AR098329A1 - Unir materiales disímiles usando una composición de resina epóxica - Google Patents
Unir materiales disímiles usando una composición de resina epóxicaInfo
- Publication number
- AR098329A1 AR098329A1 ARP140104177A ARP140104177A AR098329A1 AR 098329 A1 AR098329 A1 AR 098329A1 AR P140104177 A ARP140104177 A AR P140104177A AR P140104177 A ARP140104177 A AR P140104177A AR 098329 A1 AR098329 A1 AR 098329A1
- Authority
- AR
- Argentina
- Prior art keywords
- epoxy resin
- resin composition
- materials
- disimile
- join
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 5
- 239000000203 mixture Substances 0.000 title abstract 5
- 229920000647 polyepoxide Polymers 0.000 title abstract 5
- 239000000463 material Substances 0.000 title abstract 2
- 239000003990 capacitor Substances 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 2
- 230000007613 environmental effect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/128—Adhesives without diluent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
- C09J2400/123—Ceramic in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Se divulga una composición de resina epóxica para unir materiales disímiles. Las composiciones de resina epóxica identificadas pueden ser usadas para sellar componentes metálicos y no metálicos de un capacitor. Específicamente, la composición de resina epóxica puede ser aplicada a juntas entre un forro aislado no metálico de capacitor y una cubierta de tanque metálica y una tapa de terminal metálica. Una vez que se cura la composición de resina epóxica, puede proveer un sello que puede soportar los esfuerzos y las condiciones ambientales a las cuales se somete el capacitor.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/075,350 US9490067B2 (en) | 2013-11-08 | 2013-11-08 | Joining dissimilar materials using an epoxy resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
AR098329A1 true AR098329A1 (es) | 2016-05-26 |
Family
ID=53042008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP140104177A AR098329A1 (es) | 2013-11-08 | 2014-11-06 | Unir materiales disímiles usando una composición de resina epóxica |
Country Status (8)
Country | Link |
---|---|
US (2) | US9490067B2 (es) |
EP (1) | EP3066170B1 (es) |
KR (1) | KR102288169B1 (es) |
CN (1) | CN105683318B (es) |
AR (1) | AR098329A1 (es) |
AU (1) | AU2014346929B2 (es) |
BR (1) | BR112016008163B1 (es) |
WO (1) | WO2015069676A1 (es) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016043290A1 (ja) * | 2014-09-19 | 2016-03-24 | ヤマウチ株式会社 | 産業用ロールおよびその製造方法 |
US10253956B2 (en) | 2015-08-26 | 2019-04-09 | Abl Ip Holding Llc | LED luminaire with mounting structure for LED circuit board |
CN108467686A (zh) * | 2017-02-23 | 2018-08-31 | 海门市瑞泰纺织科技有限公司 | 在绝缘材料与金属组件之间形成固化密封的方法及应用 |
JP6912316B2 (ja) * | 2017-08-01 | 2021-08-04 | 株式会社日立製作所 | 樹脂金属複合体の解体方法 |
US10251279B1 (en) | 2018-01-04 | 2019-04-02 | Abl Ip Holding Llc | Printed circuit board mounting with tabs |
US10818434B2 (en) * | 2018-04-11 | 2020-10-27 | Eaton Intelligent Power Limited | Adaptor for a capacitor |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2333354A (en) | 1940-03-06 | 1943-11-02 | Electric Transmission Ltd | Electric fuse of cartridge type |
US2922927A (en) * | 1956-03-29 | 1960-01-26 | Ohio Brass Co | Electrical apparatus bushing |
US2977414A (en) | 1957-12-06 | 1961-03-28 | Peter G S Mero | Control system |
US3140859A (en) | 1961-01-17 | 1964-07-14 | Internat Ultrasonics Inc | Electroacoustic sandwich transducers |
US3275358A (en) * | 1963-03-14 | 1966-09-27 | Gen Electric | Glass-to-metal and glass-to-ceramic seals |
GB1060528A (en) | 1964-12-08 | 1967-03-01 | Siemens Ag | Process for the production of torsion-resistant metal-ceramic connections |
US3368175A (en) | 1966-04-08 | 1968-02-06 | Gen Electric | Voltage lead entrance for encapsulated electrical devices |
GB1137928A (en) * | 1966-10-03 | 1968-12-27 | Smiths Industries Ltd | Improvements in or relating to high-voltage bushing assemblies |
US3505630A (en) | 1968-01-29 | 1970-04-07 | Micro Devices Corp | Fuse construction |
US3647405A (en) | 1969-12-12 | 1972-03-07 | Ray F Smith | Garbage incinerator and method of operation |
US3723930A (en) | 1972-02-10 | 1973-03-27 | Gen Electric | Oil immersible current limiting fuse assembly |
US4453197A (en) * | 1981-10-22 | 1984-06-05 | Mcgraw-Edison Company | Dielectric fluid tank |
SU1065458A1 (ru) | 1982-07-19 | 1984-01-07 | Ленинградский Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологический Институт Им.Ленсовета | Эпоксидна композици |
US4595557A (en) | 1985-04-11 | 1986-06-17 | Emerson Electric Co. | Method of increasing hermeticity of metal components of glass/metal and ceramic/metal seals |
US4846163A (en) | 1987-08-24 | 1989-07-11 | Cooper Industries, Inc. | Method of sealing capacitor bushings |
JPH0625331B2 (ja) * | 1988-03-18 | 1994-04-06 | ソマール株式会社 | バッテリーケース用接着剤組成物 |
US5161728A (en) | 1988-11-29 | 1992-11-10 | Li Chou H | Ceramic-metal bonding |
US5406448A (en) * | 1992-06-17 | 1995-04-11 | Cooper Power Systems, Inc. | Capacitor hanger and attachment method |
US5371650A (en) | 1994-02-15 | 1994-12-06 | Electronic Concepts, Inc. | Hermetically sealed capacitor and method for making the same |
US5766517A (en) * | 1995-12-21 | 1998-06-16 | Cooper Industries, Inc. | Dielectric fluid for use in power distribution equipment |
US5935372A (en) | 1997-04-29 | 1999-08-10 | Occidental Chemical Corporation | Adhesive sealant for bonding metal parts to ceramics |
US6627966B2 (en) | 2000-11-29 | 2003-09-30 | Samsung Electro-Mechanics Co., Ltd. | Method and device for sealing ceramic package of saw filter |
US6500795B2 (en) | 2001-01-24 | 2002-12-31 | Honeywell International Inc. | Azeotrope-like composition of 1-chloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride |
US6585917B2 (en) * | 2001-04-12 | 2003-07-01 | Cooper Industries, Inc. | Dielectric fluid |
US20060194064A1 (en) * | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
US20040251237A1 (en) | 2003-06-13 | 2004-12-16 | Meyer Jeffry R. | Circuit breaker with bonded bushing insulators |
KR100757166B1 (ko) | 2003-07-01 | 2007-09-07 | 오츠카 가가쿠 가부시키가이샤 | 제4급 암모늄염 및 전해질 및 전기 화학 디바이스 |
US20060043597A1 (en) * | 2004-08-25 | 2006-03-02 | Yoshiyuki Wada | Solder composition, connecting process with soldering, and connection structure with soldering |
EP1932648A1 (en) | 2006-12-15 | 2008-06-18 | Sika Technology AG | Structural reinforcement material, insert, and reinforced cavity comprising same |
US7857194B2 (en) | 2007-05-01 | 2010-12-28 | University Of Dayton | Method of joining metals to ceramic matrix composites |
CN103484035A (zh) * | 2007-08-02 | 2014-01-01 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
US8082663B1 (en) | 2007-11-12 | 2011-12-27 | Sandia Corporation | Method for hermetic electrical connections |
KR101638646B1 (ko) | 2009-02-20 | 2016-07-11 | 엔지케이 인슐레이터 엘티디 | 세라믹스-금속 접합체 및 그 제조 방법 |
WO2010147070A1 (ja) | 2009-06-15 | 2010-12-23 | 味の素株式会社 | 樹脂組成物及び有機電解液電池 |
CN101916656A (zh) * | 2010-07-15 | 2010-12-15 | 王海龙 | 一种电力电容器 |
CN102136367A (zh) * | 2010-12-18 | 2011-07-27 | 桂林电力电容器有限责任公司 | 电力电容器电气引出端子 |
-
2013
- 2013-11-08 US US14/075,350 patent/US9490067B2/en active Active
-
2014
- 2014-11-05 AU AU2014346929A patent/AU2014346929B2/en active Active
- 2014-11-05 BR BR112016008163-3A patent/BR112016008163B1/pt active IP Right Grant
- 2014-11-05 EP EP14860517.3A patent/EP3066170B1/en active Active
- 2014-11-05 CN CN201480060441.9A patent/CN105683318B/zh active Active
- 2014-11-05 KR KR1020167011955A patent/KR102288169B1/ko active IP Right Grant
- 2014-11-05 WO PCT/US2014/063983 patent/WO2015069676A1/en active Application Filing
- 2014-11-06 AR ARP140104177A patent/AR098329A1/es unknown
-
2016
- 2016-11-04 US US15/343,468 patent/US9761374B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3066170A1 (en) | 2016-09-14 |
EP3066170B1 (en) | 2019-09-18 |
KR102288169B1 (ko) | 2021-08-09 |
EP3066170A4 (en) | 2017-06-28 |
US9761374B2 (en) | 2017-09-12 |
AU2014346929A1 (en) | 2016-04-21 |
CN105683318B (zh) | 2019-03-22 |
KR20160083870A (ko) | 2016-07-12 |
US9490067B2 (en) | 2016-11-08 |
AU2014346929B2 (en) | 2017-08-03 |
US20150132581A1 (en) | 2015-05-14 |
US20170053742A1 (en) | 2017-02-23 |
BR112016008163B1 (pt) | 2022-05-17 |
CN105683318A (zh) | 2016-06-15 |
WO2015069676A1 (en) | 2015-05-14 |
BR112016008163A2 (es) | 2017-08-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AR098329A1 (es) | Unir materiales disímiles usando una composición de resina epóxica | |
MX2022005211A (es) | Anticuerpos anti-promiostatina o miostatina latente y usos de los mismos. | |
CO2017000416A2 (es) | Una composición hidráulica | |
AR099591A1 (es) | Acelerador de cemento pasivado | |
CL2018000043A1 (es) | Anticuerpos de unión a tau | |
EP3663084A4 (en) | COMPOSITE MADE OF METAL AND RESIN | |
MX2018006065A (es) | Pelicula adhesiva estructural multicapas. | |
MX2018006037A (es) | Adhesivo estructural con resistencia mejorada a la corrosion. | |
BR112017011336A2 (pt) | composição de resina epóxi curável | |
DK3565619T3 (da) | Sprøjtestempel med dynamisk forsegling | |
IL281713A (en) | Epoxy resin preparation | |
GB2559134B (en) | Pump assemblies with stator joint seals | |
CO2019003429A2 (es) | Salsa de tomate con estabilidad de almacenamiento mejorada | |
MX360500B (es) | Herramienta del fondo del pozo con capa resistente a la erosion y metodo de uso de la misma. | |
ZA202104373B (en) | Module and assembly for underground management of fluids for shallow-depth applications | |
EP3623438A4 (en) | ADDITIVE FOR EPOXY ADHESIVE AND EPOXY ADHESIVE COMPOSITION FOR CONSTRUCTION WITH IT | |
EP3541874A4 (en) | COMPOSITION PRESENTING A GOOD BALANCE BETWEEN DISSIPATION FACTOR AND ADDITIVE ACCEPTANCE | |
MX2018005843A (es) | Cierre compuesto con puntal de soporte y metodo para hacer el mismo. | |
GB2586367B (en) | High performance fluoroelastomer bonded seal for downhole applications | |
EA201790702A1 (ru) | Анкерный болт для заделки в фиксирующий материал в канале шпура | |
BR112017001258A2 (pt) | revestimento betuminoso autoadesivo para construção e modificador de betume para revestimento betuminoso autoadesivo | |
GB201718142D0 (en) | Pre-diffused mandrel coating to provide enhanced bonding between metallic and composite components | |
UY35569A (es) | Compuesto reforzado con fibra | |
PL3250806T3 (pl) | Tłok z uszczelnionym kanałem chłodzącym oraz sposób jego konstrukcji | |
EA201691049A1 (ru) | Энтомотоксичные полипептиды |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FB | Suspension of granting procedure |