WO2023188638A1 - Electronic-component removing device and electronic-component manufacturing device - Google Patents

Electronic-component removing device and electronic-component manufacturing device Download PDF

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Publication number
WO2023188638A1
WO2023188638A1 PCT/JP2022/047641 JP2022047641W WO2023188638A1 WO 2023188638 A1 WO2023188638 A1 WO 2023188638A1 JP 2022047641 W JP2022047641 W JP 2022047641W WO 2023188638 A1 WO2023188638 A1 WO 2023188638A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive sheet
magnet
blade
electronic
Prior art date
Application number
PCT/JP2022/047641
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French (fr)
Japanese (ja)
Inventor
英児 佐藤
仁志 坂本
秀明 藤邨
雅浩 水落
大生 笹崎
Original Assignee
株式会社クリエイティブコーティングス
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Application filed by 株式会社クリエイティブコーティングス filed Critical 株式会社クリエイティブコーティングス
Priority to JP2024511244A priority Critical patent/JPWO2023188638A1/ja
Publication of WO2023188638A1 publication Critical patent/WO2023188638A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/02—Permanent magnets [PM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Definitions

  • the present invention relates to an electronic component detachment device, an electronic component manufacturing device, and the like.
  • Patent Document 1 discloses a manufacturing apparatus that applies a paste to the ends of a plurality of electronic components that are adhered to an adhesive sheet of a band-shaped member and transported, thereby manufacturing electronic components having external electrodes formed at the ends. ing.
  • a detaching device for detaching electronic components coated with paste and dried from an adhesive sheet is composed of a rotating scraper equipped with a scraper such as a rubber plate on the circumferential surface of a rotating body. can do. The electronic components are scraped off the adhesive sheet by a rotating scraper.
  • An object of the present invention is to provide an electronic component detaching device and an electronic component manufacturing device that guide electronic components scraped off from an adhesive sheet in a predetermined direction, assist the detachment, and prevent the electronic components from scattering. It is in.
  • One aspect of the present invention is a scraping member that comes into contact with at least one electronic component adhered to the adhesive sheet and scrapes the at least one electronic component from the adhesive sheet; at least one magnet that generates a magnetic force having a magnetic field directed in a predetermined direction in which the at least one electronic component moves away from the adhesive sheet; has The scraping member relates to a non-magnetic electronic component removal device.
  • the electronic component to be scraped off from the adhesive sheet by the scraping member includes a magnetic material such as metal
  • the electronic component is guided in a predetermined direction along the lines of magnetic force generated by at least one magnet. Ru.
  • the non-magnetic scraping member itself is not magnetized, electronic components are not attracted to the scraping member.
  • the electronic component detachment device may further include a non-magnetic temporary holding body that is provided in contact with or in close proximity to the at least one magnet.
  • a non-magnetic temporary holding body that is provided in contact with or in close proximity to the at least one magnet.
  • the at least one electronic component detached from the adhesive sheet is magnetically attracted by the at least one magnet and temporarily held on the temporary holding body.
  • the temporary holding body itself is not magnetized, when the magnetic field by the magnet is released, the temporary holding of the electronic component on the temporary holding body is also released.
  • the electronic component detachment device includes a mounting section on which the scraping member, the at least one magnet, and the temporary holding body are mounted, and the adhesive sheet and the mounting section.
  • the device may further include a first moving mechanism that relatively moves at least one of the components to bring the at least one electronic component and the scraping member into contact with each other.
  • the scraping member is moved relative to the electronic component by the first moving mechanism, and the electronic component can be scraped off from the adhesive sheet by the scraping member.
  • the electronic component since the relative positions of the scraping member, the at least one magnet, and the temporary holder do not change, the electronic component can be guided in a predetermined direction and temporarily held on the temporary holder.
  • the at least one magnet may be a permanent magnet.
  • the mounting section may perform a second movement of relatively moving at least one of the at least one magnet and the temporary holding body to release the magnetic attraction force acting on the electronic component on the temporary holding body. It can have a mechanism. Thereby, the electronic component temporarily held on the temporary holding body can be released from the temporary holding and recovered by releasing the magnetic attraction force.
  • at least one magnet may be an electromagnet, and in this case, the second moving mechanism is not required, and the magnetic attraction force can be canceled by canceling the energization to the electromagnet.
  • the surface of the temporary holding body that temporarily holds the at least one electronic component may be a vertical surface or an inclined surface, thereby reducing the magnetic attraction force. The release allows the at least one electronic component to fall by itself. In this way, electronic components that have naturally fallen can be collected in the collection section.
  • the scraping member may be a grounded conductive blade. Since the conductive blade releases static electricity, it is possible to prevent electronic components from adhering to the conductive blade due to static electricity. The cutting edge of the blade comes into contact with the electronic component and can scrape off the electronic component from the adhesive sheet.
  • Aspect (6) of the present invention may further include an adjustment mechanism that adjusts the inclination angle of the conductive blade with respect to the adhesive sheet. By adjusting the inclination angle of the blade, the blade can reliably come into contact with the electronic component and reliably scrape off the electronic component from the adhesive sheet.
  • Aspect (6) or (7) of the present invention may further include a vibration generator that vibrates the conductive blade. No electronic components will adhere to the blade that is vibrated by the vibration generator. Furthermore, by vibrating the blade, the opportunity for contact between the blade and the electronic component is ensured or increased, making it possible to reliably scrape off the electronic component. In addition, by applying vibration to the electronic component via the blade, the electronic component can be easily peeled off from the adhesive sheet, making it easier to scrape off the electronic component.
  • the vibration generator may be anything that vibrates the blade, such as a vibration motor that generates vibration by rotating an eccentric weight, a crystal oscillator, a piezoelectric element, or one that uses an electromagnetic coil to vibrate. be able to.
  • the at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet, and the writing member
  • the at least one magnet may have a width that contacts a plurality of electronic components at the same time, and the at least one magnet may include a plurality of magnets provided along the width direction of the adhesive sheet. In this way, a plurality of electronic components that are simultaneously scraped off can be guided in a predetermined direction along each line of magnetic force generated by a plurality of magnets.
  • an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet; the electronic component detachment device according to any one of (1) to (9), which detaches the at least one electronic component from the adhesive sheet; Defines electronic component manufacturing equipment that has
  • FIGS. 1(A) to 1(C) are diagrams showing a coating process, which is one process of an electronic component manufacturing method.
  • FIGS. 2(A) to 2(C) are diagrams showing a process of removing excess paste, which is performed after the coating process. It is a figure which shows the principal part and process of the apparatus which detaches an electronic component from an adhesive sheet.
  • FIG. 4 is an enlarged view of section A in FIG. 3 showing lines of magnetic force going from the positive pole to the negative pole of the magnet.
  • FIG. 3 is a schematic perspective view of the detachment device main body.
  • FIG. 3 is a plan view of the detachment device main body.
  • 7 is a sectional view taken along line CC in FIG. 6.
  • FIG. 9 is a sectional view of the fixed block shown in FIG. 8; It is a figure showing the vibration generator attached to the blade.
  • FIG. 3 is a diagram showing a blade equipped with a plurality of vibration generators.
  • the method for manufacturing electronic components includes a coating process that is carried out by holding the electronic component in a jig, and a detachment process that removes the electronic component from the jig.
  • the process may include a step of removing excess paste. After the application process or the paste removal process, the paste is dried and the electronic component is removed from the jig. First, the electronic component coating process and excess paste removal process will be outlined.
  • FIG. 1(A) to 1(C) and FIG. 2(A) to 2(C) show a method of manufacturing an electronic component in which external electrodes are formed on an electronic component 10, such as a capacitor, by an electrode forming apparatus 1.
  • the main steps of the method are schematically shown.
  • the electronic components 10 can be conveyed while being aligned and held on a conveyance jig (also referred to as a carrier plate) 20.
  • the surface plate 30, which can be used for both the application process and the paste removal process of the electronic component 10, is formed of, for example, ceramic, granite, metal, or the like.
  • a squeegee unit 40 is provided on the surface plate 30.
  • the squeegee unit 40 is movable along the surface (also referred to as a reference surface) 31 of the surface plate 30.
  • the squeegee unit 40 independently separates a blade 42 made of metal, for example, which spreads the dip layer 50 of conductive paste at a uniform height, and a blade 44, made of rubber, for example, which scrapes the conductive paste from the surface 31 of the surface plate 30. It is supported so that it can be raised and lowered.
  • An elevating plate 32 that can be raised and lowered relative to the base 34 is arranged above the surface plate 30.
  • the conveying jig 20 is detachably supported by the elevating plate 32.
  • An elevating motor 36 is supported on the base 34, and the elevating plate 32 is raised and lowered by a screw shaft 38 which is rotationally driven by the elevating motor 36.
  • FIGS. 1(A) to 1(C) show the process of coating a conductive paste.
  • a blade 42 set at a predetermined height is horizontally moved by the squeegee unit 40 to form a dip layer 50 of a predetermined height made of conductive paste on the surface plate 30.
  • the electronic component 10 is lowered by the lifting plate 32, and the end of the electronic component 10 is immersed in the dip layer 50 on the surface plate 30. Thereby, a conductive paste layer 14 is formed at the end of the electronic component 10.
  • FIGS. 2(A) to 2(C) show the paste removal process (blotting process).
  • FIG. 2A shows a process of scraping off the conductive paste on the surface plate 30 by horizontally moving the blade 44 by the squeegee unit 40, which has been lowered so as to come into contact with the surface 31 of the surface plate 30.
  • FIG. 2B the electronic component 10 is lowered by the lifting plate 32, and the conductive paste layer 14 formed at the end of the electronic component 10 is brought into contact with the surface plate 30. Thereafter, the electronic component 10 is lifted up by the lift plate 32. As a result, excess paste at the end of the electronic component 10 is transferred to the surface plate 30, and a flattened conductive paste layer 14A is formed.
  • Patent No. 6633829 silica blot
  • Patent No. 6787605 helical blot
  • PCT PCT
  • FIGS. 3 to 10 The apparatus and process for removing the electronic component 10 from the transport jig 20 used in the first embodiment will be described with reference to FIGS. 3 to 10.
  • an adhesive sheet 21 is provided on the lower surface of a carrier plate 20, which is a transport jig, and the electronic component 10 is attached at its end to the adhesive sheet 21 and hangs down. Retained.
  • the electrode forming apparatus 1 shown in FIGS. 1(A) to 1(C) and FIGS. 2(A) to 2(C) and the detaching device 100 shown in FIG. Manufacturing equipment is configured.
  • a detaching device 100 for detaching the electronic component 10 from the adhesive sheet 21 has a detaching device main body 110 shown in FIG. 3.
  • the detachment device main body 110 includes a scraping member such as a blade 120 formed of a non-magnetic material such as carbon or carbon fiber reinforced plastic, and at least one magnet 130 arranged in a direction perpendicular to the plane of the paper in FIG. 6).
  • the blade 120 contacts at least one electronic component 10 adhered to the adhesive sheet 21, for example, a plurality of electronic components 10 arranged in a direction perpendicular to the paper surface of FIG. 10 from the adhesive sheet 21 at the same time. As shown in FIG.
  • the cutting edge of the blade 120 preferably scrapes the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21, but is not limited thereto.
  • the scraping member 120 is not limited to a blade, and may be a rotary scraper described in Patent Document 1, as long as it scrapes the electronic component 10 from the adhesive sheet 21.
  • non-magnetic materials suitable for the scraping member 120 include graphite, aluminum, brass, synthetic resin, glass, silicon nitride, zirconia, silicon carbide, aluminum oxide, etc. in addition to the above-mentioned carbon, and composites thereof. It can be any material.
  • the blade 120 of this embodiment is made of carbon, which is non-magnetic and conductive, for example.
  • a non-conductive blade is not preferred because the electronic component 10 will stick to it due to static electricity. If the electronic component 10 is scraped off with a blade to which the electronic component 10 is attached, the adhesive sheet 21 will be scratched due to the electronic component 10 being dragged. This shortens the life of the adhesive sheet 21.
  • the conductive blade 120 which is formed of a conductive material or coated with a conductive material by plating or the like, can dissipate static electricity by being grounded. If the material of the blade 120 is not a conductive material, the material may be plated with a conductive material such as gold, silver, copper, or tin, or a conductive material such as carbon black may be kneaded into the material resin.
  • the magnet 130 generates a magnetic force with a magnetic field oriented in a predetermined direction in which the electronic component 10 moves away from the adhesive sheet 21.
  • the magnet 130 may be a permanent magnet or an electromagnet.
  • the magnet 130 of this embodiment is a permanent magnet.
  • the magnetic force in a predetermined direction that causes the electronic component 10 to move away from the adhesive sheet 21 only requires that the magnetic field acts in a direction perpendicularly away from the surface of the adhesive sheet 21, and in FIG. good. Note that since the blade 120 itself, which is made of a non-magnetic material, is not magnetized, the electronic component 10 is not attracted to the blade 120.
  • the electronic component 10 scraped off from the adhesive sheet 21 by the blade 120 is guided along the lines of magnetic force B (see FIG. 4) generated by the magnet 130.
  • the electronic component 10 itself has a magnetic material, detachment of the electronic component 10 from the adhesive sheet 21 can be assisted. That is, the electronic component 10 can be scraped off from the adhesive sheet 21 with the scraping force of the blade 120 assisted by the magnetic force of the magnet 130 .
  • the electronic component 10 once scraped off from the adhesive sheet 21 from adhering to the adhesive sheet 21 again.
  • the electronic component 10 scraped off from the adhesive sheet 21 can be prevented from scattering in random directions. Thereby, the electronic component 10 can be recovered to a predetermined position.
  • the detachment device main body 110 of the detachment device 100 can further include a non-magnetic temporary holder 140 that is provided in contact with or in close proximity to the magnet 130, as shown in FIGS. 3 and 4.
  • a non-magnetic temporary holder 140 that is provided in contact with or in close proximity to the magnet 130, as shown in FIGS. 3 and 4.
  • the electronic component 10 detached from the adhesive sheet 21 is magnetically attracted by the magnet 130 and temporarily held on the temporary holding body 140.
  • the electronic component 10 can be prevented from scattering.
  • the non-magnetic temporary holding body 140 itself is not magnetized, when the magnetic field by the magnet 130 is released, the temporary holding of the electronic component 10 on the temporary holding body 140 is also released.
  • the magnet 130 is an electromagnet
  • the temporary holding of the electronic component 10 on the temporary holding body 140 is released by canceling the power supply to the electromagnet.
  • examples of non-magnetic materials suitable for the temporary holding body 140 include the above-mentioned non-magnetic materials
  • the detachment device main body 110 of the detachment device 100 has a mounting section 150 on which the blade 120, the magnet 130, and the temporary holding body 140 are mounted, as shown in FIGS. 3 to 7.
  • the blade 120 is fixed to the upper surface of the mounting section 150
  • the temporary holder 140 is fixed to the front surface of the mounting section 150. Note that fixing of the magnet 130 will be described later.
  • the detachment device 100 further includes a first moving mechanism (not shown) that relatively moves at least one of the conveying jig 20 holding the adhesive sheet 21 and the mounting section 150 to bring the electronic component 10 and the blade 120 into contact. can have The first moving mechanism horizontally moves at least one of the base 34 shown in FIGS. 1(A) to 1(C) and FIGS.
  • the blade 120 can be a mechanism that moves in the direction.
  • the blade 120 is moved in the horizontal direction relative to the electronic component 10 by the first moving mechanism, and the electronic component 10 can be scraped off from the adhesive sheet 21 by the blade 120.
  • the relative positions of the blade 120, magnet 130, and temporary holding body 140 mounted on the mounting section 150 do not change, the electronic component 10 is guided in a predetermined direction and temporarily held on the temporary holding body 140. be able to.
  • the magnet 130 is a permanent magnet.
  • the mounting section 150 has a second moving mechanism 160.
  • the second moving mechanism 160 relatively moves at least one of the magnet 130 and the temporary holding body 140 to act on the electronic component 10 on the temporary holding body 140. Release the magnetic attraction. Thereby, the electronic component 10 temporarily held on the temporary holding body 140 can be recovered by releasing the magnetic attraction force.
  • the at least one magnet 130 may be an electromagnet, and in this case, the second moving mechanism 160 is not required, and the magnetic attraction force can be canceled by canceling the energization.
  • the second moving mechanism 160 is capable of moving the magnet 130 relative to the temporary holding body 140.
  • the second moving mechanism 160 includes a moving body 161 that is movable while being guided by a guide portion 151 (FIG. 7) such as a hole or a notch provided in the mounting portion 150.
  • the movable body 161 integrally includes eight magnet fixing parts 161A to which the eight magnets 130 shown in FIG. 6 are respectively fixed, and a handle 161B connected to the eight magnet fixing parts 161A. has.
  • the magnet fixing part 161A is movably guided by the guide part 151.
  • the second moving mechanism 160 further includes a biasing member, such as a coil spring 162, that constantly biases the movable body 161 in the direction of contacting or approaching the temporary holding body 140.
  • a biasing member such as a coil spring 162 that constantly biases the movable body 161 in the direction of contacting or approaching the temporary holding body 140.
  • the magnet 130 is positioned at a constant position by the biasing force of the coil spring 162.
  • the handle 161B may be pulled against the biasing force of the coil spring 162 to move the magnet 130 away from the temporary holder 140.
  • the second moving mechanism 160 is manually operable, but instead of the handle 161B, the second moving mechanism 160 is provided with a drive mechanism that moves the moving body 161 against the biasing force of the coil spring 162. Also good.
  • the surface of the temporary holding body 140 that temporarily holds the electronic component 10 can be a vertical surface or an inclined surface, as shown in FIG. 4 or 5. Thereby, by releasing the magnetic attraction force on the temporary holding body 140, the electronic component 10 can be allowed to fall naturally. In this way, the electronic components 10 that have naturally fallen can be collected in the collection section.
  • this embodiment includes a tilt adjustment mechanism 170 that adjusts the tilt of the blade 120 with respect to a plane parallel to the adhesive sheet 21.
  • the tilt adjustment mechanism 170 has two fixed blocks 152 that rotatably support two support shafts 142 that protrude from both ends of the mounting section 150 on which the blade 120 is mounted.
  • each of the two fixed blocks 152 is split in half by a slit 176, and one support shaft 142 is inserted into each half-split hole 174 that communicates with the slit 176.
  • the inclination of the blade 120 is adjusted by rotating each one of the spindles 142 within the halved hole 243.
  • the tilt adjustment mechanism 170 includes two fixed blocks 172 that receive the two support shafts 142, a slit 176 provided in each fixed block 172, a hole 174, and a screw or bolt 178.
  • a vibration generator 180 that vibrates the blade 120 can be further provided.
  • the blade 120 shown in FIG. 10 is thinner than the blade shown in FIG. It is preferable that the cutting edge 121 of the blade 120 scrape off the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21 . Therefore, as shown in FIG. 10, a gap ⁇ is provided between the surface parallel to the adhesive sheet 21 and the cutting edge 121.
  • the gap ⁇ is set smaller as the size of the electronic component 10 becomes smaller.
  • the designed gap ⁇ is from 10 ⁇ m to several tens of ⁇ m.
  • the vibration generator 180 uses an ultra-compact, flat-type vibration motor in this embodiment, but is not limited to this, and may be any device that vibrates the blade 120.
  • the amplitude of the blade 120 vibrated by the vibration generator 180 is preferably 2 ⁇ m or more, for example, on the premise that the cutting edge 121 does not come into contact with the adhesive sheet 21.
  • the vibration direction of the blade 120 vibrated by the vibration generator 180 is not particularly limited, but is preferably a direction that periodically changes the size of the gap ⁇ between the adhesive sheet 21 and the cutting edge 121 of the blade 120. This is to prevent the electronic component 10 from entering the gap ⁇ . In particular, even if the design value of the gap ⁇ is increased considering the safety factor, the electronic component 10 will not enter the gap ⁇ because the vibrating cutting edge 121 periodically reduces the gap ⁇ .
  • the vibration generator 180 is preferably attached directly to the blade 120, as shown in FIGS. 10 and 11.
  • the vibration from the vibration generator 180 may be transmitted to the blade 120 via another medium.
  • the blade 120 includes a fixed end 120A and a free end 120B, as shown in FIG.
  • the fixed end portion 120A is fixed to a blade fixing portion (not shown), and the free end portion 120B is provided with a cutting edge 121.
  • the free end portion 120B of the blade 120 includes a first surface 120B1 facing the adhesive sheet 21 and a second surface 120B2 opposite to the first surface 120B1.
  • the second surface 120B2 is inclined with respect to the horizontal first surface 120B1, for example.
  • three vibration generators 180 are mounted on the second surface 120B2.
  • the vibration frequency of the vibration generator 180 is not particularly limited, it can preferably vibrate the blade 120 at a frequency multiplied by the natural frequency of the blade 120. Since phase alignment of the plurality of vibration generators 180 as in this embodiment is complicated, for example, if a resonance plate (not shown) is interposed between the blade 120 and the vibration generator 180, the resonance frequency of the blades can be adjusted. 120 can be vibrated.
  • Electrode formation device 10 Electronic components, 20... Transport jig, 21... Adhesive sheet, 30... Surface plate, 100... Detachment device, 110... Detachment device main body, 120... Blade (scraping member), 130... Magnet, 140... Temporary holding body, 150... Mounting part, 151... Guide part, 160... Second moving mechanism, 161... Moving body, 161A... Magnet fixing part, 161B... Handle, 162... Biasing member, 170... Blade angle adjustment device , 172... Fixed block, 174... Hole, 176... Slit, 178... Bolt, 180... Vibration generator

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

This electronic-component (10) removing device (100) comprises: a scraper member (120) that makes contact with at least one electronic component (10) adhering to an adhesion sheet (21), thereby scraping the at-least-one electronic component (10) away from the adhesion sheet (21); and at least one magnet (130) that generates a magnetic force in a predetermined direction in which the at-least-one electronic component (10) gets away from the adhesion sheet (21).

Description

電子部品の離脱装置及び電子部品の製造装置Electronic component detachment device and electronic component manufacturing device
　本発明は、電子部品の離脱装置及び電子部品の製造装置等に関する。 The present invention relates to an electronic component detachment device, an electronic component manufacturing device, and the like.
　特許文献１は、帯状部材の粘着シートに粘着されて搬送される複数の電子部品の端部にペーストを塗布して、端部に外部電極が形成された電子部品を製造する製造装置を開示している。ペーストが塗布されて乾燥された電子部品を粘着シートから離脱させる離脱装置は、特許文献１の図１４に示すように、回転体の周面に例えばゴム板等のスクレーパーを備えた回転スクレーパーで構成することができる。電子部品は、回転スクレーパーにより粘着シートから掻き取られる。 Patent Document 1 discloses a manufacturing apparatus that applies a paste to the ends of a plurality of electronic components that are adhered to an adhesive sheet of a band-shaped member and transported, thereby manufacturing electronic components having external electrodes formed at the ends. ing. As shown in FIG. 14 of Patent Document 1, a detaching device for detaching electronic components coated with paste and dried from an adhesive sheet is composed of a rotating scraper equipped with a scraper such as a rubber plate on the circumferential surface of a rotating body. can do. The electronic components are scraped off the adhesive sheet by a rotating scraper.
ＷＯ２０２０／１４５３４８号公報WO2020/145348 publication
　電子部品のサイズが微小になると、粘着シートから掻き取られた電子部品が飛散してしまう。その結果、電子部品を所定の回収位置に回収できなくなる。 When the size of electronic components becomes minute, the electronic components scraped off the adhesive sheet end up scattering. As a result, the electronic components cannot be collected at a predetermined collection position.
　本発明の目的は、粘着シートから掻き取られる電子部品を所定の方向に案内して、離脱をアシストし、電子部品の飛散を防止する電子部品の離脱装置及び電子部品の製造装置を提供することにある。 An object of the present invention is to provide an electronic component detaching device and an electronic component manufacturing device that guide electronic components scraped off from an adhesive sheet in a predetermined direction, assist the detachment, and prevent the electronic components from scattering. It is in.
　（１）本発明の一態様は、
　粘着シートに粘着された少なくとも一つの電子部品に接触して、前記少なくとも一つの電子部品を前記粘着シートから掻き取る掻き取り部材と、
　前記少なくとも一つの電子部品が前記粘着シートより離れる所定の方向に磁界の向きを有する磁力を発生する少なくとも一つの磁石と、
を有し、
　前記掻き取り部材は非磁性である電子部品の離脱装置に関する。 (1) One aspect of the present invention is
a scraping member that comes into contact with at least one electronic component adhered to the adhesive sheet and scrapes the at least one electronic component from the adhesive sheet;
at least one magnet that generates a magnetic force having a magnetic field directed in a predetermined direction in which the at least one electronic component moves away from the adhesive sheet;
has
The scraping member relates to a non-magnetic electronic component removal device.
　本発明の一態様によれば、掻き取り部材によって粘着シートから掻き取られる電子部品は、金属等の磁性材料を有することから、少なくとも一つの磁石により発生する磁力線に沿って所定の方向に案内される。それにより、粘着シートからの電子部品の離脱をアシストすることができる。しかも、微小な電子部品であっても、その電子部品の飛散を防止することができる。なお、非磁性である掻き取り部材自体は磁化されないので、掻き取り部材に電子部品が吸着されることはない。 According to one aspect of the present invention, since the electronic component to be scraped off from the adhesive sheet by the scraping member includes a magnetic material such as metal, the electronic component is guided in a predetermined direction along the lines of magnetic force generated by at least one magnet. Ru. Thereby, it is possible to assist in detaching the electronic component from the adhesive sheet. Furthermore, even minute electronic components can be prevented from scattering. Note that since the non-magnetic scraping member itself is not magnetized, electronic components are not attracted to the scraping member.
　（２）本発明の一態様（１）では、前記電子部品の離脱装置は、前記少なくとも一つの磁石と接触または近接して設けられ、非磁性である仮保持体をさらに有することができる。こうすると、前記粘着シートより離脱された前記少なくとも一つの電子部品が、前記少なくとも一つの磁石に磁気吸引されて、前記仮保持体上に仮保持される。それにより、電子部品の飛散を防止することができる。なお、仮保持体自体は磁化されないので、磁石による磁界が解除されれば、仮保持体上での電子部品の仮保持も解除される。 (2) In one aspect (1) of the present invention, the electronic component detachment device may further include a non-magnetic temporary holding body that is provided in contact with or in close proximity to the at least one magnet. In this way, the at least one electronic component detached from the adhesive sheet is magnetically attracted by the at least one magnet and temporarily held on the temporary holding body. Thereby, it is possible to prevent electronic components from scattering. Note that since the temporary holding body itself is not magnetized, when the magnetic field by the magnet is released, the temporary holding of the electronic component on the temporary holding body is also released.
　（３）本発明の一態様（２）では、前記電子部品の離脱装置は、前記掻き取り部材、前記少なくとも一つの磁石及び前記仮保持体を搭載する搭載部と、前記粘着シート及び前記搭載部の少なくとも一方を相対的に移動させて、前記少なくとも一つの電子部品と前記掻き取り部材とを接触させる第１移動機構と、をさらに有することができる。こうすると、第１移動機構により掻き取り部材が電子部品に対して相対的に移動されて、掻き取り部材により電子部品を粘着シートから掻き取ることができる。加えて、掻き取り部材、少なくとも一つの磁石及び仮保持体の相対的位置は変化しないので、電子部品を所定の方向に案内して、仮保持体上に仮保持することができる。 (3) In the aspect (2) of the present invention, the electronic component detachment device includes a mounting section on which the scraping member, the at least one magnet, and the temporary holding body are mounted, and the adhesive sheet and the mounting section. The device may further include a first moving mechanism that relatively moves at least one of the components to bring the at least one electronic component and the scraping member into contact with each other. In this case, the scraping member is moved relative to the electronic component by the first moving mechanism, and the electronic component can be scraped off from the adhesive sheet by the scraping member. In addition, since the relative positions of the scraping member, the at least one magnet, and the temporary holder do not change, the electronic component can be guided in a predetermined direction and temporarily held on the temporary holder.
　（４）本発明の一態様（３）では、前記少なくとも一つの磁石は永久磁石とすることができる。この場合、前記搭載部は、前記少なくとも一つの磁石及び前記仮保持体の少なくとも一方を相対的に移動して、前記仮保持体上の前記電子部品に作用する磁気吸引力を解除する第２移動機構を有することができる。それにより、一旦は仮保持体上に仮保持された電子部品を、磁気吸引力を解除することで仮保持を解除して回収することができる。なお、少なくとも一つの磁石は電磁石としても良く、この場合には第２移動機構を要せず、電磁石への通電を解除することによって磁気吸引力を解除することができる。 (4) In aspect (3) of the present invention, the at least one magnet may be a permanent magnet. In this case, the mounting section may perform a second movement of relatively moving at least one of the at least one magnet and the temporary holding body to release the magnetic attraction force acting on the electronic component on the temporary holding body. It can have a mechanism. Thereby, the electronic component temporarily held on the temporary holding body can be released from the temporary holding and recovered by releasing the magnetic attraction force. Note that at least one magnet may be an electromagnet, and in this case, the second moving mechanism is not required, and the magnetic attraction force can be canceled by canceling the energization to the electromagnet.
　（５）本発明の一態様（４）では、前記仮保持体は、前記少なくとも一つの電子部品を仮保持する面を垂直面又は傾斜面とすることができ、それにより、前記磁気吸引力の解除により前記少なくとも一つの電子部品を自然落下させることができる。こうして、自然落下される電子部品を回収部に回収することができる。 (5) In the aspect (4) of the present invention, the surface of the temporary holding body that temporarily holds the at least one electronic component may be a vertical surface or an inclined surface, thereby reducing the magnetic attraction force. The release allows the at least one electronic component to fall by itself. In this way, electronic components that have naturally fallen can be collected in the collection section.
　（６）本発明の一態様（１）～（５）では、前記掻き取り部材は、接地された導電性ブレードとすることができる。導電性ブレードは静電気を逃がすので、静電気によって電子部品が導電性ブレードに付着することを防止できる。ブレードは、刃先が電子部品と接触して、電子部品を粘着シートから掻き取ることができる。 (6) In aspects (1) to (5) of the present invention, the scraping member may be a grounded conductive blade. Since the conductive blade releases static electricity, it is possible to prevent electronic components from adhering to the conductive blade due to static electricity. The cutting edge of the blade comes into contact with the electronic component and can scrape off the electronic component from the adhesive sheet.
　（７）本発明の一態様（６）では、前記粘着シートに対する前記導電性ブレードの傾斜角を調整する調整機構をさらに有することができる。ブレードの傾斜角を調整することで、ブレードが確実に電子部品と接触して、電子部品を粘着シートから確実に掻き取ることができる。 (7) Aspect (6) of the present invention may further include an adjustment mechanism that adjusts the inclination angle of the conductive blade with respect to the adhesive sheet. By adjusting the inclination angle of the blade, the blade can reliably come into contact with the electronic component and reliably scrape off the electronic component from the adhesive sheet.
　（８）本発明の一態様（６）または（７）では、前記導電性ブレードを振動させる振動発生器をさらに有することができる。振動発生器により振動されるブレードに電子部品が付着することはない。また、ブレードが振動することにより、ブレードと電子部品の接触機会が確保されまたは増大されて、電子部品を確実に掻き取ることが可能となる。加えて、ブレードを介して電子部品にも振動が付与されることでも、電子部品が粘着シートから剥がれ易くなり、電子部品を掻き取り易くすることができる。ここで、振動発生器はブレードを振動させるものであればよく、偏心重りを回転させて振動を発生する振動モーター、水晶振動子、圧電素子、または電磁コイルを利用して振動させるもの等を挙げることができる。 (8) Aspect (6) or (7) of the present invention may further include a vibration generator that vibrates the conductive blade. No electronic components will adhere to the blade that is vibrated by the vibration generator. Furthermore, by vibrating the blade, the opportunity for contact between the blade and the electronic component is ensured or increased, making it possible to reliably scrape off the electronic component. In addition, by applying vibration to the electronic component via the blade, the electronic component can be easily peeled off from the adhesive sheet, making it easier to scrape off the electronic component. Here, the vibration generator may be anything that vibrates the blade, such as a vibration motor that generates vibration by rotating an eccentric weight, a crystal oscillator, a piezoelectric element, or one that uses an electromagnetic coil to vibrate. be able to.
　（９）本発明の一態様（１）～（８）では、前記少なくとも一つの電子部品は、前記粘着シートの幅方向に沿って粘着された複数の電子部品を含み、前記書き取り部材は、前記複数の電子部品と同時に接触する幅を有し、前記少なくとも一つの磁石は、前記粘着シートの幅方向に沿って設けられる複数の磁石を含むことができる。こうして、同時に掻き取られる複数の電子部品を、複数の磁石により発生する各磁力線に沿って所定の方向に案内することができる。 (9) In aspects (1) to (8) of the present invention, the at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet, and the writing member The at least one magnet may have a width that contacts a plurality of electronic components at the same time, and the at least one magnet may include a plurality of magnets provided along the width direction of the adhesive sheet. In this way, a plurality of electronic components that are simultaneously scraped off can be guided in a predetermined direction along each line of magnetic force generated by a plurality of magnets.
　（１０）本発明の他の態様は、
　粘着シートに粘着された少なくとも一つの電子部品の端部に電極を形成する電極形成装置と、
　前記粘着シートから前記少なくとも一つの電子部品を離脱させる、（１）～（９）のいずれか記載の電子部品の離脱装置と、
を有する電子部品の製造装置を定義している。 (10) Other aspects of the present invention include:
an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet;
the electronic component detachment device according to any one of (1) to (9), which detaches the at least one electronic component from the adhesive sheet;
Defines electronic component manufacturing equipment that has
図１（Ａ）～図１（Ｃ）は、電子部品の製造方法の一工程である塗布工程を示す図である。FIGS. 1(A) to 1(C) are diagrams showing a coating process, which is one process of an electronic component manufacturing method. 図２（Ａ）～図２（Ｃ）は、塗布工程の後に実施される、余分なペーストを除去する工程を示す図である。FIGS. 2(A) to 2(C) are diagrams showing a process of removing excess paste, which is performed after the coating process. 粘着シートから電子部品を離脱させる装置の要部及び工程を示す図である。It is a figure which shows the principal part and process of the apparatus which detaches an electronic component from an adhesive sheet. 磁石の正極から負極に向かう磁力線を示す図３のＡ部の拡大図である。FIG. 4 is an enlarged view of section A in FIG. 3 showing lines of magnetic force going from the positive pole to the negative pole of the magnet. 離脱装置本体の概略斜視図である。FIG. 3 is a schematic perspective view of the detachment device main body. 離脱装置本体の平面図である。FIG. 3 is a plan view of the detachment device main body. 図６のＣ－Ｃ断面図である。7 is a sectional view taken along line CC in FIG. 6. FIG. プレート角度調整装置の概略断面図である。It is a schematic sectional view of a plate angle adjustment device. 図８に示す固定ブロックの断面図である。FIG. 9 is a sectional view of the fixed block shown in FIG. 8; ブレードに装着される振動発生器を示す図である。It is a figure showing the vibration generator attached to the blade. 複数の振動発生器が装着されたブレードを示す図である。FIG. 3 is a diagram showing a blade equipped with a plurality of vibration generators.
　以下の開示において、提示された主題の異なる特徴を実施するための多くの異なる実施形態や実施例を提供する。もちろんこれらは単なる例であり、限定的であることを意図するものではない。さらに、本開示では、様々な例において参照番号および／または文字を反復している場合がある。このように反復するのは、簡潔明瞭にするためであり、それ自体が様々な実施形態および／または説明されている構成との間に関係があることを必要とするものではない。さらに、第１の要素が第２の要素に「接続されている」または「連結されている」と記述するとき、そのような記述は、第１の要素と第２の要素とが互いに直接的に接続または連結されている実施形態を含むとともに、第１の要素と第２の要素とが、その間に介在する１以上の他の要素を有して互いに間接的に接続または連結されている実施形態も含む。また、第１の要素が第２の要素に対して「移動する」と記述するとき、そのような記述は、第１の要素及び第２の要素の少なくとも一方が他方に対して移動する相対的な移動の実施形態を含む。 In the following disclosure, many different embodiments and examples are provided for implementing different features of the presented subject matter. Of course, these are just examples and are not intended to be limiting. Additionally, this disclosure may repeat reference numbers and/or characters in various instances. Such repetition is for brevity and clarity and does not itself require a relationship between the various embodiments and/or configurations described. Further, when a first element is described as being "connected" or "coupled" to a second element, such statements mean that the first element and the second element are directly connected to each other. and embodiments in which the first element and the second element are indirectly connected or connected to each other with one or more other elements interposed between them. Also includes form. Also, when it is described that a first element "moves" with respect to a second element, such a description means that at least one of the first element and the second element moves relative to the other. including embodiments of movement.
　１．電子部品の製造方法
　電子部品の製造方法は、治具に電子部品を保持して実施される塗布工程と、治具から電子部品を離脱する離脱工程とを含み、必要により、塗布工程後に実施される余分なペーストの除去工程を含むことができる。塗布工程またはペースト除去工程後にペーストが乾燥されて、電子部品が治具から離脱される。先ず、電子部品の塗布工程及び余分なペースト除去工程について概説する。 1. Method for manufacturing electronic components The method for manufacturing electronic components includes a coating process that is carried out by holding the electronic component in a jig, and a detachment process that removes the electronic component from the jig. The process may include a step of removing excess paste. After the application process or the paste removal process, the paste is dried and the electronic component is removed from the jig. First, the electronic component coating process and excess paste removal process will be outlined.
　図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）は、電子部品の製造方法として、電極形成装置１による例えばコンデンサー等の電子部品１０に外部電極を形成する方法の主たる工程を模式的に示している。電子部品１０は、搬送治具（キャリアプレートとも称する）２０に整列して保持されて搬送可能である。電子部品１０の塗布工程およびペースト除去工程に兼用することができる定盤３０は、例えばセラミック、御影石、金属等で形成される。定盤３０上にはスキージユニット４０が設けられる。スキージユニット４０は、定盤３０の表面（基準面ともいう）３１に沿って移動可能である。スキージユニット４０は、導電ペーストのディップ層５０を均一高さで敷き詰める例えば金属製のブレード４２と、定盤３０の表面３１から導電ペーストを掻き取る例えばゴム製のブレード４４とを、それぞれ独立して昇降可能に支持している。 1(A) to 1(C) and FIG. 2(A) to 2(C) show a method of manufacturing an electronic component in which external electrodes are formed on an electronic component 10, such as a capacitor, by an electrode forming apparatus 1. The main steps of the method are schematically shown. The electronic components 10 can be conveyed while being aligned and held on a conveyance jig (also referred to as a carrier plate) 20. The surface plate 30, which can be used for both the application process and the paste removal process of the electronic component 10, is formed of, for example, ceramic, granite, metal, or the like. A squeegee unit 40 is provided on the surface plate 30. The squeegee unit 40 is movable along the surface (also referred to as a reference surface) 31 of the surface plate 30. The squeegee unit 40 independently separates a blade 42 made of metal, for example, which spreads the dip layer 50 of conductive paste at a uniform height, and a blade 44, made of rubber, for example, which scrapes the conductive paste from the surface 31 of the surface plate 30. It is supported so that it can be raised and lowered.
　定盤３０の上方には、基盤３４に対して昇降可能な昇降盤３２が配置されている。搬送治具２０は、昇降盤３２に着脱自在に支持される。基盤３４には昇降モーター３６が支持され、昇降モーター３６により回転駆動されるねじ軸３８により昇降盤３２が昇降される。 An elevating plate 32 that can be raised and lowered relative to the base 34 is arranged above the surface plate 30. The conveying jig 20 is detachably supported by the elevating plate 32. An elevating motor 36 is supported on the base 34, and the elevating plate 32 is raised and lowered by a screw shaft 38 which is rotationally driven by the elevating motor 36.
　１．１．塗布工程
　図１（Ａ）～図１（Ｃ）は、導電ペーストの塗布工程を示している。図１（Ａ）では、所定高さに設定されたブレード４２をスキージユニット４０により水平移動させて、定盤３０上に導電ペーストによる一定高さのディップ層５０を形成する。図１（Ｂ）では、昇降盤３２により電子部品１０を下降させ、電子部品１０の端部を定盤３０上のディップ層５０に浸漬させる。それにより、電子部品１０の端部に導電ペースト層１４が形成される。 1.1. Coating process FIGS. 1(A) to 1(C) show the process of coating a conductive paste. In FIG. 1A, a blade 42 set at a predetermined height is horizontally moved by the squeegee unit 40 to form a dip layer 50 of a predetermined height made of conductive paste on the surface plate 30. In FIG. 1B, the electronic component 10 is lowered by the lifting plate 32, and the end of the electronic component 10 is immersed in the dip layer 50 on the surface plate 30. Thereby, a conductive paste layer 14 is formed at the end of the electronic component 10.
　１．２．ペースト除去工程
　図２（Ａ）～図２（Ｃ）は、ペースト除去工程（ブロット工程）を示している。図２（Ａ）は、定盤３０の表面３１と接触するように下降されたブレード４４をスキージユニット４０により水平移動させて、定盤３０上の導電ペーストを掻き取る工程を示している。図２（Ｂ）では、昇降盤３２により電子部品１０を下降させ、電子部品１０の端部に形成された導電ペースト層１４を定盤３０に接触させる。その後、昇降盤３２により電子部品１０は上昇される。それにより、電子部品１０の端部の余分なペーストが定盤３０に転写されて、平坦化された導電ペースト層１４Ａが形成される。なお、図２（Ａ）～図２（Ｃ）に示す従来のペースト除去工程に代えて、本出願人により提案された特許第６６３３８２９号（スライドブロット）、特許第６７８７６０５号（ヘリカルブロット）またはＰＣＴ／ＪＰ２０２０／０１０４４８等に記載されたペースト除去工程を用いると、導電ペースト層１４Ａがさらに改善される。 1.2. Paste Removal Process FIGS. 2(A) to 2(C) show the paste removal process (blotting process). FIG. 2A shows a process of scraping off the conductive paste on the surface plate 30 by horizontally moving the blade 44 by the squeegee unit 40, which has been lowered so as to come into contact with the surface 31 of the surface plate 30. In FIG. 2B, the electronic component 10 is lowered by the lifting plate 32, and the conductive paste layer 14 formed at the end of the electronic component 10 is brought into contact with the surface plate 30. Thereafter, the electronic component 10 is lifted up by the lift plate 32. As a result, excess paste at the end of the electronic component 10 is transferred to the surface plate 30, and a flattened conductive paste layer 14A is formed. Note that instead of the conventional paste removal process shown in FIGS. 2(A) to 2(C), Patent No. 6633829 (slide blot), Patent No. 6787605 (helical blot) or PCT proposed by the present applicant may be used. When the paste removal process described in /JP2020/010448 and the like is used, the conductive paste layer 14A is further improved.
　２．第１実施形態
　次に、第１実施形態について説明する。第１実施形態に用いられる搬送治具２０から電子部品１０を離脱させる装置及び工程について、図３～図１０を参照して説明する。本実施形態では、図３に示すように、搬送治具であるキャリアプレート２０の下面には粘着シート２１が設けられ、電子部品１０はその端部が粘着シート２１に粘着されて、垂下して保持される。本実施形態では、図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）に示す電極形成装置１と、図３に示す離脱装置１００とで、電子部品１０の製造装置が構成される。 2. First Embodiment Next, a first embodiment will be described. The apparatus and process for removing the electronic component 10 from the transport jig 20 used in the first embodiment will be described with reference to FIGS. 3 to 10. In this embodiment, as shown in FIG. 3, an adhesive sheet 21 is provided on the lower surface of a carrier plate 20, which is a transport jig, and the electronic component 10 is attached at its end to the adhesive sheet 21 and hangs down. Retained. In this embodiment, the electrode forming apparatus 1 shown in FIGS. 1(A) to 1(C) and FIGS. 2(A) to 2(C) and the detaching device 100 shown in FIG. Manufacturing equipment is configured.
　粘着シート２１から電子部品１０を離脱させる離脱装置１００は、図３に示す離脱装置本体１１０を有する。離脱装置本体１１０は、非磁性材料例えばカーボンや炭素繊維強化プラスチックで形成される掻き取り部材例えばブレード１２０と、少なくとも一つ例えば図３の紙面と直交する方向に配列された８つの磁石１３０（図６参照）とを有する。ブレード１２０は、粘着シート２１に粘着された少なくとも一つ、例えば図３の紙面と直交する方向（粘着シート２１の幅方向）に配列された複数の電子部品１０に接触して、複数の電子部品１０を粘着シート２１から同時に掻き取る。図４に示すように、ブレード１２０の刃先は、粘着シート２１とは非接触で、電子部品１０を粘着シート２１から掻き取ることが好ましいが、これに限定されない。掻き取り部材１２０は、ブレードに限らず、特許文献１の回転スクレーパー等であっても良く、電子部品１０を粘着シート２１から掻き取るものであれば良い。掻き取り部材１２０に好適な非磁性材料としては、上述のカーボンの他、グラファイト、アルミニウム、真鍮、合成樹脂、ガラス、窒化ケイ素、ジルコニア、炭化ケイ素、酸化アルミニウム等を挙げることができ、これらの複合材料でも良い。 A detaching device 100 for detaching the electronic component 10 from the adhesive sheet 21 has a detaching device main body 110 shown in FIG. 3. The detachment device main body 110 includes a scraping member such as a blade 120 formed of a non-magnetic material such as carbon or carbon fiber reinforced plastic, and at least one magnet 130 arranged in a direction perpendicular to the plane of the paper in FIG. 6). The blade 120 contacts at least one electronic component 10 adhered to the adhesive sheet 21, for example, a plurality of electronic components 10 arranged in a direction perpendicular to the paper surface of FIG. 10 from the adhesive sheet 21 at the same time. As shown in FIG. 4, the cutting edge of the blade 120 preferably scrapes the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21, but is not limited thereto. The scraping member 120 is not limited to a blade, and may be a rotary scraper described in Patent Document 1, as long as it scrapes the electronic component 10 from the adhesive sheet 21. Examples of non-magnetic materials suitable for the scraping member 120 include graphite, aluminum, brass, synthetic resin, glass, silicon nitride, zirconia, silicon carbide, aluminum oxide, etc. in addition to the above-mentioned carbon, and composites thereof. It can be any material.
　本実施形態のブレード１２０は、非磁性でかつ導電性である例えばカーボンで形成される。非導電性ブレードは、静電気により電子部品１０が付着するので好ましくない。もし電子部品１０が付着されたブレードで掻き取りすると、電子部品１０の引き摺りにより、粘着シート２１に傷が発生する。それにより、粘着シート２１の寿命を短くしてしまう。導電材で形成されるか、あるいは導電材によってメッキ等で被覆される導電性ブレード１２０は、接地されることにより静電気を逃がすことができる。ブレード１２０の素材が導電材でない場合には、その素材に金・銀・銅・錫等の導電材でめっきするか、あるいは導電材であるカーボンブラックなどを素材樹脂に練り込むことができる。 The blade 120 of this embodiment is made of carbon, which is non-magnetic and conductive, for example. A non-conductive blade is not preferred because the electronic component 10 will stick to it due to static electricity. If the electronic component 10 is scraped off with a blade to which the electronic component 10 is attached, the adhesive sheet 21 will be scratched due to the electronic component 10 being dragged. This shortens the life of the adhesive sheet 21. The conductive blade 120, which is formed of a conductive material or coated with a conductive material by plating or the like, can dissipate static electricity by being grounded. If the material of the blade 120 is not a conductive material, the material may be plated with a conductive material such as gold, silver, copper, or tin, or a conductive material such as carbon black may be kneaded into the material resin.
　磁石１３０は、電子部品１０が粘着シート２１より離れる所定の方向に磁界の向きを有する磁力を発生する。磁石１３０は、永久磁石でも電磁石でも良い。本実施形態の磁石１３０は永久磁石としている。電子部品１０が粘着シート２１より離れる所定の方向の磁力とは、粘着シート２１の表面から垂直に離れる方向に磁界が作用していればよく、図３では下向きの磁界の向きの成分があればよい。なお、非磁性材料で形成されるブレード１２０自体は磁化されないので、ブレード１２０に電子部品１０が吸着されことはない。 The magnet 130 generates a magnetic force with a magnetic field oriented in a predetermined direction in which the electronic component 10 moves away from the adhesive sheet 21. The magnet 130 may be a permanent magnet or an electromagnet. The magnet 130 of this embodiment is a permanent magnet. The magnetic force in a predetermined direction that causes the electronic component 10 to move away from the adhesive sheet 21 only requires that the magnetic field acts in a direction perpendicularly away from the surface of the adhesive sheet 21, and in FIG. good. Note that since the blade 120 itself, which is made of a non-magnetic material, is not magnetized, the electronic component 10 is not attracted to the blade 120.
　本実施形態によれば、ブレード１２０によって粘着シート２１から掻き取られる電子部品１０は、磁石１３０により発生する磁力線Ｂ（図４参照）に沿って案内される。それにより、電子部品１０自体が磁性体を有することから、粘着シート２１からの電子部品１０の離脱をアシストすることができる。つまり、ブレード１２０による掻き取り力に磁石１３０の磁力のアシストを受けて、電子部品１０を粘着シート２１から掻き取ることができる。これにより、一旦粘着シート２１から掻き取られた電子部品１０が粘着シート２１に再粘着するという事態も防止できる。特に、微小な電子部品１０であっても、粘着シート２１から掻き取られた電子部品１０が、ランダムな方向に飛散することを防止することができる。それにより、電子部品１０を所定の位置に回収することができる。 According to this embodiment, the electronic component 10 scraped off from the adhesive sheet 21 by the blade 120 is guided along the lines of magnetic force B (see FIG. 4) generated by the magnet 130. Thereby, since the electronic component 10 itself has a magnetic material, detachment of the electronic component 10 from the adhesive sheet 21 can be assisted. That is, the electronic component 10 can be scraped off from the adhesive sheet 21 with the scraping force of the blade 120 assisted by the magnetic force of the magnet 130 . Thereby, it is possible to prevent the electronic component 10 once scraped off from the adhesive sheet 21 from adhering to the adhesive sheet 21 again. In particular, even if the electronic component 10 is minute, the electronic component 10 scraped off from the adhesive sheet 21 can be prevented from scattering in random directions. Thereby, the electronic component 10 can be recovered to a predetermined position.
　離脱装置１００の離脱装置本体１１０は、図３及び図４に示すように、磁石１３０と接触または近接して設けられる、非磁性である仮保持体１４０をさらに有することができる。こうすると、粘着シート２１より離脱された電子部品１０は、磁石１３０に磁気吸引されて、仮保持体１４０上に仮保持される。こうして、電子部品１０の飛散を防止することができる。なお、非磁性の仮保持体１４０自体は磁化されないので、磁石１３０による磁界が解除されれば、仮保持体１４０上での電子部品１０の仮保持も解除される。磁石１３０が電磁石の場合には、電磁石への通電を解除することで、仮保持体１４０上での電子部品１０の仮保持は解除される。なお、仮保持体１４０に好適な非磁性材料として、掻き取り部材１２０に好適な上述の非磁性材料を挙げることができる。 The detachment device main body 110 of the detachment device 100 can further include a non-magnetic temporary holder 140 that is provided in contact with or in close proximity to the magnet 130, as shown in FIGS. 3 and 4. In this way, the electronic component 10 detached from the adhesive sheet 21 is magnetically attracted by the magnet 130 and temporarily held on the temporary holding body 140. In this way, the electronic component 10 can be prevented from scattering. Note that since the non-magnetic temporary holding body 140 itself is not magnetized, when the magnetic field by the magnet 130 is released, the temporary holding of the electronic component 10 on the temporary holding body 140 is also released. When the magnet 130 is an electromagnet, the temporary holding of the electronic component 10 on the temporary holding body 140 is released by canceling the power supply to the electromagnet. In addition, examples of non-magnetic materials suitable for the temporary holding body 140 include the above-mentioned non-magnetic materials suitable for the scraping member 120.
　離脱装置１００の離脱装置本体１１０は、図３～図７に示すように、ブレード１２０、磁石１３０及び仮保持体１４０を搭載する搭載部１５０を有する。搭載部１５０の例えば上面にブレード１２０が固定され、搭載部１５０の前面に仮保持体１４０が固定される。なお、磁石１３０の固定については後述する。離脱装置１００は、粘着シート２１を保持する搬送治具２０及び搭載部１５０の少なくとも一方を相対的に移動させて、電子部品１０とブレード１２０とを接触させる第１移動機構（図示省略）をさらに有することができる。第１移動機構は、例えば図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）に示す基盤３４、及び図５に示す離脱装置本体１１０の少なくとも一方を、水平方向に移動する機構とすることができる。こうすると、第１移動機構によりブレード１２０が電子部品１０に対して相対的に水平方向に移動されて、ブレード１２０により電子部品１０を粘着シート２１から掻き取ることができる。加えて、搭載部１５０に搭載されるブレード１２０、磁石１３０及び仮保持体１４０の相対的位置は変化しないので、電子部品１０を所定の方向に案内して、仮保持体１４０上に仮保持することができる。 The detachment device main body 110 of the detachment device 100 has a mounting section 150 on which the blade 120, the magnet 130, and the temporary holding body 140 are mounted, as shown in FIGS. 3 to 7. For example, the blade 120 is fixed to the upper surface of the mounting section 150, and the temporary holder 140 is fixed to the front surface of the mounting section 150. Note that fixing of the magnet 130 will be described later. The detachment device 100 further includes a first moving mechanism (not shown) that relatively moves at least one of the conveying jig 20 holding the adhesive sheet 21 and the mounting section 150 to bring the electronic component 10 and the blade 120 into contact. can have The first moving mechanism horizontally moves at least one of the base 34 shown in FIGS. 1(A) to 1(C) and FIGS. It can be a mechanism that moves in the direction. In this way, the blade 120 is moved in the horizontal direction relative to the electronic component 10 by the first moving mechanism, and the electronic component 10 can be scraped off from the adhesive sheet 21 by the blade 120. In addition, since the relative positions of the blade 120, magnet 130, and temporary holding body 140 mounted on the mounting section 150 do not change, the electronic component 10 is guided in a predetermined direction and temporarily held on the temporary holding body 140. be able to.
　本実施形態では磁石１３０を永久磁石としている。この場合、搭載部１５０は第２移動機構１６０を有する。第２移動機構１６０は、図３、図５～図７に示すように、磁石１３０及び仮保持体１４０の少なくとも一方を相対的に移動して、仮保持体１４０上の電子部品１０に作用する磁気吸引力を解除する。それにより、一旦は仮保持体１４０上に仮保持された電子部品１０を、磁気吸引力を解除することで回収することができる。なお、前記少なくとも一つの磁石１３０は電磁石としても良く、この場合には第２移動機構１６０を要せず、通電解除によって磁気吸引力を解除することができる。 In this embodiment, the magnet 130 is a permanent magnet. In this case, the mounting section 150 has a second moving mechanism 160. As shown in FIGS. 3 and 5 to 7, the second moving mechanism 160 relatively moves at least one of the magnet 130 and the temporary holding body 140 to act on the electronic component 10 on the temporary holding body 140. Release the magnetic attraction. Thereby, the electronic component 10 temporarily held on the temporary holding body 140 can be recovered by releasing the magnetic attraction force. Note that the at least one magnet 130 may be an electromagnet, and in this case, the second moving mechanism 160 is not required, and the magnetic attraction force can be canceled by canceling the energization.
　本実施形態では、第２移動機構１６０は、仮保持体１４０に対して磁石１３０を移動可能としている。このために、第２移動機構１６０は、搭載部１５０に設けた孔または切り欠き等の案内部１５１（図７）に案内されて移動可能な移動体１６１を有する。移動体１６１は、図７に示すように、例えば図６に示す８つの磁石１３０がそれぞれ固定される８つの磁石固定部１６１Ａと、８つの磁石固定部１６１Ａに連結されるハンドル１６１Ｂとを一体的に有する。磁石固定部１６１Ａは案内部１５１に移動案内される。第２移動機構１６０は、移動体１６１を仮保持体１４０に接触または近接する方向に常時付勢する付勢部材例えばコイルスプリング１６２をさらに有する。それにより、磁石１３０の位置はコイルスプリング１６２の付勢力により一定位置に位置決めされる。仮保持体１４０上での磁気吸引力を開示するには、コイルスプリング１６２の付勢力に抗してハンドル１６１Ｂを引っ張って、磁石１３０を仮保持体１４０から遠ざければよい。本実施形態では第２移動機構１６０は手動操作可能としたが、ハンドル１６１Ｂに代えて、コイルスプリング１６２の付勢力に抗して移動体１６１を移動させる駆動機構を第２移動機構１６０に設けても良い。 In this embodiment, the second moving mechanism 160 is capable of moving the magnet 130 relative to the temporary holding body 140. For this purpose, the second moving mechanism 160 includes a moving body 161 that is movable while being guided by a guide portion 151 (FIG. 7) such as a hole or a notch provided in the mounting portion 150. As shown in FIG. 7, the movable body 161 integrally includes eight magnet fixing parts 161A to which the eight magnets 130 shown in FIG. 6 are respectively fixed, and a handle 161B connected to the eight magnet fixing parts 161A. has. The magnet fixing part 161A is movably guided by the guide part 151. The second moving mechanism 160 further includes a biasing member, such as a coil spring 162, that constantly biases the movable body 161 in the direction of contacting or approaching the temporary holding body 140. As a result, the magnet 130 is positioned at a constant position by the biasing force of the coil spring 162. To release the magnetic attraction force on the temporary holder 140, the handle 161B may be pulled against the biasing force of the coil spring 162 to move the magnet 130 away from the temporary holder 140. In this embodiment, the second moving mechanism 160 is manually operable, but instead of the handle 161B, the second moving mechanism 160 is provided with a drive mechanism that moves the moving body 161 against the biasing force of the coil spring 162. Also good.
　仮保持体１４０は、電子部品１０を仮保持する面を、図４又は図５に示すように、垂直面又は傾斜面とすることができる。それにより、仮保持体１４０上での磁気吸引力の解除により、電子部品１０を自然落下させることができる。こうして、自然落下される電子部品１０を回収部に回収することができる。 The surface of the temporary holding body 140 that temporarily holds the electronic component 10 can be a vertical surface or an inclined surface, as shown in FIG. 4 or 5. Thereby, by releasing the magnetic attraction force on the temporary holding body 140, the electronic component 10 can be allowed to fall naturally. In this way, the electronic components 10 that have naturally fallen can be collected in the collection section.
　３．第２実施形態
　図８に示すように、本実施形態は、粘着シート２１と平行な面に対してブレード１２０の傾きを調整する傾き調整機構１７０を有する。傾き調整機構１７０は、ブレード１２０を搭載する搭載部１５０の両端より突出する２つの支軸１４２を自転可能に支持する２つの固定ブロック１５２を有する。２つの固定ブロック１５２の各々は、図９に示すように、スリット１７６により半割され、スリット１７６と連通する半割された孔１７４に各一つの支軸１４２が挿通される。半割された孔２４３内で各一つの支軸１４２を自転させることで、ブレード１２０の傾きが調整される。ブレード１２０の傾きを調整した後に、図９に示すねじまたはボルト１７８を締結してスリット１７６の隙間を狭める。それにより、スリット１７６と連通する半割された孔１７４内にて各一つの支軸１４２が締め付けられて固定される。傾き調整機構１７０は、２つの支軸１４２を受け入れる２つの固定ブロック１７２と、各固定ブロック１７２に設けられたスリット１７６と、孔１７４と、ねじ又はボルト１７８で構成される。 3. Second Embodiment As shown in FIG. 8, this embodiment includes a tilt adjustment mechanism 170 that adjusts the tilt of the blade 120 with respect to a plane parallel to the adhesive sheet 21. The tilt adjustment mechanism 170 has two fixed blocks 152 that rotatably support two support shafts 142 that protrude from both ends of the mounting section 150 on which the blade 120 is mounted. As shown in FIG. 9, each of the two fixed blocks 152 is split in half by a slit 176, and one support shaft 142 is inserted into each half-split hole 174 that communicates with the slit 176. The inclination of the blade 120 is adjusted by rotating each one of the spindles 142 within the halved hole 243. After adjusting the inclination of the blade 120, a screw or bolt 178 shown in FIG. 9 is tightened to narrow the gap between the slits 176. As a result, each one of the support shafts 142 is tightened and fixed within the half-split hole 174 communicating with the slit 176. The tilt adjustment mechanism 170 includes two fixed blocks 172 that receive the two support shafts 142, a slit 176 provided in each fixed block 172, a hole 174, and a screw or bolt 178.
　４．第３実施形態
　第１実施形態または第２実施形態において、図１０及び図１１に示すように、ブレード１２０を振動させる振動発生器１８０をさらに設けることができる。図１０に示すブレード１２０は、図３に示すブレードと比較して薄く形成される。ブレード１２０の刃先１２１は、粘着シート２１とは非接触で、電子部品１０を粘着シート２１から掻き取ることが好ましい。このため、図１０に示すように、粘着シート２１と平行な面と刃先１２１との間には、隙間δが設けられる。隙間δは、電子部品１０のサイズが小さくなるほど小さく設定される。電子部品１０が微小サイズである場合、隙間δは、設計値で１０μｍから数十μｍである。 4. Third Embodiment In the first embodiment or the second embodiment, as shown in FIGS. 10 and 11, a vibration generator 180 that vibrates the blade 120 can be further provided. The blade 120 shown in FIG. 10 is thinner than the blade shown in FIG. It is preferable that the cutting edge 121 of the blade 120 scrape off the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21 . Therefore, as shown in FIG. 10, a gap δ is provided between the surface parallel to the adhesive sheet 21 and the cutting edge 121. The gap δ is set smaller as the size of the electronic component 10 becomes smaller. When the electronic component 10 is minute in size, the designed gap δ is from 10 μm to several tens of μm.
　振動発生器１８０は、本実施形態では超小型で扁平タイプの振動モーターを用いているが、これに限定されず、ブレード１２０を振動させるものであれば良い。振動発生器１８０により振動されるブレード１２０の振幅は、粘着シート２１に刃先１２１が接触しないことを前提として、例えば２μｍ以上であることが好ましい。振動発生器１８０により振動されるブレード１２０の振動方向は、特に制限はないが、粘着シート２１とブレード１２０の刃先１２１との隙間δの大きさを周期的に変化させる方向であることが好ましい。隙間δに電子部品１０を入り込ませないためである。特に、安全率をみて設計値の隙間δを大きくしても、振動する刃先１２１により隙間δが周期的に小さくなるため、隙間δに電子部品１０を入り込むことがない。 The vibration generator 180 uses an ultra-compact, flat-type vibration motor in this embodiment, but is not limited to this, and may be any device that vibrates the blade 120. The amplitude of the blade 120 vibrated by the vibration generator 180 is preferably 2 μm or more, for example, on the premise that the cutting edge 121 does not come into contact with the adhesive sheet 21. The vibration direction of the blade 120 vibrated by the vibration generator 180 is not particularly limited, but is preferably a direction that periodically changes the size of the gap δ between the adhesive sheet 21 and the cutting edge 121 of the blade 120. This is to prevent the electronic component 10 from entering the gap δ. In particular, even if the design value of the gap δ is increased considering the safety factor, the electronic component 10 will not enter the gap δ because the vibrating cutting edge 121 periodically reduces the gap δ.
　本実施形態では、図１０及び図１１に示すように、振動発生器１８０はブレード１２０に直接装着されることが好ましい。ただし、振動発生器１８０からの振動を他の媒体を介してブレード１２０に伝達するものであってもよい。ここで、ブレード１２０は、図３に示すように、固定端部１２０Ａと自由端部１２０Ｂとを含む。固定端部１２０Ａが図示しないブレード固定部に固定され、自由端部１２０Ｂに刃先１２１が設けられる。ブレード１２０の自由端部１２０Ｂは、粘着シート２１と対面する第１面１２０Ｂ１と、第１面１２０Ｂ１との反対側の第２面１２０Ｂ２とを含む。なお、第１面１２０Ｂ１と第２面１２０Ｂ２との交差により楔状の刃先１２１を形成するために、例えば水平な第１面１２０Ｂ１に対して第２面１２０Ｂ２は傾斜している。本実施形態では、例えば３つの振動発生器１８０を第２面１２０Ｂ２に装着している。振動し易い自由端部１２０Ｂに振動発生器１８０を設けることで、振動発生器１８０のパワーを小さくすることができる。また、粘着シート２１と対面する第１面１２０Ｂ１に振動発生器１８０が設けられないことから、振動発生器１８０が粘着シート２１と干渉することもない。 In this embodiment, the vibration generator 180 is preferably attached directly to the blade 120, as shown in FIGS. 10 and 11. However, the vibration from the vibration generator 180 may be transmitted to the blade 120 via another medium. Here, the blade 120 includes a fixed end 120A and a free end 120B, as shown in FIG. The fixed end portion 120A is fixed to a blade fixing portion (not shown), and the free end portion 120B is provided with a cutting edge 121. The free end portion 120B of the blade 120 includes a first surface 120B1 facing the adhesive sheet 21 and a second surface 120B2 opposite to the first surface 120B1. In addition, in order to form the wedge-shaped cutting edge 121 by the intersection of the first surface 120B1 and the second surface 120B2, the second surface 120B2 is inclined with respect to the horizontal first surface 120B1, for example. In this embodiment, for example, three vibration generators 180 are mounted on the second surface 120B2. By providing the vibration generator 180 at the free end portion 120B that is likely to vibrate, the power of the vibration generator 180 can be reduced. Further, since the vibration generator 180 is not provided on the first surface 120B1 facing the adhesive sheet 21, the vibration generator 180 does not interfere with the adhesive sheet 21.
　振動発生器１８０は、振動数について特に制限はないが、好ましくはブレード１２０の固有振動数の逓倍でブレード１２０を振動させることができる。本実施形態のように複数の振動発生器１８０の位相合わせは煩雑であるので、例えばブレード１２０と振動発生器１８０との間に共鳴板（図示せず）を介在させると、共鳴振動数でブレード１２０を振動させることができる。 Although the vibration frequency of the vibration generator 180 is not particularly limited, it can preferably vibrate the blade 120 at a frequency multiplied by the natural frequency of the blade 120. Since phase alignment of the plurality of vibration generators 180 as in this embodiment is complicated, for example, if a resonance plate (not shown) is interposed between the blade 120 and the vibration generator 180, the resonance frequency of the blades can be adjusted. 120 can be vibrated.
　１…電極形成装置、１０電子部品、２０…搬送治具、２１…粘着シート、３０…定盤、１００…離脱装置、１１０…離脱装置本体、１２０…ブレード（掻き取り部材）、１３０…磁石、１４０…仮保持体、１５０…搭載部、１５１…案内部、１６０…第２移動機構、１６１…移動体、１６１Ａ…磁石固定部、１６１Ｂ…ハンドル、１６２…付勢部材、１７０…ブレード角度調整装置、１７２…固定ブロック、１７４…孔、１７６…スリット、１７８…ボルト、１８０…振動発生器 DESCRIPTION OF SYMBOLS 1... Electrode formation device, 10 Electronic components, 20... Transport jig, 21... Adhesive sheet, 30... Surface plate, 100... Detachment device, 110... Detachment device main body, 120... Blade (scraping member), 130... Magnet, 140... Temporary holding body, 150... Mounting part, 151... Guide part, 160... Second moving mechanism, 161... Moving body, 161A... Magnet fixing part, 161B... Handle, 162... Biasing member, 170... Blade angle adjustment device , 172... Fixed block, 174... Hole, 176... Slit, 178... Bolt, 180... Vibration generator

Claims (10)

  1. 　粘着シートに粘着された少なくとも一つの電子部品に接触して、前記少なくとも一つの電子部品を前記粘着シートから掻き取る掻き取り部材と、
    　前記少なくとも一つの電子部品が前記粘着シートより離れる所定の方向に磁界の向きを有する磁力を発生する少なくとも一つの磁石と、
    を有し、
    　前記掻き取り部材は非磁性である電子部品の離脱装置。     a scraping member that comes into contact with at least one electronic component adhered to the adhesive sheet and scrapes the at least one electronic component from the adhesive sheet;
    at least one magnet that generates a magnetic force having a magnetic field directed in a predetermined direction in which the at least one electronic component moves away from the adhesive sheet;
    has
    The scraping member is a non-magnetic electronic component detaching device.
  2. 　請求項１において、
    　前記少なくとも一つの磁石と接触または近接して設けられ、非磁性である仮保持体をさらに有し、
    　前記粘着シートより離脱された前記少なくとも一つの電子部品が前記少なくとも一つの磁石に磁気吸引されて、前記仮保持体上に仮保持される電子部品の離脱装置。     In claim 1,
    further comprising a non-magnetic temporary holder provided in contact with or in close proximity to the at least one magnet;
    An electronic component detaching device in which the at least one electronic component detached from the adhesive sheet is magnetically attracted by the at least one magnet and temporarily held on the temporary holding body.
  3. 　請求項２において、
    　前記掻き取り部材、前記少なくとも一つの磁石及び前記仮保持体を搭載する搭載部と、
    　前記粘着シート及び前記搭載部の少なくとも一方を相対的に移動させて、前記少なくとも一つの電子部品と前記掻き取り部材とを接触させる第１移動機構と、
    をさらに有する電子部品の離脱装置。     In claim 2,
    a mounting section on which the scraping member, the at least one magnet, and the temporary holding body are mounted;
    a first moving mechanism that relatively moves at least one of the adhesive sheet and the mounting section to bring the at least one electronic component into contact with the scraping member;
    An electronic component detachment device further comprising:
  4. 　請求項３において、
    　前記少なくとも一つの磁石は永久磁石であり、
    　前記搭載部は、前記少なくとも一つの磁石及び前記仮保持体の少なくとも一方を相対的に移動して、前記仮保持体上の前記電子部品に作用する磁気吸引力を解除する第２移動機構を有する電子部品の離脱装置。     In claim 3,
    the at least one magnet is a permanent magnet;
    The mounting section includes a second moving mechanism that relatively moves at least one of the at least one magnet and the temporary holding body to release the magnetic attraction force acting on the electronic component on the temporary holding body. Electronic component detachment device.
  5. 　請求項４において、
    　前記仮保持体は、前記少なくとも一つの電子部品を仮保持する面が垂直面又は傾斜面であり、前記磁気吸引力の解除により前記少なくとも一つの電子部品を自然落下させる電子部品の離脱装置。     In claim 4,
    In the temporary holding body, a surface for temporarily holding the at least one electronic component is a vertical surface or an inclined surface, and the electronic component detachment device allows the at least one electronic component to naturally fall when the magnetic attraction force is released.
  6. 　請求項１において、
    　前記掻き取り部材は、接地された導電性ブレードである電子部品の離脱装置。     In claim 1,
    The scraping member is a grounded conductive blade.
  7. 　請求項６において、
    　前記粘着シートと平行な面に対する前記導電性ブレードの傾きを調整する傾き調整機構をさらに有する電子部品の離脱装置。     In claim 6,
    An electronic component detaching device further comprising an inclination adjustment mechanism for adjusting an inclination of the conductive blade with respect to a plane parallel to the adhesive sheet.
  8. 　請求項６において、
    　前記導電性ブレードを振動させる振動発生器をさらに有する電子部品の離脱装置。     In claim 6,
    An electronic component detachment device further comprising a vibration generator that vibrates the conductive blade.
  9. 　請求項１において、
    　前記少なくとも一つの電子部品は、前記粘着シートの幅方向に沿って粘着された複数の電子部品を含み、
    　前記掻き取り部材は、前記複数の電子部品と同時に接触する幅を有し、
    　前記少なくとも一つの磁石は、前記粘着シートの幅方向に沿って設けられる複数の磁石を含む電子部品の離脱装置。     In claim 1,
    The at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet,
    The scraping member has a width that contacts the plurality of electronic components simultaneously,
    The at least one magnet is an electronic component detachment device including a plurality of magnets provided along the width direction of the adhesive sheet.
  10. 　粘着シートに粘着された少なくとも一つの電子部品の端部に電極を形成する電極形成装置と、
    　前記粘着シートから前記少なくとも一つの電子部品を離脱させる、請求項１乃至９のいずれか一項記載の電子部品の離脱装置と、
    を有する電子部品の製造装置。     an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet;
    The electronic component detachment device according to any one of claims 1 to 9, which detaches the at least one electronic component from the adhesive sheet;
    Electronic component manufacturing equipment with
PCT/JP2022/047641 2022-03-31 2022-12-23 Electronic-component removing device and electronic-component manufacturing device WO2023188638A1 (en)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2004193366A (en) * 2002-12-11 2004-07-08 Murata Mfg Co Ltd Holding jig of electronic part and method for handling electronic part
JP2011142273A (en) * 2010-01-08 2011-07-21 Shin Etsu Polymer Co Ltd Holding/removing jig and handling jig
JP2013125945A (en) * 2011-12-16 2013-06-24 Tdk Corp Peeling device of electronic component, peeling method of electronic component, and manufacturing method of electronic component
JP2015015360A (en) * 2013-07-04 2015-01-22 デクセリアルズ株式会社 Method for producing heat conductive sheet, device for producing heat conductive sheet and method for cutting heat conductive sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2004193366A (en) * 2002-12-11 2004-07-08 Murata Mfg Co Ltd Holding jig of electronic part and method for handling electronic part
JP2011142273A (en) * 2010-01-08 2011-07-21 Shin Etsu Polymer Co Ltd Holding/removing jig and handling jig
JP2013125945A (en) * 2011-12-16 2013-06-24 Tdk Corp Peeling device of electronic component, peeling method of electronic component, and manufacturing method of electronic component
JP2015015360A (en) * 2013-07-04 2015-01-22 デクセリアルズ株式会社 Method for producing heat conductive sheet, device for producing heat conductive sheet and method for cutting heat conductive sheet

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