ATE172837T1 - Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren - Google Patents

Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren

Info

Publication number
ATE172837T1
ATE172837T1 AT94909504T AT94909504T ATE172837T1 AT E172837 T1 ATE172837 T1 AT E172837T1 AT 94909504 T AT94909504 T AT 94909504T AT 94909504 T AT94909504 T AT 94909504T AT E172837 T1 ATE172837 T1 AT E172837T1
Authority
AT
Austria
Prior art keywords
squares
grid
circuit board
shielding
grids
Prior art date
Application number
AT94909504T
Other languages
English (en)
Inventor
Edward D Suski
Original Assignee
Ast Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/012,547 external-priority patent/US5300899A/en
Application filed by Ast Research Inc filed Critical Ast Research Inc
Application granted granted Critical
Publication of ATE172837T1 publication Critical patent/ATE172837T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/085—Triplate lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Golf Clubs (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Treating Waste Gases (AREA)
  • Biological Treatment Of Waste Water (AREA)
AT94909504T 1993-02-02 1994-02-01 Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren ATE172837T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/012,547 US5300899A (en) 1993-02-02 1993-02-02 Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US10916093A 1993-08-19 1993-08-19

Publications (1)

Publication Number Publication Date
ATE172837T1 true ATE172837T1 (de) 1998-11-15

Family

ID=26683697

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94909504T ATE172837T1 (de) 1993-02-02 1994-02-01 Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren

Country Status (10)

