WO2023188639A1 - Electronic component detaching apparatus and electronic component manufacturing apparatus - Google Patents

Electronic component detaching apparatus and electronic component manufacturing apparatus Download PDF

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Publication number
WO2023188639A1
WO2023188639A1 PCT/JP2022/047642 JP2022047642W WO2023188639A1 WO 2023188639 A1 WO2023188639 A1 WO 2023188639A1 JP 2022047642 W JP2022047642 W JP 2022047642W WO 2023188639 A1 WO2023188639 A1 WO 2023188639A1
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WIPO (PCT)
Prior art keywords
electronic component
blade
adhesive sheet
vibration generator
detachment device
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PCT/JP2022/047642
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French (fr)
Japanese (ja)
Inventor
英児 佐藤
仁志 坂本
泰一 木村
紀昭 西
Original Assignee
株式会社クリエイティブコーティングス
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Priority to JP2024511245A priority Critical patent/JPWO2023188639A1/ja
Publication of WO2023188639A1 publication Critical patent/WO2023188639A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Definitions

  • the present invention relates to an electronic component detachment device, an electronic component manufacturing device, and the like.
  • Patent Document 1 discloses a manufacturing apparatus that applies a paste to the ends of a plurality of electronic components that are adhered to an adhesive sheet of a band-shaped member and transported, thereby manufacturing electronic components having external electrodes formed at the ends. ing.
  • a detaching device for detaching electronic components coated with paste and dried from an adhesive sheet is composed of a rotating scraper equipped with a scraper such as a rubber plate on the circumferential surface of a rotating body. can do. The electronic components are scraped off the adhesive sheet by a rotating scraper.
  • the scraped electronic components may adhere to the blade as a lump. If you scrape off the adhesive with a blade that has chips attached to it, the adhesive sheet will be scratched due to the dragging of the chips. This shortens the life of the adhesive sheet.
  • An object of the present invention is to provide an electronic component removal device and an electronic component manufacturing device that prevent electronic components from adhering to a blade that scrapes electronic components from an adhesive sheet.
  • One aspect of the present invention is a blade that comes into contact with at least one electronic component adhered to an adhesive sheet and scrapes the at least one electronic component from the adhesive sheet; a vibration generator that vibrates the blade;
  • the present invention relates to an electronic component detachment device having the following features.
  • electronic components are scraped off from the adhesive sheet with a blade.
  • the blade is vibrated by a vibration generator. This prevents electronic components from adhering to the blade. Furthermore, by vibrating the blade, the opportunity for contact between the blade and the electronic component is ensured or increased, making it possible to reliably scrape off the electronic component.
  • the vibration generator may be anything that vibrates the blade, such as a vibration motor that generates vibration by rotating an eccentric weight, a crystal oscillator, a piezoelectric element, or one that uses an electromagnetic coil to vibrate. be able to.
  • the blade includes a fixed end portion and a free end portion, the free end portion is provided with a cutting edge, and the at least one vibration generator is arranged on the blade.
  • the free end can be vibrated. The free end of the blade vibrates more easily than the fixed end, and the cutting edge formed at the free end comes into contact with the electronic component while vibrating, allowing the electronic component to be scraped off.
  • the at least one vibration generator is capable of vibrating the blade in a direction that changes the size of the gap. If a gap is required between the blade and the adhesive sheet, a minute electronic component may enter the gap and the electronic component may not be able to be scraped off. By vibrating the blade and changing the dimensions of the gap, tiny electronic components will not get stuck in the periodically narrowed gap.
  • the at least one vibration generator can be attached to the blade. In this way, the blade can be directly vibrated by the vibration generator.
  • the free end portion of the blade includes a first surface facing the adhesive sheet and a second surface opposite to the first surface, and At least one vibration generator can be mounted on the second surface.
  • the power of the vibration generator can be reduced by providing the vibration generator at the free end that is likely to vibrate. Further, since the vibration generator is not provided on the first surface facing the adhesive sheet, the vibration generator does not interfere with the adhesive sheet.
  • a mounting section on which the blade is mounted, and at least one of the adhesive sheet and the mounting section are moved relatively, and the at least one electronic component is mounted.
  • the blade may further include a moving mechanism that brings the blade into contact with the blade. In this case, the blade is moved relative to the electronic component by the moving mechanism, and the electronic component can be scraped off from the adhesive sheet by the blade.
  • the mounting section may include an inclination adjustment mechanism that adjusts the inclination of the blade with respect to a plane parallel to the adhesive sheet.
  • the at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet, and the blade
  • the at least one vibration generator may include a plurality of vibration generators provided along the width direction of the adhesive sheet. In this way, multiple electronic components can be scraped simultaneously by blades vibrated by multiple vibration generators.
  • an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet; the electronic component detachment device according to any one of (1) to (8), which detaches the at least one electronic component from the adhesive sheet; Defines electronic component manufacturing equipment that has
  • FIGS. 1(A) to 1(C) are diagrams showing a coating process, which is one process of an electronic component manufacturing method.
  • FIGS. 2(A) to 2(C) are diagrams showing a process of removing excess paste, which is performed after the coating process. It is a figure which shows the principal part and process of the apparatus which detaches an electronic component from an adhesive sheet.
  • FIG. 3 is a diagram showing a plurality of vibration generators attached to a blade.
  • FIG. 3 is a schematic perspective view of the detachment device main body.
  • FIG. 3 is a partially cutaway front view of the detachment device main body.
  • FIG. 3 is a side view of the detachment device main body.
  • the method for manufacturing electronic components includes a coating process that is carried out by holding the electronic component in a jig, and a detachment process that removes the electronic component from the jig.
  • the process may include a step of removing excess paste. After the application process or the paste removal process, the paste is dried and the electronic component is removed from the jig. First, the electronic component coating process and excess paste removal process will be outlined.
  • FIG. 1(A) to 1(C) and FIG. 2(A) to 2(C) show a method of manufacturing an electronic component in which external electrodes are formed on an electronic component 10, such as a capacitor, by an electrode forming apparatus 1.
  • the main steps of the method are schematically shown.
  • the electronic components 10 can be conveyed while being aligned and held on a conveyance jig (also referred to as a carrier plate) 20.
  • the surface plate 30, which can be used for both the application process and the paste removal process of the electronic component 10, is formed of, for example, ceramic, granite, metal, or the like.
  • a squeegee unit 40 is provided on the surface plate 30.
  • the squeegee unit 40 is movable along the surface (also referred to as a reference surface) 31 of the surface plate 30.
  • the squeegee unit 40 independently separates a blade 42 made of metal, for example, which spreads the dip layer 50 of conductive paste at a uniform height, and a blade 44, made of rubber, for example, which scrapes the conductive paste from the surface 31 of the surface plate 30. It is supported so that it can be raised and lowered.
  • An elevating plate 32 that can be raised and lowered relative to the base 34 is arranged above the surface plate 30.
  • the conveying jig 20 is detachably supported by the elevating plate 32.
  • An elevating motor 36 is supported on the base 34, and the elevating plate 32 is raised and lowered by a screw shaft 38 which is rotationally driven by the elevating motor 36.
  • FIGS. 1(A) to 1(C) show the process of coating a conductive paste.
  • a blade 42 set at a predetermined height is horizontally moved by the squeegee unit 40 to form a dip layer 50 of a predetermined height made of conductive paste on the surface plate 30.
  • the electronic component 10 is lowered by the lifting plate 32, and the end of the electronic component 10 is immersed in the dip layer 50 on the surface plate 30. Thereby, a conductive paste layer 14 is formed at the end of the electronic component 10.
  • FIGS. 2(A) to 2(C) show the paste removal process (blotting process).
  • FIG. 2A shows a process of scraping off the conductive paste on the surface plate 30 by horizontally moving the blade 44 by the squeegee unit 40, which has been lowered so as to come into contact with the surface 31 of the surface plate 30.
  • FIG. 2B the electronic component 10 is lowered by the lifting plate 32, and the conductive paste layer 14 formed at the end of the electronic component 10 is brought into contact with the surface plate 30. Thereafter, the electronic component 10 is lifted up by the lift plate 32. As a result, excess paste at the end of the electronic component 10 is transferred to the surface plate 30, and a flattened conductive paste layer 14A is formed.
  • Patent No. 6633829 silica blot
  • Patent No. 6787605 helical blot
  • PCT PCT
  • FIG. 3 an adhesive sheet 21 is provided on the lower surface of a carrier plate 20, which is a transport jig, and the electronic component 10 is attached at its end to the adhesive sheet 21 and hangs down. Retained.
  • the electrode forming apparatus 1 shown in FIGS. 1(A) to 1(C) and FIGS. 2(A) to 2(C) and the detaching device 100 shown in FIG. Manufacturing equipment is configured.
  • a detaching device 100 for detaching the electronic component 10 from the adhesive sheet 21 has a detaching device main body 110 shown in FIG. 3.
  • the detachment device main body 110 includes a blade 120 that is a scraping member, and at least one vibration generator 130 (see FIG. 4) arranged in a direction perpendicular to the paper plane of FIG. 3, for example.
  • the blade 120 contacts at least one electronic component 10 adhered to the adhesive sheet 21, for example, a plurality of electronic components 10 arranged in a direction perpendicular to the paper surface of FIG. 10 from the adhesive sheet 21 at the same time.
  • the blade 120 of this embodiment is made of a conductive material such as carbon or carbon fiber reinforced plastic.
  • a non-conductive blade is not preferred because the electronic component 10 will stick to it due to static electricity. If the electronic component 10 is scraped off with a blade to which the electronic component 10 is attached, the adhesive sheet 21 will be scratched due to the electronic component 10 being dragged. This shortens the life of the adhesive sheet 21.
  • the conductive blade 120 which is formed of a conductive material or coated with a conductive material by plating or the like, can dissipate static electricity by being grounded.
  • the blade 120 has a cutting edge 121 as shown in FIG. It is preferable that the cutting edge 121 of the blade 120 scrape off the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21 . Therefore, as shown in FIG.
  • a gap ⁇ is provided between the surface parallel to the adhesive sheet 21 and the cutting edge 121.
  • the gap ⁇ is set smaller as the size of the electronic component 10 becomes smaller.
  • the designed gap ⁇ is from 10 ⁇ m to several tens of ⁇ m.
  • the gap ⁇ can be set to 3 to 15% of the dimension of the electronic component 10 in the direction of protrusion from the adhesive sheet 21.
  • the vibration generator 130 uses an ultra-compact, flat-type vibration motor in this embodiment, but is not limited to this, and may be any device that vibrates the blade 120.
  • the amplitude of the blade 120 vibrated by the vibration generator 130 is preferably 2 ⁇ m or more, for example, on the premise that the cutting edge 121 does not come into contact with the adhesive sheet 21.
  • the vibration direction of the blade 120 vibrated by the vibration generator 130 is not particularly limited, but is preferably a direction that periodically changes the size of the gap ⁇ between the adhesive sheet 21 and the cutting edge 121 of the blade 120. This is to prevent the electronic component 10 from entering the gap ⁇ . In particular, even if the design value of the gap ⁇ is increased considering the safety factor, the electronic component 10 will not enter the gap ⁇ because the vibrating cutting edge 121 periodically reduces the gap ⁇ .
  • the vibration generator 130 is preferably attached directly to the blade 120.
  • the vibration from the vibration generator 130 may be transmitted to the blade 120 via another medium.
  • the blade 120 includes a fixed end 120A and a free end 120B, as shown in FIG.
  • the fixed end portion 120A is fixed to a blade fixing portion (not shown), and the free end portion 120B is provided with a cutting edge 121.
  • the free end portion 120B of the blade 120 includes a first surface 120B1 facing the adhesive sheet 21 and a second surface 120B2 opposite to the first surface 120B1.
  • the second surface 120B2 is inclined with respect to the horizontal first surface 120B1, for example.
  • three vibration generators 130 are mounted on the second surface 120B2.
  • the vibration generator 130 is not particularly limited in frequency, but preferably can vibrate the blade 120 at a frequency multiplied by the natural frequency of the blade 120. Since phase alignment of the plurality of vibration generators 130 as in the present embodiment is complicated, for example, if a resonance plate (not shown) is interposed between the blade 120 and the vibration generator 130, the resonance frequency of the blade can be adjusted. 120 can be vibrated.
  • the detachment device main body 110 has a mounting part (not shown) on which the blade 120 is mounted by fixing the fixed end 120A of the blade 120 to which the vibration generator 130 is attached.
  • the detachment device 100 may further include a moving mechanism (not shown) that relatively moves at least one of the carrier jig 20 holding the adhesive sheet 21 and the mounting section to bring the electronic component 10 and the blade 120 into contact. can.
  • the moving mechanism is a mechanism for horizontally moving at least one of the base 34 and the detachment device main body 110 shown in FIGS. 1(A) to 1(C) and 2(A) to 2(C), for example. be able to. In this case, the blade 120 is moved in the horizontal direction relative to the electronic component 10 by the moving mechanism, and the electronic component 10 can be scraped off from the adhesive sheet 21 by the blade 120.
  • the detachment device main body 200 has a fixed platen 210, as shown in FIGS. 5 to 7.
  • the fixed platen 210 supports a movable platen 220 that can be raised and lowered by a plurality of height adjustment units, such as a height adjustment shaft 230, so that the movable platen 220 can be raised and lowered.
  • Two fixed blocks 240 are supported on the movable platen 220.
  • the fixed end portion 120A of the blade 120 is mounted and fixed on the blade fixing portion (mounting portion) 140.
  • the blade fixing part 140 has two support shafts 142 protruding from both sides thereof, and FIG. 6 shows one support shaft 142.
  • the two fixed blocks 240 support the blade 120 via the blade fixing part 140 by supporting the two support shafts 142.
  • This embodiment has a tilt adjustment mechanism that adjusts the tilt of the blade 120 with respect to a plane parallel to the adhesive sheet 21.
  • the two support shafts 142 are rotatable on the two fixed blocks 240.
  • each of the two fixed blocks 240 is divided in half by a slit 242, and one support shaft 142 is inserted into each of the half-divided holes 243 communicating with the slit 242.
  • the inclination of the blade 120 is adjusted by rotating the two support shafts 142 within the halved hole 243.
  • the inclination of the blade 120 can be recognized by detecting the rotation of a detection shaft 252 coaxially with the support shaft 142 and rotating integrally with the potentiometer 250.
  • the tilt adjustment mechanism includes two fixed blocks 240 that receive two support shafts 142, a slit 2442 provided in each fixed block 240, a hole 243, and a screw or bolt 244.
  • the tilt adjustment mechanism can further include a potentiometer 250 and a detection shaft 252 if necessary.
  • one of the two fixed blocks 240 is movable up and down with respect to the movable platen 220 by a micrometer head 260.
  • the parallelism of the two fixed blocks 240 that is, the parallelism of the blade 120, can be adjusted.
  • Electrode forming device 10 Electronic components, 20... Transport jig, 21... Adhesive sheet, 30... Surface plate, 100... Detachment device, 110... Detachment device main body, 120... Blade (scraping member), 130... Vibrator , 140... Blade fixing part (mounting part), 142... Support shaft, 200... Detachment device main body, 210... Fixed plate, 220... Movable plate, 230... Height adjustment part, 240-252... Tilt adjustment mechanism, 240... Fixed Block, 242... Slit, 243... Hole, 244... Screw or bolt, 250... Potentiometer, 252... Detection shaft, 260... Micrometer head

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

An electronic component (10) detaching apparatus (100) comprises a blade (120) that comes into contact with at least one electronic component (10) adhered to an adhesive sheet (21) to scrape the at least one electronic component (10) from the adhesive sheet (21), and at least one vibration generator (130) that vibrates the blade (120).

Description

電子部品の離脱装置及び電子部品の製造装置Electronic component detachment device and electronic component manufacturing device
　本発明は、電子部品の離脱装置及び電子部品の製造装置等に関する。 The present invention relates to an electronic component detachment device, an electronic component manufacturing device, and the like.
　特許文献１は、帯状部材の粘着シートに粘着されて搬送される複数の電子部品の端部にペーストを塗布して、端部に外部電極が形成された電子部品を製造する製造装置を開示している。ペーストが塗布されて乾燥された電子部品を粘着シートから離脱させる離脱装置は、特許文献１の図１４に示すように、回転体の周面に例えばゴム板等のスクレーパーを備えた回転スクレーパーで構成することができる。電子部品は、回転スクレーパーにより粘着シートから掻き取られる。 Patent Document 1 discloses a manufacturing apparatus that applies a paste to the ends of a plurality of electronic components that are adhered to an adhesive sheet of a band-shaped member and transported, thereby manufacturing electronic components having external electrodes formed at the ends. ing. As shown in FIG. 14 of Patent Document 1, a detaching device for detaching electronic components coated with paste and dried from an adhesive sheet is composed of a rotating scraper equipped with a scraper such as a rubber plate on the circumferential surface of a rotating body. can do. The electronic components are scraped off the adhesive sheet by a rotating scraper.
ＷＯ２０２０／１４５３４８号公報WO2020/145348 publication
　回転スクレーパーに代えて、ブレードにより電子部品を粘着シートから掻き取ろうとすると、掻き取られた電子部品がブレードに塊として付着することがある。チップが付着したブレードで掻き取りを行うと、チップの引き摺りにより、粘着シートに傷が発生する。それにより粘着シートの寿命を短くしてしまう。 When attempting to scrape electronic components from an adhesive sheet with a blade instead of a rotary scraper, the scraped electronic components may adhere to the blade as a lump. If you scrape off the adhesive with a blade that has chips attached to it, the adhesive sheet will be scratched due to the dragging of the chips. This shortens the life of the adhesive sheet.
　本発明の目的は、粘着シートから電子部品を掻き取るブレードに、電子部品が付着することを防止する電子部品の離脱装置及び電子部品の製造装置を提供することにある。 An object of the present invention is to provide an electronic component removal device and an electronic component manufacturing device that prevent electronic components from adhering to a blade that scrapes electronic components from an adhesive sheet.
　（１）本発明の一態様は、
　粘着シートに粘着された少なくとも一つの電子部品に接触して、前記少なくとも一つの電子部品を前記粘着シートから掻き取るブレードと、
　前記ブレードを振動させる振動発生器と、
を有する電子部品の離脱装置に関する。 (1) One aspect of the present invention is
a blade that comes into contact with at least one electronic component adhered to an adhesive sheet and scrapes the at least one electronic component from the adhesive sheet;
a vibration generator that vibrates the blade;
The present invention relates to an electronic component detachment device having the following features.
　本発明の一態様によれば、電子部品は、ブレードによって粘着シートから掻き取られる。ブレードは、振動発生器により振動される。それにより、ブレードに電子部品が付着することはない。また、ブレードが振動することにより、ブレードと電子部品の接触機会が確保されまたは増大されて、電子部品を確実に掻き取ることが可能となる。加えて、ブレードを介して電子部品にも振動が付与されることでも、電子部品が粘着シートから剥がれ易くなり、電子部品を掻き取り易くすることができる。ここで、振動発生器はブレードを振動させるものであればよく、偏心重りを回転させて振動を発生する振動モーター、水晶振動子、圧電素子、または電磁コイルを利用して振動させるもの等を挙げることができる。 According to one aspect of the present invention, electronic components are scraped off from the adhesive sheet with a blade. The blade is vibrated by a vibration generator. This prevents electronic components from adhering to the blade. Furthermore, by vibrating the blade, the opportunity for contact between the blade and the electronic component is ensured or increased, making it possible to reliably scrape off the electronic component. In addition, by applying vibration to the electronic component via the blade, the electronic component can be easily peeled off from the adhesive sheet, making it easier to scrape off the electronic component. Here, the vibration generator may be anything that vibrates the blade, such as a vibration motor that generates vibration by rotating an eccentric weight, a crystal oscillator, a piezoelectric element, or one that uses an electromagnetic coil to vibrate. be able to.
　（２）本発明の一態様（１）では、前記ブレードは、固定端部と自由端部とを含み、前記自由端部に刃先が設けられ、前記少なくとも一つの振動発生器は、前記ブレードの前記自由端部を振動させることができる。ブレードの自由端部は固定端部よりも振動し易く、その自由端部に形成された刃先が振動しながら電子部品と接触して、電子部品を掻き取ることができる。 (2) In one aspect (1) of the present invention, the blade includes a fixed end portion and a free end portion, the free end portion is provided with a cutting edge, and the at least one vibration generator is arranged on the blade. The free end can be vibrated. The free end of the blade vibrates more easily than the fixed end, and the cutting edge formed at the free end comes into contact with the electronic component while vibrating, allowing the electronic component to be scraped off.
　（３）本発明の一態様（２）では、前記少なくとも一つの電子部品を前記粘着シートから掻き取る位置での非振動時の前記ブレードの前記自由端部と、前記粘着シートとの間には、隙間が設けられ、前記少なくとも一つの振動発生器は、前記隙間の寸法を変化させる方向に前記ブレードを振動させることができる。ブレードと粘着シートとの間に隙間が必要とされる場合、その隙間に微小な電子部品が入り込み、電子部品を掻き取ることができないことがある。ブレードを振動させて、隙間の寸法を変化させると、周期的に狭められる隙間に微小な電子部品が入り込むことがない。 (3) In the aspect (2) of the present invention, there is a gap between the free end of the blade when not vibrating at a position where the at least one electronic component is scraped off the adhesive sheet and the adhesive sheet. , a gap is provided, and the at least one vibration generator is capable of vibrating the blade in a direction that changes the size of the gap. If a gap is required between the blade and the adhesive sheet, a minute electronic component may enter the gap and the electronic component may not be able to be scraped off. By vibrating the blade and changing the dimensions of the gap, tiny electronic components will not get stuck in the periodically narrowed gap.
　（４）本発明の一態様（１）または（２）では、前記少なくとも一つの振動発生器は、前記ブレードに装着することができる。こうして、振動発生器によりブレードを直接振動させることができる。 (4) In one aspect (1) or (2) of the present invention, the at least one vibration generator can be attached to the blade. In this way, the blade can be directly vibrated by the vibration generator.
　（５）本発明の一態様（４）では、前記ブレードの前記自由端部は、前記粘着シートと対面する第１面と、前記第１面との反対側の第２面とを含み、前記少なくとも一つの振動発生器を前記第２面に装着することができる。こうすると、振動し易い自由端部に振動発生器を設けることで、振動発生器のパワーを小さくすることができる。また、粘着シートと対面する第１面に振動発生器が設けられないことから、振動発生器が粘着シートと干渉することもない。 (5) In one aspect (4) of the present invention, the free end portion of the blade includes a first surface facing the adhesive sheet and a second surface opposite to the first surface, and At least one vibration generator can be mounted on the second surface. In this case, the power of the vibration generator can be reduced by providing the vibration generator at the free end that is likely to vibrate. Further, since the vibration generator is not provided on the first surface facing the adhesive sheet, the vibration generator does not interfere with the adhesive sheet.
　（６）本発明の一態様（１）～（５）では、前記ブレードを搭載する搭載部と、前記粘着シート及び前記搭載部の少なくとも一方を相対的に移動させて、前記少なくとも一つの電子部品と前記ブレードとを接触させる移動機構と、をさらに有することができる。こうすると、移動機構によりブレードが電子部品に対して相対的に移動されて、ブレードにより電子部品を粘着シートから掻き取ることができる。 (6) In aspects (1) to (5) of the present invention, a mounting section on which the blade is mounted, and at least one of the adhesive sheet and the mounting section are moved relatively, and the at least one electronic component is mounted. The blade may further include a moving mechanism that brings the blade into contact with the blade. In this case, the blade is moved relative to the electronic component by the moving mechanism, and the electronic component can be scraped off from the adhesive sheet by the blade.
　（７）本発明の一態様（６）では、前記搭載部は、前記粘着シートと平行な面に対して前記ブレードの傾きを調整する傾き調整機構を含むことができる。傾き調整機構によりブレードの傾きを変更することで、ブレードが電子部品を押圧する方向が変更されて、チップ倒れによる粘着シートへの付着が減るため、チップの引き摺りが減り、電子部品を的確に掻き取るように調整される。 (7) In one aspect (6) of the present invention, the mounting section may include an inclination adjustment mechanism that adjusts the inclination of the blade with respect to a plane parallel to the adhesive sheet. By changing the inclination of the blade using the inclination adjustment mechanism, the direction in which the blade presses the electronic components is changed, reducing the adhesion of the chips to the adhesive sheet due to tipping, reducing the dragging of the chips, and allowing the electronic components to be accurately scraped. Adjusted to take.
　（８）本発明の一態様（１）～（６）では、前記少なくとも一つの電子部品は、前記粘着シートの幅方向に沿って粘着された複数の電子部品を含み、前記ブレードは、前記複数の電子部品と同時に接触する幅を有し、前記少なくとも一つの振動発生器は、前記粘着シートの前記幅方向に沿って設けられる複数の振動発生器を含むことができる。こうして、複数の電子部品を、複数の振動発生器により振動されるブレードによって同時に掻き取ることができる。 (8) In aspects (1) to (6) of the present invention, the at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet, and the blade The at least one vibration generator may include a plurality of vibration generators provided along the width direction of the adhesive sheet. In this way, multiple electronic components can be scraped simultaneously by blades vibrated by multiple vibration generators.
　（９）本発明の他の態様は、
　粘着シートに粘着された少なくとも一つの電子部品の端部に電極を形成する電極形成装置と、
　前記粘着シートから前記少なくとも一つの電子部品を離脱させる、（１）～（８）のいずれか記載の電子部品の離脱装置と、
を有する電子部品の製造装置を定義している。 (9) Other aspects of the present invention include:
an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet;
the electronic component detachment device according to any one of (1) to (8), which detaches the at least one electronic component from the adhesive sheet;
Defines electronic component manufacturing equipment that has
図１（Ａ）～図１（Ｃ）は、電子部品の製造方法の一工程である塗布工程を示す図である。FIGS. 1(A) to 1(C) are diagrams showing a coating process, which is one process of an electronic component manufacturing method. 図２（Ａ）～図２（Ｃ）は、塗布工程の後に実施される、余分なペーストを除去する工程を示す図である。FIGS. 2(A) to 2(C) are diagrams showing a process of removing excess paste, which is performed after the coating process. 粘着シートから電子部品を離脱させる装置の要部及び工程を示す図である。It is a figure which shows the principal part and process of the apparatus which detaches an electronic component from an adhesive sheet. ブレードに装着される複数の振動発生器を示す図である。FIG. 3 is a diagram showing a plurality of vibration generators attached to a blade. 離脱装置本体の概略斜視図である。FIG. 3 is a schematic perspective view of the detachment device main body. 一部が切断された離脱装置本体の正面図である。FIG. 3 is a partially cutaway front view of the detachment device main body. 離脱装置本体の側面図である。FIG. 3 is a side view of the detachment device main body.
　以下の開示において、提示された主題の異なる特徴を実施するための多くの異なる実施形態や実施例を提供する。もちろんこれらは単なる例であり、限定的であることを意図するものではない。さらに、本開示では、様々な例において参照番号および／または文字を反復している場合がある。このように反復するのは、簡潔明瞭にするためであり、それ自体が様々な実施形態および／または説明されている構成との間に関係があることを必要とするものではない。さらに、第１の要素が第２の要素に「接続されている」または「連結されている」と記述するとき、そのような記述は、第１の要素と第２の要素とが互いに直接的に接続または連結されている実施形態を含むとともに、第１の要素と第２の要素とが、その間に介在する１以上の他の要素を有して互いに間接的に接続または連結されている実施形態も含む。また、第１の要素が第２の要素に対して「移動する」と記述するとき、そのような記述は、第１の要素及び第２の要素の少なくとも一方が他方に対して移動する相対的な移動の実施形態を含む。 In the following disclosure, many different embodiments and examples are provided for implementing different features of the presented subject matter. Of course, these are just examples and are not intended to be limiting. Additionally, this disclosure may repeat reference numbers and/or characters in various instances. Such repetition is for brevity and clarity and does not itself require a relationship between the various embodiments and/or configurations described. Further, when a first element is described as being "connected" or "coupled" to a second element, such statements mean that the first element and the second element are directly connected to each other. and embodiments in which the first element and the second element are indirectly connected or connected to each other with one or more other elements interposed between them. Also includes form. Also, when it is described that a first element "moves" with respect to a second element, such a description means that at least one of the first element and the second element moves relative to the other. including embodiments of movement.
　１．電子部品の製造方法
　電子部品の製造方法は、治具に電子部品を保持して実施される塗布工程と、治具から電子部品を離脱する離脱工程とを含み、必要により、塗布工程後に実施される余分なペーストの除去工程を含むことができる。塗布工程またはペースト除去工程後にペーストが乾燥されて、電子部品が治具から離脱される。先ず、電子部品の塗布工程及び余分なペースト除去工程について概説する。 1. Method for manufacturing electronic components The method for manufacturing electronic components includes a coating process that is carried out by holding the electronic component in a jig, and a detachment process that removes the electronic component from the jig. The process may include a step of removing excess paste. After the application process or the paste removal process, the paste is dried and the electronic component is removed from the jig. First, the electronic component coating process and excess paste removal process will be outlined.
　図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）は、電子部品の製造方法として、電極形成装置１による例えばコンデンサー等の電子部品１０に外部電極を形成する方法の主たる工程を模式的に示している。電子部品１０は、搬送治具（キャリアプレートとも称する）２０に整列して保持されて搬送可能である。電子部品１０の塗布工程およびペースト除去工程に兼用することができる定盤３０は、例えばセラミック、御影石、金属等で形成される。定盤３０上にはスキージユニット４０が設けられる。スキージユニット４０は、定盤３０の表面（基準面ともいう）３１に沿って移動可能である。スキージユニット４０は、導電ペーストのディップ層５０を均一高さで敷き詰める例えば金属製のブレード４２と、定盤３０の表面３１から導電ペーストを掻き取る例えばゴム製のブレード４４とを、それぞれ独立して昇降可能に支持している。 1(A) to 1(C) and FIG. 2(A) to 2(C) show a method of manufacturing an electronic component in which external electrodes are formed on an electronic component 10, such as a capacitor, by an electrode forming apparatus 1. The main steps of the method are schematically shown. The electronic components 10 can be conveyed while being aligned and held on a conveyance jig (also referred to as a carrier plate) 20. The surface plate 30, which can be used for both the application process and the paste removal process of the electronic component 10, is formed of, for example, ceramic, granite, metal, or the like. A squeegee unit 40 is provided on the surface plate 30. The squeegee unit 40 is movable along the surface (also referred to as a reference surface) 31 of the surface plate 30. The squeegee unit 40 independently separates a blade 42 made of metal, for example, which spreads the dip layer 50 of conductive paste at a uniform height, and a blade 44, made of rubber, for example, which scrapes the conductive paste from the surface 31 of the surface plate 30. It is supported so that it can be raised and lowered.
　定盤３０の上方には、基盤３４に対して昇降可能な昇降盤３２が配置されている。搬送治具２０は、昇降盤３２に着脱自在に支持される。基盤３４には昇降モーター３６が支持され、昇降モーター３６により回転駆動されるねじ軸３８により昇降盤３２が昇降される。 An elevating plate 32 that can be raised and lowered relative to the base 34 is arranged above the surface plate 30. The conveying jig 20 is detachably supported by the elevating plate 32. An elevating motor 36 is supported on the base 34, and the elevating plate 32 is raised and lowered by a screw shaft 38 which is rotationally driven by the elevating motor 36.
　１．１．塗布工程
　図１（Ａ）～図１（Ｃ）は、導電ペーストの塗布工程を示している。図１（Ａ）では、所定高さに設定されたブレード４２をスキージユニット４０により水平移動させて、定盤３０上に導電ペーストによる一定高さのディップ層５０を形成する。図１（Ｂ）では、昇降盤３２により電子部品１０を下降させ、電子部品１０の端部を定盤３０上のディップ層５０に浸漬させる。それにより、電子部品１０の端部に導電ペースト層１４が形成される。 1.1. Coating process FIGS. 1(A) to 1(C) show the process of coating a conductive paste. In FIG. 1A, a blade 42 set at a predetermined height is horizontally moved by the squeegee unit 40 to form a dip layer 50 of a predetermined height made of conductive paste on the surface plate 30. In FIG. 1B, the electronic component 10 is lowered by the lifting plate 32, and the end of the electronic component 10 is immersed in the dip layer 50 on the surface plate 30. Thereby, a conductive paste layer 14 is formed at the end of the electronic component 10.
　１．２．ペースト除去工程
　図２（Ａ）～図２（Ｃ）は、ペースト除去工程（ブロット工程）を示している。図２（Ａ）は、定盤３０の表面３１と接触するように下降されたブレード４４をスキージユニット４０により水平移動させて、定盤３０上の導電ペーストを掻き取る工程を示している。図２（Ｂ）では、昇降盤３２により電子部品１０を下降させ、電子部品１０の端部に形成された導電ペースト層１４を定盤３０に接触させる。その後、昇降盤３２により電子部品１０は上昇される。それにより、電子部品１０の端部の余分なペーストが定盤３０に転写されて、平坦化された導電ペースト層１４Ａが形成される。なお、図２（Ａ）～図２（Ｃ）に示す従来のペースト除去工程に代えて、本出願人により提案された特許第６６３３８２９号（スライドブロット）、特許第６７８７６０５号（ヘリカルブロット）またはＰＣＴ／ＪＰ２０２０／０１０４４８等に記載されたペースト除去工程を用いると、導電ペースト層１４Ａの形状がさらに改善される。 1.2. Paste Removal Process FIGS. 2(A) to 2(C) show the paste removal process (blotting process). FIG. 2A shows a process of scraping off the conductive paste on the surface plate 30 by horizontally moving the blade 44 by the squeegee unit 40, which has been lowered so as to come into contact with the surface 31 of the surface plate 30. In FIG. 2B, the electronic component 10 is lowered by the lifting plate 32, and the conductive paste layer 14 formed at the end of the electronic component 10 is brought into contact with the surface plate 30. Thereafter, the electronic component 10 is lifted up by the lift plate 32. As a result, excess paste at the end of the electronic component 10 is transferred to the surface plate 30, and a flattened conductive paste layer 14A is formed. Note that instead of the conventional paste removal process shown in FIGS. 2(A) to 2(C), Patent No. 6633829 (slide blot), Patent No. 6787605 (helical blot) or PCT proposed by the present applicant may be used. When the paste removal process described in /JP2020/010448 and the like is used, the shape of the conductive paste layer 14A is further improved.
　２．第１実施形態
　次に、第１実施形態について説明する。第１実施形態に用いられる搬送治具２０から電子部品１０を離脱させる装置及び工程について、図３～図７を参照して説明する。本実施形態では、図３に示すように、搬送治具であるキャリアプレート２０の下面には粘着シート２１が設けられ、電子部品１０はその端部が粘着シート２１に粘着されて、垂下して保持される。本実施形態では、図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）に示す電極形成装置１と、図３に示す離脱装置１００とで、電子部品１０の製造装置が構成される。 2. First Embodiment Next, a first embodiment will be described. The apparatus and process for removing the electronic component 10 from the transport jig 20 used in the first embodiment will be described with reference to FIGS. 3 to 7. In this embodiment, as shown in FIG. 3, an adhesive sheet 21 is provided on the lower surface of a carrier plate 20, which is a transport jig, and the electronic component 10 is attached at its end to the adhesive sheet 21 and hangs down. Retained. In this embodiment, the electrode forming apparatus 1 shown in FIGS. 1(A) to 1(C) and FIGS. 2(A) to 2(C) and the detaching device 100 shown in FIG. Manufacturing equipment is configured.
　粘着シート２１から電子部品１０を離脱させる離脱装置１００は、図３に示す離脱装置本体１１０を有する。離脱装置本体１１０は、掻き取り部材であるブレード１２０と、少なくとも一つ例えば図３の紙面と直交する方向に配列された３つの振動発生器１３０（図４参照）とを有する。ブレード１２０は、粘着シート２１に粘着された少なくとも一つ、例えば図３の紙面と直交する方向（粘着シート２１の幅方向）に配列された複数の電子部品１０に接触して、複数の電子部品１０を粘着シート２１から同時に掻き取る。ブレード１２０の材質に特に制限はないが、本実施形態のブレード１２０は導電材例えばカーボンまたは炭素繊維強化プラスチック等で形成される。非導電性ブレードは、静電気により電子部品１０が付着するので好ましくない。もし電子部品１０が付着されたブレードで掻き取りすると、電子部品１０の引き摺りにより、粘着シート２１に傷が発生する。それにより、粘着シート２１の寿命を短くしてしまう。導電体で形成されるか、あるいは導電材によってメッキ等で被覆される導電性ブレード１２０は、接地されることにより静電気を逃がすことができる。ブレード１２０は、図３に示すように刃先１２１を有する。ブレード１２０の刃先１２１は、粘着シート２１とは非接触で、電子部品１０を粘着シート２１から掻き取ることが好ましい。このため、図３に示すように、粘着シート２１と平行な面と刃先１２１との間には、隙間δが設けられる。隙間δは、電子部品１０のサイズが小さくなるほど小さく設定される。電子部品１０が微小サイズである場合、隙間δは、設計値で１０μｍから数十μｍである。例えば、刃先１２１の厚みが５０μｍの場合、隙間δは、粘着シート２１から突出する方向での電子部品１０の寸法の３～１５％とすることができる。 A detaching device 100 for detaching the electronic component 10 from the adhesive sheet 21 has a detaching device main body 110 shown in FIG. 3. The detachment device main body 110 includes a blade 120 that is a scraping member, and at least one vibration generator 130 (see FIG. 4) arranged in a direction perpendicular to the paper plane of FIG. 3, for example. The blade 120 contacts at least one electronic component 10 adhered to the adhesive sheet 21, for example, a plurality of electronic components 10 arranged in a direction perpendicular to the paper surface of FIG. 10 from the adhesive sheet 21 at the same time. Although there is no particular restriction on the material of the blade 120, the blade 120 of this embodiment is made of a conductive material such as carbon or carbon fiber reinforced plastic. A non-conductive blade is not preferred because the electronic component 10 will stick to it due to static electricity. If the electronic component 10 is scraped off with a blade to which the electronic component 10 is attached, the adhesive sheet 21 will be scratched due to the electronic component 10 being dragged. This shortens the life of the adhesive sheet 21. The conductive blade 120, which is formed of a conductive material or coated with a conductive material by plating or the like, can dissipate static electricity by being grounded. The blade 120 has a cutting edge 121 as shown in FIG. It is preferable that the cutting edge 121 of the blade 120 scrape off the electronic component 10 from the adhesive sheet 21 without contacting the adhesive sheet 21 . Therefore, as shown in FIG. 3, a gap δ is provided between the surface parallel to the adhesive sheet 21 and the cutting edge 121. The gap δ is set smaller as the size of the electronic component 10 becomes smaller. When the electronic component 10 is minute in size, the designed gap δ is from 10 μm to several tens of μm. For example, when the thickness of the cutting edge 121 is 50 μm, the gap δ can be set to 3 to 15% of the dimension of the electronic component 10 in the direction of protrusion from the adhesive sheet 21.
　振動発生器１３０は、本実施形態では超小型で扁平タイプの振動モーターを用いているが、これに限定されず、ブレード１２０を振動させるものであれば良い。振動発生器１３０により振動されるブレード１２０の振幅は、粘着シート２１に刃先１２１が接触しないことを前提として、例えば２μｍ以上であることが好ましい。振動発生器１３０により振動されるブレード１２０の振動方向は、特に制限はないが、粘着シート２１とブレード１２０の刃先１２１との隙間δの大きさを周期的に変化させる方向であることが好ましい。隙間δに電子部品１０を入り込ませないためである。特に、安全率をみて設計値の隙間δを大きくしても、振動する刃先１２１により隙間δが周期的に小さくなるため、隙間δに電子部品１０を入り込むことがない。 The vibration generator 130 uses an ultra-compact, flat-type vibration motor in this embodiment, but is not limited to this, and may be any device that vibrates the blade 120. The amplitude of the blade 120 vibrated by the vibration generator 130 is preferably 2 μm or more, for example, on the premise that the cutting edge 121 does not come into contact with the adhesive sheet 21. The vibration direction of the blade 120 vibrated by the vibration generator 130 is not particularly limited, but is preferably a direction that periodically changes the size of the gap δ between the adhesive sheet 21 and the cutting edge 121 of the blade 120. This is to prevent the electronic component 10 from entering the gap δ. In particular, even if the design value of the gap δ is increased considering the safety factor, the electronic component 10 will not enter the gap δ because the vibrating cutting edge 121 periodically reduces the gap δ.
　本実施形態では、図３及び図４に示すように、振動発生器１３０はブレード１２０に直接装着されることが好ましい。ただし、振動発生器１３０からの振動を他の媒体を介してブレード１２０に伝達するものであってもよい。ここで、ブレード１２０は、図３に示すように、固定端部１２０Ａと自由端部１２０Ｂとを含む。固定端部１２０Ａが図示しないブレード固定部に固定され、自由端部１２０Ｂに刃先１２１が設けられる。ブレード１２０の自由端部１２０Ｂは、粘着シート２１と対面する第１面１２０Ｂ１と、第１面１２０Ｂ１との反対側の第２面１２０Ｂ２とを含む。なお、第１面１２０Ｂ１と第２面１２０Ｂ２との交差により楔状の刃先１２１を形成するために、例えば水平な第１面１２０Ｂ１に対して第２面１２０Ｂ２は傾斜している。本実施形態では、例えば３つの振動発生器１３０を第２面１２０Ｂ２に装着している。振動し易い自由端部１２０Ｂに振動発生器１３０を設けることで、振動発生器１３０のパワーを小さくすることができる。また、粘着シート２１と対面する第１面１２０Ｂ１に振動発生器１３０が設けられないことから、振動発生器１３０が粘着シート２１と干渉することもない。 In this embodiment, as shown in FIGS. 3 and 4, the vibration generator 130 is preferably attached directly to the blade 120. However, the vibration from the vibration generator 130 may be transmitted to the blade 120 via another medium. Here, the blade 120 includes a fixed end 120A and a free end 120B, as shown in FIG. The fixed end portion 120A is fixed to a blade fixing portion (not shown), and the free end portion 120B is provided with a cutting edge 121. The free end portion 120B of the blade 120 includes a first surface 120B1 facing the adhesive sheet 21 and a second surface 120B2 opposite to the first surface 120B1. In addition, in order to form the wedge-shaped cutting edge 121 by the intersection of the first surface 120B1 and the second surface 120B2, the second surface 120B2 is inclined with respect to the horizontal first surface 120B1, for example. In this embodiment, for example, three vibration generators 130 are mounted on the second surface 120B2. By providing the vibration generator 130 at the free end portion 120B that is likely to vibrate, the power of the vibration generator 130 can be reduced. Further, since the vibration generator 130 is not provided on the first surface 120B1 facing the adhesive sheet 21, the vibration generator 130 does not interfere with the adhesive sheet 21.
　振動発生器１３０は、振動数について特に制限はないが、好ましくはブレード１２０の固有振動数の逓倍でブレード１２０を振動させることができる。本実施形態のように複数の振動発生器１３０の位相合わせは煩雑であるので、例えばブレード１２０と振動発生器１３０との間に共鳴板（図示せず）を介在させると、共鳴振動数でブレード１２０を振動させることができる。 The vibration generator 130 is not particularly limited in frequency, but preferably can vibrate the blade 120 at a frequency multiplied by the natural frequency of the blade 120. Since phase alignment of the plurality of vibration generators 130 as in the present embodiment is complicated, for example, if a resonance plate (not shown) is interposed between the blade 120 and the vibration generator 130, the resonance frequency of the blade can be adjusted. 120 can be vibrated.
　離脱装置本体１１０は、振動発生器１３０が装着されたブレード１２０の固定端部１２０Ａ固定することにより、ブレード１２０を搭載する搭載部（図示せず）を有する。離脱装置１００は、粘着シート２１を保持する搬送治具２０及び搭載部の少なくとも一方を相対的に移動させて、電子部品１０とブレード１２０とを接触させる移動機構（図示省略）をさらに有することができる。移動機構は、例えば図１（Ａ）～図１（Ｃ）及び図２（Ａ）～図２（Ｃ）に示す基盤３４及び離脱装置本体１１０の少なくとも一方を、水平方向に移動する機構とすることができる。こうすると、移動機構によりブレード１２０が電子部品１０に対して相対的に水平方向に移動されて、ブレード１２０により電子部品１０を粘着シート２１から掻き取ることができる。 The detachment device main body 110 has a mounting part (not shown) on which the blade 120 is mounted by fixing the fixed end 120A of the blade 120 to which the vibration generator 130 is attached. The detachment device 100 may further include a moving mechanism (not shown) that relatively moves at least one of the carrier jig 20 holding the adhesive sheet 21 and the mounting section to bring the electronic component 10 and the blade 120 into contact. can. The moving mechanism is a mechanism for horizontally moving at least one of the base 34 and the detachment device main body 110 shown in FIGS. 1(A) to 1(C) and 2(A) to 2(C), for example. be able to. In this case, the blade 120 is moved in the horizontal direction relative to the electronic component 10 by the moving mechanism, and the electronic component 10 can be scraped off from the adhesive sheet 21 by the blade 120.
　３．第２実施形態
　離脱装置本体２００は、図５～図７に示すように、固定盤２１０を有する。固定盤２１０は、複数の高さ調整部例えば高さ調整シャフト２３０により昇降される可動盤２２０を、昇降可能に支持している。可動盤２２０には、２つの固定ブロック２４０が支持されている。一方、ブレード１２０は、その固定端部１２０Ａがブレード固定部（搭載部）１４０に搭載されて固定される。ブレード固定部１４０は、その両側面より突出する２つの支軸１４２を有し、図６には片側の支軸１４２が示されている。２つの固定ブロック２４０は、２つの支軸１４２を支持することにより、ブレード固定部１４０を介してブレード１２０を支持する。 3. Second Embodiment The detachment device main body 200 has a fixed platen 210, as shown in FIGS. 5 to 7. The fixed platen 210 supports a movable platen 220 that can be raised and lowered by a plurality of height adjustment units, such as a height adjustment shaft 230, so that the movable platen 220 can be raised and lowered. Two fixed blocks 240 are supported on the movable platen 220. On the other hand, the fixed end portion 120A of the blade 120 is mounted and fixed on the blade fixing portion (mounting portion) 140. The blade fixing part 140 has two support shafts 142 protruding from both sides thereof, and FIG. 6 shows one support shaft 142. The two fixed blocks 240 support the blade 120 via the blade fixing part 140 by supporting the two support shafts 142.
　本実施形態は、粘着シート２１と平行な面に対してブレード１２０の傾きを調整する傾き調整機構を有する。ブレード１２０の傾きを調整するために、２つの支軸１４２は、２つの固定ブロック２４０に自転可能とされる。そのために、２つの固定ブロック２４０の各々は、スリット２４２により半割され、スリット２４２と連通する半割された孔２４３に各一つの支軸１４２が挿通される。半割された孔２４３内で２つの支軸１４２を自転させることで、ブレード１２０の傾きが調整される。ブレード１２０の傾きは、支軸１４２と同軸で一体回転する検出軸２５２の回転を、ポテンショメータ２５０で検出することで認識可能となる。ポテンショメータを調整した後に、図５に示すねじまたはボルト２４４を締結してスリット２４２の隙間を狭める。それにより、スリット２４２と連通する半割された孔２４３内にて２つの支軸１４２が締め付けられて固定される。傾き調整機構は、２つの支軸１４２を受け入れる２つの固定ブロック２４０と、各固定ブロック２４０に設けられたスリット２４４２と、孔２４３と、ねじ又はボルト２４４で構成される。傾き調整機構は、必要によりポテンショメータ２５０及び検出軸２５２をさらに有することができる。 This embodiment has a tilt adjustment mechanism that adjusts the tilt of the blade 120 with respect to a plane parallel to the adhesive sheet 21. In order to adjust the inclination of the blade 120, the two support shafts 142 are rotatable on the two fixed blocks 240. For this purpose, each of the two fixed blocks 240 is divided in half by a slit 242, and one support shaft 142 is inserted into each of the half-divided holes 243 communicating with the slit 242. The inclination of the blade 120 is adjusted by rotating the two support shafts 142 within the halved hole 243. The inclination of the blade 120 can be recognized by detecting the rotation of a detection shaft 252 coaxially with the support shaft 142 and rotating integrally with the potentiometer 250. After adjusting the potentiometer, the screw or bolt 244 shown in FIG. 5 is tightened to narrow the gap between the slits 242. As a result, the two support shafts 142 are tightened and fixed within the half-split holes 243 that communicate with the slits 242. The tilt adjustment mechanism includes two fixed blocks 240 that receive two support shafts 142, a slit 2442 provided in each fixed block 240, a hole 243, and a screw or bolt 244. The tilt adjustment mechanism can further include a potentiometer 250 and a detection shaft 252 if necessary.
　本実施形態では、２つの固定ブロック２４０の一方は、可動盤２２０に対してマイクロメーターヘッド２６０により昇降可能とされる。それにより、２つの固定ブロック２４０の平行度、つまりはブレード１２０の平行度を調整することができる。 In this embodiment, one of the two fixed blocks 240 is movable up and down with respect to the movable platen 220 by a micrometer head 260. Thereby, the parallelism of the two fixed blocks 240, that is, the parallelism of the blade 120, can be adjusted.
　１…電極形成装置、１０電子部品、２０…搬送治具、２１…粘着シート、３０…定盤、１００…離脱装置、１１０…離脱装置本体、１２０…ブレード（掻き取り部材）、１３０…振動子、１４０…ブレード固定部（搭載部）、１４２…支軸、２００…離脱装置本体、２１０…固定盤、２２０…可動盤、２３０…高さ調整部、２４０～２５２…傾き調整機構、２４０…固定ブロック、２４２…スリット、２４３…孔、２４４…ねじ又はボルト、２５０…ポテンショメータ、２５２…検出軸、２６０…マイクロメーターヘッド DESCRIPTION OF SYMBOLS 1... Electrode forming device, 10 Electronic components, 20... Transport jig, 21... Adhesive sheet, 30... Surface plate, 100... Detachment device, 110... Detachment device main body, 120... Blade (scraping member), 130... Vibrator , 140... Blade fixing part (mounting part), 142... Support shaft, 200... Detachment device main body, 210... Fixed plate, 220... Movable plate, 230... Height adjustment part, 240-252... Tilt adjustment mechanism, 240... Fixed Block, 242... Slit, 243... Hole, 244... Screw or bolt, 250... Potentiometer, 252... Detection shaft, 260... Micrometer head

Claims (9)

  1. 　粘着シートに粘着された少なくとも一つの電子部品に接触して、前記少なくとも一つの電子部品を前記粘着シートから掻き取るブレードと、
    　前記ブレードを振動させる少なくとも一つの振動発生器と、
    を有する電子部品の離脱装置。     a blade that comes into contact with at least one electronic component adhered to an adhesive sheet and scrapes the at least one electronic component from the adhesive sheet;
    at least one vibration generator that vibrates the blade;
    An electronic component detachment device with
  2. 　請求項１において、
    　前記ブレードは、固定端部と自由端部とを含み、前記自由端部に刃先が設けられ、
    　前記少なくとも一つの振動発生器は、前記ブレードの前記自由端部を振動させる電子部品の離脱装置。     In claim 1,
    The blade includes a fixed end and a free end, and the free end is provided with a cutting edge,
    The at least one vibration generator is an electronic component detachment device that vibrates the free end of the blade.
  3. 　請求項２において、
    　前記少なくとも一つの電子部品を前記粘着シートから掻き取る位置での非振動時の前記ブレードの前記自由端部と、前記粘着シートとの間には、隙間が設けられ、
    　前記少なくとも一つの振動発生器は、前記隙間の寸法を変化させる方向に前記ブレードを振動させる電子部品の離脱装置。     In claim 2,
    A gap is provided between the free end of the blade when not vibrating at a position where the at least one electronic component is scraped from the adhesive sheet and the adhesive sheet,
    The at least one vibration generator is an electronic component detachment device that vibrates the blade in a direction that changes the size of the gap.
  4. 　請求項２において、
    　前記少なくとも一つの振動発生器は、前記ブレードに装着される電子部品の離脱装置。     In claim 2,
    The at least one vibration generator is a detachment device for electronic components mounted on the blade.
  5. 　請求項４において、
    　前記ブレードの前記自由端部は、前記粘着シートと対面する第１面と、前記第１面との反対側の第２面とを含み、
    　前記少なくとも一つの振動発生器は、前記第２面に装着される電子部品の離脱装置。     In claim 4,
    The free end of the blade includes a first surface facing the adhesive sheet and a second surface opposite to the first surface,
    The at least one vibration generator is a detaching device for electronic components mounted on the second surface.
  6. 　請求項４において、
    　前記ブレードを搭載する搭載部と、
    　前記粘着シート及び前記搭載部の少なくとも一方を相対的に移動させて、前記少なくとも一つの電子部品と前記ブレードとを接触させる移動機構と、
    をさらに有する電子部品の離脱装置。     In claim 4,
    a mounting section on which the blade is mounted;
    a moving mechanism that relatively moves at least one of the adhesive sheet and the mounting section to bring the at least one electronic component into contact with the blade;
    An electronic component detachment device further comprising:
  7. 　請求項６において、
    　前記搭載部は、前記粘着シートと平行な面に対して前記ブレードの傾きを調整する傾き調整機構を含む電子部品の離脱装置。     In claim 6,
    The mounting section is an electronic component removal device including an inclination adjustment mechanism that adjusts the inclination of the blade with respect to a plane parallel to the adhesive sheet.
  8. 　請求項１において、
    　前記少なくとも一つの電子部品は、前記粘着シートの幅方向に沿って粘着された複数の電子部品を含み、
    　前記ブレードは、前記複数の電子部品と同時に接触する幅を有し、
    　前記少なくとも一つの振動発生器は、前記粘着シートの前記幅方向に沿って設けられる複数の振動発生器を含む電子部品の離脱装置。     In claim 1,
    The at least one electronic component includes a plurality of electronic components adhered along the width direction of the adhesive sheet,
    The blade has a width that contacts the plurality of electronic components simultaneously,
    The at least one vibration generator is an electronic component detachment device including a plurality of vibration generators provided along the width direction of the adhesive sheet.
  9. 　粘着シートに粘着された少なくとも一つの電子部品の端部に電極を形成する電極形成装置と、
    　前記粘着シートから前記少なくとも一つの電子部品を離脱させる、請求項１乃至８のいずれか一項記載の電子部品の離脱装置と、
    を有する電子部品の製造装置。     an electrode forming device for forming an electrode on an end of at least one electronic component adhered to an adhesive sheet;
    The electronic component detachment device according to any one of claims 1 to 8, which detaches the at least one electronic component from the adhesive sheet;
    Electronic component manufacturing equipment with
PCT/JP2022/047642 2022-03-31 2022-12-23 Electronic component detaching apparatus and electronic component manufacturing apparatus WO2023188639A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2004193366A (en) * 2002-12-11 2004-07-08 Murata Mfg Co Ltd Holding jig of electronic part and method for handling electronic part
JP2011142273A (en) * 2010-01-08 2011-07-21 Shin Etsu Polymer Co Ltd Holding/removing jig and handling jig
JP2015015360A (en) * 2013-07-04 2015-01-22 デクセリアルズ株式会社 Method for producing heat conductive sheet, device for producing heat conductive sheet and method for cutting heat conductive sheet

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2004193366A (en) * 2002-12-11 2004-07-08 Murata Mfg Co Ltd Holding jig of electronic part and method for handling electronic part
JP2011142273A (en) * 2010-01-08 2011-07-21 Shin Etsu Polymer Co Ltd Holding/removing jig and handling jig
JP2015015360A (en) * 2013-07-04 2015-01-22 デクセリアルズ株式会社 Method for producing heat conductive sheet, device for producing heat conductive sheet and method for cutting heat conductive sheet

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