WO2022255451A1 - 液晶表示素子用シール剤及び液晶表示素子 - Google Patents
液晶表示素子用シール剤及び液晶表示素子 Download PDFInfo
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- WO2022255451A1 WO2022255451A1 PCT/JP2022/022492 JP2022022492W WO2022255451A1 WO 2022255451 A1 WO2022255451 A1 WO 2022255451A1 JP 2022022492 W JP2022022492 W JP 2022022492W WO 2022255451 A1 WO2022255451 A1 WO 2022255451A1
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- liquid crystal
- meth
- crystal display
- acrylate
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 144
- 239000000565 sealant Substances 0.000 title claims abstract description 65
- 150000001875 compounds Chemical class 0.000 claims abstract description 149
- 239000004593 Epoxy Substances 0.000 claims abstract description 141
- -1 amine compound Chemical class 0.000 claims abstract description 62
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 49
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 125000003277 amino group Chemical group 0.000 claims abstract description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 13
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 18
- 239000007787 solid Substances 0.000 claims description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- XEVRDFDBXJMZFG-UHFFFAOYSA-N carbonyl dihydrazine Chemical compound NNC(=O)NN XEVRDFDBXJMZFG-UHFFFAOYSA-N 0.000 claims description 10
- 150000001412 amines Chemical class 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 238000011109 contamination Methods 0.000 abstract description 23
- 238000003860 storage Methods 0.000 abstract description 20
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 109
- 238000007789 sealing Methods 0.000 description 35
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 28
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 19
- 239000000126 substance Substances 0.000 description 19
- 239000010936 titanium Substances 0.000 description 19
- 229910052719 titanium Inorganic materials 0.000 description 19
- 230000015572 biosynthetic process Effects 0.000 description 18
- 239000000758 substrate Substances 0.000 description 18
- 238000003786 synthesis reaction Methods 0.000 description 18
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 16
- 229920003986 novolac Polymers 0.000 description 15
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 14
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 13
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 13
- 239000003999 initiator Substances 0.000 description 13
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 12
- 239000010419 fine particle Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 10
- 238000005160 1H NMR spectroscopy Methods 0.000 description 10
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 10
- 150000002148 esters Chemical class 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 9
- 238000001723 curing Methods 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 8
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- 150000002009 diols Chemical class 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 238000005227 gel permeation chromatography Methods 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- 239000007870 radical polymerization initiator Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- OUMVQDFNHGJHOM-UHFFFAOYSA-N 2-[[4-[4-(oxiran-2-ylmethoxy)phenoxy]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1OC(C=C1)=CC=C1OCC1CO1 OUMVQDFNHGJHOM-UHFFFAOYSA-N 0.000 description 5
- 229930185605 Bisphenol Natural products 0.000 description 5
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 239000010408 film Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 5
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 235000002597 Solanum melongena Nutrition 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 239000011164 primary particle Substances 0.000 description 4
- 238000010992 reflux Methods 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 3
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000002542 deteriorative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine hydrate Chemical compound O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 229920000233 poly(alkylene oxides) Polymers 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- CYXLGABBVLIUJZ-UHFFFAOYSA-N 2-(2-hydroxypropoxycarbonyl)benzoic acid Chemical compound CC(O)COC(=O)C1=CC=CC=C1C(O)=O CYXLGABBVLIUJZ-UHFFFAOYSA-N 0.000 description 1
- PUBNJSZGANKUGX-UHFFFAOYSA-N 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=C(C)C=C1 PUBNJSZGANKUGX-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- RUVNKAUVVBCURD-UHFFFAOYSA-N 2-[[4-[2-[4-(oxiran-2-ylmethoxy)-3-prop-2-enylphenyl]propan-2-yl]-2-prop-2-enylphenoxy]methyl]oxirane Chemical compound C=1C=C(OCC2OC2)C(CC=C)=CC=1C(C)(C)C(C=C1CC=C)=CC=C1OCC1CO1 RUVNKAUVVBCURD-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-ISLYRVAYSA-N V-65 Substances CC(C)CC(C)(C#N)\N=N\C(C)(C#N)CC(C)C WYGWHHGCAGTUCH-ISLYRVAYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- LOCXTTRLSIDGPS-FVDSYPCUSA-N [(z)-[1-oxo-1-(4-phenylsulfanylphenyl)octan-2-ylidene]amino] benzoate Chemical compound C=1C=C(SC=2C=CC=CC=2)C=CC=1C(=O)C(/CCCCCC)=N\OC(=O)C1=CC=CC=C1 LOCXTTRLSIDGPS-FVDSYPCUSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical class [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 239000012933 diacyl peroxide Substances 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- XVKKIGYVKWTOKG-UHFFFAOYSA-N diphenylphosphoryl(phenyl)methanone Chemical compound C=1C=CC=CC=1P(=O)(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 XVKKIGYVKWTOKG-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- SWRGUMCEJHQWEE-UHFFFAOYSA-N ethanedihydrazide Chemical compound NNC(=O)C(=O)NN SWRGUMCEJHQWEE-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 229910003472 fullerene Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000000717 hydrazino group Chemical group [H]N([*])N([H])[H] 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 125000005634 peroxydicarbonate group Chemical group 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229910021647 smectite Inorganic materials 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- RYYWUUFWQRZTIU-UHFFFAOYSA-K thiophosphate Chemical compound [O-]P([O-])([O-])=S RYYWUUFWQRZTIU-UHFFFAOYSA-K 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
- C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
Definitions
- the present invention relates to a sealant for liquid crystal display elements which is excellent in storage stability, adhesiveness, and low liquid crystal contamination.
- the present invention also relates to a liquid crystal display element using the sealant for a liquid crystal display element.
- a method for manufacturing a liquid crystal display element such as a liquid crystal display cell
- dropping using a sealing agent as disclosed in Patent Documents 1 and 2 A liquid crystal dropping method called construction method is used.
- the dropping method first, a frame-shaped seal pattern is formed on one of the two electrode-attached substrates by dispensing.
- liquid crystal microdroplets are dropped into the frame of the seal pattern while the sealant is not yet cured, and the other substrate is superimposed under vacuum, and the sealant is cured to fabricate a liquid crystal display element.
- this dripping method is the mainstream method for manufacturing liquid crystal display elements.
- narrowing the frame of the liquid crystal display part is mentioned, and for example, the position of the seal part is arranged under the black matrix (hereinafter also referred to as narrow frame design).
- the sealant In the narrow frame design, the sealant is placed directly under the black matrix. The curing of the sealant is insufficient. Insufficient curing of the sealant causes the problem that the uncured sealant components are easily eluted into the liquid crystal to cause liquid crystal contamination. In particular, in recent years, as the polarity of liquid crystals has become higher, contamination of liquid crystals may occur even when using sealing agents that had no problems in the past.
- thermosetting agent is added to the sealant.
- the sealant is also placed on the alignment film, so there is a demand for a sealant for liquid crystal display elements that is excellent in adhesion not only to the substrate but also to the alignment film.
- the resulting sealant may have poor storage stability or cause liquid crystal contamination. was there.
- the present disclosure 1 is a sealant for liquid crystal display elements containing a curable resin and a thermosetting agent, wherein the thermosetting agent is an adduct of an amine compound having an amino group equivalent of 30 or less and an epoxy compound. It is a sealant for liquid crystal display elements containing.
- Present Disclosure 2 is the sealant for a liquid crystal display element according to Present Disclosure 1, wherein the amine-based compound having an amino group equivalent of 30 or less is at least one of hydrazine and carbohydrazide.
- Present Disclosure 3 is the sealant for a liquid crystal display element according to Present Disclosure 1 or 2, wherein the adduct of the amine-based compound having an amino group equivalent of 30 or less and the epoxy compound is solid at 25°C.
- Present Disclosure 4 is the sealant for a liquid crystal display element according to Present Disclosure 1, 2 or 3, wherein the epoxy compound is an epoxy compound having a structure derived from a compound having a phenolic hydroxyl group.
- 5 of the present disclosure is a liquid crystal display device having a cured product of the sealant for a liquid crystal display device of 1, 2, 3 or 4 of the present disclosure. The present invention will be described in detail below.
- the present inventors have studied the use of an amine adduct of an epoxy compound as a thermosetting agent to improve the storage stability and low liquid crystal contamination resistance of a sealant for liquid crystal display elements.
- the obtained sealant for liquid crystal display elements sometimes has poor adhesiveness (in particular, adhesiveness to the alignment film). Therefore, as a result of intensive studies, the present inventors have found that by using an adduct of an amine compound having an amino group equivalent of 30 or less and an epoxy compound as a heat curing agent, storage stability, adhesion, and low liquid crystal staining resistance can be achieved.
- the inventors have found that it is possible to obtain a sealing compound for liquid crystal display elements which is excellent in all of the above, and have completed the present invention.
- the sealant for liquid crystal display elements of the present invention contains a thermosetting agent.
- the thermosetting agent includes an adduct of an amine compound having an amino group equivalent of 30 or less and an epoxy compound (hereinafter also referred to as "adduct according to the present invention").
- adduct according to the present invention an epoxy compound
- the sealant for liquid crystal display elements of the present invention is excellent in all of storage stability, adhesiveness, and low liquid crystal contamination.
- the above-mentioned "amine-based compound” means a compound having an amino group such as an amine compound, a hydrazino compound, a hydrazide compound, and the like.
- amino group equivalent means a value calculated by (molecular weight of amine-based compound) / (number of amino groups in one molecule of amine-based compound), and the above-mentioned "number of amino groups” constitutes an amino group. It means the number of nitrogen atoms. For example, one hydrazino group ( -NHNH2 group) is calculated assuming that the number of amino groups is two.
- the adduct according to the present invention has a structure derived from an amine compound having an amino group equivalent of 30 or less and a structure derived from an epoxy compound.
- the preferred lower limit of the amino group equivalent weight of the amine compound having an amino group equivalent weight of 30 or less, from which the adduct of the present invention is derived, is 15, and the preferred upper limit thereof is 25.
- the amino group equivalent of the amine-based compound having an amino group equivalent of 30 or less is within this range, the resulting sealing agent for liquid crystal display elements is excellent in all of storage stability, adhesion, and low liquid crystal contamination. It becomes excellent by the effect to be made.
- a more preferable lower limit of the amino group equivalent weight of the amine-based compound having an amino group equivalent weight of 30 or less is 16, and a more preferable upper limit thereof is 23.
- amine compound having an amino group equivalent weight of 30 or less examples include hydrazine, carbodihydrazide, oxalyldihydrazide, and the like.
- hydrazine and carbohydrazide is used because it is excellent in the effect of making the resulting sealing agent for liquid crystal display elements excellent in all of storage stability, adhesiveness, and low liquid crystal contamination.
- hydrazine and carbohydrazide is used because it is excellent in the effect of making the resulting sealing agent for liquid crystal display elements excellent in all of storage stability, adhesiveness, and low liquid crystal contamination.
- Epoxy compounds derived from adducts according to the present invention include, for example, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol E type epoxy compounds, bisphenol S type epoxy compounds, and 2,2'-diallylbisphenol A type. Epoxy compounds, hydrogenated bisphenol type epoxy compounds, propylene oxide added bisphenol A type epoxy compounds, resorcinol type epoxy compounds, biphenyl type epoxy compounds, sulfide type epoxy compounds, diphenyl ether type epoxy compounds, dicyclopentadiene type epoxy compounds, naphthalene type epoxy compounds , phenol novolak type epoxy compound, ortho-cresol novolak type epoxy compound, dicyclopentadiene novolak type epoxy compound, biphenyl novolak type epoxy compound, naphthalenephenol novolak type epoxy compound, glycidylamine type epoxy compound, alkyl polyol type epoxy compound, rubber modified type Examples include epoxy compounds and glycidyl ester compounds.
- an epoxy compound having a structure derived from a compound having a phenolic hydroxyl group is preferred.
- the epoxy compound having a structure derived from a compound having a phenolic hydroxyl group a bisphenol A-type epoxy compound, a bisphenol F-type epoxy compound, and a diphenyl ether-type epoxy compound are more preferable, and a diphenyl ether-type epoxy compound is even more preferable.
- the bisphenol A type epoxy compound include bisphenol A diglycidyl ether.
- the bisphenol F type epoxy compound include bisphenol F diglycidyl ether and bisphenol F type epoxy polymer.
- the diphenyl ether type epoxy compound include bis(4-glycidyloxyphenyl) ether and the like.
- the adduct according to the present invention preferably has a weight average molecular weight of 200 as a lower limit and 3,000 as an upper limit.
- the mass-average molecular weight of the adduct according to the present invention is 200 or more, the resulting sealing compound for liquid crystal display elements is excellent in low liquid crystal contamination.
- the mass-average molecular weight of the adduct according to the present invention is 3000 or less, the obtained sealing agent for liquid crystal display elements is superior in handleability.
- a more preferable lower limit of the mass-average molecular weight of the adduct according to the present invention is 300, and a more preferable upper limit thereof is 1,500.
- the said mass average molecular weight is a value which performs measurement using a tetrahydrofuran as a solvent by a gel permeation chromatography (GPC), and is calculated
- GPC gel permeation chromatography
- Examples of a column for measuring the weight average molecular weight by GPC in terms of polystyrene include Shodex LF-804 (manufactured by Showa Denko KK).
- the adduct according to the present invention is preferably solid at 25°C.
- a preferred lower limit of the melting point of the adduct according to the present invention is 60°C, and a more preferred lower limit is 90°C.
- the upper limit of the melting point of the adduct according to the present invention is preferably 180°C, more preferably 150°C.
- the melting point can be determined by differential scanning calorimetry or a commercially available melting point measuring instrument.
- a preferable lower limit of the content of the adduct according to the present invention to 100 parts by mass of the curable resin described later is 3 parts by mass, and a preferable upper limit is 70 parts by mass.
- the obtained sealing agent for liquid crystal display elements has excellent adhesiveness.
- the obtained sealing compound for liquid crystal display elements is excellent in low liquid crystal contamination and storage stability.
- a more preferable lower limit of the content of the adduct according to the present invention to 100 parts by mass of the curable resin is 6 parts by mass, and a more preferable upper limit is 35 parts by mass.
- the preferable lower limit of the content of the adduct according to the present invention with respect to 1 equivalent of the epoxy compound is 0.5 equivalents, and the preferable upper limit thereof is 2.0 equivalents.
- the content of the adduct according to the present invention relative to 1 equivalent of the epoxy compound is 0.5 equivalent or more, the obtained sealing agent for liquid crystal display elements is excellent in curability and adhesiveness.
- the obtained sealing agent for liquid crystal display elements is excellent in storage stability and low liquid crystal contamination resistance.
- a more preferable lower limit of the content of the adduct according to the present invention with respect to 1 equivalent of the epoxy compound is 0.8 equivalents, and a more preferable upper limit thereof is 1.2 equivalents.
- the sealant for liquid crystal display elements of the present invention contains a curable resin.
- the curable resin preferably contains an epoxy compound.
- the epoxy compounds include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol E type epoxy compounds, bisphenol S type epoxy compounds, 2,2′-diallylbisphenol A type epoxy compounds, and hydrogenated bisphenol type epoxy compounds.
- propylene oxide-added bisphenol A type epoxy compound propylene oxide-added bisphenol A type epoxy compound, resorcinol type epoxy compound, biphenyl type epoxy compound, sulfide type epoxy compound, diphenyl ether type epoxy compound, dicyclopentadiene type epoxy compound, naphthalene type epoxy compound, phenol novolac type epoxy compound, ortho-cresol Novolak-type epoxy compounds, dicyclopentadiene novolak-type epoxy compounds, biphenyl novolac-type epoxy compounds, naphthalenephenol novolak-type epoxy compounds, glycidylamine-type epoxy compounds, alkylpolyol-type epoxy compounds, rubber-modified epoxy compounds, glycidyl ester compounds, and the like. be done.
- bisphenol A type epoxy compounds include, for example, jER828EL, jER1004 (all manufactured by Mitsubishi Chemical Corporation), EPICLON850 (manufactured by DIC Corporation), and the like.
- bisphenol F-type epoxy compounds include, for example, jER806 and jER4004 (both manufactured by Mitsubishi Chemical Corporation) and EPICLON EXA-830CRP (manufactured by DIC Corporation).
- Examples of commercially available bisphenol E type epoxy compounds include Epomic R710 (manufactured by Mitsui Chemicals, Inc.).
- Examples of commercially available bisphenol S-type epoxy compounds include EPICLON EXA-1514 (manufactured by DIC Corporation).
- Examples of commercially available 2,2'-diallylbisphenol A type epoxy compounds include RE-810NM (manufactured by Nippon Kayaku Co., Ltd.).
- Commercially available hydrogenated bisphenol epoxy compounds include, for example, EPICLON EXA-7015 (manufactured by DIC).
- Examples of commercially available propylene oxide-added bisphenol A type epoxy compounds include EP-4000S (manufactured by ADEKA).
- Commercially available resorcinol-type epoxy compounds include, for example, EX-201 (manufactured by Nagase ChemteX Corporation).
- Commercially available biphenyl-type epoxy compounds include, for example, jER YX-4000H (manufactured by Mitsubishi Chemical Corporation).
- Examples of commercially available sulfide-type epoxy compounds include YSLV-50TE (manufactured by Nippon Steel Chemical & Materials Co., Ltd.). Examples of commercially available diphenyl ether type epoxy compounds include YSLV-80DE (manufactured by Nippon Steel Chemical & Materials Co., Ltd.). Examples of commercially available dicyclopentadiene type epoxy compounds include EP-4088S (manufactured by ADEKA). Examples of commercially available naphthalene-type epoxy compounds include EPICLON HP-4032 and EPICLON EXA-4700 (both manufactured by DIC Corporation). Examples of commercially available phenolic novolac type epoxy compounds include EPICLON N-770 (manufactured by DIC Corporation).
- Examples of commercially available ortho-cresol novolac type epoxy compounds include EPICLON N-670-EXP-S (manufactured by DIC Corporation).
- Examples of commercially available dicyclopentadiene novolac type epoxy compounds include EPICLON HP-7200 (manufactured by DIC Corporation).
- Commercially available biphenyl novolac type epoxy compounds include, for example, NC-3000P (manufactured by Nippon Kayaku Co., Ltd.).
- Examples of commercially available naphthalenephenol novolac type epoxy compounds include ESN-165S (manufactured by Nippon Steel Chemical & Materials Co., Ltd.).
- Examples of commercially available glycidylamine type epoxy compounds include jER630 (manufactured by Mitsubishi Chemical Corporation), EPICLON430 (manufactured by DIC Corporation), TETRAD-X (manufactured by Mitsubishi Gas Chemical Co., Ltd.), and the like.
- Examples of commercially available alkyl polyol type epoxy compounds include ZX-1542 (manufactured by Nippon Steel Chemical & Materials), EPICLON726 (manufactured by DIC), Epolite 80MFA (manufactured by Kyoeisha Chemical Co., Ltd.), Denacol EX- 611 (manufactured by Nagase ChemteX Corporation) and the like.
- Examples of commercially available rubber-modified epoxy compounds include YR-450 and YR-207 (both manufactured by Nippon Steel Chemical & Materials) and Epolead PB (manufactured by Daicel).
- Examples of commercially available glycidyl ester compounds include Denacol EX-147 (manufactured by Nagase ChemteX Corporation).
- Other commercially available epoxy compounds include YDC-1312, YSLV-80XY, YSLV-90CR (all manufactured by Nippon Steel Chemical & Materials), XAC4151 (manufactured by Asahi Kasei), jER1031, and jER1032. (all manufactured by Mitsubishi Chemical), EXA-7120 (manufactured by DIC), TEPIC (manufactured by Nissan Chemical) and the like.
- Partially (meth)acryl-modified epoxy compounds are also suitably used as the epoxy compound.
- the partially (meth)acrylic-modified epoxy compound is obtained by reacting a partial epoxy group of an epoxy compound having two or more epoxy groups with (meth)acrylic acid. It means a compound having one or more epoxy groups and one or more (meth)acryloyl groups in the molecule.
- the above-mentioned "(meth)acryl” means acryl or methacryl
- the above-mentioned "(meth)acryloyl” means acryloyl or methacryloyl.
- Examples of commercially available partially (meth)acrylic-modified epoxy compounds include UVACURE 1561, KRM8030, and KRM8287 (all manufactured by Daicel Allnex).
- the curable resin may contain a (meth)acrylic compound.
- the (meth)acrylic compound include (meth)acrylic acid ester compounds, epoxy (meth)acrylates, and urethane (meth)acrylates. Among them, epoxy (meth)acrylate is preferred.
- the (meth)acrylic compound preferably has two or more (meth)acryloyl groups in one molecule from the viewpoint of reactivity.
- the said "(meth)acrylic compound” means the compound which has a (meth)acryloyl group.
- the above “(meth)acrylate” means acrylate or methacrylate
- the above "epoxy(meth)acrylate” is a compound obtained by reacting all epoxy groups in an epoxy compound with (meth)acrylic acid. represents
- monofunctional ones include, for example, methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate.
- t-butyl (meth)acrylate 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, iso myristyl (meth) acrylate, stearyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, cyclohexyl ( meth)acrylate, isobornyl (meth)acrylate, bicyclopentenyl (meth)acrylate, benzyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate,
- bifunctional ones include, for example, 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexane Diol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate (Meth) acrylate, polyethylene glycol di (meth) acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) ) acrylate, polypropylene glycol di(meth)acrylate, neopen
- trifunctional or higher ones include, for example, trimethylolpropane tri(meth)acrylate, ethylene oxide-added trimethylolpropane tri(meth)acrylate, propylene oxide-added trimethylolpropane tri( meth)acrylate, caprolactone-modified trimethylolpropane tri(meth)acrylate, ethylene oxide-added isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, propylene oxide-added glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol penta(meth)acryl
- Examples of the epoxy (meth)acrylate include those obtained by reacting an epoxy compound and (meth)acrylic acid in the presence of a basic catalyst according to a conventional method.
- the same epoxy compound as the curable resin contained in the sealing agent for liquid crystal display elements of the present invention can be used.
- epoxy (meth)acrylates include, for example, epoxy (meth)acrylate manufactured by Daicel Allnex, epoxy (meth)acrylate manufactured by Shin-Nakamura Chemical Industry, epoxy (meth)acrylate manufactured by Kyoeisha Chemical Co., Ltd. ( meth) acrylate, epoxy (meth) acrylate manufactured by Nagase ChemteX Corporation, and the like.
- Epoxy Ester M-600A Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA and the like.
- Examples of epoxy (meth)acrylates manufactured by Nagase ChemteX Co., Ltd. include Denacol acrylate DA-141, Denacol acrylate DA-314, Denacol acrylate DA-911, and the like.
- the urethane (meth)acrylate can be obtained, for example, by reacting an isocyanate compound with a (meth)acrylic acid derivative having a hydroxyl group in the presence of a catalytic amount of a tin compound.
- MDI diphenylmethane-4,4
- the isocyanate compound that is a raw material for the urethane (meth)acrylate a chain-extended isocyanate compound obtained by reacting a polyol with an excessive amount of an isocyanate compound can also be used.
- the polyol include ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, polycaprolactone diol and the like.
- Examples of the (meth)acrylic acid derivative having a hydroxyl group include hydroxyalkyl mono(meth)acrylates, dihydric alcohol mono(meth)acrylates, trihydric alcohol mono(meth)acrylates and di(meth)acrylates. , epoxy (meth)acrylate, and the like.
- Examples of the hydroxyalkyl mono(meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate and the like. mentioned.
- Examples of the dihydric alcohol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol.
- Examples of the trihydric alcohol include trimethylolethane, trimethylolpropane, glycerin and the like.
- Examples of the epoxy (meth)acrylate include bisphenol A type epoxy (meth)acrylate.
- urethane (meth) acrylates examples include urethane (meth) acrylate manufactured by Toagosei Co., Ltd., urethane (meth) acrylate manufactured by Daicel Allnex, and urethane (meth) acrylate manufactured by Negami Kogyo Co., Ltd. acrylate, urethane (meth)acrylate manufactured by Shin-Nakamura Chemical Co., Ltd., urethane (meth)acrylate manufactured by Kyoeisha Chemical Co., Ltd., and the like.
- Examples of the urethane (meth)acrylates manufactured by Toagosei Co., Ltd. examples include M-1100, M-1200, M-1210 and M-1600.
- urethane (meth)acrylate manufactured by Kyoeisha Chemical Co., Ltd. include AH-600, AI-600, AT-600, UA-101I, UA-101T, UA-306H, UA-306I, and UA-306T. be done.
- the epoxy group in the curable resin and the (meth) is 30 mol % or more and 95 mol % or less.
- the resulting sealant for liquid crystal display elements has excellent adhesion while suppressing the occurrence of liquid crystal contamination.
- the curable resin preferably has a hydrogen-bonding unit such as —OH group, —NH— group, or —NH 2 group.
- the sealant for liquid crystal display elements of the present invention preferably contains a radical photopolymerization initiator.
- the radical photopolymerization initiator include benzophenone compounds, acetophenone compounds, acylphosphine oxide compounds, titanocene compounds, oxime ester compounds, benzoin ether compounds, and thioxanthone compounds.
- photoradical polymerization initiator examples include 1-hydroxycyclohexylphenyl ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino )-2-((4-methylphenyl)methyl)-1-(4-(4-morpholinyl)phenyl)-1-butanone, 2,2-dimethoxy-1,2-diphenylethan-1-one, bis( 2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one, 1-(4-(2-hydroxyethoxy)-phenyl) -2-hydroxy-2-methyl-1-propan-1-one, 1-(4-(phenylthio)phenyl)-1,2-octanedione 2-(O-benzoyloxime), 2,4,6-trimethyl and benzoyldiphenylphosphine
- the content of the radical photopolymerization initiator has a preferable lower limit of 0.5 parts by mass and a preferable upper limit of 10 parts by mass with respect to 100 parts by mass of the curable resin.
- the content of the radical photopolymerization initiator is within this range, the resulting sealing compound for liquid crystal display elements is excellent in storage stability and photocurability while suppressing liquid crystal contamination.
- a more preferable lower limit to the content of the radical photopolymerization initiator is 1 part by mass, and a more preferable upper limit is 7 parts by mass.
- the sealing compound for liquid crystal display elements of the present invention may contain a thermal radical polymerization initiator.
- the thermal radical polymerization initiator include those composed of azo compounds, organic peroxides, and the like. Among them, from the viewpoint of suppressing liquid crystal contamination, an initiator composed of an azo compound (hereinafter also referred to as an "azo initiator”) is preferable, and an initiator composed of a polymer azo compound (hereinafter referred to as a "polymer azo initiator”) is preferable. Also referred to as "initiator”) is more preferred.
- the thermal radical polymerization initiators may be used alone, or two or more of them may be used in combination.
- polymeric azo compound means a compound having an azo group, a number average molecular weight of 300 or more, which generates a radical capable of reacting with a (meth)acryloyl group by heat. do.
- a preferable lower limit of the number average molecular weight of the above high-molecular azo compound is 1,000, and a preferable upper limit thereof is 300,000.
- the lower limit of the number average molecular weight of the high-molecular azo compound is more preferably 5,000, the upper limit is 100,000, the lower limit is still more preferably 10,000, and the upper limit is still more preferably 90,000.
- the said number average molecular weight is a value which measures by gel permeation chromatography (GPC) using tetrahydrofuran as a solvent, and is calculated
- GPC gel permeation chromatography
- Examples of a column for measuring the number average molecular weight by GPC in terms of polystyrene include Shodex LF-804 (manufactured by Showa Denko KK).
- Examples of the polymer azo compound include those having a structure in which a plurality of units such as polyalkylene oxide and polydimethylsiloxane are bonded via an azo group.
- the polymer azo compound having a structure in which a plurality of units such as polyalkylene oxide are bonded via the azo group one having a polyethylene oxide structure is preferable.
- Specific examples of the high-molecular azo compound include polycondensates of 4,4′-azobis(4-cyanopentanoic acid) and polyalkylene glycol, and 4,4′-azobis(4-cyanopentanoic acid). and a polycondensate of polydimethylsiloxane having a terminal amino group.
- polymeric azo initiators include, for example, VPE-0201, VPE-0401, VPE-0601, VPS-0501, VPS-1001 (all manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) and the like. mentioned.
- non-polymeric azo initiators include V-65 and V-501 (both manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.).
- organic peroxides examples include ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, peroxyesters, diacyl peroxides and peroxydicarbonates.
- the content of the thermal radical polymerization initiator has a preferable lower limit of 0.1 parts by mass and a preferable upper limit of 10 parts by mass with respect to 100 parts by mass of the curable resin.
- the content of the thermal radical polymerization initiator is within this range, the obtained sealing compound for liquid crystal display elements is excellent in storage stability and thermosetting property while suppressing liquid crystal contamination.
- a more preferable lower limit to the content of the thermal radical polymerization initiator is 0.3 parts by mass, and a more preferable upper limit is 5 parts by mass.
- the sealant for liquid crystal display elements of the present invention may contain a filler for the purpose of improving viscosity, improving adhesion due to stress dispersion effect, improving coefficient of linear expansion, improving moisture resistance of the cured product, and the like.
- An inorganic filler or an organic filler can be used as the filler.
- inorganic fillers include silica, talc, glass beads, asbestos, gypsum, diatomaceous earth, smectite, bentonite, montmorillonite, sericite, activated clay, alumina, zinc oxide, iron oxide, magnesium oxide, tin oxide, and titanium oxide. , calcium carbonate, magnesium carbonate, magnesium hydroxide, aluminum hydroxide, aluminum nitride, silicon nitride, barium sulfate, calcium silicate and the like.
- the organic filler include polyester fine particles, polyurethane fine particles, vinyl polymer fine particles, acrylic polymer fine particles, and the like. The above fillers may be used alone, or two or more of them may be used in combination.
- a preferable lower limit of the content of the filler in 100 parts by mass of the sealing compound for liquid crystal display elements of the present invention is 10 parts by mass, and a preferable upper limit thereof is 70 parts by mass.
- the content of the filler is within this range, the effect of improving adhesiveness and the like is excellent without deteriorating coatability and the like.
- a more preferable lower limit of the filler content is 20 parts by mass, and a more preferable upper limit is 60 parts by mass.
- the sealing compound for liquid crystal display elements of the present invention may contain a silane coupling agent.
- the silane coupling agent mainly functions as an adhesion assistant for good adhesion between the liquid crystal display element sealing compound and the substrate.
- silane coupling agent for example, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-isocyanatopropyltrimethoxysilane and the like are preferably used. These are excellent in the effect of improving the adhesiveness to a substrate or the like, and can suppress the outflow of the curable resin into the liquid crystal by chemically bonding with the curable resin. Among them, 3-glycidoxypropyltrimethoxysilane is preferred.
- the silane coupling agents may be used alone, or two or more of them may be used in combination.
- a preferable lower limit of the content of the silane coupling agent in 100 parts by mass of the liquid crystal display element sealing compound of the present invention is 0.1 parts by mass, and a preferable upper limit thereof is 10 parts by mass.
- the content of the silane coupling agent is within this range, the effect of improving adhesion while suppressing the occurrence of liquid crystal contamination is more excellent.
- a more preferable lower limit to the content of the silane coupling agent is 0.3 parts by mass, and a more preferable upper limit is 5 parts by mass.
- the sealant for liquid crystal display elements of the present invention may contain a light shielding agent.
- the sealant for liquid crystal display elements of the present invention can be suitably used as a light shielding sealant.
- Examples of the light shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. Among them, titanium black is preferred.
- Titanium black is a substance that exhibits a higher transmittance for light in the vicinity of the ultraviolet region, particularly light with a wavelength of 370 nm or more and 450 nm or less, than average transmittance for light with a wavelength of 300 nm or more and 800 nm or less. That is, the titanium black has a property of imparting a light-shielding property to the sealing agent for a liquid crystal display element of the present invention by sufficiently shielding light of wavelengths in the visible light region, while transmitting light of wavelengths in the vicinity of the ultraviolet region.
- the photoradical polymerization initiator one capable of initiating the reaction by light of a wavelength that increases the transmittance of the titanium black, the photocurability of the sealant for a liquid crystal display element of the present invention is further increased.
- the light shielding agent contained in the sealing compound for liquid crystal display elements of the present invention a substance with high insulating properties is preferable, and titanium black is also suitable as the light shielding agent with high insulating properties.
- the above titanium black preferably has an optical density (OD value) per 1 ⁇ m of 3 or more, more preferably 4 or more. The higher the light shielding property of the titanium black, the better. Although there is no particular upper limit for the OD value of the titanium black, it is usually 5 or less.
- the above titanium black exerts a sufficient effect even if it is not surface-treated, but it can also be used when the surface is treated with an organic component such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, oxide.
- an organic component such as a coupling agent, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, oxide.
- Surface-treated titanium blacks such as those coated with inorganic components such as zirconium and magnesium oxide, can also be used. Among them, those treated with an organic component are preferable because they can further improve the insulating properties.
- the liquid crystal display device manufactured using the sealing agent for a liquid crystal display device of the present invention in which the above-described titanium black is blended as a light shielding agent has sufficient light shielding properties, so that light does not leak out and has high contrast. A liquid crystal display element having excellent image display quality can be realized.
- titanium blacks include, for example, titanium black manufactured by Mitsubishi Materials Corporation, titanium black manufactured by Ako Kasei Co., Ltd., and the like. Examples of titanium black manufactured by Mitsubishi Materials Corporation include 12S, 13M, 13M-C, 13R-N, and 14M-C. Examples of the titanium black manufactured by Ako Kasei Co., Ltd. include Tilak D and the like.
- the specific surface area of the titanium black has a preferred lower limit of 13 m 2 /g, a preferred upper limit of 30 m 2 /g, a more preferred lower limit of 15 m 2 /g, and a more preferred upper limit of 25 m 2 /g.
- the preferred lower limit of the volume resistivity of titanium black is 0.5 ⁇ cm, the preferred upper limit is 3 ⁇ cm, the more preferred lower limit is 1 ⁇ cm, and the more preferred upper limit is 2.5 ⁇ cm.
- the primary particle size of the light shielding agent is not particularly limited as long as it is equal to or smaller than the distance between the substrates of the liquid crystal display element, but the preferred lower limit is 1 nm and the preferred upper limit is 5000 nm. When the primary particle size of the light shielding agent is within this range, the obtained sealing agent for liquid crystal display elements can be made more excellent in light shielding properties without deteriorating the applicability or the like.
- the primary particle size of the light shielding agent has a more preferable lower limit of 5 nm, a more preferable upper limit of 200 nm, a still more preferable lower limit of 10 nm, and a still more preferable upper limit of 100 nm.
- the primary particle size of the light shielding agent can be measured by dispersing the light shielding agent in a solvent (water, organic solvent, etc.) using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS).
- a preferable lower limit of the content of the light shielding agent in 100 parts by mass of the liquid crystal display element sealing compound of the present invention is 5 parts by mass, and a preferable upper limit thereof is 80 parts by mass.
- the content of the light-shielding agent is within this range, the obtained sealant for liquid crystal display elements exhibits excellent light-shielding properties without significantly deteriorating the adhesiveness, strength after curing, and drawability. be able to.
- a more preferable lower limit of the content of the light shielding agent is 10 parts by mass, a more preferable upper limit is 70 parts by mass, a still more preferable lower limit is 30 parts by mass, and a further preferable upper limit is 60 parts by mass.
- the sealant for liquid crystal display elements of the present invention may further contain, if necessary, stress relaxation agents, reactive diluents, thixotropic agents, spacers, curing accelerators, antifoaming agents, leveling agents, polymerization inhibitors, and the like. It may contain an agent.
- a mixer is used to mix a curable resin, a thermosetting agent, and a photoradical polymerization initiator to be added as necessary. and the like.
- the mixer include a homodisper, a homomixer, a universal mixer, a planetary mixer, a kneader, and three rolls.
- the conductive fine particles for example, metal balls, resin fine particles having a conductive metal layer formed on the surface thereof, and the like can be used.
- the one in which a conductive metal layer is formed on the surface of the resin fine particles is preferable because the excellent elasticity of the resin fine particles enables conductive connection without damaging the transparent substrate or the like.
- a liquid crystal display element having a cured product of the sealant for a liquid crystal display element of the present invention is also one aspect of the present invention.
- a liquid crystal display element having a narrow frame design is preferable. Specifically, it is preferable that the width of the frame portion around the liquid crystal display section is 2 mm or less. Moreover, it is preferable that the coating width of the sealant for a liquid crystal display element of the present invention when manufacturing the liquid crystal display element of the present invention is 1 mm or less.
- the sealing compound for liquid crystal display elements of the present invention can be suitably used for manufacturing liquid crystal display elements by the liquid crystal dropping method.
- Examples of the method for manufacturing the liquid crystal display element of the present invention by the liquid crystal dropping method include the following methods. First, a step of forming a frame-shaped seal pattern on a substrate by screen printing, applying with a dispenser, or the like, is performed with the sealant for a liquid crystal display element of the present invention. Next, a step of applying liquid crystal microdroplets to the entire surface of the frame of the seal pattern while the sealant for a liquid crystal display element of the present invention is in an uncured state, and immediately superimposing another substrate is performed. After that, a liquid crystal display element can be obtained by a method of performing a step of heating and curing the sealant. Moreover, before the step of heating and curing the sealant, a step of temporarily curing the sealant by irradiating the seal pattern portion with light such as ultraviolet rays may be performed.
- the sealing compound for liquid crystal display elements which is excellent in storage stability, adhesiveness, and low-liquid-crystal contamination property can be provided. Further, according to the present invention, it is possible to provide a liquid crystal display element using the sealant for a liquid crystal display element.
- adduct A that was solid at 25°C.
- the mass average molecular weight of adduct A was 1,200.
- 1 H-NMR, 13 C-NMR, and FT-IR confirmed that the adduct A had a hydrazine-derived structure and a bisphenol F diglycidyl ether-derived structure.
- the mass average molecular weight of adduct F was 1,350.
- 1 H-NMR, 13 C-NMR, and FT-IR confirmed that the adduct F had a structure derived from carbodihydrazide and a structure derived from bisphenol F diglycidyl ether.
- Examples 1 to 10 Comparative Examples 1 to 4
- a planetary stirrer manufactured by Thinky Co., Ltd., "Awatori Mixer”
- Sealants for liquid crystal display elements of Examples 1 to 10 and Comparative Examples 1 to 4 were prepared.
- spacer fine particles 1 part by mass of spacer fine particles was dispersed in 100 parts by mass of each sealant for liquid crystal display elements obtained in Examples and Comparative Examples.
- Micropearl SI-H050 manufactured by Sekisui Chemical Co., Ltd.
- a liquid crystal display element sealing compound in which spacer particles were dispersed was minutely dropped onto one of two glass substrates (length 4.5 mm, width 2.5 mm) with an ITO thin film.
- Another ITO thin film-coated glass substrate was attached to this in a cross shape, irradiated with ultraviolet rays of 3000 mJ/cm 2 with a metal halide lamp, and then heated at 120° C.
- the bonded substrates were allowed to stand still for 15 minutes after bonding, and then the portion of the liquid crystal display element sealing agent was irradiated with ultraviolet rays of 100 mW/cm 2 for 30 seconds using a metal halide lamp to temporarily remove the liquid crystal display element sealing agent. Hardened.
- the composition was heated at 120° C. for 1 hour for final curing, thereby producing a liquid crystal display device.
- the resulting liquid crystal display device was checked for alignment disorder (display unevenness) using a polarizing microscope ("VHX-5000" manufactured by Keyence Corporation). Orientation disorder was judged from color unevenness in the display portion, and the low liquid crystal contamination resistance was evaluated as "O" when no display unevenness was observed in the liquid crystal display element, and as "X" when display unevenness was observed.
- the sealing compound for liquid crystal display elements which is excellent in storage stability, adhesiveness, and low-liquid-crystal contamination property can be provided. Further, according to the present invention, it is possible to provide a liquid crystal display element using the sealant for a liquid crystal display element.
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Abstract
Description
滴下工法では、まず、2枚の電極付き基板の一方に、ディスペンスにより枠状のシールパターンを形成する。次いで、シール剤が未硬化の状態で液晶の微小滴をシールパターンの枠内に滴下し、真空下で他方の基板を重ね合わせた後にシール剤を硬化させ、液晶表示素子を作製する。現在この滴下工法が液晶表示素子の製造方法の主流となっている。
本開示2は、上記アミノ基当量が30以下のアミン系化合物は、ヒドラジン及びカルボヒドラジドのうちの少なくともいずれかである本開示1の液晶表示素子用シール剤である。
本開示3は、上記アミノ基当量が30以下のアミン系化合物とエポキシ化合物とのアダクト体は、25℃で固体状である本開示1又は2の液晶表示素子用シール剤である。
本開示4は、上記エポキシ化合物は、フェノール性水酸基を有する化合物に由来する構造を有するエポキシ化合物である本開示1、2又は3の液晶表示素子用シール剤である。
本開示5は、本開示1、2、3又は4の液晶表示素子用シール剤の硬化物を有する液晶表示素子である。
以下に本発明を詳述する。
上記熱硬化剤は、アミノ基当量が30以下のアミン系化合物とエポキシ化合物とのアダクト体(以下、「本発明にかかるアダクト体」ともいう)を含む。
本発明にかかるアダクト体を含有することにより、本発明の液晶表示素子用シール剤は、保存安定性、接着性、及び、低液晶汚染性の全てに優れるものとなる。
なお、本明細書において、上記「アミン系化合物」は、アミン化合物、ヒドラジノ化合物、ヒドラジド化合物等のアミノ基を有する化合物を意味する。また、上記「アミノ基当量」は、(アミン系化合物の分子量)/(アミン系化合物1分子中のアミノ基数)で計算される値を意味し、上記「アミノ基数」は、アミノ基を構成する窒素原子の数を意味する。例えば、1つのヒドラジノ基(-NHNH2基)については、アミノ基数が2として計算される。
上記ビスフェノールA型エポキシ化合物としては、例えば、ビスフェノールAジグリシジルエーテル等が挙げられる。
上記ビスフェノールF型エポキシ化合物としては、例えば、ビスフェノールFジグリシジルエーテル、ビスフェノールF型エポキシポリマー等が挙げられる。
上記ジフェニルエーテル型エポキシ化合物としては、例えば、ビス(4-グリシジルオキシフェニル)エーテル等が挙げられる。
なお、本明細書において、上記質量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で溶媒としてテトラヒドロフランを用いて測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による質量平均分子量を測定する際のカラムとしては、例えば、Shodex LF-804(昭和電工社製)等が挙げられる。
本発明にかかるアダクト体の融点の好ましい下限は60℃、より好ましい下限は90℃である。
また、得られる液晶表示素子用シール剤の硬化性等の観点から、本発明にかかるアダクト体の融点の好ましい上限は180℃、より好ましい上限は150℃である。
なお、上記融点は、示差走査熱量測定又は市販の融点測定器により求めることができる。
また、上記硬化性樹脂として後述するエポキシ化合物を含有する場合、該エポキシ化合物1当量に対する本発明にかかるアダクト体の含有量の好ましい下限は0.5当量、好ましい上限は2.0当量である。上記エポキシ化合物1当量に対する本発明にかかるアダクト体の含有量が0.5当量以上であることにより、得られる液晶表示素子用シール剤が硬化性や接着性により優れるものとなる。上記エポキシ化合物1当量に対する本発明にかかるアダクト体の含有量が2.0当量以下であることにより、得られる液晶表示素子用シール剤が保存安定性及び低液晶汚染性により優れるものとなる。上記エポキシ化合物1当量に対する本発明にかかるアダクト体の含有量のより好ましい下限は0.8当量、より好ましい上限は1.2当量である。
上記硬化性樹脂は、エポキシ化合物を含むことが好ましい。
上記エポキシ化合物としては、例えば、ビスフェノールA型エポキシ化合物、ビスフェノールF型エポキシ化合物、ビスフェノールE型エポキシ化合物、ビスフェノールS型エポキシ化合物、2,2’-ジアリルビスフェノールA型エポキシ化合物、水添ビスフェノール型エポキシ化合物、プロピレンオキシド付加ビスフェノールA型エポキシ化合物、レゾルシノール型エポキシ化合物、ビフェニル型エポキシ化合物、スルフィド型エポキシ化合物、ジフェニルエーテル型エポキシ化合物、ジシクロペンタジエン型エポキシ化合物、ナフタレン型エポキシ化合物、フェノールノボラック型エポキシ化合物、オルトクレゾールノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、ナフタレンフェノールノボラック型エポキシ化合物、グリシジルアミン型エポキシ化合物、アルキルポリオール型エポキシ化合物、ゴム変性型エポキシ化合物、グリシジルエステル化合物等が挙げられる。
上記ビスフェノールF型エポキシ化合物のうち市販されているものとしては、例えば、jER806、jER4004(いずれも三菱ケミカル社製)、EPICLON EXA-830CRP(DIC社製)等が挙げられる。
上記ビスフェノールE型エポキシ化合物のうち市販されているものとしては、例えば、エポミックR710(三井化学社製)等が挙げられる。
上記ビスフェノールS型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON EXA-1514(DIC社製)等が挙げられる。
上記2,2’-ジアリルビスフェノールA型エポキシ化合物のうち市販されているものとしては、例えば、RE-810NM(日本化薬社製)等が挙げられる。
上記水添ビスフェノール型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON EXA-7015(DIC社製)等が挙げられる。
上記プロピレンオキシド付加ビスフェノールA型エポキシ化合物のうち市販されているものとしては、例えば、EP-4000S(ADEKA社製)等が挙げられる。
上記レゾルシノール型エポキシ化合物のうち市販されているものとしては、例えば、EX-201(ナガセケムテックス社製)等が挙げられる。
上記ビフェニル型エポキシ化合物のうち市販されているものとしては、例えば、jER YX-4000H(三菱ケミカル社製)等が挙げられる。
上記スルフィド型エポキシ化合物のうち市販されているものとしては、例えば、YSLV-50TE(日鉄ケミカル&マテリアル社製)等が挙げられる。
上記ジフェニルエーテル型エポキシ化合物のうち市販されているものとしては、例えば、YSLV-80DE(日鉄ケミカル&マテリアル社製)等が挙げられる。
上記ジシクロペンタジエン型エポキシ化合物のうち市販されているものとしては、例えば、EP-4088S(ADEKA社製)等が挙げられる。
上記ナフタレン型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON HP-4032、EPICLON EXA-4700(いずれもDIC社製)等が挙げられる。
上記フェノールノボラック型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON N-770(DIC社製)等が挙げられる。
上記オルトクレゾールノボラック型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON N-670-EXP-S(DIC社製)等が挙げられる。
上記ジシクロペンタジエンノボラック型エポキシ化合物のうち市販されているものとしては、例えば、EPICLON HP-7200(DIC社製)等が挙げられる。
上記ビフェニルノボラック型エポキシ化合物のうち市販されているものとしては、例えば、NC-3000P(日本化薬社製)等が挙げられる。
上記ナフタレンフェノールノボラック型エポキシ化合物のうち市販されているものとしては、例えば、ESN-165S(日鉄ケミカル&マテリアル社製)等が挙げられる。
上記グリシジルアミン型エポキシ化合物のうち市販されているものとしては、例えば、jER630(三菱ケミカル社製)、EPICLON430(DIC社製)、TETRAD-X(三菱ガス化学社製)等が挙げられる。
上記アルキルポリオール型エポキシ化合物のうち市販されているものとしては、例えば、ZX-1542(日鉄ケミカル&マテリアル社製)、EPICLON726(DIC社製)、エポライト80MFA(共栄社化学社製)、デナコールEX-611(ナガセケムテックス社製)等が挙げられる。
上記ゴム変性型エポキシ化合物のうち市販されているものとしては、例えば、YR-450、YR-207(いずれも日鉄ケミカル&マテリアル社製)、エポリードPB(ダイセル社製)等が挙げられる。
上記グリシジルエステル化合物のうち市販されているものとしては、例えば、デナコールEX-147(ナガセケムテックス社製)等が挙げられる。
上記エポキシ化合物のうちその他に市販されているものとしては、例えば、YDC-1312、YSLV-80XY、YSLV-90CR(いずれも日鉄ケミカル&マテリアル社製)、XAC4151(旭化成社製)、jER1031、jER1032(いずれも三菱ケミカル社製)、EXA-7120(DIC社製)、TEPIC(日産化学社製)等が挙げられる。
なお、本明細書において上記部分(メタ)アクリル変性エポキシ化合物とは、2つ以上のエポキシ基を有するエポキシ化合物の一部分のエポキシ基を(メタ)アクリル酸と反応させることによって得ることができる、1分子中にエポキシ基と(メタ)アクリロイル基とをそれぞれ1つ以上有する化合物を意味する。
なお、本明細書において、上記「(メタ)アクリル」とは、アクリル又はメタクリルを意味し、上記「(メタ)アクリロイル」とは、アクリロイル又はメタクリロイルを意味する。
上記(メタ)アクリル化合物としては、例えば、(メタ)アクリル酸エステル化合物、エポキシ(メタ)アクリレート、ウレタン(メタ)アクリレート等が挙げられる。なかでも、エポキシ(メタ)アクリレートが好ましい。また、上記(メタ)アクリル化合物は、反応性の観点から1分子中に(メタ)アクリロイル基を2個以上有するものが好ましい。
なお、本明細書において、上記「(メタ)アクリル化合物」とは、(メタ)アクリロイル基を有する化合物を意味する。また、上記「(メタ)アクリレート」とは、アクリレート又はメタクリレートを意味し、上記「エポキシ(メタ)アクリレート」とは、エポキシ化合物中の全てのエポキシ基を(メタ)アクリル酸と反応させた化合物のことを表す。
上記ダイセル・オルネクス社製のエポキシ(メタ)アクリレートとしては、例えば、EBECRYL860、EBECRYL3200、EBECRYL3201、EBECRYL3412、EBECRYL3600、EBECRYL3700、EBECRYL3701、EBECRYL3702、EBECRYL3703、EBECRYL3708、EBECRYL3800、EBECRYL6040、EBECRYL RDX63182等が挙げられる。
上記新中村化学工業社製のエポキシ(メタ)アクリレートとしては、例えば、EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、EMA-1020等が挙げられる。
上記共栄社化学社製のエポキシ(メタ)アクリレートとしては、例えば、エポキシエステルM-600A、エポキシエステル40EM、エポキシエステル70PA、エポキシエステル200PA、エポキシエステル80MFA、エポキシエステル3002M、エポキシエステル3002A、エポキシエステル1600A、エポキシエステル3000M、エポキシエステル3000A、エポキシエステル200EA、エポキシエステル400EA等が挙げられる。
上記ナガセケムテックス社製のエポキシ(メタ)アクリレートとしては、例えば、デナコールアクリレートDA-141、デナコールアクリレートDA-314、デナコールアクリレートDA-911等が挙げられる。
上記ポリオールとしては、例えば、エチレングリコール、プロピレングリコール、グリセリン、ソルビトール、トリメチロールプロパン、カーボネートジオール、ポリエーテルジオール、ポリエステルジオール、ポリカプロラクトンジオール等が挙げられる。
上記ヒドロキシアルキルモノ(メタ)アクリレートとしては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート等が挙げられる。
上記二価のアルコールとしては、例えば、エチレングリコール、プロピレングリコール、1,3-プロパンジオール、1,3-ブタンジオール、1,4-ブタンジオール、ポリエチレングリコール等が挙げられる。
上記三価のアルコールとしては、例えば、トリメチロールエタン、トリメチロールプロパン、グリセリン等が挙げられる。
上記エポキシ(メタ)アクリレートとしては、例えば、ビスフェノールA型エポキシ(メタ)アクリレート等が挙げられる。
上記東亞合成社製のウレタン(メタ)アクリレートとしては、例えば、M-1100、M-1200、M-1210、M-1600等が挙げられる。
上記ダイセル・オルネクス社製のウレタン(メタ)アクリレートとしては、例えば、EBECRYL210、EBECRYL220、EBECRYL230、EBECRYL270、EBECRYL1290、EBECRYL2220、EBECRYL4827、EBECRYL4842、EBECRYL4858、EBECRYL5129、EBECRYL6700、EBECRYL8402、EBECRYL8803、EBECRYL8804、EBECRYL8807、EBECRYL9260等が挙げられる。
上記根上工業社製のウレタン(メタ)アクリレートとしては、例えば、アートレジンUN-330、アートレジンSH-500B、アートレジンUN-1200TPK、アートレジンUN-1255、アートレジンUN-3320HB、アートレジンUN-7100、アートレジンUN-9000A、アートレジンUN-9000H等が挙げられる。
上記新中村化学工業社製のウレタン(メタ)アクリレートとしては、例えば、U-2HA、U-2PHA、U-3HA、U-4HA、U-6H、U-6HA、U-6LPA、U-10H、U-15HA、U-108、U-108A、U-122A、U-122P、U-324A、U-340A、U-340P、U-1084A、U-2061BA、UA-340P、UA-4000、UA-4100、UA-4200、UA-4400、UA-5201P、UA-7100、UA-7200、UA-W2A等が挙げられる。
上記共栄社化学社製のウレタン(メタ)アクリレートとしては、例えば、AH-600、AI-600、AT-600、UA-101I、UA-101T、UA-306H、UA-306I、UA-306T等が挙げられる。
上記光ラジカル重合開始剤としては、例えば、ベンゾフェノン化合物、アセトフェノン化合物、アシルフォスフィンオキサイド化合物、チタノセン化合物、オキシムエステル化合物、ベンゾインエーテル化合物、チオキサントン化合物等が挙げられる。
上記光ラジカル重合開始剤としては、具体的には例えば、1-ヒドロキシシクロヘキシルフェニルケトン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-1-ブタノン、2-(ジメチルアミノ)-2-((4-メチルフェニル)メチル)-1-(4-(4-モルホリニル)フェニル)-1-ブタノン、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン、ビス(2,4,6-トリメチルベンゾイル)フェニルホスフィンオキサイド、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン、1-(4-(2-ヒドロキシエトキシ)-フェニル)-2-ヒドロキシ-2-メチル-1-プロパン-1-オン、1-(4-(フェニルチオ)フェニル)-1,2-オクタンジオン2-(O-ベンゾイルオキシム)、2,4,6-トリメチルベンゾイルジフェニルホスフィンオキサイド等が挙げられる。
上記光ラジカル重合開始剤は、単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
上記熱ラジカル重合開始剤としては、例えば、アゾ化合物や有機過酸化物等で構成されるものが挙げられる。なかでも、液晶汚染を抑制する観点から、アゾ化合物で構成される開始剤(以下、「アゾ開始剤」ともいう)が好ましく、高分子アゾ化合物で構成される開始剤(以下、「高分子アゾ開始剤」ともいう)がより好ましい。
上記熱ラジカル重合開始剤は、単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
なお、本明細書において上記「高分子アゾ化合物」とは、アゾ基を有し、熱によって(メタ)アクリロイル基を反応させることができるラジカルを生成する、数平均分子量が300以上の化合物を意味する。
なお、本明細書において、上記数平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で溶媒としてテトラヒドロフランを用いて測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による数平均分子量を測定する際のカラムとしては、例えば、Shodex LF-804(昭和電工社製)等が挙げられる。
上記アゾ基を介してポリアルキレンオキサイド等のユニットが複数結合した構造を有する高分子アゾ化合物としては、ポリエチレンオキサイド構造を有するものが好ましい。
上記高分子アゾ化合物としては、具体的には例えば、4,4’-アゾビス(4-シアノペンタン酸)とポリアルキレングリコールの重縮合物や、4,4’-アゾビス(4-シアノペンタン酸)と末端アミノ基を有するポリジメチルシロキサンの重縮合物等が挙げられる。
上記高分子アゾ開始剤のうち市販されているものとしては、例えば、VPE-0201、VPE-0401、VPE-0601、VPS-0501、VPS-1001(いずれも富士フイルム和光純薬社製)等が挙げられる。
また、高分子ではないアゾ開始剤としては、例えば、V-65、V-501(いずれも富士フイルム和光純薬社製)等が挙げられる。
上記無機充填剤としては、例えば、シリカ、タルク、ガラスビーズ、石綿、石膏、珪藻土、スメクタイト、ベントナイト、モンモリロナイト、セリサイト、活性白土、アルミナ、酸化亜鉛、酸化鉄、酸化マグネシウム、酸化錫、酸化チタン、炭酸カルシウム、炭酸マグネシウム、水酸化マグネシウム、水酸化アルミニウム、窒化アルミニウム、窒化珪素、硫酸バリウム、珪酸カルシウム等が挙げられる。
上記有機充填剤としては、例えば、ポリエステル微粒子、ポリウレタン微粒子、ビニル重合体微粒子、アクリル重合体微粒子等が挙げられる。
上記充填剤は、単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
上記シランカップリング剤は、単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
上記チタンブラックは、1μmあたりの光学濃度(OD値)が、3以上であることが好ましく、4以上であることがより好ましい。上記チタンブラックの遮光性は高ければ高いほどよく、上記チタンブラックのOD値に好ましい上限は特にないが、通常は5以下となる。
また、遮光剤として上記チタンブラックを配合した本発明の液晶表示素子用シール剤を用いて製造した液晶表示素子は、充分な遮光性を有するため、光の漏れ出しがなく高いコントラストを有し、優れた画像表示品質を有する液晶表示素子を実現することができる。
上記三菱マテリアル社製のチタンブラックとしては、例えば、12S、13M、13M-C、13R-N、14M-C等が挙げられる。
上記赤穂化成社製のチタンブラックとしては、例えば、ティラックD等が挙げられる。
また、上記チタンブラックの体積抵抗の好ましい下限は0.5Ω・cm、好ましい上限は3Ω・cmであり、より好ましい下限は1Ω・cm、より好ましい上限は2.5Ω・cmである。
なお、上記遮光剤の一次粒子径は、NICOMP 380ZLS(PARTICLE SIZING SYSTEMS社製)を用いて、上記遮光剤を溶媒(水、有機溶媒等)に分散させて測定することができる。
上記混合機としては、例えば、ホモディスパー、ホモミキサー、万能ミキサー、プラネタリーミキサー、ニーダー、3本ロール等が挙げられる。
また、本発明の液晶表示素子を製造する際の本発明の液晶表示素子用シール剤の塗布幅は1mm以下であることが好ましい。
液晶滴下工法によって本発明の液晶表示素子を製造する方法としては、例えば、以下の方法等が挙げられる。
まず、基板に本発明の液晶表示素子用シール剤をスクリーン印刷、ディスペンサー塗布等により枠状のシールパターンを形成する工程を行う。次いで、本発明の液晶表示素子用シール剤が未硬化の状態で液晶の微小滴をシールパターンの枠内全面に滴下塗布し、すぐに別の基板を重ね合わせる工程を行う。その後、シール剤を加熱して硬化させる工程を行う方法により、液晶表示素子を得ることができる。また、シール剤を加熱して硬化させる工程の前にシールパターン部分に紫外線等の光を照射してシール剤を仮硬化させる工程を行ってもよい。
還流冷却管を取り付けた100mL容のナスフラスコに、テトラヒドロフラン50mLと、エタノール50mLと、ヒドラジン一水和物10g(0.2モル)と、ビスフェノールFジグリシジルエーテル6.24g(0.02モル)とを入れ、還流冷却を行いながら60℃で一晩撹拌した。次いで、得られた溶液を1000mL容のナスフラスコに移し、水500mLを加えて撹拌した。その後、得られた混合液を濾過し、残渣を真空オーブンにて60℃で真空乾燥させ、25℃で固体状のアダクト体Aを得た。アダクト体Aの質量平均分子量は1200であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Aは、ヒドラジンに由来する構造とビスフェノールFジグリシジルエーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビスフェノールF型エポキシポリマー38.4g(0.02モル)を用いたこと以外は、上記「(アダクト体Aの合成)」と同様にして、25℃で固体状のアダクト体Bを得た。アダクト体Bの質量平均分子量は1950であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Bは、ヒドラジンに由来する構造とビスフェノールF型エポキシポリマーに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビスフェノールAジグリシジルエーテル6.8g(0.02モル)を用いたこと以外は、上記「(アダクト体Aの合成)」と同様にして、25℃で固体状のアダクト体Cを得た。アダクト体Cの質量平均分子量は1250であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Cは、ヒドラジンに由来する構造とビスフェノールAジグリシジルエーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビス(4-グリシジルオキシフェニル)エーテル6.28g(0.02モル)を用いたこと以外は、上記「(アダクト体Aの合成)」と同様にして、25℃で固体状のアダクト体Dを得た。アダクト体Dの質量平均分子量は1200であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Dは、ヒドラジンに由来する構造とビス(4-グリシジルオキシフェニル)エーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、フェノールノボラック型エポキシ化合物11.4g(0.02モル)を用いたこと以外は、上記「(アダクト体Aの合成)」と同様にして、25℃で固体状のアダクト体Eを得た。アダクト体Eの質量平均分子量は2300であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Eは、ヒドラジンに由来する構造とフェノールノボラック型エポキシ化合物に由来する構造とを有するアダクト体であることを確認した。
還流冷却管を取り付けた200mL容のナスフラスコに、テトラヒドロフラン50mLと、水50mLと、カルボジヒドラジド18g(0.2モル)と、ビスフェノールFジグリシジルエーテル6.24g(0.02モル)とを入れ、還流冷却を行いながら60℃で一晩撹拌した。次いで、得られた溶液を1000mL容のナスフラスコに移し、水500mLを加えて撹拌した。その後、得られた混合液を濾過し、残渣を真空オーブンにて60℃で真空乾燥させ、25℃で固体状のアダクト体Fを得た。アダクト体Fの質量平均分子量は1350であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Fは、カルボジヒドラジドに由来する構造とビスフェノールFジグリシジルエーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビスフェノールF型エポキシポリマー38.4g(0.02モル)を用いたこと以外は、上記「(アダクト体Fの合成)」と同様にして、25℃で固体状のアダクト体Gを得た。アダクト体Gの質量平均分子量は2100であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Gは、カルボジヒドラジドに由来する構造とビスフェノールF型エポキシポリマーに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビスフェノールAジグリシジルエーテル6.8g(0.02モル)を用いたこと以外は、上記「(アダクト体Fの合成)」と同様にして、25℃で固体状のアダクト体Hを得た。アダクト体Hの質量平均分子量は1400であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Hは、カルボジヒドラジドに由来する構造とビスフェノールAジグリシジルエーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、ビス(4-グリシジルオキシフェニル)エーテル6.28g(0.02モル)を用いたこと以外は、上記「(アダクト体Fの合成)」と同様にして、25℃で固体状のアダクト体Iを得た。アダクト体Iの質量平均分子量は1350であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Iは、カルボジヒドラジドに由来する構造とビス(4-グリシジルオキシフェニル)エーテルに由来する構造とを有するアダクト体であることを確認した。
ビスフェノールFジグリシジルエーテル6.24g(0.02モル)に代えて、フェノールノボラック型エポキシ化合物11.4g(0.02モル)を用いたこと以外は、上記「(アダクト体Fの合成)」と同様にして、25℃で固体状のアダクト体Jを得た。アダクト体Jの質量平均分子量は2500であった。
1H-NMR、13C-NMR、及び、FT-IRにより、アダクト体Jは、カルボジヒドラジドに由来する構造とフェノールノボラック型エポキシ化合物に由来する構造とを有するアダクト体であることを確認した。
表1、2に記載された配合比に従い、各材料を、遊星式撹拌機(シンキー社製、「あわとり練太郎」)を用いて混合した後、更に3本ロールを用いて混合することにより実施例1~10、比較例1~4の各液晶表示素子用シール剤を調製した。
実施例及び比較例で得られた各液晶表示素子用シール剤について以下の評価を行った。結果を表1、2に示した。
実施例及び比較例で得られた各液晶表示素子用シール剤について、製造直後の初期粘度と、製造後に25℃で1週間保管した後の粘度とを測定した。(保管後の粘度)/(初期粘度)を増粘率とし、増粘率が2.0未満であったものを「◎」、2.0以上3.0未満であったものを「○」、3.0以上であったものを「×」として保存安定性を評価した。
なお、液晶表示素子用シール剤の粘度は、E型粘度計(BROOK FIELD社製、「DV-III」)を用い、25℃において回転速度1.0rpmの条件で測定した。
実施例及び比較例で得られた各液晶表示素子用シール剤100質量部にスペーサー微粒子1質量部を分散させた。スペーサー微粒子としては、ミクロパールSI-H050(積水化学工業社製)を用いた。次いで、スペーサー粒子を分散させた液晶表示素子用シール剤を、2枚のITO薄膜付きガラス基板(長さ4.5mm、幅2.5mm)のうちの一方に微小滴下した。これにもう一方のITO薄膜付きガラス基板を十字状に貼り合わせ、メタルハライドランプにて3000mJ/cm2の紫外線を照射した後、120℃で60分加熱することによって接着性試験片を得た。作製した接着性試験片における基板の端部を半径5mmの金属円柱を使って5mm/minの速度で押し込んだときに、パネル剥がれが起こる際の強度を測定した。
得られた測定値(kgf)をシール直径(cm)で除した値が、3.0kgf/cm以上であった場合を「◎」、2.0kgf/cmを超え3.0kgf/cm未満であった場合を「○」、2.0kgf/cm以下であった場合を「×」として接着性を評価した。
また、ITO薄膜付きガラス基板に代えてTN用ポリイミド配向膜(日産化学社製、「SE6414」)付きガラス基板を用いて同様にして接着性を評価した。
実施例及び比較例で得られた各液晶表示素子用シール剤100質量部に平均粒子径7μmのスペーサー微粒子(積水化学工業社製、「ミクロパールSI-H050」)1質量部を分散させ、シリンジに充填し、遠心脱泡機(アワトロンAW-1)にて脱泡した。脱泡処理後の液晶表示素子用シール剤を、ディスペンサーを用いて、ノズル径0.4mmφ、ノズルギャップ42μm、シリンジの吐出圧100~400kPa、塗布速度60mm/secの条件で2枚の配向膜及びITO薄膜付き基板の一方に枠状に塗布した。このとき、液晶表示素子用シール剤の線幅が約1.0mmとなるように吐出圧を調整した。続いて液晶(東京化成工業社製、「4-ペンチル-4-ビフェニルカルボニトリル」)の微小滴を、液晶表示素子用シール剤を塗布した基板の液晶表示素子用シール剤の枠内全面に滴下塗布し、2時間放置したのち真空下でもう一方の基板を貼り合わせた。貼り合わせた基板について、貼り合わせてから15分間静置した後、液晶表示素子用シール剤部分にメタルハライドランプを用いて100mW/cm2の紫外線を30秒間照射して液晶表示素子用シール剤を仮硬化させた。次いで、120℃で1時間加熱して本硬化を行い、液晶表示素子を作製した。
得られた液晶表示素子について、偏光顕微鏡(キーエンス社製、「VHX-5000」)を用いて、配向乱れ(表示むら)を確認した。配向乱れは表示部の色むらより判断し、液晶表示素子に表示むらが全く見られなかった場合を「○」、表示むらが確認された場合を「×」として低液晶汚染性を評価した。
Claims (5)
- 硬化性樹脂と熱硬化剤とを含有する液晶表示素子用シール剤であって、
前記熱硬化剤は、アミノ基当量が30以下のアミン系化合物とエポキシ化合物とのアダクト体を含む
ことを特徴とする液晶表示素子用シール剤。 - 前記アミノ基当量が30以下のアミン系化合物は、ヒドラジン及びカルボヒドラジドのうちの少なくともいずれかである請求項1記載の液晶表示素子用シール剤。
- 前記アミノ基当量が30以下のアミン系化合物とエポキシ化合物とのアダクト体は、25℃で固体状である請求項1又は2記載の液晶表示素子用シール剤。
- 前記エポキシ化合物は、フェノール性水酸基を有する化合物に由来する構造を有するエポキシ化合物である請求項1、2又は3記載の液晶表示素子用シール剤。
- 請求項1、2、3又は4記載の液晶表示素子用シール剤の硬化物を有する液晶表示素子。
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WO2014010446A1 (ja) * | 2012-07-11 | 2014-01-16 | 協立化学産業株式会社 | 硬化剤及びそれを用いた樹脂組成物 |
JP2014115639A (ja) * | 2012-11-13 | 2014-06-26 | Sekisui Chem Co Ltd | 液晶表示素子用シール剤、上下導通材料、液晶表示素子、及び、ヒドラジド系熱硬化剤 |
JP2016056361A (ja) * | 2014-09-04 | 2016-04-21 | 積水化学工業株式会社 | 重合性化合物、硬化性樹脂組成物、液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
WO2021044842A1 (ja) * | 2019-09-06 | 2021-03-11 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
WO2022071404A1 (ja) * | 2020-09-30 | 2022-04-07 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
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JPH0714694B2 (ja) | 1988-09-29 | 1995-02-22 | 三菱自動車工業株式会社 | 塩化ビニル製トリム表皮の防しわ貼込法 |
JP3583326B2 (ja) | 1999-11-01 | 2004-11-04 | 協立化学産業株式会社 | Lcdパネルの滴下工法用シール剤 |
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- 2022-06-02 CN CN202280018008.3A patent/CN116940889A/zh active Pending
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WO2014010446A1 (ja) * | 2012-07-11 | 2014-01-16 | 協立化学産業株式会社 | 硬化剤及びそれを用いた樹脂組成物 |
JP2014115639A (ja) * | 2012-11-13 | 2014-06-26 | Sekisui Chem Co Ltd | 液晶表示素子用シール剤、上下導通材料、液晶表示素子、及び、ヒドラジド系熱硬化剤 |
JP2016056361A (ja) * | 2014-09-04 | 2016-04-21 | 積水化学工業株式会社 | 重合性化合物、硬化性樹脂組成物、液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
WO2021044842A1 (ja) * | 2019-09-06 | 2021-03-11 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
WO2022071404A1 (ja) * | 2020-09-30 | 2022-04-07 | 積水化学工業株式会社 | 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子 |
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JPWO2022255451A1 (ja) | 2022-12-08 |
CN116940889A (zh) | 2023-10-24 |
TW202313920A (zh) | 2023-04-01 |
KR20240015659A (ko) | 2024-02-05 |
JP7185103B1 (ja) | 2022-12-06 |
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