Country Link
US (1) US5682124A (de)
EP (1) EP0682852B1 (de)
JP (1) JPH08506696A (de)
KR (1) KR100301363B1 (de)
CN (1) CN1044306C (de)
AT (1) ATE172837T1 (de)
AU (1) AU6232994A (de)
CA (1) CA2154156C (de)
DE (1) DE69414237T2 (de)
WO (1) WO1994018812A1 (de)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5410107A (en) * 1993-03-01 1995-04-25 The Board Of Trustees Of The University Of Arkansas Multichip module
DE59703635D1 (de) * 1996-04-04 2001-07-05 Langer Guenter Anordnung zur Reduzierung der elektromagnetischen Abstrahlung bei Leiterkarten und anderen Trägern elektronischer Schaltungen
US5764489A (en) * 1996-07-18 1998-06-09 Compaq Computer Corporation Apparatus for controlling the impedance of high speed signals on a printed circuit board
JP3185048B2 (ja) 1996-10-04 2001-07-09 モレックス インコーポレーテッド 平型柔軟ケーブル
US5912809A (en) * 1997-01-21 1999-06-15 Dell Usa, L.P. Printed circuit board (PCB) including channeled capacitive plane structure
US6012928A (en) * 1998-08-28 2000-01-11 Molex Incorporated Microstrip edge card connector
US6225568B1 (en) * 1998-08-31 2001-05-01 Advanced Flexible Circuits Co., Ltd. Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time
US6150895A (en) * 1999-01-25 2000-11-21 Dell Usa, L.P. Circuit board voltage plane impedance matching
US6225687B1 (en) * 1999-09-02 2001-05-01 Intel Corporation Chip package with degassing holes
WO2001067837A1 (fr) * 2000-03-06 2001-09-13 Fujitsu Limited Plaque metallique blindee et dispositif a circuit utilisant cette plaque metallique blindee
JP4680410B2 (ja) * 2001-04-24 2011-05-11 日本特殊陶業株式会社 配線基板
JP4540262B2 (ja) * 2001-06-28 2010-09-08 京セラ株式会社 配線基板およびこれを用いた半導体装置
JP4063533B2 (ja) * 2001-12-10 2008-03-19 日本碍子株式会社 フレキシブル配線板
US6977345B2 (en) * 2002-01-08 2005-12-20 International Business Machines Corporation Vents with signal image for signal return path
US7739624B2 (en) * 2002-07-29 2010-06-15 Synopsys, Inc. Methods and apparatuses to generate a shielding mesh for integrated circuit devices
US7943436B2 (en) * 2002-07-29 2011-05-17 Synopsys, Inc. Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
DE602004028349D1 (de) 2003-03-04 2010-09-09 Rohm & Haas Elect Mat Koaxiale wellenleitermikrostrukturen und verfahern zu ihrer bildung
US7259968B2 (en) 2003-05-14 2007-08-21 Hewlett-Packard Development Company, L.P. Tailoring impedances of conductive traces in a circuit board
US20110298567A1 (en) * 2004-09-24 2011-12-08 Oracle America, Inc., formerly known as Sun Microsystems, Inc. System and method for constant characteristic impedance in a flexible trace interconnect array
JP2006100699A (ja) * 2004-09-30 2006-04-13 Toshiba Corp プリント配線板、情報処理装置、及びプリント配線板の製造方法
US7528797B2 (en) * 2005-08-29 2009-05-05 Kyocera Wireless Corp. Electrical connector with frequency-tuned groundplane
US7292454B2 (en) * 2004-12-03 2007-11-06 Dell Products L.P. System and method for optimizing printed circuit boards to minimize effects of non-uniform dielectric
JP2007179995A (ja) * 2005-12-28 2007-07-12 Adorinkusu:Kk 可撓性平面ケーブル
US20070227762A1 (en) * 2006-04-04 2007-10-04 Compeq Manufacturing Company Limited Multilayer circuit board with grounding grids and method for controlling characteristic impedance of the multilayer circuit board
CN101207968B (zh) * 2006-12-22 2011-11-09 鸿富锦精密工业（深圳）有限公司 电路板
TWI364399B (en) 2006-12-30 2012-05-21 Rohm & Haas Elect Mat Three-dimensional microstructures and methods of formation thereof
KR101472134B1 (ko) 2007-03-20 2014-12-15 누보트로닉스, 엘.엘.씨 동축 전송선 마이크로구조물 및 그의 형성방법
US7755174B2 (en) 2007-03-20 2010-07-13 Nuvotonics, LLC Integrated electronic components and methods of formation thereof
JP4912960B2 (ja) * 2007-06-06 2012-04-11 日本メクトロン株式会社 プリント配線板
KR100850217B1 (ko) * 2007-07-05 2008-08-04 삼성전자주식회사 임피던스 매칭된 분기 스트립 전송라인을 갖는 프린트배선기판
CN101472386B (zh) * 2007-12-26 2012-03-28 鸿富锦精密工业（深圳）有限公司 印刷电路板
US8629841B2 (en) * 2008-04-30 2014-01-14 Apple Inc. Multi-touch sensor patterns and stack-ups
US8138857B2 (en) * 2008-06-24 2012-03-20 International Business Machines Corporation Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
US8193878B2 (en) * 2008-06-24 2012-06-05 International Business Machines Corporation Structure, structure and method for providing an on-chip variable delay transmission line with fixed characteristic impedance
US8011950B2 (en) 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
US8659371B2 (en) * 2009-03-03 2014-02-25 Bae Systems Information And Electronic Systems Integration Inc. Three-dimensional matrix structure for defining a coaxial transmission line channel
US8058954B2 (en) * 2009-03-05 2011-11-15 Apple Inc. Transmission line with a cross-hatched ground plane that is either filled with conductive paint or covered by a conductive foil
JP2010212438A (ja) * 2009-03-10 2010-09-24 Sumitomo Bakelite Co Ltd 回路基板
WO2010103722A1 (ja) * 2009-03-10 2010-09-16 住友ベークライト株式会社 回路基板
US20110123783A1 (en) 2009-11-23 2011-05-26 David Sherrer Multilayer build processses and devices thereof
US8917150B2 (en) 2010-01-22 2014-12-23 Nuvotronics, Llc Waveguide balun having waveguide structures disposed over a ground plane and having probes located in channels
KR101796098B1 (ko) 2010-01-22 2017-11-10 누보트로닉스, 인크. 열관리
JP4922417B2 (ja) 2010-01-29 2012-04-25 株式会社東芝 電子機器および回路基板
TWI395519B (zh) * 2010-06-28 2013-05-01 Wistron Neweb Corp 具跳線結構之電路板
FR2966692B1 (fr) 2010-10-26 2012-12-14 Sagem Defense Securite Carte electronique, dispositif electronique comportant une telle carte et procede de protection d'une carte electronique
JP2012094646A (ja) * 2010-10-26 2012-05-17 Daisho Denshi Co Ltd 特性インピーダンスコントロール対応プリント配線基板
KR101405068B1 (ko) * 2010-12-03 2014-06-20 가부시키가이샤 무라타 세이사쿠쇼 고주파 신호 선로
US8866300B1 (en) 2011-06-05 2014-10-21 Nuvotronics, Llc Devices and methods for solder flow control in three-dimensional microstructures
US8814601B1 (en) 2011-06-06 2014-08-26 Nuvotronics, Llc Batch fabricated microconnectors
EP2731783A4 (de) 2011-07-13 2016-03-09 Nuvotronics Llc Verfahren zur herstellung von elektronischen und mechanischen strukturen
GB201119046D0 (en) * 2011-11-04 2011-12-14 Rolls Royce Plc Electrial harness
WO2014020999A1 (ja) * 2012-07-30 2014-02-06 株式会社村田製作所 フラットケーブル
US9325044B2 (en) 2013-01-26 2016-04-26 Nuvotronics, Inc. Multi-layer digital elliptic filter and method
US9306255B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
US9306254B1 (en) 2013-03-15 2016-04-05 Nuvotronics, Inc. Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
TWI578856B (zh) * 2013-06-19 2017-04-11 Adv Flexible Circuits Co Ltd Anti - Attenuation Control Structure of High Frequency Signal Transmission Line on Flexible Circuit Board
CN103796424B (zh) * 2014-01-06 2017-06-27 联想(北京)有限公司 一种多层电路板及其阻抗控制方法
KR20160133422A (ko) 2014-01-17 2016-11-22 누보트로닉스, 인크. 웨이퍼 규모 테스트 인터페이스 유닛 및 컨택터
JP6324738B2 (ja) * 2014-01-27 2018-05-16 ルネサスエレクトロニクス株式会社 半導体装置
JP6300156B2 (ja) * 2014-03-31 2018-03-28 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
US10847469B2 (en) 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016094129A1 (en) 2014-12-03 2016-06-16 Nuvotronics, Inc. Systems and methods for manufacturing stacked circuits and transmission lines
CN107852813A (zh) * 2015-07-30 2018-03-27 莱尔德技术股份有限公司 用于emi减轻的频率选择性结构
TWI579869B (zh) * 2015-09-14 2017-04-21 瑞昱半導體股份有限公司 積體電感／變壓器的屏蔽結構
CN105552063A (zh) * 2016-02-03 2016-05-04 深圳佰维存储科技有限公司 Sip封装结构
DE102017101478A1 (de) * 2017-01-26 2018-07-26 Rheinmetall Waffe Munition Gmbh Vorrichtung zum Entlüften oder Belüften eines Raumes
CN107204322A (zh) * 2017-05-03 2017-09-26 中国电子科技集团公司第五十五研究所 多芯片集成式cqfp陶瓷外壳及其制作方法
KR102060739B1 (ko) * 2017-07-03 2019-12-31 (주)잉크테크 전자파 차폐 기능을 갖는 회로기판과 이의 제조방법 및 이를 이용한 평판 케이블
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
JP2018117131A (ja) * 2018-02-15 2018-07-26 三菱電機株式会社 フレキシブルプリント回路基板
WO2020092334A2 (en) * 2018-10-29 2020-05-07 Cellink Corporation Flexible hybrid interconnect circuits
WO2020097361A1 (en) * 2018-11-07 2020-05-14 Meditrina, Inc. Endoscope and method of use
CN111295039A (zh) * 2020-02-26 2020-06-16 安捷利电子科技（苏州）有限公司 一种线路板及电子设备
CN113392613B (zh) * 2020-03-13 2023-07-21 浙江宇视科技有限公司 一种电路板布线方法、***及装置
WO2024103438A1 (zh) * 2022-11-15 2024-05-23 奥士康科技股份有限公司 网格屏蔽结构的线路阻抗计算方法及***、设备、介质

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2721312A (en) * 1951-06-30 1955-10-18 Itt Microwave cable
US3612744A (en) * 1969-02-27 1971-10-12 Hughes Aircraft Co Flexible flat conductor cable of variable electrical characteristics
US3634782A (en) * 1969-10-01 1972-01-11 Thomas & Betts Corp Coaxial flat cable
US3654381A (en) * 1970-06-26 1972-04-04 Surprenant Inc Woven flat conductor
GB1324023A (en) * 1970-10-01 1973-07-18 Int Computers Ltd Circuit interconnecting cables and methods of making such cables
US3923364A (en) * 1973-12-06 1975-12-02 Executone Inf Sys Inc Shielded flexible conductor cable and assembly thereof
US3914531A (en) * 1974-03-29 1975-10-21 Amp Inc Power isolated transmission cable assembly
US4367585A (en) * 1979-12-26 1983-01-11 Western Electric Company, Inc. Methods for the termination and connectorization of multi-conductor flat cable
DE3025362C2 (de) * 1980-07-04 1982-11-04 Ewald Max Christian Dipl.-Phys. 6000 Frankfurt Hennig Kraftaufnehmer
US4408255A (en) * 1981-01-12 1983-10-04 Harold Adkins Absorptive electromagnetic shielding for high speed computer applications
US4689262A (en) * 1984-05-21 1987-08-25 Cts Corporation Electrically insulating substrate
US4695810A (en) * 1984-10-22 1987-09-22 Harris Corporation Waffleline-configured microwave transmission link
JPH0642515B2 (ja) * 1984-12-26 1994-06-01 株式会社東芝 回路基板
US4642592A (en) * 1985-04-26 1987-02-10 Tektronix, Inc. Grounding and supporting metal mesh
US4644092A (en) * 1985-07-18 1987-02-17 Amp Incorporated Shielded flexible cable
US4845313A (en) * 1985-07-22 1989-07-04 Tokyo Communication Equipment Co., Ltd. Metallic core wiring substrate
US4695694A (en) * 1986-02-14 1987-09-22 Fusion Systems Corporation Structure for minimizing microwave leakage
JPS62251136A (ja) * 1986-04-25 1987-10-31 三菱樹脂株式会社 金属複合積層板
DE3625631A1 (de) * 1986-07-29 1988-02-04 Gore W L & Co Gmbh Elektromagnetische abschirmung
JPS6480094A (en) * 1987-09-19 1989-03-24 Nippon Cmk Kk Printed wiring board
US4855537A (en) * 1987-09-25 1989-08-08 Kabushiki Kaisha Toshiba Wiring substrate having mesh-shaped earth line
EP0322720A3 (de) * 1987-12-25 1990-01-17 Asahi Glass Company Ltd. Durchsichtiger Körper zur Abschirmung gegen elektromagnetische Wellen
US4825090A (en) * 1988-02-09 1989-04-25 Grabis Dietrich W Shielding membrane
US4857119A (en) * 1988-03-01 1989-08-15 General Dynamics Lands Systems, Inc. Case-Hardened plate armor and method of making
US5014593A (en) * 1988-03-01 1991-05-14 General Dynamics Land Systems, Inc. Perforated plate armor
JPH0268571A (ja) * 1988-09-02 1990-03-08 Konica Corp 画像形成装置に於けるプリント基板
US5012041A (en) * 1989-06-22 1991-04-30 The Curran Company Screened window for shielded enclosure
US5202688A (en) * 1989-10-02 1993-04-13 Brunswick Corporation Bulk RF absorber apparatus and method
FR2653599B1 (fr) * 1989-10-23 1991-12-20 Commissariat Energie Atomique Materiau composite stratifie presentant des proprietes electromagnetiques absorbantes et son procede de fabrication.
JPH0476996A (ja) * 1990-07-18 1992-03-11 Cmk Corp プリント配線板の製造方法
JPH04151899A (ja) * 1990-10-15 1992-05-25 Cmk Corp 電磁波シールドプリント配線板の製造方法
US5177324A (en) * 1991-08-19 1993-01-05 Motorola, Inc. In situ RF shield for printed circuit board
US5293004A (en) * 1991-09-02 1994-03-08 Nippon Cmk Corp. Printed circuit board having an electromagnetic shielding layer
US5235132A (en) * 1992-01-29 1993-08-10 W. L. Gore & Associates, Inc. Externally and internally shielded double-layered flat cable assembly
US5195243A (en) * 1992-02-28 1993-03-23 General Motors Corporation Method of making a coated porous metal panel
US5300899A (en) * 1993-02-02 1994-04-05 Ast Research, Inc. Thin, flexible, stripline flex cable having two shielding ground planes formed as grids having mutually offset grid patterns
US5296651A (en) * 1993-02-09 1994-03-22 Hewlett-Packard Company Flexible circuit with ground plane
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board

Also Published As

Publication number Publication date
CA2154156C (en) 2005-04-26
EP0682852A1 (de) 1995-11-22
DE69414237T2 (de) 1999-06-02
CA2154156A1 (en) 1994-08-18
AU6232994A (en) 1994-08-29
KR100301363B1 (ko) 2001-11-22
JPH08506696A (ja) 1996-07-16
WO1994018812A1 (en) 1994-08-18
CN1119903A (zh) 1996-04-03
EP0682852B1 (de) 1998-10-28
DE69414237D1 (de) 1998-12-03
US5682124A (en) 1997-10-28
KR960700626A (ko) 1996-01-20
CN1044306C (zh) 1999-07-21

Similar Documents

Publication Publication Date Title
ATE172837T1 (de) Leiterplattenanordnung mit abschirmungsgittern und herstellungsverfahren
US3757028A (en) Terference printed board and similar transmission line structure for reducing in
CA2103966C (en) Connector for communication systems with cancelled crosstalk
US4707671A (en) Electrical transmission line
US6300846B1 (en) Flat flexible cable with ground conductors
US5360949A (en) Printed circuit board
GB1432793A (en) Flat electric cables
US5334800A (en) Flexible shielded circuit board
TW331671B (en) Reference plane requiring no conductor and grid alignment
TW367635B (en) Improved high frequency electrical connector
ATE147194T1 (de) Steckverbinder mit erdungsstruktur
GB1449209A (en) Electrical connection board
CA2123260A1 (en) Communications connector terminal arrays having noise cancelling capabilities
JPH0757563A (ja) 電気ケーブル
ATE13605T1 (de) Abgeschirmtes elektrisches kabel.
GB1282371A (en) Coaxial circuit construction and method of making
US4443805A (en) Plate-type antenna with double circular loops
JPS6448311A (en) Shielded tape wire
EP1036427A1 (de) Ein verfahren zum reduzieren von hochfrequenzkupplung zwischen leiterpaaren eines verbinders und ein verbinder zum übertragen von differentiellen signalen.
EP0204446A2 (de) Elektrische Transmissionsleitung
US20030214421A1 (en) Device for the transmission of electric signals between at least two units mobile relative to each other
CN112770493B (zh) 柔性线路板及电子设备
GB1502977A (en) Multilayer printed circuit boards
FI90935B (fi) Koaksiaalisen siirtojohdon asennusmenetelmä painetulle piirilevylle
ATE344971T1 (de) Isolator für elektrische leiter mit aussenabschirmung.

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties