WO2024135182A1 - Connection device - Google Patents

Connection device Download PDF

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Publication number
WO2024135182A1
WO2024135182A1 PCT/JP2023/041389 JP2023041389W WO2024135182A1 WO 2024135182 A1 WO2024135182 A1 WO 2024135182A1 JP 2023041389 W JP2023041389 W JP 2023041389W WO 2024135182 A1 WO2024135182 A1 WO 2024135182A1
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WO
WIPO (PCT)
Prior art keywords
connection device
wiring
connection
layer
conductor
Prior art date
Application number
PCT/JP2023/041389
Other languages
French (fr)
Japanese (ja)
Inventor
英章 吉見
Original Assignee
株式会社ヨコオ
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Filing date
Publication date
Application filed by 株式会社ヨコオ filed Critical 株式会社ヨコオ
Publication of WO2024135182A1 publication Critical patent/WO2024135182A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices

Definitions

  • the present invention relates to a connection device.
  • connection devices have been developed for electrically connecting an object to be inspected, such as an integrated circuit (IC), to an inspection board, such as a printed circuit board (PCB).
  • IC integrated circuit
  • PCB printed circuit board
  • a connection device is disposed between the object to be inspected and the inspection board.
  • the connection device described in Patent Document 1 includes a support board through which connection wiring passes, a plurality of wiring patterns located on the surface of the support board facing the object to be inspected, and a plurality of probes mounted on the plurality of wiring patterns. Some of the probes are electrically connected to each other via some of the wiring patterns.
  • a wiring pattern may be located on the surface of the support substrate that faces the object to be inspected.
  • a wiring pattern is located on the surface of the support substrate that faces the object to be inspected, it may be difficult to ensure flatness on the surface of the connection device that faces the object to be inspected.
  • One object of the present invention is to ensure the flatness of the surface of the connection device that faces the object to be inspected.
  • Other objects of the present invention will become apparent from the description of this specification.
  • connection device for electrically connecting an object to be inspected and an inspection board, A substrate; a connection conductor located on a predetermined surface side of the board facing the inspection board;
  • a connection device comprising:
  • the above aspect of the present invention ensures flatness on the side of the connection device that faces the object to be inspected.
  • FIG. 2 is a cross-sectional view of a connection device according to an embodiment.
  • 11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment.
  • 11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment.
  • 11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment.
  • FIG. 1 is a cross-sectional view of a connection device 10 according to an embodiment.
  • an inspection object 20, an inspection board 30, and a pin block 200 are illustrated together with the connection device 10.
  • FIG. 1 shows a Z axis indicating the Z direction.
  • the Z direction is a direction parallel to an imaginary line connecting the inspection object 20 and the inspection board 30.
  • the side indicated by the arrow on the Z axis will be referred to as the +Z side
  • the side opposite to the side indicated by the arrow on the Z axis will be referred to as the -Z side.
  • the +Z side and the -Z side are the upper and lower sides in the vertical direction, respectively.
  • the direction perpendicular to the Z direction will be referred to as the horizontal direction (lateral direction).
  • connection device 10 electrically connects the test object 20 and the test board 30.
  • the connection device 10 is disposed between the test object 20 and the test board 30 in the Z direction.
  • a pin block 200 is disposed between the connection device 10 and the test board 30 in the Z direction.
  • the connection device 10 includes a board 100, a plurality of lands 110, a plurality of probes 120, an insulating layer 130, a connection conductor 140, and a plurality of pads 150.
  • the test object 20 is, for example, an IC.
  • the test board 30 is, for example, a PCB.
  • the substrate 100 is a ceramic substrate, specifically an LTCC (Low Temperature Co-fired Ceramics) substrate.
  • the substrate 100 may be a substrate of a different type than a ceramic substrate.
  • the substrate 100 has a first surface 102 and a second surface 104.
  • the first surface 102 is the +Z side surface of the substrate 100.
  • the first surface 102 and the -Z side surface of the inspection object 20 face each other.
  • the second surface 104 is the -Z side surface of the substrate 100.
  • the second surface 104 and the +Z side surface of the inspection substrate 30 face each other via the pin block 200.
  • the substrate 100 defines a plurality of through holes 106.
  • the plurality of through holes 106 are arranged, for example, in a substantially lattice pattern.
  • FIG. 1 shows five through holes 106 arranged in the horizontal direction in the figure.
  • Each through hole 106 penetrates the substrate 100 between the first surface 102 and the second surface 104 substantially parallel to the Z direction.
  • An internal conductor such as a metal is provided on the inner surface around the Z direction of each through hole 106.
  • the internal conductor covers the inner surface around the Z direction of each through hole 106.
  • the internal conductor is not embedded in the entire internal space of each through hole 106.
  • each through hole 106 is hollow.
  • the internal conductor may be embedded in the entire internal space of each through hole 106.
  • each through hole 106 may be solid.
  • the multiple lands 110 are located on the first surface 102 side. When viewed from the +Z side, the multiple lands 110 are arranged, for example, in a substantially lattice pattern. However, the layout of the multiple lands 110 when viewed from the +Z side is not limited to this example.
  • FIG. 1 shows five lands 110 arranged horizontally in the figure. At least a portion of each of the multiple lands 110 and at least a portion of each of the multiple through holes 106 overlap each other in the Z direction.
  • the -Z side surface of each of the multiple lands 110 and the internal conductors at the +Z side end of each of the multiple through holes 106 are electrically connected to each other. In the example shown in FIG. 1, the -Z side surface of each of the multiple lands 110 and the internal conductors at the +Z side end of each of the multiple through holes 106 are in direct contact with each other.
  • each land 110 includes a first land layer 112 and a second land layer 114.
  • the first land layer 112 and the second land layer 114 are stacked in order in the Z direction as they move away from the first surface 102.
  • the first land layer 112 is made of a material that is cheaper than the material of the second land layer 114.
  • the first land layer 112 is made of, for example, copper. Therefore, each land 110 can be formed at a lower cost than when the entire land 110 is made of the material of the second land layer 114.
  • the second land layer 114 is made of a material that is more resistant to oxidation than the material of the first land layer 112.
  • the second land layer 114 is made of, for example, gold.
  • each land 110 can be a land layer of a single material.
  • each land 110 may include three or more land layers.
  • Each of the multiple probes 120 is mounted on the +Z side surface of each of the multiple lands 110.
  • FIG. 1 shows five probes 120 arranged horizontally in the figure.
  • the -Z side end of each of the multiple probes 120 and the +Z side surface of each of the multiple lands 110 are electrically connected to each other.
  • the +Z side end of each of the multiple probes 120 and each of the multiple first electrodes 22 located on the -Z side surface of the test object 20 face each other.
  • each probe 120 has a cantilever structure. Specifically, the +Z side end of each probe 120 is bent in a direction approximately perpendicular to the Z direction. Therefore, the +Z side end of each probe 120 can be biased toward each first electrode 22.
  • the structure of each probe 120 is not limited to this example.
  • the +Z side end of each probe 120 may be biased toward the test object 20 by an elastic body such as a coil spring.
  • the insulating layer 130 is located on the second surface 104 side.
  • the insulating layer 130 includes a first insulating layer 132, a second insulating layer 134, and a third insulating layer 136.
  • the first insulating layer 132, the second insulating layer 134, and the third insulating layer 136 are stacked in order in the Z direction as they move away from the second surface 104.
  • Each of the first insulating layer 132, the second insulating layer 134, and the third insulating layer 136 is, for example, a resin layer such as polyimide.
  • the insulating layer 130 may be a single insulating layer.
  • the insulating layer 130 may include two insulating layers stacked in the Z direction or four or more insulating layers stacked in the Z direction.
  • connection conductor 140 includes a first connection conductor 142 and a second connection conductor 144.
  • the first connection conductor 142 and the second connection conductor 144 include, for example, at least one of copper and a copper alloy.
  • the first, second and fourth connecting conductors 140 from the left in FIG. 1 will be described.
  • the first, second and fourth connecting conductors 140 from the left in FIG. 1 are electrically connected to the internal conductors of the first, second and fifth through holes 106 from the left in FIG. 1, respectively, as follows.
  • the first connection conductor 142 includes a first via 142a and a first wiring 142b.
  • the first via 142a and the first wiring 142b are integrated with each other.
  • the first via 142a penetrates the first insulating layer 132 in a direction substantially parallel to the Z direction.
  • the internal conductors at the +Z side end of the first via 142a and the -Z side end of the through hole 106 are electrically connected to each other.
  • the first wiring 142b extends in a direction substantially parallel to the horizontal direction.
  • the first wiring 142b may extend not only in the lateral direction in FIG. 1, but also toward the front or back of FIG. 1.
  • the first wiring 142b is located on the -Z side surface of the first insulating layer 132.
  • the first wiring 142b is covered by the second insulating layer 134.
  • the +Z side surface of the first wiring 142b and the -Z side end of the first via 142a are electrically connected to each other.
  • the second connection conductor 144 includes a second via 144a and a second wiring 144b.
  • the second via 144a and the second wiring 144b are integrated with each other.
  • the second via 144a penetrates the second insulating layer 134 approximately parallel to the Z direction.
  • the +Z side end of the second via 144a and the -Z side surface of the first wiring 142b are electrically connected to each other.
  • the second wiring 144b extends in a direction approximately parallel to the horizontal direction.
  • the second wiring 144b may extend not only in the lateral direction in FIG. 1, but also toward the front or back of FIG. 1.
  • the second wiring 144b is located on the -Z side surface of the second insulating layer 134.
  • the second wiring 144b is covered by the third insulating layer 136.
  • the +Z side surface of the second wiring 144b and the -Z side end of the second via 144a are electrically connected to each other.
  • connection conductor 140T includes a first connection conductor 142T and a second connection conductor 144T.
  • Connection conductor 140T is similar to the first, second, and fourth connection conductors 140 from the left in FIG. 1, except for the following points.
  • the first connection conductor 142T includes two first vias 142aT and a first wiring 142bT.
  • the +Z side ends of the two first vias 142aT and the internal conductors at the -Z side ends of the third and fourth through holes 106 from the left in FIG. 1 are electrically connected to each other.
  • the two first vias 142aT are electrically connected to the same first wiring 142bT. Therefore, it is possible to supply approximately the same potential to the internal conductors of the third and fourth through holes 106 from the left in FIG. 1 via the connection conductor 140T. In other words, the internal conductors of the third and fourth through holes 106 from the left in FIG. 1 are short-circuited to each other.
  • Examples of potentials supplied to the internal conductors of these through holes 106 include a power supply potential and a ground potential. Similar to the second connection conductors 144 of the first, second, and fourth connection conductors 140 from the left in FIG. 1, the second connection conductor 144T includes a second via 144aT and a second wiring 144bT.
  • the multiple pads 150 are located on the -Z side surface of the insulating layer 130. When viewed from the -Z side, the multiple pads 150 are arranged, for example, in a substantially lattice shape. However, the layout of the multiple pads 150 when viewed from the -Z side is not limited to this example.
  • FIG. 1 shows four pads 150 arranged horizontally in the figure. At least a portion of the -Z side surface of the multiple pads 150 is exposed from the -Z side surface of the third insulating layer 136 toward the pin block 200.
  • the +Z side surface of the pads 150 and the -Z side surface of the second wiring 144b are electrically connected to each other.
  • each pad 150 is made of a material that is more resistant to oxidation than the material of the connection conductor 140.
  • Each pad 150 is made of, for example, gold.
  • each pad 150 covers at least a portion of the -Z side surface of each connection conductor 140. Therefore, the oxidation of the connection conductor 140 can be suppressed by the pad 150.
  • the multiple pogo pins 210 are supported by a pin block 200.
  • the pin block 200 is made of an insulating material such as resin.
  • FIG. 1 shows four pogo pins 210 arranged horizontally in the figure.
  • the +Z side ends of the multiple pogo pins 210 and the -Z side faces of the multiple pads 150 face each other.
  • the -Z side ends of the multiple pogo pins 210 and the multiple second electrodes 32 located on the +Z side face of the inspection board 30 face each other.
  • the -Z side ends of each pogo pin 210 can be biased toward the second electrodes 32 by a coil spring (not shown) provided inside each pogo pin 210.
  • each of the multiple probes 120 and each of the multiple first electrodes 22 of the test object 20 are in contact with each other.
  • the +Z end of each of the multiple pogo pins 210 and the -Z surface of each of the multiple pads 150 are in contact with each other.
  • the -Z end of each of the multiple pogo pins 210 and each of the multiple second electrodes 32 of the test board 30 are in contact with each other. Therefore, each first electrode 22 and each second electrode 32 are electrically connected to each other via each probe 120, each land 110, the internal conductor provided in each through hole 106, each connection conductor 140, and each pogo pin 210.
  • the insulating layer 130 can function as a member that relieves the load on each pad 150. Therefore, the durability of the connection device 10 can be improved compared to when the insulating layer 130 is not provided.
  • connection conductor 140 can make the layout of the electrodes on the test subject 20 side of the connection device 10 different from the layout of the electrodes on the test board 30 side of the connection device 10.
  • the electrodes on the test subject 20 side of the connection device 10 correspond to the lands 110.
  • the electrodes on the test board 30 side of the connection device 10 correspond to the pads 150.
  • each first wiring 142b and each second wiring 144b extend in a direction approximately parallel to the horizontal direction. Therefore, the horizontal position of the -Z side end of the through hole 106 and the horizontal position of the pad 150 electrically connected to the internal conductor provided in the through hole 106 can be shifted from each other in the horizontal direction. Therefore, depending on the structure of the connecting conductor 140, the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be converted into each other.
  • Each connection conductor 140 has a plurality of wirings that at least partially overlap each other in the Z direction.
  • the first wiring 142b and the second wiring 144b at least partially overlap each other in the Z direction.
  • the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be converted into each other by multiple layers of wiring. Therefore, compared to the case where the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 are converted into each other by a single layer of wiring, the degree of freedom in converting the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be improved.
  • the number of lands 110 arranged horizontally in the figure (five) and the number of pads 150 arranged horizontally in the figure (four) are different due to the four connecting conductors 140 arranged horizontally in the figure. In other words, the number of pads 150 is less than the number of lands 110.
  • the internal conductor of the third through hole 106 from the left in the figure and the internal conductor of the fourth through hole 106 from the left in the figure are electrically connected to the connecting conductor 140T.
  • the connecting conductor 140T is electrically connected to the third single pad 150 from the left in the figure. Therefore, the number of pads 150 can be reduced by one compared to the case where separate connecting conductors 140 are provided for these two through holes 106.
  • the relationship between the number of lands 110 and the number of pads 150 is not limited to the example shown in FIG. 1. In order to make the number of lands 110 and the number of pads 150 different from each other, it is sufficient that the internal conductors of the multiple through holes 106 and one connecting conductor 140 are electrically connected to each other. For example, the internal conductors of three through holes 106 and one connecting conductor 140 may be electrically connected to each other.
  • the number of pads 150 is less than the number of lands 110.
  • the number of pads 150 may be greater than the number of lands 110 by using the connection conductors 140. That is, in order to make the number of pads 150 greater than the number of lands 110, one connection conductor 140 and multiple pads 150 may be electrically connected to each other. In this case, the one connection conductor 140 and the internal conductor of one through hole 106 are electrically connected to each other.
  • connection conductor 140 is located on the second surface 104 side, not on the first surface 102 side. Let us consider a state in which the connection conductor 140 is located on the first surface 102 side. In this state, from the -Z side to the +Z side, a plurality of pads 150, the substrate 100, the insulating layer 130, and a plurality of probes 120 are arranged in order. The insulating layer 130 is provided with a plurality of connection conductors 140. In this state, it may be relatively difficult to ensure flatness on the first surface 102 side of the connection device 10.
  • the height of the connection conductor 140 in the Z direction may vary depending on the area of the region where the first wiring 142b and the second wiring 144b overlap each other in the Z direction.
  • the land 110 is located on the first surface 102 side.
  • the land 110 can be regarded as a single-layer wiring by integrating the first land layer 112 and the second land layer 114. Therefore, the land 110 can be formed without providing an insulating layer equivalent to the insulating layer 130.
  • the length or width of the land 110 approximately parallel to the horizontal direction is easily made shorter than the length approximately parallel to the horizontal direction of the wiring used to convert the pitch of the electrodes on the inspection target 20 side of the connection device 10 and the pitch of the electrodes on the inspection board 30 side of the connection device 10, such as the first wiring 142b and the second wiring 144b. Therefore, in the embodiment, it is easier to ensure the flatness of the first surface 102 side of the connection device 10 compared to the case where the connection conductor 140 is located on the first surface 102 side.
  • the layout of the electrodes on the test subject 20 side of the connection device 10 and the layout of the electrodes on the test board 30 side of the connection device 10 are different from each other due to the multiple connection conductors 140. Therefore, the board 100 does not need to have internal wiring to make the layout of the electrodes on the test subject 20 side of the connection device 10 and the layout of the electrodes on the test board 30 side of the connection device 10 different from each other. If the board 100 had the internal wiring, the yield of the board 100 may be relatively low. In contrast, in the embodiment, the board 100 defines the through hole 106. That is, in the embodiment, the board 100 can have a simpler structure than when the board 100 has the above-mentioned internal wiring. Therefore, the yield of the board 100 can be improved compared to when the board 100 has the above-mentioned internal wiring. However, if the improvement of the yield of the board 100 is not taken into consideration, the board 100 may have the above-mentioned internal wiring.
  • the wiring layer having the insulating layer 130 and the connection conductor 140 is located on the second surface 104 side of the substrate 100.
  • the quality of such a wiring layer can be determined by visual inspection.
  • the quality of the internal wiring of the substrate 100 may be determined by electrical inspection. However, this electrical inspection may leave inspection marks on the lands and pads of the substrate 100. If wiring is provided on such inspection marks, the yield of the connection device 10 may deteriorate. In contrast, in the embodiment, the substrate 100 is not subjected to electrical inspection. Therefore, deterioration of the yield of the connection device 10 due to electrical inspection can be suppressed.
  • FIGS. 2 to 4 are diagrams for explaining an example of a manufacturing method for the connection device 10 according to the embodiment.
  • the direction of the Z axis in FIG. 2 to FIG. 4 is opposite to the direction of the Z axis in FIG. 1 in the up-down direction of the paper.
  • the connection device 10 is manufactured as follows.
  • the original substrate 100R is prepared.
  • the original substrate 100R has a plurality of through holes 106 formed therein as described with reference to FIG. 1. To simplify the drawings, the through holes 106 are not shown in FIGS. 2 to 4.
  • the second surface 104 of the original substrate 100R may be roughened beforehand. The roughening treatment can improve the adhesion between the second surface 104 and layers provided on the second surface 104, such as the first insulating layer 132. Similarly, the first surface 102 of the original substrate 100R may also be roughened beforehand.
  • Figures 2 to 4 show two sections S from which two substrates 100 are cut out from the original substrate 100R.
  • one connection conductor 140 is formed in each section S.
  • multiple connection conductors 140 may be formed in each section S.
  • the number of substrates 100 cut out from the original substrate 100R is not limited to two, and may be three or more.
  • a first insulating layer 132 is formed in each section S on the second surface 104 side of the original substrate 100R.
  • the first insulating layer 132 is formed, for example, using lithography technology.
  • the first insulating layer 132 defines a first opening pattern 132a.
  • the first opening pattern 132a exposes a portion of the second surface 104 toward the -Z side.
  • a first seed layer 142s is formed across two sections S on the second surface 104 side of the original substrate 100R.
  • the first seed layer 142s is formed by a method such as sputtering or ion plating.
  • the first seed layer 142s includes, for example, a copper layer and a titanium tungsten alloy layer (TiW/Cu) that are stacked in sequence in the Z direction as they move away from the second surface 104.
  • a first resist 302 is formed.
  • the first resist 302 is formed, for example, using lithography techniques.
  • the first resist 302 defines a first resist opening 302a.
  • a portion of the first resist 302 covers a portion of the first seed layer 142s that extends between two sections S.
  • the first resist opening 302a exposes a portion of the -Z side surface of the first seed layer 142s toward the -Z side.
  • the first plating layer 142p is formed by electrolytic plating using the first seed layer 142s.
  • the first plating layer 142p is, for example, a copper layer.
  • the first plating layer 142p is embedded in the first opening pattern 132a and the first resist opening 302a. Therefore, in each section S, the portion of the first seed layer 142s and the first plating layer 142p embedded in the first opening pattern 132a becomes the first via 142a. In each section S, the portion of the first seed layer 142s and the first plating layer 142p embedded in the first resist opening 302a becomes the first wiring 142b.
  • the first resist 302 is removed.
  • the portion of the first seed layer 142s that does not overlap with the first plating layer 142p in the Z direction is removed by etching.
  • the first connection conductors 142 of each section S are electrically insulated from each other.
  • an etchant is used that selectively etches the first seed layer 142s rather than the first plating layer 142p.
  • the Z-direction thickness of the first seed layer 142s and the Z-direction thickness of the first plating layer 142p are depicted diagrammatically as being approximately equal.
  • the Z-direction thickness of the first plating layer 142p is actually approximately 10 times or more the Z-direction thickness of the first seed layer 142s. Therefore, even if a portion of the first plating layer 142p, together with the portion of the first seed layer 142s that does not overlap with the first plating layer 142p in the Z direction, is removed by etching, the overall Z-direction thickness of the first plating layer 142p remains almost unchanged.
  • a second insulating layer 134 is formed in each section S.
  • the second insulating layer 134 is formed, for example, using lithography technology.
  • the second insulating layer 134 defines a second opening pattern 134a.
  • the second insulating layer 134 covers the first connecting conductor 142 except for the second opening pattern 134a.
  • the second opening pattern 134a exposes a portion of the -Z side surface of the first connecting conductor 142 toward the -Z side.
  • a second seed layer 144s is formed across two sections S on the second surface 104 side of the original substrate 100R.
  • the second seed layer 144s is formed by a method such as sputtering or ion plating.
  • the second seed layer 144s includes, for example, a copper layer and a titanium tungsten alloy layer (TiW/Cu) that are stacked in sequence in the Z direction as they move away from the second surface 104.
  • a second resist 304 is formed.
  • the second resist 304 is formed, for example, using lithography techniques.
  • the second resist 304 defines a second resist opening 304a.
  • a portion of the second resist 304 covers a portion of the second seed layer 144s that extends between two sections S.
  • the second resist opening 304a exposes a portion of the -Z side surface of the second seed layer 144s toward the -Z side.
  • the second plating layer 144p is formed by electrolytic plating using the second seed layer 144s.
  • the second plating layer 144p is, for example, a copper layer.
  • the second plating layer 144p is embedded in the second opening pattern 134a and the second resist opening 304a. Therefore, in each section S, the portion of the second seed layer 144s and the second plating layer 144p embedded in the second opening pattern 134a becomes the second via 144a. In each section S, the portion of the second seed layer 144s and the second plating layer 144p embedded in the second resist opening 304a becomes the second wiring 144b.
  • the second resist 304 is removed.
  • the portion of the second seed layer 144s that does not overlap with the second plating layer 144p in the Z direction is removed by etching.
  • the second connection conductors 144 of each section S are electrically insulated from each other.
  • an etchant is used that selectively etches the second seed layer 144s more than the second plating layer 144p.
  • the overall thickness of the second plating layer 144p in the Z direction remains almost unchanged.
  • a third insulating layer 136 is formed in each section S.
  • the third insulating layer 136 is formed, for example, using lithography technology.
  • the third insulating layer 136 defines a third opening pattern 136a.
  • the third insulating layer 136 covers the second connecting conductor 144 except for the third opening pattern 136a.
  • the third opening pattern 136a exposes a portion of the -Z side surface of the second connecting conductor 144 toward the -Z side.
  • a pad 150 is formed in the third opening pattern 136a of the third insulating layer 136.
  • a land 110 is formed on the first surface 102 side of the original substrate 100R.
  • the pad 150 may be formed after the land 110 is formed.
  • two substrates 100 are cut out from the two sections S of the original substrate 100R by dicing.
  • a probe 120 is mounted on the +Z side surface of the land 110.
  • connection device 10 according to the embodiment is manufactured.
  • multiple substrates 100 are cut out from one original substrate 100R. Therefore, when the original substrate 100R has the above-mentioned internal wiring, it may be relatively difficult to reduce the possibility of cutting out a substrate 100 that is determined to be defective in the quality judgment of the internal wiring. In contrast, in the embodiment, the original substrate 100R does not need to have the above-mentioned internal wiring. Therefore, compared to when the original substrate 100R has internal wiring, it is possible to efficiently cut out a substrate 100 that is determined to be good in the quality judgment from the original substrate 100R more easily.
  • the layout of the lands 110 and the layout of the pads 150 are different from each other.
  • the layout of the lands 110 and the layout of the pads 150 may be the same as each other.
  • connection device having the following aspects.
  • a connection device that electrically connects an object to be inspected and an inspection board includes a board and a connection conductor located on a predetermined surface side of the board that faces the inspection board.
  • the "predetermined surface” corresponds to the "second surface” in the above embodiment.
  • the above-mentioned aspect ensures flatness of the surface of the connection device facing the object to be inspected, compared to when the connection conductor is provided on the surface of the board facing the object to be inspected.
  • the substrate defines a through hole having an inner conductor electrically connected to the connecting conductor.
  • the board can have a simpler structure than when the board has internal wiring for making the layout of the electrodes on the side of the connection device facing the test object and the layout of the electrodes on the side of the connection device facing the test board different from each other. Therefore, the yield of the board can be improved compared to when the board has such internal wiring.
  • the substrate has a plurality of internal conductors electrically connected to the connecting conductors.
  • the number of electrodes on the inspection board can be reduced compared to the case where separate connection conductors are electrically connected to the multiple internal conductors. According to the above-mentioned aspect, it is possible to supply approximately the same potential to the multiple internal conductors via the connection conductors.
  • the connecting conductor has a plurality of wirings that at least partially overlap each other.
  • the pitch of the electrodes on the side of the connection device facing the test object and the pitch of the electrodes on the side of the connection device facing the test board can be converted from each other by using multiple wirings that at least partially overlap each other. Therefore, the degree of freedom in converting the pitch can be improved compared to when the pitch is converted from each other by using multiple wirings that do not overlap each other.
  • connection device further comprises an insulating layer in which at least a portion of the connection conductor is embedded.
  • the insulating layer can function as a member that relieves the load on the electrode. Therefore, the durability of the connection device can be improved compared to when no insulating layer is provided.
  • connection device further includes a land located on another predetermined surface side of the board facing the object to be inspected.
  • the "other specified surface” corresponds to the "first surface” in the above embodiment.
  • the length or width of the land can be easily made shorter than the length of the connection conductor.
  • the land can be formed without providing an insulating layer on the other specified surface side. Therefore, according to the above-mentioned aspect, it is easier to ensure flatness on the other specified surface side of the connection device compared to when the connection conductor is located on the other specified surface side of the board.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A connection device according to the present invention is to electrically connect an inspection target and an inspection substrate and comprises a substrate and a connection conductor that is positioned on a prescribed side of the substrate that is to face the inspection substrate.

Description

接続装置Connecting Devices
　本発明は、接続装置に関する。 The present invention relates to a connection device.
　近年、集積回路（ＩＣ）等の検査対象物と、ＰＣＢ（Ｐｒｉｎｔｅｄ　Ｃｉｒｃｕｉｔ　Ｂｏａｒｄ）等の検査基板と、を電気的に接続するための様々な接続装置が開発されている。例えば、特許文献１に記載されているように、検査対象物が検査される際、接続装置は、検査対象物及び検査基板の間に配置されている。特許文献１に記載の接続装置は、接続配線が貫通する支持基板と、支持基板の検査対象物に対向する面側に位置する複数の配線パターンと、複数の配線パターンに実装された複数のプローブと、を備えている。一部のプローブは、一部の配線パターンを介して電気的に互いに接続されている。 In recent years, various connection devices have been developed for electrically connecting an object to be inspected, such as an integrated circuit (IC), to an inspection board, such as a printed circuit board (PCB). For example, as described in Patent Document 1, when the object to be inspected is inspected, a connection device is disposed between the object to be inspected and the inspection board. The connection device described in Patent Document 1 includes a support board through which connection wiring passes, a plurality of wiring patterns located on the surface of the support board facing the object to be inspected, and a plurality of probes mounted on the plurality of wiring patterns. Some of the probes are electrically connected to each other via some of the wiring patterns.
特開２０１８－１７９７５８号公報JP 2018-179758 A
　例えば、特許文献１に記載されているように、支持基板の検査対象物に対向する面側に配線パターンが位置することがある。しかしながら、支持基板の検査対象物に対向する面側に配線パターンが位置する場合、接続装置の検査対象物に対向する面側の平坦性を確保することが難しいことがある。 For example, as described in Patent Document 1, a wiring pattern may be located on the surface of the support substrate that faces the object to be inspected. However, when a wiring pattern is located on the surface of the support substrate that faces the object to be inspected, it may be difficult to ensure flatness on the surface of the connection device that faces the object to be inspected.
　本発明の目的の一例は、接続装置の検査対象物に対向する面側の平坦性を確保することにある。本発明の他の目的は、本明細書の記載から明らかになるであろう。 One object of the present invention is to ensure the flatness of the surface of the connection device that faces the object to be inspected. Other objects of the present invention will become apparent from the description of this specification.
　本発明の一態様は、
　検査対象物及び検査基板を電気的に接続する接続装置であって、
　基板と、
　前記基板の前記検査基板に対向する所定面側に位置する接続導体と、
を備える接続装置である。 One aspect of the present invention is
A connection device for electrically connecting an object to be inspected and an inspection board,
A substrate;
a connection conductor located on a predetermined surface side of the board facing the inspection board;
A connection device comprising:
　本発明の上記態様によれば、接続装置の検査対象物に対向する面側の平坦性を確保することができる。 The above aspect of the present invention ensures flatness on the side of the connection device that faces the object to be inspected.
実施形態に係る接続装置の断面図である。FIG. 2 is a cross-sectional view of a connection device according to an embodiment. 実施形態に係る接続装置の製造方法の一例を説明するための図である。11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment. 実施形態に係る接続装置の製造方法の一例を説明するための図である。11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment. 実施形態に係る接続装置の製造方法の一例を説明するための図である。11A to 11C are diagrams for explaining an example of a manufacturing method of the connection device according to the embodiment.
　以下、本発明の実施形態について、図面を用いて説明する。すべての図面において、同様な構成要素には同様の符号を付し、適宜説明を省略する。 Below, an embodiment of the present invention will be described with reference to the drawings. In all drawings, similar components are given similar reference symbols and descriptions will be omitted as appropriate.
　図１は、実施形態に係る接続装置１０の断面図である。図１には、検査対象物２０、検査基板３０及びピンブロック２００が接続装置１０とともに図示されている。 FIG. 1 is a cross-sectional view of a connection device 10 according to an embodiment. In FIG. 1, an inspection object 20, an inspection board 30, and a pin block 200 are illustrated together with the connection device 10.
　図１には、説明のため、Ｚ方向を示すＺ軸が図示されている。Ｚ方向は、検査対象物２０及び検査基板３０を結ぶ仮想線に平行な方向である。以下、必要に応じて、Ｚ軸の矢印が指し示す側を＋Ｚ側といい、Ｚ軸の矢印が指し示す側の反対側を－Ｚ側という。例えば、＋Ｚ側及び－Ｚ側は、それぞれ、鉛直方向の上側及び下側である。以下、必要に応じて、Ｚ方向に垂直な方向を水平方向（横方向）という。 For the sake of explanation, FIG. 1 shows a Z axis indicating the Z direction. The Z direction is a direction parallel to an imaginary line connecting the inspection object 20 and the inspection board 30. Hereinafter, as necessary, the side indicated by the arrow on the Z axis will be referred to as the +Z side, and the side opposite to the side indicated by the arrow on the Z axis will be referred to as the -Z side. For example, the +Z side and the -Z side are the upper and lower sides in the vertical direction, respectively. Hereinafter, as necessary, the direction perpendicular to the Z direction will be referred to as the horizontal direction (lateral direction).
　接続装置１０は、検査対象物２０及び検査基板３０を電気的に接続している。接続装置１０は、Ｚ方向において検査対象物２０及び検査基板３０の間に配置されている。図１に示す例において、Ｚ方向において接続装置１０及び検査基板３０の間にはピンブロック２００が配置されている。接続装置１０は、基板１００、複数のランド１１０、複数のプローブ１２０、絶縁層１３０、接続導体１４０及び複数のパッド１５０を備えている。検査対象物２０は、例えばＩＣである。検査基板３０は、例えばＰＣＢである。 The connection device 10 electrically connects the test object 20 and the test board 30. The connection device 10 is disposed between the test object 20 and the test board 30 in the Z direction. In the example shown in FIG. 1, a pin block 200 is disposed between the connection device 10 and the test board 30 in the Z direction. The connection device 10 includes a board 100, a plurality of lands 110, a plurality of probes 120, an insulating layer 130, a connection conductor 140, and a plurality of pads 150. The test object 20 is, for example, an IC. The test board 30 is, for example, a PCB.
　基板１００は、セラミックス基板、具体的にはＬＴＣＣ（Ｌｏｗ　Ｔｅｍｐｅｒａｔｕｒｅ　Ｃｏ－ｆｉｒｅｄ　Ｃｅｒａｍｉｃｓ）基板である。ただし、基板１００は、セラミックス基板と異なる種類の基板であってもよい。 The substrate 100 is a ceramic substrate, specifically an LTCC (Low Temperature Co-fired Ceramics) substrate. However, the substrate 100 may be a substrate of a different type than a ceramic substrate.
　基板１００は、第１面１０２及び第２面１０４を有している。第１面１０２は、基板１００の＋Ｚ側の面である。第１面１０２と、検査対象物２０の－Ｚ側の面と、は互いに対向している。第２面１０４は、基板１００の－Ｚ側の面である。第２面１０４と、検査基板３０の＋Ｚ側の面と、はピンブロック２００を介して互いに対向している。 The substrate 100 has a first surface 102 and a second surface 104. The first surface 102 is the +Z side surface of the substrate 100. The first surface 102 and the -Z side surface of the inspection object 20 face each other. The second surface 104 is the -Z side surface of the substrate 100. The second surface 104 and the +Z side surface of the inspection substrate 30 face each other via the pin block 200.
　基板１００は、複数のスルーホール１０６を画定している。＋Ｚ側から見て、複数のスルーホール１０６は、例えば、略格子状に配置されている。ただし、Ｚ方向から見た場合の複数のスルーホール１０６のレイアウトは、この例に限定されない。図１には、図内の横方向に並ぶ５つのスルーホール１０６が模式的に図示されている。各スルーホール１０６は、第１面１０２及び第２面１０４の間でＺ方向に略平行に基板１００を貫通している。各スルーホール１０６のＺ方向の周りの内側面には、金属等の内部導体が設けられている。内部導体は、各スルーホール１０６のＺ方向の周りの内側面を覆っている。内部導体は、各スルーホール１０６の内部空間の全体に埋め込まれていない。すなわち、各スルーホール１０６は、中空となっている。ただし、内部導体は、各スルーホール１０６の内部空間の全体に埋め込まれていてもよい。すなわち、各スルーホール１０６は、中実であってもよい。 The substrate 100 defines a plurality of through holes 106. When viewed from the +Z side, the plurality of through holes 106 are arranged, for example, in a substantially lattice pattern. However, the layout of the plurality of through holes 106 when viewed from the Z direction is not limited to this example. FIG. 1 shows five through holes 106 arranged in the horizontal direction in the figure. Each through hole 106 penetrates the substrate 100 between the first surface 102 and the second surface 104 substantially parallel to the Z direction. An internal conductor such as a metal is provided on the inner surface around the Z direction of each through hole 106. The internal conductor covers the inner surface around the Z direction of each through hole 106. The internal conductor is not embedded in the entire internal space of each through hole 106. In other words, each through hole 106 is hollow. However, the internal conductor may be embedded in the entire internal space of each through hole 106. In other words, each through hole 106 may be solid.
　複数のランド１１０は、第１面１０２側に位置している。＋Ｚ側から見て、複数のランド１１０は、例えば、略格子状に配置されている。ただし、＋Ｚ側から見た場合の複数のランド１１０のレイアウトは、この例に限定されない。図１には、図内の横方向に並ぶ５つのランド１１０が模式的に図示されている。複数のランド１１０の各々の少なくとも一部分及び複数のスルーホール１０６の各々の少なくとも一部分は、Ｚ方向に互いに重なっている。複数のランド１１０の各々の－Ｚ側の面及び複数のスルーホール１０６の各々の＋Ｚ側の端部の内部導体は、電気的に互いに接続されている。図１に示す例において、複数のランド１１０の各々の－Ｚ側の面及び複数のスルーホール１０６の各々の＋Ｚ側の端部の内部導体は、互いに直接接触している。 The multiple lands 110 are located on the first surface 102 side. When viewed from the +Z side, the multiple lands 110 are arranged, for example, in a substantially lattice pattern. However, the layout of the multiple lands 110 when viewed from the +Z side is not limited to this example. FIG. 1 shows five lands 110 arranged horizontally in the figure. At least a portion of each of the multiple lands 110 and at least a portion of each of the multiple through holes 106 overlap each other in the Z direction. The -Z side surface of each of the multiple lands 110 and the internal conductors at the +Z side end of each of the multiple through holes 106 are electrically connected to each other. In the example shown in FIG. 1, the -Z side surface of each of the multiple lands 110 and the internal conductors at the +Z side end of each of the multiple through holes 106 are in direct contact with each other.
　実施形態において、各ランド１１０は、第１ランド層１１２及び第２ランド層１１４を含んでいる。第１ランド層１１２及び第２ランド層１１４は、第１面１０２から離れるにつれてＺ方向に順に積層されている。第１ランド層１１２は、第２ランド層１１４の材料より安価な材料からなっている。第１ランド層１１２は、例えば、銅からなっている。よって、各ランド１１０の全体が第２ランド層１１４の材料からなる場合と比較して、各ランド１１０を安価に形成することができる。第２ランド層１１４は、第１ランド層１１２の材料より耐酸化性が高い材料からなっている。第２ランド層１１４は、例えば、金からなっている。よって、各ランド１１０の全体が第１ランド層１１２の材料からなる場合と比較して、各ランド１１０の耐酸化性を向上させることができる。ただし、各ランド１１０は、単一の材料のランド層であってもよい。或いは、各ランド１１０は、３層以上のランド層を含んでいてもよい。 In the embodiment, each land 110 includes a first land layer 112 and a second land layer 114. The first land layer 112 and the second land layer 114 are stacked in order in the Z direction as they move away from the first surface 102. The first land layer 112 is made of a material that is cheaper than the material of the second land layer 114. The first land layer 112 is made of, for example, copper. Therefore, each land 110 can be formed at a lower cost than when the entire land 110 is made of the material of the second land layer 114. The second land layer 114 is made of a material that is more resistant to oxidation than the material of the first land layer 112. The second land layer 114 is made of, for example, gold. Therefore, the oxidation resistance of each land 110 can be improved compared to when the entire land 110 is made of the material of the first land layer 112. However, each land 110 may be a land layer of a single material. Alternatively, each land 110 may include three or more land layers.
　複数のプローブ１２０の各々は、複数のランド１１０の各々の＋Ｚ側の面側に実装されている。図１には、図内の横方向に並ぶ５つのプローブ１２０が模式的に図示されている。複数のプローブ１２０の各々の－Ｚ側の端部及び複数のランド１１０の各々の＋Ｚ側の面は、電気的に互いに接続されている。複数のプローブ１２０の各々の＋Ｚ側の端部及び検査対象物２０の－Ｚ側の面側に位置する複数の第１電極２２の各々は、互いに対向している。図１に示す例において、各プローブ１２０は、カンチレバー構造を有している。具体的には、各プローブ１２０の＋Ｚ側の端部は、Ｚ方向に略垂直な方向に向けて折り曲げられている。よって、各プローブ１２０の＋Ｚ側の端部は、各第１電極２２に向けて付勢可能になっている。ただし、各プローブ１２０の構造は、この例に限定されない。例えば、各プローブ１２０の＋Ｚ側の端部は、巻きばね等の弾性体によって検査対象物２０に向けて付勢可能であってもよい。 Each of the multiple probes 120 is mounted on the +Z side surface of each of the multiple lands 110. FIG. 1 shows five probes 120 arranged horizontally in the figure. The -Z side end of each of the multiple probes 120 and the +Z side surface of each of the multiple lands 110 are electrically connected to each other. The +Z side end of each of the multiple probes 120 and each of the multiple first electrodes 22 located on the -Z side surface of the test object 20 face each other. In the example shown in FIG. 1, each probe 120 has a cantilever structure. Specifically, the +Z side end of each probe 120 is bent in a direction approximately perpendicular to the Z direction. Therefore, the +Z side end of each probe 120 can be biased toward each first electrode 22. However, the structure of each probe 120 is not limited to this example. For example, the +Z side end of each probe 120 may be biased toward the test object 20 by an elastic body such as a coil spring.
　絶縁層１３０は、第２面１０４側に位置している。図１に示す例において、絶縁層１３０は、第１絶縁層１３２、第２絶縁層１３４及び第３絶縁層１３６を含んでいる。第１絶縁層１３２、第２絶縁層１３４及び第３絶縁層１３６は、第２面１０４から離れるにつれてＺ方向に順に積層されている。第１絶縁層１３２、第２絶縁層１３４及び第３絶縁層１３６の各々は、例えば、ポリイミド等の樹脂層である。ただし、絶縁層１３０は、単一の絶縁層であってもよい。或いは、絶縁層１３０は、Ｚ方向に積層された２層の絶縁層又はＺ方向に積層された４層以上の絶縁層を含んでいてもよい。 The insulating layer 130 is located on the second surface 104 side. In the example shown in FIG. 1, the insulating layer 130 includes a first insulating layer 132, a second insulating layer 134, and a third insulating layer 136. The first insulating layer 132, the second insulating layer 134, and the third insulating layer 136 are stacked in order in the Z direction as they move away from the second surface 104. Each of the first insulating layer 132, the second insulating layer 134, and the third insulating layer 136 is, for example, a resin layer such as polyimide. However, the insulating layer 130 may be a single insulating layer. Alternatively, the insulating layer 130 may include two insulating layers stacked in the Z direction or four or more insulating layers stacked in the Z direction.
　複数の接続導体１４０の少なくとも一部分は、絶縁層１３０に埋め込まれている。図１には、図内の横方向に並ぶ４つの接続導体１４０が模式的に図示されている。図１に示す例において、各接続導体１４０は、第１接続導体１４２及び第２接続導体１４４を含んでいる。第１接続導体１４２及び第２接続導体１４４は、例えば、銅及び銅合金の少なくとも一方を含んでいる。 At least a portion of the multiple connection conductors 140 is embedded in the insulating layer 130. FIG. 1 shows four connection conductors 140 arranged horizontally in the figure. In the example shown in FIG. 1, each connection conductor 140 includes a first connection conductor 142 and a second connection conductor 144. The first connection conductor 142 and the second connection conductor 144 include, for example, at least one of copper and a copper alloy.
　図１内の左から１つ目、２つ目及び４つ目の接続導体１４０について説明する。以下のようにして、図１内の左から１つ目、２つ目及び４つ目の接続導体１４０は、それぞれ、図１内の左から１つ目、２つ目及び５つ目のスルーホール１０６の内部導体に電気的に接続されている。 The first, second and fourth connecting conductors 140 from the left in FIG. 1 will be described. The first, second and fourth connecting conductors 140 from the left in FIG. 1 are electrically connected to the internal conductors of the first, second and fifth through holes 106 from the left in FIG. 1, respectively, as follows.
　第１接続導体１４２は、第１ビア１４２ａ及び第１配線１４２ｂを含んでいる。図１に示す例において、第１ビア１４２ａ及び第１配線１４２ｂは、互いに一体となっている。第１ビア１４２ａは、第１絶縁層１３２をＺ方向に略平行に貫通している。第１ビア１４２ａの＋Ｚ側の端部及びスルーホール１０６の－Ｚ側の端部の内部導体は、電気的に互いに接続されている。第１配線１４２ｂは、水平方向に略平行な方向に延在している。第１配線１４２ｂは、図１内の横方向だけでなく、図１の手前又は奥に向けて延在していてもよい。第１配線１４２ｂは、第１絶縁層１３２の－Ｚ側の面側に位置している。第１配線１４２ｂは、第２絶縁層１３４によって覆われている。第１配線１４２ｂの＋Ｚ側の面及び第１ビア１４２ａの－Ｚ側の端部は、電気的に互いに接続されている。 The first connection conductor 142 includes a first via 142a and a first wiring 142b. In the example shown in FIG. 1, the first via 142a and the first wiring 142b are integrated with each other. The first via 142a penetrates the first insulating layer 132 in a direction substantially parallel to the Z direction. The internal conductors at the +Z side end of the first via 142a and the -Z side end of the through hole 106 are electrically connected to each other. The first wiring 142b extends in a direction substantially parallel to the horizontal direction. The first wiring 142b may extend not only in the lateral direction in FIG. 1, but also toward the front or back of FIG. 1. The first wiring 142b is located on the -Z side surface of the first insulating layer 132. The first wiring 142b is covered by the second insulating layer 134. The +Z side surface of the first wiring 142b and the -Z side end of the first via 142a are electrically connected to each other.
　第２接続導体１４４は、第２ビア１４４ａ及び第２配線１４４ｂを含んでいる。図１に示す例において、第２ビア１４４ａ及び第２配線１４４ｂは、互いに一体となっている。第２ビア１４４ａは、第２絶縁層１３４をＺ方向に略平行に貫通している。第２ビア１４４ａの＋Ｚ側の端部及び第１配線１４２ｂの－Ｚ側の面は、電気的に互いに接続されている。第２配線１４４ｂは、水平方向に略平行な方向に延在している。第２配線１４４ｂは、図１内の横方向だけでなく、図１の手前又は奥に向けて延在していてもよい。第２配線１４４ｂは、第２絶縁層１３４の－Ｚ側の面側に位置している。第２配線１４４ｂは、第３絶縁層１３６によって覆われている。第２配線１４４ｂの＋Ｚ側の面及び第２ビア１４４ａの－Ｚ側の端部は、電気的に互いに接続されている。 The second connection conductor 144 includes a second via 144a and a second wiring 144b. In the example shown in FIG. 1, the second via 144a and the second wiring 144b are integrated with each other. The second via 144a penetrates the second insulating layer 134 approximately parallel to the Z direction. The +Z side end of the second via 144a and the -Z side surface of the first wiring 142b are electrically connected to each other. The second wiring 144b extends in a direction approximately parallel to the horizontal direction. The second wiring 144b may extend not only in the lateral direction in FIG. 1, but also toward the front or back of FIG. 1. The second wiring 144b is located on the -Z side surface of the second insulating layer 134. The second wiring 144b is covered by the third insulating layer 136. The +Z side surface of the second wiring 144b and the -Z side end of the second via 144a are electrically connected to each other.
　図１内の左から３つ目の接続導体１４０について説明する。以下、必要に応じて、図１内の左から３つ目の接続導体１４０を接続導体１４０Ｔと表記する。接続導体１４０Ｔは、第１接続導体１４２Ｔ及び第２接続導体１４４Ｔを含んでいる。接続導体１４０Ｔは、以下の点を除いて、図１内の左から１つ目、２つ目及び４つ目の接続導体１４０と同様である。 The third connection conductor 140 from the left in FIG. 1 will be described below. Where necessary, the third connection conductor 140 from the left in FIG. 1 will be referred to as connection conductor 140T. Connection conductor 140T includes a first connection conductor 142T and a second connection conductor 144T. Connection conductor 140T is similar to the first, second, and fourth connection conductors 140 from the left in FIG. 1, except for the following points.
　第１接続導体１４２Ｔは、２つの第１ビア１４２ａＴ及び第１配線１４２ｂＴを含んでいる。２つの第１ビア１４２ａＴの各々の＋Ｚ側の端部と、図１内の左から３つ目及び４つ目のスルーホール１０６の各々の－Ｚ側の端部の内部導体と、は電気的に互いに接続されている。２つの第１ビア１４２ａＴは、同一の第１配線１４２ｂＴに電気的に接続されている。よって、接続導体１４０Ｔを介して、図１内の左から３つ目及び４つ目のスルーホール１０６の内部導体に略同一の電位を供給することができる。すなわち、図１内の左から３つ目及び４つ目のスルーホール１０６の内部導体は、互いに短絡している。これらのスルーホール１０６の内部導体に供給される電位としては、電源電位や接地電位が例示される。図１内の左から１つ目、２つ目及び４つ目の接続導体１４０の第２接続導体１４４と同様にして、第２接続導体１４４Ｔは、第２ビア１４４ａＴ及び第２配線１４４ｂＴを含んでいる。 The first connection conductor 142T includes two first vias 142aT and a first wiring 142bT. The +Z side ends of the two first vias 142aT and the internal conductors at the -Z side ends of the third and fourth through holes 106 from the left in FIG. 1 are electrically connected to each other. The two first vias 142aT are electrically connected to the same first wiring 142bT. Therefore, it is possible to supply approximately the same potential to the internal conductors of the third and fourth through holes 106 from the left in FIG. 1 via the connection conductor 140T. In other words, the internal conductors of the third and fourth through holes 106 from the left in FIG. 1 are short-circuited to each other. Examples of potentials supplied to the internal conductors of these through holes 106 include a power supply potential and a ground potential. Similar to the second connection conductors 144 of the first, second, and fourth connection conductors 140 from the left in FIG. 1, the second connection conductor 144T includes a second via 144aT and a second wiring 144bT.
　複数のパッド１５０は、絶縁層１３０の－Ｚ側の面に位置している。－Ｚ側から見て、複数のパッド１５０は、例えば、略格子状に配置されている。ただし、－Ｚ側から見た場合の複数のパッド１５０のレイアウトは、この例に限定されない。図１には、図内の横方向に並ぶ４つのパッド１５０が模式的に図示されている。複数のパッド１５０の－Ｚ側の面の少なくとも一部分は、第３絶縁層１３６の－Ｚ側の面からピンブロック２００に向けて露出されている。パッド１５０の＋Ｚ側の面及び第２配線１４４ｂの－Ｚ側の面は、互いに電気的に接続されている。実施形態において、各パッド１５０は、接続導体１４０の材料より耐酸化性が高い材料からなっている。各パッド１５０は、例えば金からなっている。実施形態では、各パッド１５０が各接続導体１４０の－Ｚ側の面の少なくとも一部分を覆っている。よって、接続導体１４０の酸化をパッド１５０によって抑制することができる。 The multiple pads 150 are located on the -Z side surface of the insulating layer 130. When viewed from the -Z side, the multiple pads 150 are arranged, for example, in a substantially lattice shape. However, the layout of the multiple pads 150 when viewed from the -Z side is not limited to this example. FIG. 1 shows four pads 150 arranged horizontally in the figure. At least a portion of the -Z side surface of the multiple pads 150 is exposed from the -Z side surface of the third insulating layer 136 toward the pin block 200. The +Z side surface of the pads 150 and the -Z side surface of the second wiring 144b are electrically connected to each other. In the embodiment, each pad 150 is made of a material that is more resistant to oxidation than the material of the connection conductor 140. Each pad 150 is made of, for example, gold. In the embodiment, each pad 150 covers at least a portion of the -Z side surface of each connection conductor 140. Therefore, the oxidation of the connection conductor 140 can be suppressed by the pad 150.
　複数のポゴピン２１０は、ピンブロック２００によって支持されている。ピンブロック２００は、例えば、樹脂等の絶縁体からなっている。図１には、図内の横方向に並ぶ４つのポゴピン２１０が模式的に図示されている。複数のポゴピン２１０の各々の＋Ｚ側の端部及び複数のパッド１５０の各々の－Ｚ側の面は、互いに対向している。複数のポゴピン２１０の各々の－Ｚ側の端部及び検査基板３０の＋Ｚ側の面側に位置する複数の第２電極３２は、互いに対向している。各ポゴピン２１０の－Ｚ側の端部は、各ポゴピン２１０の内部に設けられた不図示の巻きばねによって、第２電極３２に向けて付勢可能になっている。 The multiple pogo pins 210 are supported by a pin block 200. The pin block 200 is made of an insulating material such as resin. FIG. 1 shows four pogo pins 210 arranged horizontally in the figure. The +Z side ends of the multiple pogo pins 210 and the -Z side faces of the multiple pads 150 face each other. The -Z side ends of the multiple pogo pins 210 and the multiple second electrodes 32 located on the +Z side face of the inspection board 30 face each other. The -Z side ends of each pogo pin 210 can be biased toward the second electrodes 32 by a coil spring (not shown) provided inside each pogo pin 210.
　図１を参照して、接続装置１０を用いての検査対象物２０の検査について説明する。 With reference to Figure 1, the inspection of the inspection target 20 using the connection device 10 will be described.
　この検査において、複数のプローブ１２０の各々の＋Ｚ側の端部と、検査対象物２０の複数の第１電極２２の各々と、は互いに接触している。複数のポゴピン２１０の各々の＋Ｚ側の端部と、複数のパッド１５０の各々の－Ｚ側の面と、は互いに接触している。複数のポゴピン２１０の各々の－Ｚ側の端部と、検査基板３０の複数の第２電極３２の各々と、は互いに接触している。よって、各第１電極２２及び各第２電極３２は、各プローブ１２０と、各ランド１１０と、各スルーホール１０６に設けられた内部導体と、各接続導体１４０と、各ポゴピン２１０と、を介して電気的に互いに接続されている。 In this test, the +Z end of each of the multiple probes 120 and each of the multiple first electrodes 22 of the test object 20 are in contact with each other. The +Z end of each of the multiple pogo pins 210 and the -Z surface of each of the multiple pads 150 are in contact with each other. The -Z end of each of the multiple pogo pins 210 and each of the multiple second electrodes 32 of the test board 30 are in contact with each other. Therefore, each first electrode 22 and each second electrode 32 are electrically connected to each other via each probe 120, each land 110, the internal conductor provided in each through hole 106, each connection conductor 140, and each pogo pin 210.
　実施形態では、検査対象物２０の検査において各パッド１５０の－Ｚ側の面及び各ポゴピン２１０の＋Ｚ側の端部が互いに接触する際、絶縁層１３０を各パッド１５０への荷重を緩和する部材として機能させることができる。よって、絶縁層１３０が設けられていない場合と比較して、接続装置１０の耐久性を向上させることができる。 In the embodiment, when the -Z side surface of each pad 150 and the +Z side end of each pogo pin 210 come into contact with each other during inspection of the inspection target 20, the insulating layer 130 can function as a member that relieves the load on each pad 150. Therefore, the durability of the connection device 10 can be improved compared to when the insulating layer 130 is not provided.
　次に、図１を参照して、接続装置１０の検査対象物２０側の電極のピッチ、数等のレイアウトと、接続装置１０の検査基板３０側の電極のピッチ、数等のレイアウトと、の関係について説明する。実施形態では、接続導体１４０によって、接続装置１０の検査対象物２０側の電極のレイアウトと、接続装置１０の検査基板３０側の電極のレイアウトと、を互いに異ならせることができる。実施形態において、接続装置１０の検査対象物２０側の電極は、ランド１１０に相当している。実施形態において、接続装置１０の検査基板３０側の電極は、パッド１５０に相当している。 Next, referring to FIG. 1, the relationship between the layout of the electrodes on the test subject 20 side of the connection device 10 (such as the pitch and number) and the layout of the electrodes on the test board 30 side of the connection device 10 (such as the pitch and number) will be described. In the embodiment, the connection conductor 140 can make the layout of the electrodes on the test subject 20 side of the connection device 10 different from the layout of the electrodes on the test board 30 side of the connection device 10. In the embodiment, the electrodes on the test subject 20 side of the connection device 10 correspond to the lands 110. In the embodiment, the electrodes on the test board 30 side of the connection device 10 correspond to the pads 150.
　実施形態におけるランド１１０の水平方向のピッチ及びパッド１５０の水平方向のピッチの関係について説明する。 The relationship between the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 in this embodiment will be explained.
　各接続導体１４０では、各第１配線１４２ｂ及び各第２配線１４４ｂが水平方向に略平行な方向に延在している。よって、スルーホール１０６の－Ｚ側の端部の水平方向内の位置と、当該スルーホール１０６に設けられた内部導体に電気的に接続されたパッド１５０の水平方向内の位置と、を水平方向に互いにずらすことができる。したがって、接続導体１４０の構造に応じて、ランド１１０の水平方向のピッチ及びパッド１５０の水平方向のピッチを互いに変換することができる。 In each connecting conductor 140, each first wiring 142b and each second wiring 144b extend in a direction approximately parallel to the horizontal direction. Therefore, the horizontal position of the -Z side end of the through hole 106 and the horizontal position of the pad 150 electrically connected to the internal conductor provided in the through hole 106 can be shifted from each other in the horizontal direction. Therefore, depending on the structure of the connecting conductor 140, the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be converted into each other.
　各接続導体１４０は、少なくとも部分的にＺ方向に互いに重なる複数の配線を有している。図１に示す例では、各接続導体１４０において、第１配線１４２ｂ及び第２配線１４４ｂが少なくとも部分的にＺ方向に互いに重なっている。よって、実施形態では、複数層の配線によって、ランド１１０の水平方向のピッチ及びパッド１５０の水平方向のピッチを互いに変換することができる。したがって、単層の配線によって、ランド１１０の水平方向のピッチ及びパッド１５０の水平方向のピッチを互いに変換する場合と比較して、ランド１１０の水平方向のピッチ及びパッド１５０の水平方向のピッチの変換の自由度を向上させることができる。 Each connection conductor 140 has a plurality of wirings that at least partially overlap each other in the Z direction. In the example shown in FIG. 1, in each connection conductor 140, the first wiring 142b and the second wiring 144b at least partially overlap each other in the Z direction. Thus, in the embodiment, the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be converted into each other by multiple layers of wiring. Therefore, compared to the case where the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 are converted into each other by a single layer of wiring, the degree of freedom in converting the horizontal pitch of the lands 110 and the horizontal pitch of the pads 150 can be improved.
　実施形態におけるランド１１０の数及びパッド１５０の数の関係について説明する。 The relationship between the number of lands 110 and the number of pads 150 in this embodiment will be explained.
　図１に示す例では、図内の横方向に並ぶランド１１０の数５個と、図内の横方向に並ぶパッド１５０の数４個と、が図内の横方向に並ぶ４つの接続導体１４０によって互いに異なっている。すなわち、パッド１５０の数がランド１１０の数より少なくなっている。具体的には、図１に示す例では、図内の左から３つ目のスルーホール１０６の内部導体と、図内の左から４つ目のスルーホール１０６の内部導体と、が接続導体１４０Ｔに電気的に接続されている。接続導体１４０Ｔは、図内の左から３つ目の単一のパッド１５０に電気的に接続されている。したがって、これら２つのスルーホール１０６に別々の接続導体１４０を設ける場合と比較して、パッド１５０の数を１つだけ少なくすることができる。 In the example shown in FIG. 1, the number of lands 110 arranged horizontally in the figure (five) and the number of pads 150 arranged horizontally in the figure (four) are different due to the four connecting conductors 140 arranged horizontally in the figure. In other words, the number of pads 150 is less than the number of lands 110. Specifically, in the example shown in FIG. 1, the internal conductor of the third through hole 106 from the left in the figure and the internal conductor of the fourth through hole 106 from the left in the figure are electrically connected to the connecting conductor 140T. The connecting conductor 140T is electrically connected to the third single pad 150 from the left in the figure. Therefore, the number of pads 150 can be reduced by one compared to the case where separate connecting conductors 140 are provided for these two through holes 106.
　ランド１１０の数及びパッド１５０の数の関係は、図１に示す例に限定されない。ランド１１０の数及びパッド１５０の数を互いに異ならせるため、複数のスルーホール１０６の内部導体と、１つの接続導体１４０と、が電気的に互いに接続されていればよい。例えば、３つのスルーホール１０６の内部導体と、１つの接続導体１４０と、が電気的に互いに接続されていてもよい。 The relationship between the number of lands 110 and the number of pads 150 is not limited to the example shown in FIG. 1. In order to make the number of lands 110 and the number of pads 150 different from each other, it is sufficient that the internal conductors of the multiple through holes 106 and one connecting conductor 140 are electrically connected to each other. For example, the internal conductors of three through holes 106 and one connecting conductor 140 may be electrically connected to each other.
　図１に示す例では、パッド１５０の数がランド１１０の数より少なくなっている。しかしながら、接続導体１４０によって、パッド１５０の数をランド１１０の数より多くしてもよい。すなわち、パッド１５０の数をランド１１０の数より多くするため、１つの接続導体１４０と、複数のパッド１５０と、が電気的に互いに接続されていてもよい。この場合、当該１つの接続導体１４０と、１つのスルーホール１０６の内部導体と、が電気的に互いに接続されている。 In the example shown in FIG. 1, the number of pads 150 is less than the number of lands 110. However, the number of pads 150 may be greater than the number of lands 110 by using the connection conductors 140. That is, in order to make the number of pads 150 greater than the number of lands 110, one connection conductor 140 and multiple pads 150 may be electrically connected to each other. In this case, the one connection conductor 140 and the internal conductor of one through hole 106 are electrically connected to each other.
　次に、図１を参照して、接続装置１０の第１面１０２側の平坦性について説明する。 Next, the flatness of the first surface 102 of the connection device 10 will be described with reference to FIG.
　実施形態では、接続導体１４０が第１面１０２側でなく第２面１０４側に位置している。仮に、接続導体１４０が第１面１０２側に位置する状態を検討する。この状態では、－Ｚ側から＋Ｚ側にかけて、複数のパッド１５０、基板１００、絶縁層１３０及び複数のプローブ１２０が順に並んでいる。絶縁層１３０には、複数の接続導体１４０が設けられている。この状態においては、接続装置１０の第１面１０２側の平坦性を確保することが比較的難しくなることがある。これは、第１絶縁層１３２、第２絶縁層１３４等、水平方向に略平行な方向の長さが比較的長い絶縁層のＺ方向の厚さの均一性を確保することが比較的難しいことによる。また、第１配線１４２ｂや第２配線１４４ｂ等、水平方向に略平行な方向の長さが比較的長い配線のＺ方向の厚さの均一性を確保することが比較的難しいことによる。また、第１配線１４２ｂ及び第２配線１４４ｂがＺ方向に互いに重なり合う領域の面積に応じて、接続導体１４０のＺ方向の高さにばらつきが生じ得ることによる。実施形態では、第１面１０２側にランド１１０が位置している。ランド１１０は、第１ランド層１１２及び第２ランド層１１４を一体として単層配線とみなすことができる。よって、絶縁層１３０に相当する絶縁層を設けることなく、ランド１１０を形成することができる。また、ランド１１０の水平方向に略平行な長さ又は幅は、第１配線１４２ｂや第２配線１４４ｂ等、接続装置１０の検査対象物２０側の電極のピッチ及び接続装置１０の検査基板３０側の電極のピッチの変換に用いられる配線の水平方向に略平行な長さより短くしやすくなっている。よって、実施形態では、接続導体１４０が第１面１０２側に位置する場合と比較して、接続装置１０の第１面１０２側の平坦性を確保しやすくすることができる。 In the embodiment, the connection conductor 140 is located on the second surface 104 side, not on the first surface 102 side. Let us consider a state in which the connection conductor 140 is located on the first surface 102 side. In this state, from the -Z side to the +Z side, a plurality of pads 150, the substrate 100, the insulating layer 130, and a plurality of probes 120 are arranged in order. The insulating layer 130 is provided with a plurality of connection conductors 140. In this state, it may be relatively difficult to ensure flatness on the first surface 102 side of the connection device 10. This is because it is relatively difficult to ensure uniformity in the thickness in the Z direction of insulating layers that are relatively long in a direction approximately parallel to the horizontal direction, such as the first insulating layer 132 and the second insulating layer 134. In addition, it is relatively difficult to ensure uniformity in the thickness in the Z direction of wiring that is relatively long in a direction approximately parallel to the horizontal direction, such as the first wiring 142b and the second wiring 144b. In addition, the height of the connection conductor 140 in the Z direction may vary depending on the area of the region where the first wiring 142b and the second wiring 144b overlap each other in the Z direction. In the embodiment, the land 110 is located on the first surface 102 side. The land 110 can be regarded as a single-layer wiring by integrating the first land layer 112 and the second land layer 114. Therefore, the land 110 can be formed without providing an insulating layer equivalent to the insulating layer 130. In addition, the length or width of the land 110 approximately parallel to the horizontal direction is easily made shorter than the length approximately parallel to the horizontal direction of the wiring used to convert the pitch of the electrodes on the inspection target 20 side of the connection device 10 and the pitch of the electrodes on the inspection board 30 side of the connection device 10, such as the first wiring 142b and the second wiring 144b. Therefore, in the embodiment, it is easier to ensure the flatness of the first surface 102 side of the connection device 10 compared to the case where the connection conductor 140 is located on the first surface 102 side.
　次に、図１を参照して、基板１００の歩留まりについて説明する。 Next, the yield of the substrate 100 will be explained with reference to FIG.
　上述したように、実施形態では、複数の接続導体１４０によって、接続装置１０の検査対象物２０側の電極のレイアウトと、接続装置１０の検査基板３０側の電極のレイアウトと、が互いに異なっている。よって、基板１００は、接続装置１０の検査対象物２０側の電極のレイアウトと、接続装置１０の検査基板３０側の電極のレイアウトと、を互いに異ならせるための内部配線を有する必要がない。仮に、基板１００が当該内部配線を有する場合、基板１００の歩留まりが比較的低くなることがある。これに対して、実施形態では、基板１００は、スルーホール１０６を画定している。すなわち、実施形態では、基板１００が上述の内部配線を有する場合と比較して、基板１００を単純な構造にすることができる。よって、基板１００が上述の内部配線を有する場合と比較して、基板１００の歩留まりを向上させることができる。ただし、基板１００の歩留まりの向上を考慮しないのであれば、基板１００は、上述の内部配線を有していてもよい。 As described above, in the embodiment, the layout of the electrodes on the test subject 20 side of the connection device 10 and the layout of the electrodes on the test board 30 side of the connection device 10 are different from each other due to the multiple connection conductors 140. Therefore, the board 100 does not need to have internal wiring to make the layout of the electrodes on the test subject 20 side of the connection device 10 and the layout of the electrodes on the test board 30 side of the connection device 10 different from each other. If the board 100 had the internal wiring, the yield of the board 100 may be relatively low. In contrast, in the embodiment, the board 100 defines the through hole 106. That is, in the embodiment, the board 100 can have a simpler structure than when the board 100 has the above-mentioned internal wiring. Therefore, the yield of the board 100 can be improved compared to when the board 100 has the above-mentioned internal wiring. However, if the improvement of the yield of the board 100 is not taken into consideration, the board 100 may have the above-mentioned internal wiring.
　実施形態において、絶縁層１３０及び接続導体１４０を有する配線層は、基板１００の第２面１０４側に位置している。このような配線層の良否判定は、外観検査によって行うことができる。さらに、基板１００が上述の内部配線を有する場合、基板１００の当該内部配線の良否判定は、電気的検査で行われることがある。しかしながら、この電気的検査では、基板１００のランドやパッドに検査痕が残る可能性がある。このような検査痕上に配線が設けられると、接続装置１０の歩留まりが悪化する可能性がある。これに対して、実施形態では、基板１００の、電気的検査を行わない。したがって、電気的検査による接続装置１０の歩留まりの悪化を抑制することができる。 In the embodiment, the wiring layer having the insulating layer 130 and the connection conductor 140 is located on the second surface 104 side of the substrate 100. The quality of such a wiring layer can be determined by visual inspection. Furthermore, if the substrate 100 has the above-mentioned internal wiring, the quality of the internal wiring of the substrate 100 may be determined by electrical inspection. However, this electrical inspection may leave inspection marks on the lands and pads of the substrate 100. If wiring is provided on such inspection marks, the yield of the connection device 10 may deteriorate. In contrast, in the embodiment, the substrate 100 is not subjected to electrical inspection. Therefore, deterioration of the yield of the connection device 10 due to electrical inspection can be suppressed.
　図２～図４は、実施形態に係る接続装置１０の製造方法の一例を説明するための図である。図２～図４におけるＺ軸の向きは、紙面の上下方向において図１におけるＺ軸の向きとは逆になっている。この例において、接続装置１０は、以下のようにして製造されている。 FIGS. 2 to 4 are diagrams for explaining an example of a manufacturing method for the connection device 10 according to the embodiment. The direction of the Z axis in FIG. 2 to FIG. 4 is opposite to the direction of the Z axis in FIG. 1 in the up-down direction of the paper. In this example, the connection device 10 is manufactured as follows.
　まず、図２に示すように、原基板１００Ｒを準備する。原基板１００Ｒには、図１を用いて説明した複数のスルーホール１０６が予め形成されている。図２～図４には、図の簡易化のため、スルーホール１０６は図示されていない。原基板１００Ｒの第２面１０４には、粗化処理が予め施されていてもよい。粗化処理によって、第２面１０４と、第１絶縁層１３２等、第２面１０４に設けられる層と、の密着性を向上させることができる。原基板１００Ｒの第１面１０２にも、同様に、粗化処理が予め施されていてもよい。 First, as shown in FIG. 2, the original substrate 100R is prepared. The original substrate 100R has a plurality of through holes 106 formed therein as described with reference to FIG. 1. To simplify the drawings, the through holes 106 are not shown in FIGS. 2 to 4. The second surface 104 of the original substrate 100R may be roughened beforehand. The roughening treatment can improve the adhesion between the second surface 104 and layers provided on the second surface 104, such as the first insulating layer 132. Similarly, the first surface 102 of the original substrate 100R may also be roughened beforehand.
　図２～図４には、原基板１００Ｒから２つの基板１００が切り出される２つの区画Ｓが図示されている。図２～図４では、説明の簡易化のため、各区画Ｓにおいて１つの接続導体１４０が形成されている。しかしながら、実際には、各区画Ｓにおいて複数の接続導体１４０が形成されることもある。原基板１００Ｒから切り出される基板１００の数は、２つに限定されず、３つ以上となることもある。 Figures 2 to 4 show two sections S from which two substrates 100 are cut out from the original substrate 100R. For ease of explanation, in Figures 2 to 4, one connection conductor 140 is formed in each section S. However, in reality, multiple connection conductors 140 may be formed in each section S. The number of substrates 100 cut out from the original substrate 100R is not limited to two, and may be three or more.
　次いで、図２に示すように、原基板１００Ｒの第２面１０４側の各区画Ｓにおいて第１絶縁層１３２を形成する。第１絶縁層１３２は、例えば、リソグラフィ技術を用いて形成されている。各区画Ｓにおいて、第１絶縁層１３２は、第１開口パターン１３２ａを画定している。各区画Ｓにおいて、第１開口パターン１３２ａは、第２面１０４の一部分を－Ｚ側に向けて露出している。 Next, as shown in FIG. 2, a first insulating layer 132 is formed in each section S on the second surface 104 side of the original substrate 100R. The first insulating layer 132 is formed, for example, using lithography technology. In each section S, the first insulating layer 132 defines a first opening pattern 132a. In each section S, the first opening pattern 132a exposes a portion of the second surface 104 toward the -Z side.
　次いで、図２に示すように、原基板１００Ｒの第２面１０４側の２つの区画Ｓに亘って第１シード層１４２ｓを形成する。第１シード層１４２ｓは、例えば、スパッタ、イオンプレーティング等の方法によって形成されている。第１シード層１４２ｓは、例えば、第２面１０４から離れるにつれてＺ方向に順に積層された銅層及びチタンタングステン合金層（ＴｉＷ／Ｃｕ）を含んでいる。 Next, as shown in FIG. 2, a first seed layer 142s is formed across two sections S on the second surface 104 side of the original substrate 100R. The first seed layer 142s is formed by a method such as sputtering or ion plating. The first seed layer 142s includes, for example, a copper layer and a titanium tungsten alloy layer (TiW/Cu) that are stacked in sequence in the Z direction as they move away from the second surface 104.
　次いで、図２に示すように、第１レジスト３０２を形成する。第１レジスト３０２は、例えば、リソグラフィ技術を用いて形成されている。各区画Ｓにおいて、第１レジスト３０２は、第１レジスト開口３０２ａを画定している。図２に示す例において、第１レジスト３０２の一部分は、第１シード層１４２ｓにおける２つの区画Ｓの間で延在する部分を覆っている。各第１レジスト開口３０２ａの少なくとも一部分及び各第１開口パターン１３２ａの少なくとも一部分は、Ｚ方向に互いに重なっている。各区画Ｓにおいて、第１レジスト開口３０２ａは、第１シード層１４２ｓの－Ｚ側の面の一部分を－Ｚ側に向けて露出している。 Next, as shown in FIG. 2, a first resist 302 is formed. The first resist 302 is formed, for example, using lithography techniques. In each section S, the first resist 302 defines a first resist opening 302a. In the example shown in FIG. 2, a portion of the first resist 302 covers a portion of the first seed layer 142s that extends between two sections S. At least a portion of each first resist opening 302a and at least a portion of each first opening pattern 132a overlap each other in the Z direction. In each section S, the first resist opening 302a exposes a portion of the -Z side surface of the first seed layer 142s toward the -Z side.
　次いで、図２に示すように、第１シード層１４２ｓを用いた電解めっきによって、第１めっき層１４２ｐを形成する。第１めっき層１４２ｐは、例えば、銅層である。各区画Ｓにおいて、第１めっき層１４２ｐは、第１開口パターン１３２ａ及び第１レジスト開口３０２ａに埋め込まれている。よって、各区画Ｓにおいて、第１シード層１４２ｓ及び第１めっき層１４２ｐにおける第１開口パターン１３２ａに埋め込まれた部分は、第１ビア１４２ａとなる。各区画Ｓにおいて、第１シード層１４２ｓ及び第１めっき層１４２ｐにおける第１レジスト開口３０２ａに埋め込まれた部分は、第１配線１４２ｂとなる。 Next, as shown in FIG. 2, the first plating layer 142p is formed by electrolytic plating using the first seed layer 142s. The first plating layer 142p is, for example, a copper layer. In each section S, the first plating layer 142p is embedded in the first opening pattern 132a and the first resist opening 302a. Therefore, in each section S, the portion of the first seed layer 142s and the first plating layer 142p embedded in the first opening pattern 132a becomes the first via 142a. In each section S, the portion of the first seed layer 142s and the first plating layer 142p embedded in the first resist opening 302a becomes the first wiring 142b.
　次いで、図３に示すように、第１レジスト３０２を除去する。 Then, as shown in FIG. 3, the first resist 302 is removed.
　次いで、図３に示すように、第１シード層１４２ｓにおける第１めっき層１４２ｐとＺ方向に重ならない部分をエッチングによって除去する。よって、各区画Ｓの第１接続導体１４２が電気的に互いに絶縁される。このエッチングでは、例えば、第１めっき層１４２ｐよりも第１シード層１４２ｓを選択的にエッチングするエッチャントが用いられている。 Next, as shown in FIG. 3, the portion of the first seed layer 142s that does not overlap with the first plating layer 142p in the Z direction is removed by etching. Thus, the first connection conductors 142 of each section S are electrically insulated from each other. In this etching, for example, an etchant is used that selectively etches the first seed layer 142s rather than the first plating layer 142p.
　図２～図４では、図の簡易化のため、第１シード層１４２ｓのＺ方向の厚さ及び第１めっき層１４２ｐのＺ方向の厚さはほぼ等しいように模式的に描写されている。しかしながら、第１めっき層１４２ｐのＺ方向の厚さは、実際には、第１シード層１４２ｓのＺ方向の厚さのおおよそ１０倍以上となっている。よって、第１シード層１４２ｓにおける第１めっき層１４２ｐとＺ方向に重ならない部分とともに第１めっき層１４２pの一部分がエッチングによって除去されても、第１めっき層１４２ｐのＺ方向の全体の厚さはほとんど変化しない。 2 to 4, for the sake of simplicity, the Z-direction thickness of the first seed layer 142s and the Z-direction thickness of the first plating layer 142p are depicted diagrammatically as being approximately equal. However, the Z-direction thickness of the first plating layer 142p is actually approximately 10 times or more the Z-direction thickness of the first seed layer 142s. Therefore, even if a portion of the first plating layer 142p, together with the portion of the first seed layer 142s that does not overlap with the first plating layer 142p in the Z direction, is removed by etching, the overall Z-direction thickness of the first plating layer 142p remains almost unchanged.
　次いで、図３に示すように、各区画Ｓにおいて第２絶縁層１３４を形成する。第２絶縁層１３４は、例えば、リソグラフィ技術を用いて形成されている。各区画Ｓにおいて、第２絶縁層１３４は、第２開口パターン１３４ａを画定している。第２絶縁層１３４は、第２開口パターン１３４ａを除いて、第１接続導体１４２を覆っている。各区画Ｓにおいて、第２開口パターン１３４ａは、第１接続導体１４２の－Ｚ側の面の一部分を－Ｚ側に向けて露出している。 Next, as shown in FIG. 3, a second insulating layer 134 is formed in each section S. The second insulating layer 134 is formed, for example, using lithography technology. In each section S, the second insulating layer 134 defines a second opening pattern 134a. The second insulating layer 134 covers the first connecting conductor 142 except for the second opening pattern 134a. In each section S, the second opening pattern 134a exposes a portion of the -Z side surface of the first connecting conductor 142 toward the -Z side.
　次いで、図３に示すように、原基板１００Ｒの第２面１０４側の２つの区画Ｓに亘って第２シード層１４４ｓを形成する。第２シード層１４４ｓは、例えば、スパッタ、イオンプレーティング等の方法によって形成されている。第２シード層１４４ｓは、例えば、第２面１０４から離れるにつれてＺ方向に順に積層された銅層及びチタンタングステン合金層（ＴｉＷ／Ｃｕ）を含んでいる。 Next, as shown in FIG. 3, a second seed layer 144s is formed across two sections S on the second surface 104 side of the original substrate 100R. The second seed layer 144s is formed by a method such as sputtering or ion plating. The second seed layer 144s includes, for example, a copper layer and a titanium tungsten alloy layer (TiW/Cu) that are stacked in sequence in the Z direction as they move away from the second surface 104.
　次いで、図３に示すように、第２レジスト３０４を形成する。第２レジスト３０４は、例えば、リソグラフィ技術を用いて形成されている。各区画Ｓにおいて、第２レジスト３０４は、第２レジスト開口３０４ａを画定している。図３に示す例において、第２レジスト３０４の一部分は、第２シード層１４４ｓにおける２つの区画Ｓの間で延在する部分を覆っている。各第２レジスト開口３０４ａの少なくとも一部分及び各第２開口パターン１３４ａの少なくとも一部分は、Ｚ方向に互いに重なっている。各区画Ｓにおいて、第２レジスト開口３０４ａは、第２シード層１４４ｓの－Ｚ側の面の一部分を－Ｚ側に向けて露出している。 Then, as shown in FIG. 3, a second resist 304 is formed. The second resist 304 is formed, for example, using lithography techniques. In each section S, the second resist 304 defines a second resist opening 304a. In the example shown in FIG. 3, a portion of the second resist 304 covers a portion of the second seed layer 144s that extends between two sections S. At least a portion of each second resist opening 304a and at least a portion of each second opening pattern 134a overlap each other in the Z direction. In each section S, the second resist opening 304a exposes a portion of the -Z side surface of the second seed layer 144s toward the -Z side.
　次いで、図３に示すように、第２シード層１４４ｓを用いた電解めっきによって、第２めっき層１４４ｐを形成する。第２めっき層１４４ｐは、例えば、銅層である。各区画Ｓにおいて、第２めっき層１４４ｐは、第２開口パターン１３４ａ及び第２レジスト開口３０４ａに埋め込まれている。よって、各区画Ｓにおいて、第２シード層１４４ｓ及び第２めっき層１４４ｐにおける第２開口パターン１３４ａに埋め込まれた部分は、第２ビア１４４ａとなる。各区画Ｓにおいて、第２シード層１４４ｓ及び第２めっき層１４４ｐにおける第２レジスト開口３０４ａに埋め込まれた部分は、第２配線１４４ｂとなる。 Next, as shown in FIG. 3, the second plating layer 144p is formed by electrolytic plating using the second seed layer 144s. The second plating layer 144p is, for example, a copper layer. In each section S, the second plating layer 144p is embedded in the second opening pattern 134a and the second resist opening 304a. Therefore, in each section S, the portion of the second seed layer 144s and the second plating layer 144p embedded in the second opening pattern 134a becomes the second via 144a. In each section S, the portion of the second seed layer 144s and the second plating layer 144p embedded in the second resist opening 304a becomes the second wiring 144b.
　次いで、図４に示すように、第２レジスト３０４を除去する。 Then, as shown in FIG. 4, the second resist 304 is removed.
　次いで、図４に示すように、第２シード層１４４ｓにおける第２めっき層１４４ｐとＺ方向に重ならない部分をエッチングによって除去する。よって、各区画Ｓの第２接続導体１４４が電気的に互いに絶縁される。このエッチングでは、例えば、第２めっき層１４４ｐよりも第２シード層１４４ｓを選択的にエッチングするエッチャントが用いられている。第１シード層１４２ｓ及び第１めっき層１４２ｐの上述のエッチングと同様にして、第２シード層１４４ｓにおける第２めっき層１４４ｐとＺ方向に重ならない部分とともに第２めっき層１４４ｐの一部分がエッチングによって除去されても、第２めっき層１４４ｐのＺ方向の全体の厚さはほとんど変化しない。 Next, as shown in FIG. 4, the portion of the second seed layer 144s that does not overlap with the second plating layer 144p in the Z direction is removed by etching. Thus, the second connection conductors 144 of each section S are electrically insulated from each other. In this etching, for example, an etchant is used that selectively etches the second seed layer 144s more than the second plating layer 144p. As with the above-described etching of the first seed layer 142s and the first plating layer 142p, even if a portion of the second plating layer 144p is removed by etching together with the portion of the second seed layer 144s that does not overlap with the second plating layer 144p in the Z direction, the overall thickness of the second plating layer 144p in the Z direction remains almost unchanged.
　次いで、図４に示すように、各区画Ｓにおいて第３絶縁層１３６を形成する。第３絶縁層１３６は、例えば、リソグラフィ技術を用いて形成されている。各区画Ｓにおいて、第３絶縁層１３６は、第３開口パターン１３６ａを画定している。第３絶縁層１３６は、第３開口パターン１３６ａを除いて、第２接続導体１４４を覆っている。各区画Ｓにおいて、第３開口パターン１３６ａは、第２接続導体１４４の－Ｚ側の面の一部分を－Ｚ側に向けて露出している。 Next, as shown in FIG. 4, a third insulating layer 136 is formed in each section S. The third insulating layer 136 is formed, for example, using lithography technology. In each section S, the third insulating layer 136 defines a third opening pattern 136a. The third insulating layer 136 covers the second connecting conductor 144 except for the third opening pattern 136a. In each section S, the third opening pattern 136a exposes a portion of the -Z side surface of the second connecting conductor 144 toward the -Z side.
　次いで、各区画Ｓにおいて、第３絶縁層１３６の第３開口パターン１３６ａにパッド１５０を形成する。次いで、各区画Ｓにおいて、原基板１００Ｒの第１面１０２側にランド１１０を形成する。ただし、ランド１１０を形成した後にパッド１５０を形成してもよい。次いで、ダイシングによって原基板１００Ｒの２つの区画Ｓから２つの基板１００を切り出す。次いで、ランド１１０の＋Ｚ側の面側にプローブ１２０を実装する。 Next, in each section S, a pad 150 is formed in the third opening pattern 136a of the third insulating layer 136. Next, in each section S, a land 110 is formed on the first surface 102 side of the original substrate 100R. However, the pad 150 may be formed after the land 110 is formed. Next, two substrates 100 are cut out from the two sections S of the original substrate 100R by dicing. Next, a probe 120 is mounted on the +Z side surface of the land 110.
　このようにして、実施形態に係る接続装置１０が製造される。 In this manner, the connection device 10 according to the embodiment is manufactured.
　上述したように、実施形態では、１つの原基板１００Ｒから複数の基板１００が切り出されている。よって、原基板１００Ｒが上述した内部配線を有する場合、内部配線の良否判定において不良と判定される基板１００が切り出される可能性を抑制することが比較的難しくなることがある。これに対して、実施形態においては、原基板１００Ｒが上述した内部配線を有する必要がない。よって、原基板１００Ｒが内部配線を有する場合と比較して、良否判定において良と判定される基板１００を原基板１００Ｒから効率的に切り出しやすくすることができる。 As described above, in the embodiment, multiple substrates 100 are cut out from one original substrate 100R. Therefore, when the original substrate 100R has the above-mentioned internal wiring, it may be relatively difficult to reduce the possibility of cutting out a substrate 100 that is determined to be defective in the quality judgment of the internal wiring. In contrast, in the embodiment, the original substrate 100R does not need to have the above-mentioned internal wiring. Therefore, compared to when the original substrate 100R has internal wiring, it is possible to efficiently cut out a substrate 100 that is determined to be good in the quality judgment from the original substrate 100R more easily.
　以上、図面を参照して本発明の実施形態について述べたが、これらは本発明の例示であり、上記以外の様々な構成を採用することもできる。 The above describes the embodiments of the present invention with reference to the drawings, but these are merely examples of the present invention, and various configurations other than those described above can also be adopted.
　例えば、実施形態では、複数のランド１１０のレイアウト及び複数のパッド１５０のレイアウトが互いに異なっている。しかしながら、複数のランド１１０のレイアウト及び複数のパッド１５０のレイアウトは互いに同一であってもよい。 For example, in the embodiment, the layout of the lands 110 and the layout of the pads 150 are different from each other. However, the layout of the lands 110 and the layout of the pads 150 may be the same as each other.
　本明細書によれば、以下の態様の接続装置が提供される。
（態様１）
　態様１では、検査対象物及び検査基板を電気的に接続する接続装置が、基板と、前記基板の前記検査基板に対向する所定面側に位置する接続導体と、を備えている。 According to the present specification, there is provided a connection device having the following aspects.
(Aspect 1)
In the first aspect, a connection device that electrically connects an object to be inspected and an inspection board includes a board and a connection conductor located on a predetermined surface side of the board that faces the inspection board.
　「所定面」は、上述の実施形態の「第２面」に相当する。 The "predetermined surface" corresponds to the "second surface" in the above embodiment.
　上述の態様によれば、基板の検査対象物に対向する面側に接続導体が設けられている場合と比較して、接続装置の検査対象物に対向する面側の平坦性を確保することができる。 The above-mentioned aspect ensures flatness of the surface of the connection device facing the object to be inspected, compared to when the connection conductor is provided on the surface of the board facing the object to be inspected.
（態様２）
　態様２では、前記基板が、前記接続導体に電気的に接続された内部導体が設けられたスルーホールを画定している。 (Aspect 2)
In a second aspect, the substrate defines a through hole having an inner conductor electrically connected to the connecting conductor.
　上述の態様によれば、基板が、接続装置の検査対象物に対向する面側の電極のレイアウトと、接続装置の検査基板に対向する面側の電極のレイアウトと、を互いに異ならせるための内部配線を有する場合と比較して、基板を単純な構造にすることができる。よって、基板が当該内部配線を有する場合と比較して、基板の歩留まりを向上させることができる。 According to the above-mentioned aspect, the board can have a simpler structure than when the board has internal wiring for making the layout of the electrodes on the side of the connection device facing the test object and the layout of the electrodes on the side of the connection device facing the test board different from each other. Therefore, the yield of the board can be improved compared to when the board has such internal wiring.
（態様３）
　態様３では、前記基板が、前記接続導体に電気的に接続された複数の内部導体を有している。 (Aspect 3)
In a third aspect, the substrate has a plurality of internal conductors electrically connected to the connecting conductors.
　上述の態様によれば、複数の内部導体に別々の接続導体を電気的に接続する場合と比較して、検査基板の電極の数を少なくすることができる。上述の態様によれば、接続導体を介して、複数の内部導体に略同一の電位を供給することができる。 According to the above-mentioned aspect, the number of electrodes on the inspection board can be reduced compared to the case where separate connection conductors are electrically connected to the multiple internal conductors. According to the above-mentioned aspect, it is possible to supply approximately the same potential to the multiple internal conductors via the connection conductors.
（態様４）
　態様４では、前記接続導体が、少なくとも部分的に互いに重なる複数の配線を有している。 (Aspect 4)
In a fourth aspect, the connecting conductor has a plurality of wirings that at least partially overlap each other.
　上述の態様によれば、少なくとも部分的に互いに重なる複数の配線によって、接続装置の検査対象物に対向する面側の電極のピッチと、接続装置の検査基板に対向する面側の電極のピッチと、を互いに変換することができる。よって、互いに重なることがない複数の配線によって当該ピッチを互いに変換する場合と比較して、当該ピッチの変換の自由度を向上させることができる。 According to the above-mentioned aspect, the pitch of the electrodes on the side of the connection device facing the test object and the pitch of the electrodes on the side of the connection device facing the test board can be converted from each other by using multiple wirings that at least partially overlap each other. Therefore, the degree of freedom in converting the pitch can be improved compared to when the pitch is converted from each other by using multiple wirings that do not overlap each other.
（態様５）
　態様５では、接続装置が、前記接続導体の少なくとも一部分が埋め込まれた絶縁層をさらに備えている。 (Aspect 5)
In a fifth aspect, the connection device further comprises an insulating layer in which at least a portion of the connection conductor is embedded.
　上述の態様によれば、検査対象物の検査において、接続装置の検査基板に対向する面側の電極と、ポゴピン等の外部部材と、が互いに接触する際、絶縁層を当該電極への荷重を緩和する部材として機能させることができる。よって、絶縁層が設けられていない場合と比較して、接続装置の耐久性を向上させることができる。 According to the above-mentioned aspect, when an electrode on the surface of the connection device facing the test board comes into contact with an external member such as a pogo pin during testing of the test object, the insulating layer can function as a member that relieves the load on the electrode. Therefore, the durability of the connection device can be improved compared to when no insulating layer is provided.
（態様６）
　態様６では、接続装置が、前記基板の前記検査対象物に対向する他の所定面側に位置するランドをさらに備えている。 (Aspect 6)
In a sixth aspect, the connection device further includes a land located on another predetermined surface side of the board facing the object to be inspected.
　「他の所定面」は、上述の実施形態の「第１面」に相当する。 The "other specified surface" corresponds to the "first surface" in the above embodiment.
　ランドの長さ又は幅は、接続導体の長さよりも短くしやすくなっている。また、他の所定面側に絶縁層を設けることなく、ランドを形成することができる。よって、上述の態様によれば、接続導体が基板の他の所定面側に位置する場合と比較して、接続装置の他の所定面側の平坦性を確保しやすくすることができる。 The length or width of the land can be easily made shorter than the length of the connection conductor. In addition, the land can be formed without providing an insulating layer on the other specified surface side. Therefore, according to the above-mentioned aspect, it is easier to ensure flatness on the other specified surface side of the connection device compared to when the connection conductor is located on the other specified surface side of the board.
　この出願は、２０２２年１２月２１日に出願された日本出願特願２０２２－２０４０３２号を基礎とする優先権を主張し、その開示の全てをここに取り込む。 This application claims priority based on Japanese Patent Application No. 2022-204032, filed on December 21, 2022, the disclosure of which is incorporated herein in its entirety.
１０　接続装置、２０　検査対象物、２２　第１電極、３０　検査基板、３２　第２電極、１００　基板、１００Ｒ　原基板、１０２　第１面、１０４　第２面、１０６　スルーホール、１１０　ランド、１１２　第１ランド層、１１４　第２ランド層、１２０　プローブ、１３０　絶縁層、１３２　第１絶縁層、１３２ａ　第１開口パターン、１３４　第２絶縁層、１３４ａ　第２開口パターン、１３６　第３絶縁層、１３６ａ　第３開口パターン、１４０，１４０Ｔ　接続導体、１４２，１４２Ｔ　第１接続導体、１４２ａ，１４２ａＴ　第１ビア、１４２ｂ，１４２ｂＴ　第１配線、１４２ｐ　第１めっき層、１４４，１４４Ｔ　第２接続導体、１４４ａ，１４４ａＴ　第２ビア、１４４ｂ，１４４ｂＴ　第２配線、１４４ｐ　第２めっき層、１５０　パッド、２００　ピンブロック、２１０　ポゴピン、３０２　第１レジスト、３０２ａ　第１レジスト開口、３０４　第２レジスト、３０４ａ　第２レジスト開口、Ｓ　区画 10 Connection device, 20 Test object, 22 First electrode, 30 Test board, 32 Second electrode, 100 Board, 100R Original board, 102 First surface, 104 Second surface, 106 Through hole, 110 Land, 112 First land layer, 114 Second land layer, 120 Probe, 130 Insulating layer, 132 First insulating layer, 132a First opening pattern, 134 Second insulating layer, 134a Second opening pattern, 136 Third insulating layer, 136a Third opening pattern, 140, 14 0T connecting conductor, 142, 142T first connecting conductor, 142a, 142aT first via, 142b, 142bT first wiring, 142p first plating layer, 144, 144T second connecting conductor, 144a, 144aT second via, 144b, 144bT second wiring, 144p second plating layer, 150 pad, 200 pin block, 210 pogo pin, 302 first resist, 302a first resist opening, 304 second resist, 304a second resist opening, S section

Claims (6)

  1. 　検査対象物及び検査基板を電気的に接続する接続装置であって、
    　基板と、
    　前記基板の前記検査基板に対向する所定面側に位置する接続導体と、
    を備える接続装置。     A connection device for electrically connecting an object to be inspected and an inspection board,
    A substrate;
    a connection conductor located on a predetermined surface side of the board facing the inspection board;
    A connection device comprising:
  2. 　前記基板が、前記接続導体に電気的に接続された内部導体が設けられたスルーホールを画定している、請求項１に記載の接続装置。 The connection device of claim 1, wherein the substrate defines a through hole having an internal conductor electrically connected to the connection conductor.
  3. 　前記基板が、前記接続導体に電気的に接続された複数の内部導体を有する、請求項１に記載の接続装置。 The connection device of claim 1, wherein the substrate has a plurality of internal conductors electrically connected to the connection conductors.
  4. 　前記接続導体が、少なくとも部分的に互いに重なる複数の配線を有する、請求項１から３のいずれかに記載の接続装置。 The connection device according to any one of claims 1 to 3, wherein the connection conductor has a plurality of wirings that at least partially overlap each other.
  5. 　前記接続導体の少なくとも一部分が埋め込まれた絶縁層をさらに備える、請求項１から３のいずれかに記載の接続装置。 The connection device according to any one of claims 1 to 3, further comprising an insulating layer in which at least a portion of the connection conductor is embedded.
  6. 　前記基板の前記検査対象物に対向する他の所定面側に位置するランドをさらに備える、請求項１から３のいずれかに記載の接続装置。 The connection device according to any one of claims 1 to 3, further comprising a land located on another predetermined surface side of the board facing the object to be inspected.
PCT/JP2023/041389 2022-12-21 2023-11-17 Connection device WO2024135182A1 (en)

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JP2022204032A JP2024088964A (en) 2022-12-21 2022-12-21 Connecting Devices

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0772171A (en) * 1993-09-03 1995-03-17 Toshiba Corp Electric inspection jig for wiring board
WO2002067638A1 (en) * 2001-02-19 2002-08-29 Sony Corporation Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board
JP2009092581A (en) * 2007-10-11 2009-04-30 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection device
JP2009267267A (en) * 2008-04-28 2009-11-12 Tdk Corp Electronic component mounting device
JP2015012013A (en) * 2013-06-26 2015-01-19 京セラ株式会社 Multilayer wiring board and probe card including the same
JP2018031659A (en) * 2016-08-24 2018-03-01 京セラ株式会社 Circuit device
JP2019096817A (en) * 2017-11-27 2019-06-20 京セラ株式会社 Wiring board and probe board
JP2021076486A (en) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス Electrical connection device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0772171A (en) * 1993-09-03 1995-03-17 Toshiba Corp Electric inspection jig for wiring board
WO2002067638A1 (en) * 2001-02-19 2002-08-29 Sony Corporation Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board
JP2009092581A (en) * 2007-10-11 2009-04-30 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection device
JP2009267267A (en) * 2008-04-28 2009-11-12 Tdk Corp Electronic component mounting device
JP2015012013A (en) * 2013-06-26 2015-01-19 京セラ株式会社 Multilayer wiring board and probe card including the same
JP2018031659A (en) * 2016-08-24 2018-03-01 京セラ株式会社 Circuit device
JP2019096817A (en) * 2017-11-27 2019-06-20 京セラ株式会社 Wiring board and probe board
JP2021076486A (en) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス Electrical connection device

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