WO2024034790A1 - Appareil de transfert de chambre et appareil de dépôt de couche atomique le comprenant - Google Patents

Appareil de transfert de chambre et appareil de dépôt de couche atomique le comprenant Download PDF

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Publication number
WO2024034790A1
WO2024034790A1 PCT/KR2023/006846 KR2023006846W WO2024034790A1 WO 2024034790 A1 WO2024034790 A1 WO 2024034790A1 KR 2023006846 W KR2023006846 W KR 2023006846W WO 2024034790 A1 WO2024034790 A1 WO 2024034790A1
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WO
WIPO (PCT)
Prior art keywords
chamber
guide rail
disposed
guide
transfer device
Prior art date
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PCT/KR2023/006846
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English (en)
Korean (ko)
Inventor
최광현
김현우
곽노원
서정호
강병주
Original Assignee
주식회사 한화
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Publication of WO2024034790A1 publication Critical patent/WO2024034790A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C23C16/45525—Atomic layer deposition [ALD]
    • C23C16/45544—Atomic layer deposition [ALD] characterized by the apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Definitions

  • the present invention relates to a chamber transfer device and an atomic layer deposition device including the same. More specifically, the invention relates to a chamber transfer device that can easily transfer a chamber used in a process and an atomic layer deposition device including the same.
  • the chamber is used to carry out various processes while blocking the object from its surroundings.
  • a chamber may be used to deposit an atomic layer on a wafer by thermally decomposing gas introduced from the outside and then spraying it while a wafer is placed inside.
  • the chamber requires maintenance and repair as the process progresses repeatedly. For example, in the atomic layer deposition process, if deposits accumulate inside the chamber, the quality of the wafer deteriorates, so it needs to be cleaned periodically. In general, chambers support large quantities of wafers and are exposed to high temperature or high pressure environments, so they are bound to have a large size, thickness, and corresponding weight for durability and capacity.
  • the worker separates the chamber from an external device for cleaning, so the process of the worker separating the chamber takes a lot of time and increases the risk of the worker being injured. Also, when using a crane or the like to replace a worker, there is the inconvenience of having to install the crane separately in the process line. This problem also applies when the cleaned chamber is reinstalled on an external device.
  • the present invention is an invention to solve the above-described problems, and relates to a device that can easily transport a chamber from an external device and an atomic layer deposition device including the same.
  • a chamber transfer device is a movable chamber transfer device that receives a chamber from an external device or transfers a chamber to the external device, and includes a base frame and one device disposed on the base frame and extending in a first direction. It includes one or more chamber supports, wherein the chamber supports are provided in the same number as the chamber, directly support the chamber, and provide a first guide rail and a second direction from the first guide rail that intersects the first direction. and a guide rail including a second guide rail spaced apart from the first guide rail and disposed in parallel with the first guide rail, wherein the first guide rail and the second guide rail include one or more transfer rollers in contact with the chamber. .
  • the one or more transfer rollers are disposed on surfaces of the first guide rail and the second guide rail facing each other, and may be disposed in plural numbers along the first direction. You can.
  • the first guide rail and the second guide rail may further include one or more auxiliary rollers respectively disposed on their upper surfaces.
  • some of the plurality of auxiliary rollers are disposed between two adjacent transfer rollers, and some of the remaining portions are located at the front end of the guide rail through which the chamber enters or exits. It may be arranged so that at least a portion of the transfer roller overlaps in a second direction intersecting the first direction.
  • the first guide rail and the second guide rail are disposed between two adjacent auxiliary rollers, and one or more sides are disposed spaced apart from the auxiliary rollers. Additional support may be included.
  • the gap between the first guide rail and the second guide rail is greater than the width of the chamber, and the length of the first guide rail and the second guide rail is It may be longer than the length of the chamber.
  • the one or more guide rails are disposed at the tip of the chamber through which the chamber enters or exits, and include a position sensor to confirm the position of the chamber and the position sensor to determine the position of the chamber. It may further include a first stopper that operates to open and close the inlet portion of the guide rail depending on the position of the chamber.
  • the one or more guide rails have a tip through which the chamber enters or exits is inserted into the inside of the external device while the chamber transfer device is mounted on the external device.
  • the chamber support may further include a fixing means for fixing the distal end to the external device.
  • An atomic layer deposition apparatus includes a base, an entry guide disposed on the base, a cover disposed downstream of the entry guide, a process guide disposed within the cover and arranged in parallel with the entry guide, and An atomic layer deposition apparatus comprising at least one chamber and a movable chamber transfer device that enters from the outside through an entry guide and holds a wafer in a state supported on the process guide, wherein the chamber transfer device includes a base frame and a wafer on the base frame. It includes one or more chamber supports disposed in and extending in a first direction, wherein the chamber supports are provided in the same number as the chamber, directly support the chamber, and are connected to a first guide rail and from the first guide rail.
  • a guide rail including a second guide rail spaced apart in a second direction intersecting the first direction and disposed parallel to the first guide rail, wherein the first guide rail and the second guide rail are the second guide rails. It is disposed on an extension of the process guide in one direction and may include one or more transfer rollers in contact with the chamber.
  • the one or more transfer rollers are disposed on surfaces of the first guide rail and the second guide rail facing each other, and are disposed in plural numbers along the first direction. and may contact the sliding rail disposed on the bottom of the chamber.
  • the first guide rail and the second guide rail are respectively disposed on the upper surface and may further include one or more auxiliary rollers in contact with the side of the chamber. .
  • some of the plurality of auxiliary rollers are disposed between two adjacent transport rollers, and the remaining portions are located at the front end of the guide rail through which the chamber enters or exits. It may be arranged so that at least a portion of the transfer roller overlaps in a second direction intersecting the first direction.
  • the first guide rail and the second guide rail are disposed between two adjacent auxiliary rollers, and one or more disposed spaced apart from the auxiliary rollers. Additional side supports may be included.
  • the gap between the first guide rail and the second guide rail is greater than the width of the chamber, and the length of the first guide rail and the second guide rail may be longer than the length of the chamber.
  • the one or more guide rails are disposed at the tip of the chamber through which the chamber enters or exits, and include a position sensor to confirm the position of the chamber and a position sensor that detects the position of the chamber. It may further include a first stopper that operates to open and close the inlet portion of the guide rail depending on the position of the chamber.
  • the at least one guide rail has a tip portion through which the chamber enters or exits is inserted into the inside of the base while the chamber transfer device is mounted on the base.
  • the base and the tip of the one or more guide rails are arranged to overlap, and the chamber support fixes the tip to the base when the chamber transfer device receives the chamber from the atomic layer deposition device,
  • the chamber transfer device may further include fixing means for releasing the fixation from the base.
  • the chamber transfer device may transfer the chamber while moving between the atomic layer deposition device and the cleaning device.
  • the chamber transfer device and the atomic layer deposition device including the same do not require additional equipment such as a separate crane when transferring the chamber, and can safely and easily transfer the chamber without or with minimal manual work. there is.
  • FIG. 1 shows an atomic layer deposition device including a chamber transfer device according to an embodiment of the present invention.
  • Figure 2 shows a perspective view of a chamber transfer device according to an embodiment of the present invention.
  • Figure 3 is a plan view showing a state in which a chamber transfer device according to an embodiment of the present invention transfers a chamber.
  • Figure 4 is a front view showing a state in which a chamber transfer device according to an embodiment of the present invention transfers a chamber.
  • Figure 5 shows an enlarged portion of a chamber transfer device according to an embodiment of the present invention.
  • Figure 6 shows a state in which the chamber transfer device according to an embodiment of the present invention is mounted on the base.
  • Figure 7 is a plan view showing a state in which a chamber transfer device according to another embodiment of the present invention transfers a chamber.
  • Figure 8 shows a state in which a chamber is seated on a process guide according to an embodiment of the present invention.
  • a chamber transfer device is a movable chamber transfer device that receives a chamber from an external device or transfers a chamber to the external device, and includes a base frame and one device disposed on the base frame and extending in a first direction. It includes one or more chamber supports, wherein the chamber supports are provided in the same number as the chamber, directly support the chamber, and provide a first guide rail and a second direction from the first guide rail that intersects the first direction. and a guide rail including a second guide rail spaced apart from the first guide rail and disposed in parallel with the first guide rail, wherein the first guide rail and the second guide rail include one or more transfer rollers in contact with the chamber. .
  • first and second are used not in a limiting sense but for the purpose of distinguishing one component from another component.
  • the x-axis, y-axis, and z-axis are not limited to the three axes in the Cartesian coordinate system, but can be interpreted in a broad sense including these.
  • the x-axis, y-axis, and z-axis may be orthogonal to each other, but may also refer to different directions that are not orthogonal to each other.
  • a specific process sequence may be performed differently from the described sequence.
  • two processes described in succession may be performed substantially at the same time, or may be performed in an order opposite to that in which they are described.
  • FIG. 1 shows an atomic layer deposition apparatus 1 including a chamber transfer device 10 according to an embodiment of the present invention
  • FIG. 2 is a perspective view of the chamber transfer device 10 according to an embodiment of the present invention
  • 3 shows a plan view showing the state in which the chamber transfer device 10 according to an embodiment of the present invention transfers the chamber 40
  • FIG. 4 shows the chamber transfer device 10 according to an embodiment of the present invention.
  • a front view shows the state in which the temporary chamber 40 is transferred
  • FIG. 5 shows an enlarged portion of the chamber transfer device 10 according to an embodiment of the present invention
  • FIG. 6 shows a chamber transfer device 10 according to an embodiment of the present invention. Shows a state in which the transfer device 10 is mounted on the base 20, and
  • FIG. 7 shows a top view of a state in which the chamber transfer device 10 transfers the chamber 40 according to another embodiment of the present invention
  • FIG. 8 represents a state in which the chamber 40 is seated on the process guide 60 according to an embodiment of the present invention.
  • the atomic layer deposition apparatus 1 can be used in an atomic layer deposition process to form a thin film on a wafer during semiconductor manufacturing.
  • a boat B loaded with a plurality of wafers enters the atomic layer deposition apparatus 1 from the outside, a predetermined gas is sprayed and deposited on the wafer to form an atomic layer thin film.
  • the atomic layer deposition apparatus 1 includes a chamber transfer device 10, a base 20, an entry guide 30, a chamber 40, a cover 50, and a process guide 60. It can be included.
  • the chamber transfer device 10 may be a device that is detachable and movable relative to an external device.
  • the external device is a device that uses the chamber 40 during the process, and its type is not particularly limited.
  • the external device may be an atomic layer deposition device (1).
  • the chamber transfer device 10 may be used to transfer the chamber 40 from the atomic layer deposition apparatus 1 to the outside or to transfer the chamber 40 from the outside to the atomic layer deposition apparatus 1.
  • the following description will focus on the case where the external device is the atomic layer deposition device 1, but the external device may be any other type of device used in each process when manufacturing a semiconductor.
  • external devices can be used in fields other than semiconductor manufacturing, such as logistics and transportation.
  • the chamber transfer device 10 can be transferred to the outside of the atomic layer deposition apparatus 1. More specifically, the chamber transfer device 10 can transfer the chamber 40 from the atomic layer deposition device 1 to the cleaning device 2 in order to clean it. Additionally, when cleaning of the chamber 40 is completed in the cleaning device 2, the chamber transfer device 10 can transfer it back to the atomic layer deposition device 1.
  • the chamber transfer device 10 will be described in detail later.
  • Base 20 holds and supports other components of atomic layer deposition device 1.
  • the base 20 may have an entry guide 30, a chamber 40, a cover 50, and a process guide 60 disposed on the upper surface.
  • the size and shape of the base 20 are not particularly limited and may be appropriately selected depending on the size and shape of the chamber 40 and/or the processing capacity of the atomic layer deposition device 1.
  • the base 20 may have a controller, a display, a communication module, etc. for controlling the operation of the atomic layer deposition device 1 therein, and may have a rectangular parallelepiped shape with a flat upper surface.
  • the entry guide 30 is disposed on one side of the base 20 and delivers the boat B into the cover 50.
  • the entry guide 30 may be disposed on the upper surface of the base 20 in the entry direction of the boat B.
  • the entry guide 30 extends parallel to the moving direction of the boat (B) and may have a rail shape that supports the bottom of the boat (B).
  • the entry guide 30 may be arranged in a number corresponding to the number of boats B. For example, as shown in FIG. 1, a pair of entry guides 30 may be provided to each support the lower surface of one boat B. When the boat (B) is placed on top, the entry guide (30) uses a pusher (not shown) to allow the boat (B) to enter the chamber (40) within the cover (50).
  • the chamber 40 holds and supports the boat B delivered from the entry guide 30.
  • the chamber 40 may have a long shape in the longitudinal direction of the boat B so as to have a space within which the boat B is placed. More specifically, as shown in FIG. 1, the chamber 40 may have a rectangular parallelepiped shape.
  • the chamber 40 may be supported on the process guide 60 while placed within the cover 50 .
  • the chamber 40 may have a passage through which gas used in the atomic layer deposition process flows.
  • the chamber 40 may be input into or discharged from the atomic layer deposition apparatus 1 through the rear end of the base 20.
  • the chamber 40 when performing an atomic layer deposition process, the chamber 40 is introduced from the rear end of the base 20 through the chamber transfer device 10 and can be moved into the cover 50 along the process guide 60. .
  • the chamber 40 when maintaining and repairing the chamber 40, the chamber 40 can be removed to the outside of the cover 50 along the process guide 60 and then transferred to the chamber transfer device 10. .
  • the operator uses the handle 42 disposed on the outside of the chamber 40 to push the chamber 40 along the process guide 60 to transfer the chamber 40 to the chamber transfer device 10. It can be delivered.
  • the chamber 40 is pushed along the process guide 60 using a pusher separately provided on the entry guide 30 and/or the atomic layer deposition device 1, and the chamber 40 is transferred to the chamber transfer device 10. It can be passed on.
  • the chamber 40 may include a sliding rail 41 and a handle 42.
  • the sliding rail 41 may be disposed on the lower surface of the chamber 40.
  • the sliding rails 41 extend along the longitudinal direction of the chamber 40 and may be arranged in pairs on the lower surface of the chamber 40, spaced apart from each other in the width direction.
  • the sliding rail 41 is seated on the guide roller 62 of the process guide 60 and can slide along it.
  • a groove (not shown) for sliding the guide roller 62 may be formed on the lower surface of the sliding rail 41 facing the guide roller 62.
  • the groove of the sliding rail 41 may have a shape extending along the longitudinal direction of the chamber 40.
  • the groove of the sliding rail 41 can be placed at a set position.
  • the groove of the sliding rail 41 may be located at a point corresponding to the edge area of the chamber 40.
  • the groove of the sliding rail 41 may be located at a point of about 70% or more. Accordingly, the embodiment can more stably transport the large and/or heavy chamber 40. Additionally, the sliding rail 41 and its groove can be placed at a set position.
  • the chamber 40 according to the embodiment may include a heater (not shown), and the groove of the sliding rail 40 may be disposed in an area that does not overlap the heater in the vertical direction. Accordingly, the embodiment can prevent the sliding rail 41 and the grooves of the sliding rail 41 from being deformed by the heat of the heater, and the chamber 40 can be stably transported for a long period of time.
  • One or more handles 42 may be placed on one side of the chamber 40.
  • the handle 42 may be disposed on one side of the chamber 40 facing the entry and exit direction of the chamber 40, that is, toward the rear end of the base 20.
  • the user or a separate arm may hold the handle 42 to assist in the separation of the chamber 40. You can.
  • the cover 50 is disposed on the other side of the base 20 and holds and supports the chamber 40 therein.
  • the cover 50 may have a block shape with an internal space.
  • the cover 50 is disposed on the upper surface of the base 20 and spaced apart from the entry guide 30, and the chamber 40 and the process guide 60 may be disposed therein.
  • the cover 50 may be provided with a door on one side so that the boat B can enter the internal chamber 40 and on the other side the chamber 40 can be discharged.
  • the door is closed, and the inside of the cover 50 can be maintained at atmospheric pressure and the inside of the chamber 40 can be maintained at a vacuum state.
  • One or more process guides 60 may be disposed on the upper surface of the base 20 to support the chamber 40.
  • a plurality of process guides 60 are disposed on the base 20 along the longitudinal direction of the chamber 40 and are disposed inside the cover 50. You can.
  • the number of process guides 60 is not particularly limited, and a pair of corresponding process guides may be arranged in one chamber 40.
  • the process guide 60 may include a guide body 61 and a guide roller 62. As shown in FIG. 8, the guide body 61 may extend long in the longitudinal direction of the chamber 40. The pair of guide bodies 61 may have a width greater than that of the chamber 40 so that the chamber 40 is disposed inside.
  • the guide roller 62 is connected to the guide body 61 and may contact the sliding rail 41 of the chamber 40.
  • the guide roller 62 may extend inside the pair of guide bodies 61.
  • the chamber 40 may enter or leave the cover 50 while sliding along the guide roller 62.
  • the chamber 40 can be easily transferred from or to the chamber transfer device 10 by sliding it.
  • the chamber transfer device 10 can be used to transfer the chamber 40 used in various processes.
  • the chamber 40 may have an internal space for accommodating an object and may be configured to be sealable, and may be used for processes such as heat treating an object accommodated therein or spraying gas.
  • the chamber transfer device 10 may be used in an atomic layer deposition process.
  • the chamber transfer device 10 may be a mobile device.
  • the chamber transfer device 10 may move to the cleaning device 2. After cleaning is completed and the chamber 40 is again seated in the chamber transfer device 10, the chamber transfer device 10 can be moved to the atomic layer deposition device 1.
  • the chamber transfer device 10 may include a base frame 100 and a chamber support 200.
  • the base frame 100 supports the chamber support 200 and may be movable.
  • the base frame 100 may include a horizontal frame 110, a vertical frame 120, a moving means 130, and a supporting means 140.
  • the horizontal frame 110 and the vertical frame 120 extend in the horizontal and vertical directions, respectively, to form the overall shape of the base frame 100.
  • a plurality of horizontal frames 110 and vertical frames 120 may be arranged to be orthogonal to each other.
  • the moving means 130 moves the chamber transfer device 10.
  • the means of movement 130 may be one or more wheels, as shown in FIG. 2 .
  • the moving means 130 may be a slider or a roller, and a rail corresponding to the moving means 130 may be placed in the work area.
  • the moving means 130 may be a robot-type leg or track. A user or a robot can use the moving means 130 to move the chamber transfer device 10 between the atomic layer deposition device 1 and the cleaning device 2.
  • the support means 140 supports the chamber transfer device 10 and fixes its position.
  • one or more support means 140 may be disposed at each corner of the base frame 100.
  • the support means 140 is shown in a form that suction supports the ground, but it is not limited to this.
  • the support means 140 may be fixed to the ground or another device as a mechanical clamp.
  • the chamber support 200 receives the chamber 40 from the process guide 60 and directly supports it.
  • the chamber support 200 may include one or more guide rails 210.
  • the guide rail 210 directly supports the chamber 40 delivered from the process guide 60, and can be disposed on the base frame 100, more specifically on the vertical frame 120, in a first direction. there is.
  • the guide rails 210 may be arranged in the same number as the chambers 40, so that a total of two guide rails 210 may be provided.
  • the guide rail 210 may have a longer length than the chamber 40.
  • the tip of the guide rail 210 protrudes toward the atomic layer deposition device 1, At least part of it may be mounted on the base 20. More specifically, as shown in FIG. 6, the chamber transfer device 10 moves to the rear end of the atomic layer deposition device 1 to receive the chamber 40 from the atomic layer deposition device 1. In this state, the chamber transfer device 10 may be placed close to the atomic layer deposition device 1 so that the tip of the guide rail 210 protrudes above the upper surface of the base 20 by a length P.
  • a fixing means 217 which will be described later, is disposed on the protruding front end, so that the guide rail 210 and the base 20 can be coupled.
  • the upper surface of the guide rail 210 may be disposed at the same height as the upper surface of the process guide 60.
  • the guide rail 210 includes a first guide rail 211, a second guide rail 212, a transfer roller 213, an auxiliary roller 214, a first stopper 215, and a side support 216. may include.
  • the first guide rail 211 is disposed on one side of the guide rail 210 and extends in a first direction.
  • the first guide rail 211 supports one side of the bottom of the chamber 40 and may be disposed on the vertical frame 120.
  • the first guide rail 211 may have a length longer than the chamber 40 in the first direction.
  • the second guide rail 212 is disposed on the other side of the guide rail 210 and extends in the first direction.
  • the second guide rail 212 has the same length as the first guide rail 211 and may be arranged to be spaced apart by a predetermined distance in a second direction intersecting the first direction.
  • the second guide rail 212 may be spaced apart from the first guide rail 211 by a distance D in the second direction.
  • the gap D may be larger than the width d of the chamber 40.
  • the second guide rail 212 may have a length longer than the chamber 40 in the first direction.
  • the transfer roller 213 is disposed on one side of the guide rail 210 and contacts the chamber 40 to transfer the chamber 40.
  • one or more transport rollers 213 may be disposed on surfaces where the first guide rail 211 and the second guide rail 212 face each other.
  • the transfer roller 213 is in contact with the sliding rail 41 of the chamber 40, and thus the chamber 40 can slide on the guide rail 210 through the transfer roller 213.
  • a plurality of transfer rollers 213 may be arranged at equal intervals in the first direction, that is, in the longitudinal direction of the guide rail 210. As shown in FIG. 3, the transfer roller 213 is located at the front ends of the first guide rail 211 and the second guide rail 212, that is, at one end where the chamber 40 enters and exits the chamber support 200. One is arranged, and a plurality of them may be arranged at equal intervals toward the inside of the first guide rail 211 and the second guide rail 212 in the first direction. The transfer roller 213 disposed at one end can guide the chamber 40 entering or leaving the chamber support 200 to move more easily.
  • the transfer roller 213 disposed on the first guide rail 211 and the transfer roller 213 disposed on the second guide rail 212 may be arranged to face each other. That is, the transfer roller 213 disposed on the first guide rail 211 and the transfer roller 213 disposed on the second guide rail 212 may be disposed at the same position as the second “Numbak*.” Accordingly, the chamber 40 can be transported more stably.
  • the transfer rollers 213 disposed on the first guide rail 211 and the transfer rollers 213 disposed on the second guide rail 212 may be arranged to stagger each other. That is, the transfer roller 213 disposed on the first guide rail 211 and the transfer roller 213 disposed on the second guide rail 212 may be disposed at different positions in the second direction. For example, the transfer roller 213 disposed on the first guide rail 211 may be disposed between two adjacent transfer rollers 213 disposed on the second guide rail 212. Additionally, the transfer roller 213 disposed on the second guide rail 212 may be disposed between two adjacent transfer rollers 213 disposed on the first guide rail 211. Accordingly, by tightening the contact points between the chamber 40 and the transfer roller 213 in the longitudinal direction of the chamber 40, it is possible to more reliably prevent the chamber 40 from being separated during transfer.
  • One or more auxiliary rollers 214 may be disposed on the upper surface of the first guide rail 211 and/or the second guide rail 212.
  • the auxiliary roller 214 is disposed on the upper surface of the first guide rail 211 and the second guide rail 212 to support the side of the chamber 40. there is.
  • the auxiliary roller 214 assists the transport roller 213 so that the chamber 40 is transported more stably, and can also prevent the chamber 40 from leaving or meandering in the second direction.
  • the auxiliary roller 214 may be disposed in a different position from the transfer roller 213 in the second direction. That is, as shown in FIGS. 2 and 3, the auxiliary roller 214 may be disposed between adjacent transport rollers 213. Accordingly, the contact points between the transport roller 213 and the auxiliary roller 214 and the chamber 40 are widely distributed, so that the chamber 40 can be transported more stably.
  • some of the plurality of auxiliary rollers 214 may be arranged at the same position or at least partially overlap the transfer roller 213 in the second direction.
  • the auxiliary roller 214 disposed at the front end of the first guide rail 211 and the second guide rail 212 is aligned in the same second direction as the transfer roller 213.
  • the locations or at least some of them may be arranged to overlap. Accordingly, when the chamber 40 first enters the chamber transfer device 10, the transfer roller 213 and the auxiliary roller 214 disposed at the distal end support the lower surface and side of the chamber 40, respectively, and the chamber ( 40) can be transported stably.
  • One or more first stoppers 215 may be disposed at the front end of the first guide rail 211 and/or the second guide rail 212.
  • the first stopper 215 may be disposed at the front end of the first guide rail 211. More specifically, as shown in FIGS. 2 and 3, when the chamber 40 is placed on the guide rail 210 and seated on the chamber transfer device 10, the first stopper 215 moves the chamber 40 during transfer. It may be placed at the front end of the first guide rail 211 to prevent it from coming off.
  • the first stopper 215 may be provided to be detachably attached to the first guide rail 211. Accordingly, in normal times (when the chamber 40 is not seated), the first stopper 215 can be detached from the front end of the first guide rail 211, and the front end of the first guide rail 211 can be maintained in an open state. there is.
  • first stopper 215 may be hinged to the front end of the first guide rail 211. Accordingly, in normal times, the first stopper 215 can be moved so that one end is parallel to the first guide rail 211, and the front end of the first guide rail 211 can be maintained in an open state.
  • One or more side supports 216 may be disposed on the upper surface of the first guide rail 211 and/or the second guide rail 212.
  • one or more side supports 216 are disposed on the upper surface of the first guide rail 211 and the second guide rail 212 and between the auxiliary rollers 214. You can.
  • the side support 216 may have a length corresponding to the gap between two adjacent auxiliary rollers 214. Additionally, the side support 216 may be disposed outside the auxiliary roller 214 in the second direction. Accordingly, when the chamber 40 moves in parallel in the first direction, the side support 216 does not contact the chamber 40. Instead, when the chamber 40 swings in the second direction, the side support 216 may contact the side of the chamber 40 to prevent the chamber 40 from leaving the guide rail 210.
  • FIG 2 it is shown that two side supports 216 are disposed on each of the first guide rail 211 and the second guide rail 212, but the present invention is not limited to this.
  • the side supports 216 may be continuously disposed between two adjacent auxiliary rollers 214, one each.
  • the guide rail 210 may further include fixing means 217.
  • the fixing means 217 is disposed below the guide rail 210 and fixes the guide rail 210 to the base 20. More specifically, as shown in FIGS. 5 and 6, the fixing means 217 is disposed below the front end of the first guide rail 211 or the second guide rail 212, and is attached to the first guide rail 211 or the second guide rail 212. 2Fix the guide rail 212 on the base 20.
  • the type of fixing means 217 is not particularly limited.
  • the fastening means 217 may be a mechanical clamp or an electromagnet.
  • the fixing means 217 is shown as being disposed on the first guide rail 211, but the present invention is not limited thereto.
  • the fixing means 217 may be disposed on the first guide rail 211 and/or the second guide rail 212.
  • the guide rail 210 may further include an end stopper 218.
  • One or more end stoppers 218 may be disposed at the front end of the first guide rail 211 and/or the second guide rail 212. As shown in FIG. 7, the end stopper 218 may be disposed at the front end of the second guide rail 212.
  • the end stoppers 218 are normally arranged side by side in the first direction to maintain the guide rail 210 in an open state (solid line in FIG. 7). And when the chamber 40 is arranged with the guide rail 210 and seated on the chamber transfer device 10, the end stopper 218 can rotate inward to prevent the chamber 40 from leaving during transfer. There is (dotted line in Figure 7). Through this, it is possible to prevent the chamber 40 from deviating from the front end of the guide rail 210.
  • the guide rail 210 may further include a positioning sensor (not shown).
  • the positioning sensor may be disposed on one side of the first guide rail 211 and/or the second guide rail 212 to detect the position of the chamber 40.
  • a positioning sensor (not shown) is placed at the front end of the first guide rail 211 and can detect the position of the chamber 40 in real time when the chamber 40 enters the chamber transfer device 10. You can.
  • the length of the guide rail 210 is longer than the length of the chamber 40. Accordingly, when the chamber 40 completely enters the chamber transfer device 10 from the process guide 60, the chamber 40 does not overlap the distal end of the guide rail 210 in the second direction. Through this, the positioning sensor can confirm whether the first chamber 40 has properly entered the guide rail 210 upon entry. Additionally, if the chamber 40 is not detected after entering the chamber 40, the positioning sensor may determine that the chamber 40 has moved to the end of the guide rail 210.
  • the chamber 40 is placed in the atomic layer deposition apparatus 1.
  • the chamber 40 is disposed on a process guide 60 in the cover 50, and in particular the sliding rail 41 of the chamber 40 is disposed on a guide roller 62 of the process guide 60. .
  • the chamber transfer device 10 moves to an external device, for example, the atomic layer deposition device 1.
  • the chamber transfer device 10 is disposed so that the front end of the guide rail 210 faces the rear end of the atomic layer deposition device 1. Additionally, the protruding front end of the guide rail 210 is disposed on the upper surface of the base 20. In this state, the fixing means 217 provided on the guide rail 210 is fixed to the base 20, and the chamber transfer device 10 is fixed to the base 20.
  • the chamber transfer device 10 is transferred to the chamber 40 of the atomic layer deposition device 1.
  • the chamber 40 can be pushed and transferred from the process guide 60 to the guide rail 210 of the chamber transfer device 10.
  • the door of the cover 50 on the side facing the chamber transfer device 10 may be open.
  • the user can hold the handle 42 of the chamber 40 and transfer the chamber 40 to the guide rail 210.
  • the first stopper 215 of the guide rail 210 may be maintained in an open state.
  • the transfer roller 213 and auxiliary roller 214 of the first guide rail 211 and the second guide rail 212 come into contact with the chamber 40.
  • the transport roller 213 and the auxiliary roller 214 roll while contacting the lower surface and the side surface of the chamber 40, respectively, and guide the transport of the chamber 40.
  • the first stopper 215 is attached, or the first stopper 215 is rotated about the hinge axis to close the guide rail 210. Additionally, the fixing means 217 is disconnected from the base 20.
  • the position sensor verifies the position of the chamber 40 in real time from the time the chamber 40 is entered.
  • the positioning sensor disposed on the end of the guide rail 210 does not detect the chamber 40, and the positioning sensor detects the chamber 40. It is determined that it has been completely transferred from the atomic layer deposition device 1 to the chamber transfer device 10. Accordingly, the first stopper 215 is attached or the first stopper 215 is rotated about the hinge axis to close the guide rail 210. Additionally, the fixing means 217 is disconnected from the base 20.
  • the chamber transfer device 10 moves to the cleaning device 2, and cleaning of the chamber 40 is performed in the cleaning device 2.
  • the process of transferring the cleaned chamber 40 back to the atomic layer deposition apparatus 1 is the reverse of the above-described process. That is, the chamber transfer device 10 moves from the cleaning device 2 to the atomic layer deposition device 1, and the guide rail 210 of the chamber transfer device 10 is located on the base 20. Then, the fixing means 217 is fixed on the base 20, the end stopper 218 of the guide rail 210 is opened, and then the chamber 40 moves from the guide rail 210 to the process guide 60. .
  • a user may hold the handle 42 and transfer the chamber 40 to the process guide 60, or a separate pusher may transfer the chamber 40 to the process guide 60.
  • the guide rail 210 is closed by the first stopper 215, and the chamber transfer device 10 is transferred to the atomic layer deposition device 1. You can leave the deposition device 1 and move to a preset waiting location.
  • the positioning sensor detects that if the position of the chamber 40 is no longer detected, the chamber 40 is atomized in the chamber transfer device 10. It is judged that it has been completely transferred to the layer deposition device (1). Accordingly, the guide rail 210 is closed by the first stopper 215, and the chamber transfer device 10 can leave the atomic layer deposition device 1 and move to a preset waiting location.
  • the chamber transfer device 10 and the atomic layer deposition device 1 including the same according to an embodiment of the present invention do not have a crane for transferring or towing the chamber 40 and can be operated without manual labor. Alternatively, manual work can be minimized.
  • the chamber transfer device 10 and the atomic layer deposition device 1 including the same according to an embodiment of the present invention safely and easily transport the chamber 40 in order to maintain and repair the chamber 40, such as cleaning. It can be removed from the atomic layer deposition apparatus 1 or entered into the atomic layer deposition apparatus 1.
  • a chamber transfer device according to an embodiment and an atomic layer deposition device including the same can be used in the industry related to atomic layer deposition devices.

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Abstract

Un mode de réalisation de la présente invention concerne un appareil de transfert de chambre qui est mobile pour recevoir une chambre à partir d'un appareil externe ou transférer la chambre vers l'appareil externe. Ledit appareil de transfert de chambre mobile comprend : un cadre de base ; et un ou plusieurs supports de chambre disposés sur le cadre de base et s'étendant dans une première direction. Un ou plusieurs des supports de chambre sont disposés de telle sorte que leur nombre soit identique au nombre de chambres, et les supports de chambre supportent directement les chambres et comprennent des rails de guidage comprenant un premier rail de guidage, et un second rail de guidage agencé en parallèle au premier rail de guidage en étant espacé du premier rail de guidage dans une seconde direction croisant la première direction, le premier rail de guidage et le second rail de guidage comprenant un ou plusieurs rouleaux de transfert entrant en contact avec les chambres.
PCT/KR2023/006846 2022-08-10 2023-05-19 Appareil de transfert de chambre et appareil de dépôt de couche atomique le comprenant WO2024034790A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2022-0099930 2022-08-10
KR1020220099930A KR20240021521A (ko) 2022-08-10 2022-08-10 챔버 이송 장치 및 이를 포함하는 원자층 증착 장치

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WO2024034790A1 true WO2024034790A1 (fr) 2024-02-15

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080065348A (ko) * 2007-01-09 2008-07-14 윤현석 식각 작업용 챔버의 이송장치
JP2009298223A (ja) * 2008-06-11 2009-12-24 Ihi Corp 無人搬送車
KR20140114931A (ko) * 2013-03-18 2014-09-30 주식회사 선익시스템 기판보관 챔버용 카세트 이송장치
KR20150087915A (ko) * 2014-01-23 2015-07-31 이준석 물품 이송장치 및 방법
KR20200068220A (ko) * 2018-12-05 2020-06-15 주식회사 에스에프에이 반송대차 이송 시스템

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102581325B1 (ko) 2020-12-22 2023-09-22 한국전자기술연구원 배치 타입 원자층 증착 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080065348A (ko) * 2007-01-09 2008-07-14 윤현석 식각 작업용 챔버의 이송장치
JP2009298223A (ja) * 2008-06-11 2009-12-24 Ihi Corp 無人搬送車
KR20140114931A (ko) * 2013-03-18 2014-09-30 주식회사 선익시스템 기판보관 챔버용 카세트 이송장치
KR20150087915A (ko) * 2014-01-23 2015-07-31 이준석 물품 이송장치 및 방법
KR20200068220A (ko) * 2018-12-05 2020-06-15 주식회사 에스에프에이 반송대차 이송 시스템

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