | 2004-10-05 | Semitool, Inc. | Semiconductor wafer processing apparatus |
US6723174B2 (en) | 1996-03-26 | 2004-04-20 | Semitool, Inc. | Automated semiconductor processing system |
US6942738B1 (en) * | 1996-07-15 | 2005-09-13 | Semitool, Inc. | Automated semiconductor processing system |
US6736148B2 (en) | 1997-05-05 | 2004-05-18 | Semitool, Inc. | Automated semiconductor processing system |
US6138694A (en) * | 1998-03-06 | 2000-10-31 | Scp Global Technologies | Multiple stage wet processing platform and method of use |
DE19910478C2 (de) * | 1998-03-12 | 2002-02-28 | Tokyo Electron Ltd | Substrattransportverfahren und Substratbearbeitungssystem |
US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US7039495B1 (en) * | 1998-12-08 | 2006-05-02 | Advance Micro Devices, Inc. | Management of multiple types of empty carriers in automated material handling systems |
US6575177B1 (en) | 1999-04-27 | 2003-06-10 | Applied Materials Inc. | Semiconductor substrate cleaning system |
US7108752B2 (en) * | 2000-06-05 | 2006-09-19 | Tokyo Electron Limited | Liquid processing apparatus and liquid processing method |
JP4505563B2 (ja) * | 2000-06-30 | 2010-07-21 | 東京エレクトロン株式会社 | 液処理装置 |
KR100797435B1 (ko) | 2000-06-30 | 2008-01-24 | 동경 엘렉트론 주식회사 | 액처리장치 |
EP1332349A4 (de) * | 2000-07-07 | 2008-12-17 | Semitool Inc | Automatisiertes verarbeitungssystem |
US6564469B2 (en) * | 2001-07-09 | 2003-05-20 | Motorola, Inc. | Device for performing surface treatment on semiconductor wafers |
JP2005520321A (ja) * | 2001-07-16 | 2005-07-07 | アシスト テクノロジーズ インコーポレイテッド | ツールのフロントエンド加工物処理のための統合システム |
JP2005294280A (ja) * | 2002-04-12 | 2005-10-20 | Hirata Corp | 密閉容器搬送システム |
WO2003105216A1 (ja) * | 2002-06-07 | 2003-12-18 | 平田機工株式会社 | 容器搬送システム |
US20040060582A1 (en) * | 2002-09-18 | 2004-04-01 | Dainippon Screen Mfg.Co., Ltd. | Substrate processing apparatus |
CN1875454A (zh) * | 2003-10-28 | 2006-12-06 | 诺信公司 | 等离子处理***和等离子处理工艺 |
US7720557B2 (en) * | 2003-11-06 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US7218983B2 (en) * | 2003-11-06 | 2007-05-15 | Applied Materials, Inc. | Method and apparatus for integrating large and small lot electronic device fabrication facilities |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
WO2005084267A2 (en) * | 2004-02-27 | 2005-09-15 | Georgia Tech Research Corporation | Harmonic cmut devices and fabrication methods |
US7274971B2 (en) | 2004-02-28 | 2007-09-25 | Applied Materials, Inc. | Methods and apparatus for electronic device manufacturing system monitoring and control |
TWI290875B (en) * | 2004-02-28 | 2007-12-11 | Applied Materials Inc | Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
TWI316044B (en) | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
US7578650B2 (en) * | 2004-07-29 | 2009-08-25 | Kla-Tencor Technologies Corporation | Quick swap load port |
EP1803151B1 (de) * | 2004-08-23 | 2011-10-05 | Murata Machinery, Ltd. | Werkzeuglade- und pufferungssystem auf liftbasis |
US7730898B2 (en) * | 2005-03-01 | 2010-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor wafer lifter |
JP2007036189A (ja) * | 2005-06-24 | 2007-02-08 | Dainippon Screen Mfg Co Ltd | 基板保持具および基板処理装置 |
JP4378656B2 (ja) * | 2007-03-07 | 2009-12-09 | 株式会社ダイフク | 物品搬送設備 |
US8033288B2 (en) * | 2007-03-09 | 2011-10-11 | Dainippon Screen Mfg. Co., Ltd. | Substrate treatment apparatus |
US20090016853A1 (en) * | 2007-07-09 | 2009-01-15 | Woo Sik Yoo | In-line wafer robotic processing system |
DE102007035839B4 (de) * | 2007-07-31 | 2017-06-22 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Verfahren und System zum lokalen Aufbewahren von Substratbehältern in einem Deckentransportsystem zum Verbessern der Aufnahme/Abgabe-Kapazitäten von Prozessanlagen |
KR100909988B1 (ko) | 2007-08-21 | 2009-07-29 | 세메스 주식회사 | 캐리어 이송 장치 및 이를 갖는 기판 세정 시스템 |
JP4828503B2 (ja) * | 2007-10-16 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置、基板搬送方法、コンピュータプログラムおよび記憶媒体 |
US8372238B2 (en) | 2008-05-20 | 2013-02-12 | Nordson Corporation | Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes |
KR101181560B1 (ko) * | 2008-09-12 | 2012-09-10 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그것에 사용되는 기판반송장치 |
JP5284808B2 (ja) | 2009-01-26 | 2013-09-11 | 株式会社Sokudo | ストッカー装置及び基板処理装置 |
US8226795B2 (en) * | 2009-02-03 | 2012-07-24 | Nordson Corporation | Magnetic clips and substrate holders for use in a plasma processing system |
JP5187274B2 (ja) * | 2009-05-28 | 2013-04-24 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
US9004788B2 (en) * | 2010-06-08 | 2015-04-14 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
KR101708420B1 (ko) * | 2010-09-15 | 2017-02-21 | 삼성디스플레이 주식회사 | 기판 증착 시스템 및 이를 이용한 증착 방법 |
KR101799217B1 (ko) | 2013-09-30 | 2017-11-17 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치, 반도체 장치의 제조 방법 및 기록 매체 |
KR102249316B1 (ko) | 2014-08-18 | 2021-05-07 | 삼성전자주식회사 | 웨이퍼 캐리어 |
JP6704423B2 (ja) * | 2018-01-17 | 2020-06-03 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の製造方法およびプログラム |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH641708A5 (de) * | 1979-11-02 | 1984-03-15 | Sinter Ltd | Vorrichtung zum aufbringen von lot auf leiterplatten. |
US4715392A (en) * | 1983-11-10 | 1987-12-29 | Nippon Kogaku K. K. | Automatic photomask or reticle washing and cleaning system |
US4693777A (en) * | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
DE3529313A1 (de) * | 1985-08-14 | 1987-02-26 | Schering Ag | Automatische transport- und behandlungseinrichtung fuer waren, insbesondere leiterplatten |
JPS63140523A (ja) * | 1986-12-03 | 1988-06-13 | Hitachi Ltd | 処理装置 |
US5158616A (en) * | 1988-07-22 | 1992-10-27 | Tokyo Electron Limited | Apparatus for cleaning a substrate |
JP2915458B2 (ja) * | 1989-12-26 | 1999-07-05 | 東芝セラミックス株式会社 | 半導体ウェーハ洗浄装置 |
JP2644912B2 (ja) * | 1990-08-29 | 1997-08-25 | 株式会社日立製作所 | 真空処理装置及びその運転方法 |
DE4107464A1 (de) * | 1991-03-08 | 1992-09-10 | Schmid Gmbh & Co Geb | Verfahren und vorrichtung zum einseitigen behandeln von plattenfoermigen gegenstaenden |
JPH05259136A (ja) * | 1992-03-12 | 1993-10-08 | Tokyo Electron Ltd | 洗浄処理装置 |
US5379784A (en) * | 1993-01-23 | 1995-01-10 | Tokyo Electron Limited | Apparatus for cleaning conveyor chuck |
JP2928432B2 (ja) * | 1993-02-16 | 1999-08-03 | 東京エレクトロン株式会社 | 半導体ウエハの蒸気乾燥装置及びその消火方法及び洗浄システム |
US5485644A (en) * | 1993-03-18 | 1996-01-23 | Dainippon Screen Mfg. Co., Ltd. | Substrate treating apparatus |
JP3347814B2 (ja) * | 1993-05-17 | 2002-11-20 | 大日本スクリーン製造株式会社 | 基板の洗浄・乾燥処理方法並びにその処理装置 |
KR100236412B1 (ko) * | 1993-08-18 | 1999-12-15 | 다카시마 히로시 | 반도체처리시스템의세정장치 |
JP3210154B2 (ja) * | 1993-09-14 | 2001-09-17 | エス・イー・エス株式会社 | 基板の姿勢変換装置 |
JP3273694B2 (ja) * | 1994-03-29 | 2002-04-08 | 東京エレクトロン株式会社 | 処理装置及び処理方法 |
JP3328481B2 (ja) * | 1995-10-13 | 2002-09-24 | 東京エレクトロン株式会社 | 処理方法および装置 |
US5795405A (en) * | 1996-03-13 | 1998-08-18 | Eric F. Harnden | Machine and method for processing of printed circuit boards by immersion in transversely flowing liquid chemical |
-
1998
- 1998-01-15 US US09/007,753 patent/US6009890A/en not_active Expired - Lifetime
- 1998-01-19 TW TW087100647A patent/TW411490B/zh not_active IP Right Cessation
- 1998-01-20 DE DE69822528T patent/DE69822528T2/de not_active Expired - Lifetime
- 1998-01-20 EP EP98300405A patent/EP0854499B1/de not_active Expired - Lifetime
- 1998-01-21 KR KR10-1998-0002510A patent/KR100406337B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0854499B1 (de) | 2004-03-24 |
TW411490B (en) | 2000-11-11 |
KR100406337B1 (ko) | 2004-04-03 |
US6009890A (en) | 2000-01-04 |
DE69822528T2 (de) | 2005-02-03 |
EP0854499A3 (de) | 1998-10-14 |
KR19980070919A (ko) | 1998-10-26 |
EP0854499A2 (de) | 1998-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |