JPWO2023188638A1 - - Google Patents
Info
- Publication number
- JPWO2023188638A1 JPWO2023188638A1 JP2024511244A JP2024511244A JPWO2023188638A1 JP WO2023188638 A1 JPWO2023188638 A1 JP WO2023188638A1 JP 2024511244 A JP2024511244 A JP 2024511244A JP 2024511244 A JP2024511244 A JP 2024511244A JP WO2023188638 A1 JPWO2023188638 A1 JP WO2023188638A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022059034 | 2022-03-31 | ||
PCT/JP2022/047641 WO2023188638A1 (en) | 2022-03-31 | 2022-12-23 | Electronic-component removing device and electronic-component manufacturing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2023188638A1 true JPWO2023188638A1 (en) | 2023-10-05 |
JPWO2023188638A5 JPWO2023188638A5 (en) | 2024-07-26 |
Family
ID=88200214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024511244A Pending JPWO2023188638A1 (en) | 2022-03-31 | 2022-12-23 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2023188638A1 (en) |
TW (1) | TW202343624A (en) |
WO (1) | WO2023188638A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4218785B2 (en) * | 2001-08-31 | 2009-02-04 | 株式会社村田製作所 | Electronic component handling apparatus and handling method |
JP4186611B2 (en) * | 2002-12-11 | 2008-11-26 | 株式会社村田製作所 | Electronic component holding jig and electronic component handling method |
JP2011142273A (en) * | 2010-01-08 | 2011-07-21 | Shin Etsu Polymer Co Ltd | Holding/removing jig and handling jig |
JP2013125945A (en) * | 2011-12-16 | 2013-06-24 | Tdk Corp | Peeling device of electronic component, peeling method of electronic component, and manufacturing method of electronic component |
JP6219624B2 (en) * | 2013-07-04 | 2017-10-25 | デクセリアルズ株式会社 | Manufacturing method of thermal conductive sheet, manufacturing apparatus of thermal conductive sheet, cutting method of resin molded body |
-
2022
- 2022-12-23 JP JP2024511244A patent/JPWO2023188638A1/ja active Pending
- 2022-12-23 WO PCT/JP2022/047641 patent/WO2023188638A1/en unknown
-
2023
- 2023-02-13 TW TW112104933A patent/TW202343624A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2023188638A1 (en) | 2023-10-05 |
TW202343624A (en) | 2023-11-01 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240521 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240521 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20240521 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20240716 |