WO2022230819A1 - Moisture-curable adhesive composition and cured object - Google Patents
Moisture-curable adhesive composition and cured object Download PDFInfo
- Publication number
- WO2022230819A1 WO2022230819A1 PCT/JP2022/018758 JP2022018758W WO2022230819A1 WO 2022230819 A1 WO2022230819 A1 WO 2022230819A1 JP 2022018758 W JP2022018758 W JP 2022018758W WO 2022230819 A1 WO2022230819 A1 WO 2022230819A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- moisture
- meth
- adhesive composition
- curable adhesive
- acrylate
- Prior art date
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- 239000000853 adhesive Substances 0.000 title claims abstract description 127
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 127
- 239000000203 mixture Substances 0.000 title claims abstract description 104
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 79
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 73
- 239000004417 polycarbonate Substances 0.000 claims abstract description 65
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 65
- 239000004814 polyurethane Substances 0.000 claims abstract description 17
- 229920002635 polyurethane Polymers 0.000 claims abstract description 17
- 229920005862 polyol Polymers 0.000 claims description 94
- 150000001875 compounds Chemical class 0.000 claims description 92
- -1 polyol compound Chemical class 0.000 claims description 76
- 150000003077 polyols Chemical class 0.000 claims description 68
- 239000005056 polyisocyanate Substances 0.000 claims description 27
- 229920001228 polyisocyanate Polymers 0.000 claims description 27
- 239000000047 product Substances 0.000 claims description 21
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 13
- 239000007795 chemical reaction product Substances 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 100
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 27
- 239000004593 Epoxy Substances 0.000 description 21
- 239000003822 epoxy resin Substances 0.000 description 20
- 229920000647 polyepoxide Polymers 0.000 description 20
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 18
- 150000002009 diols Chemical class 0.000 description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- 239000003054 catalyst Substances 0.000 description 13
- 150000002430 hydrocarbons Chemical group 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
- 238000013008 moisture curing Methods 0.000 description 12
- 239000002994 raw material Substances 0.000 description 12
- 125000001931 aliphatic group Chemical group 0.000 description 11
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 150000002148 esters Chemical class 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- 239000003999 initiator Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical class C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 7
- 230000001588 bifunctional effect Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 229930195734 saturated hydrocarbon Natural products 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- 239000005977 Ethylene Substances 0.000 description 5
- 230000001133 acceleration Effects 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 125000003118 aryl group Chemical group 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 238000000016 photochemical curing Methods 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 235000011187 glycerol Nutrition 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical group CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Chemical group 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 2
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 2
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- VOXZDWNPVJITMN-ZBRFXRBCSA-N 17β-estradiol Chemical compound OC1=CC=C2[C@H]3CC[C@](C)([C@H](CC4)O)[C@@H]4[C@@H]3CCC2=C1 VOXZDWNPVJITMN-ZBRFXRBCSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- YPCHGLDQZXOZFW-UHFFFAOYSA-N [2-[[4-methyl-3-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]carbonylamino]phenyl]carbamoyloxymethyl]-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound CC1=CC=C(NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C)C=C1NC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C YPCHGLDQZXOZFW-UHFFFAOYSA-N 0.000 description 2
- VZTQQYMRXDUHDO-UHFFFAOYSA-N [2-hydroxy-3-[4-[2-[4-(2-hydroxy-3-prop-2-enoyloxypropoxy)phenyl]propan-2-yl]phenoxy]propyl] prop-2-enoate Chemical compound C=1C=C(OCC(O)COC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OCC(O)COC(=O)C=C)C=C1 VZTQQYMRXDUHDO-UHFFFAOYSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- JGCWKVKYRNXTMD-UHFFFAOYSA-N bicyclo[2.2.1]heptane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CC2CCC1C2 JGCWKVKYRNXTMD-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ZMZHRHTZJDBLEX-UHFFFAOYSA-N (2-phenylphenyl) prop-2-enoate Chemical class C=CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 ZMZHRHTZJDBLEX-UHFFFAOYSA-N 0.000 description 1
- YOBOXHGSEJBUPB-MTOQALJVSA-N (z)-4-hydroxypent-3-en-2-one;zirconium Chemical compound [Zr].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O YOBOXHGSEJBUPB-MTOQALJVSA-N 0.000 description 1
- QXRRAZIZHCWBQY-UHFFFAOYSA-N 1,1-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1(CN=C=O)CCCCC1 QXRRAZIZHCWBQY-UHFFFAOYSA-N 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- LTXMGJMNBACUIY-UHFFFAOYSA-N 1-(2-hydroxyethoxy)-2-phenoxyundecan-2-ol Chemical compound CCCCCCCCCC(O)(COCCO)OC1=CC=CC=C1 LTXMGJMNBACUIY-UHFFFAOYSA-N 0.000 description 1
- NQUXRXBRYDZZDL-UHFFFAOYSA-N 1-(2-prop-2-enoyloxyethyl)cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1(CCOC(=O)C=C)C(O)=O NQUXRXBRYDZZDL-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical class C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- WWVBRUMYFUDEJQ-UHFFFAOYSA-N 1-ethoxyethane-1,2-diol Chemical compound CCOC(O)CO WWVBRUMYFUDEJQ-UHFFFAOYSA-N 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 1
- CMTIHEOOVZATEB-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylethane-1,1-diamine Chemical group CN(C)C(C)N(C)C CMTIHEOOVZATEB-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- OVJHMJJVXOJMBB-UHFFFAOYSA-N 2-(1,3-dioxo-3a,4,5,6,7,7a-hexahydroisoindol-2-yl)ethyl prop-2-enoate Chemical compound C1CCCC2C(=O)N(CCOC(=O)C=C)C(=O)C21 OVJHMJJVXOJMBB-UHFFFAOYSA-N 0.000 description 1
- YHYCMHWTYHPIQS-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-methoxyethanol Chemical compound COC(O)COCCO YHYCMHWTYHPIQS-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- WFSMVVDJSNMRAR-UHFFFAOYSA-N 2-[2-(2-ethoxyethoxy)ethoxy]ethanol Chemical compound CCOCCOCCOCCO WFSMVVDJSNMRAR-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- GTEXIOINCJRBIO-UHFFFAOYSA-N 2-[2-(dimethylamino)ethoxy]-n,n-dimethylethanamine Chemical compound CN(C)CCOCCN(C)C GTEXIOINCJRBIO-UHFFFAOYSA-N 0.000 description 1
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- FIMAGFSGWNAHTD-UHFFFAOYSA-N 3,5,8-trimethyl-1,4-diazabicyclo[2.2.2]octane Chemical group C1C(C)N2C(C)CN1CC2C FIMAGFSGWNAHTD-UHFFFAOYSA-N 0.000 description 1
- 125000004839 3-methylpentylene group Chemical group [H]C([H])([H])C([H])(C([H])([H])C([H])([H])[*:1])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- PENRYFPQHOTBJV-UHFFFAOYSA-N 4-(3-morpholin-4-ylpropyl)morpholine Chemical compound C1COCCN1CCCN1CCOCC1 PENRYFPQHOTBJV-UHFFFAOYSA-N 0.000 description 1
- ZMSQJSMSLXVTKN-UHFFFAOYSA-N 4-[2-(2-morpholin-4-ylethoxy)ethyl]morpholine Chemical compound C1COCCN1CCOCCN1CCOCC1 ZMSQJSMSLXVTKN-UHFFFAOYSA-N 0.000 description 1
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- UZDMJPAQQFSMMV-UHFFFAOYSA-N 4-oxo-4-(2-prop-2-enoyloxyethoxy)butanoic acid Chemical compound OC(=O)CCC(=O)OCCOC(=O)C=C UZDMJPAQQFSMMV-UHFFFAOYSA-N 0.000 description 1
- 229910002012 Aerosil® Inorganic materials 0.000 description 1
- WMONOXOCMIPNNU-UHFFFAOYSA-N C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O Chemical compound C=CC(=O)OCCCC(O)COC(=O)C1=CC=CC=C1C(O)=O WMONOXOCMIPNNU-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical group C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- OMRDSWJXRLDPBB-UHFFFAOYSA-N N=C=O.N=C=O.C1CCCCC1 Chemical compound N=C=O.N=C=O.C1CCCCC1 OMRDSWJXRLDPBB-UHFFFAOYSA-N 0.000 description 1
- QORUGOXNWQUALA-UHFFFAOYSA-N N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 Chemical compound N=C=O.N=C=O.N=C=O.C1=CC=C(C(C2=CC=CC=C2)C2=CC=CC=C2)C=C1 QORUGOXNWQUALA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 1
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical compound C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- KOMDZQSPRDYARS-UHFFFAOYSA-N cyclopenta-1,3-diene titanium Chemical compound [Ti].C1C=CC=C1.C1C=CC=C1 KOMDZQSPRDYARS-UHFFFAOYSA-N 0.000 description 1
- FOTKYAAJKYLFFN-UHFFFAOYSA-N decane-1,10-diol Chemical compound OCCCCCCCCCCO FOTKYAAJKYLFFN-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000002147 dimethylamino group Chemical group [H]C([H])([H])N(*)C([H])([H])[H] 0.000 description 1
- PODOEQVNFJSWIK-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethoxyphenyl)methanone Chemical compound COC1=CC(OC)=CC(OC)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 PODOEQVNFJSWIK-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- ZCIJAGHWGVCOHJ-UHFFFAOYSA-N naphthalene phenol Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.C1=CC=CC2=CC=CC=C12.C1(=CC=CC=C1)O ZCIJAGHWGVCOHJ-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000005359 phenoxyalkyl group Chemical group 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000011527 polyurethane coating Substances 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 239000011164 primary particle Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- WSFQLUVWDKCYSW-UHFFFAOYSA-M sodium;2-hydroxy-3-morpholin-4-ylpropane-1-sulfonate Chemical compound [Na+].[O-]S(=O)(=O)CC(O)CN1CCOCC1 WSFQLUVWDKCYSW-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 150000003553 thiiranes Chemical class 0.000 description 1
- RYYWUUFWQRZTIU-UHFFFAOYSA-K thiophosphate Chemical compound [O-]P([O-])([O-])=S RYYWUUFWQRZTIU-UHFFFAOYSA-K 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical group C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- 150000003752 zinc compounds Chemical class 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
Definitions
- the present invention relates to a moisture-curable adhesive composition and a cured body of the moisture-curable adhesive composition.
- moisture-curable adhesives containing moisture-curable resins that are cured by external moisture have been widely used.
- a moisture-curable urethane prepolymer may be used as the moisture-curable resin.
- a urethane prepolymer a polyurethane obtained by reacting a polyisocyanate and a polyol is widely known.
- Polyester polyols and polyether polyols are often used as polyols, which are raw materials for polyurethanes.
- the use of polycarbonate polyols, silicone skeleton-containing polyols, and the like has also been studied.
- Patent Document 1 a carboxyl group characterized by having a structure derived from a silicone-containing diol compound having a hydroxyl value of 5 to 200 mgKOH/g is used as a polyurethane used in solder resist ink or overcoat ink.
- a contained polyurethane is disclosed.
- Patent Document 2 describes a composition used for medical devices, implants, etc., containing at least one polysiloxane macrodiol and at least one polyether and/or polycarbonate macrodiol soft segment.
- a polyurethane elastomer composition is disclosed.
- Patent Document 3 describes a one-part moisture-curable polyurethane coating agent useful as a moisture-proof insulation agent, which is obtained by mixing an organic polyisocyanate, a polycarbonate diol having a specific molecular weight, a polyester polyol, and a siloxane-modified polyol in a predetermined ratio. It is disclosed that those obtained by reacting with are used.
- Patent Documents 1 to 3 are shown to improve various performances by having a silicone skeleton, but they have not been studied for use in adhesives and can be used in various substrates. There is no specific method for improving the adhesive force to the adherend.
- an object of the present invention is to provide a moisture-curable adhesive composition that can ensure excellent adhesion to various adherends.
- the present inventors have found that the above problems can be solved by including a urethane prepolymer having a specific skeleton portion in a certain content in a moisture-curable adhesive composition.
- the present invention provides the following [1] to [23].
- [1] A urethane prepolymer containing a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule, A moisture-curable adhesive composition, wherein the content of the silicone skeleton portion in the urethane prepolymer is higher than the content of the polycarbonate skeleton portion on a mass basis.
- the urethane prepolymer is a reaction product of a polyol compound containing polycarbonate polyol and silicone polyol, and a polyisocyanate compound, and the amount of silicone polyol in the polyol compound is, on a mass basis, higher than the amount of polycarbonate.
- the moisture-curable adhesive composition according to any one of [1] to [4] above.
- [6] The moisture-curable adhesive composition according to [5] above, wherein the silicone polyol is a silicone diol having two hydroxyl groups.
- the (meth)acrylic acid ester compound is selected from the group consisting of a (meth)acrylic acid ester compound having an alicyclic structure, a (meth)acrylic acid ester compound having an aromatic ring, and an alkyl (meth)acrylate.
- [15] The above [11] to [14], wherein the content of the radically polymerizable compound is 5 parts by mass or more and 70 parts by mass or less with respect to 100 parts by mass of the total amount of the urethane prepolymer and the radically polymerizable compound.
- the moisture-curable adhesive composition according to any one of .
- the total amount of the urethane prepolymer and the radically polymerizable compound is 70% by mass or more based on the total amount of the moisture-curable adhesive composition, according to any one of [1] to [18] above.
- a moisture-curable adhesive composition [20] A cured product of the moisture-curable adhesive composition according to any one of [1] to [19] above.
- An electronic device comprising the cured product according to [20] above.
- FIG.1 (a) is a top view
- FIG.1(b) is a side view.
- the moisture-curable adhesive composition of the present invention contains a urethane prepolymer containing polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule.
- the moisture-curable adhesive composition of the present invention has moisture-curable properties by containing a moisture-curable resin. Any type of moisture-curable resin may be used in the moisture-curable adhesive composition as long as it contains a moisture-curable resin. is preferred.
- the urethane prepolymer used in the present invention contains polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule.
- the moisture-curable adhesive composition of the present invention secures wettability to various adherends by incorporating both a polycarbonate skeleton with high mechanical strength and a silicone skeleton with low surface free energy into the urethane prepolymer.
- the mechanical strength of the cured product is improved. Therefore, high adhesive strength can be ensured for various types of adherends.
- heat resistance is improved, and high adhesiveness can be secured even in a high-temperature environment.
- the urethane prepolymer preferably has a moisture-curable functional group, and more preferably a urethane prepolymer containing an isocyanate group.
- the content of the silicone skeleton portion is greater than the content of the polycarbonate skeleton portion on a mass basis.
- the adhesive force to various types of adherends can be further improved.
- a polycarbonate skeleton and a silicone skeleton are introduced by using both a silicone polyol and a polycarbonate polyol as polyol compounds that are raw materials. Therefore, in the present invention, the silicone skeleton portion is a portion derived from a silicone polyol, and the polycarbonate skeleton portion is a portion derived from a polycarbonate polyol.
- a silicone skeleton means an organopolysiloxane skeleton.
- both polycarbonate polyol and silicone polyol are used as the polyol compound that is the raw material of the urethane prepolymer. That is, the urethane prepolymer is a reaction product of a mixture of polycarbonate polyol and silicone polyol and a polyisocyanate compound. As a result, at least part of the polyurethane constituting the urethane prepolymer can contain both a polycarbonate skeleton and a silicone skeleton in the molecule.
- the polyurethane constituting the urethane prepolymer contains isocyanate groups by increasing [NCO]/[OH], and preferably contains a plurality of isocyanate groups in the molecule.
- the polyol compound used to obtain the urethane prepolymer is preferably a diol compound, and the polyisocyanate compound is preferably a diisocyanate compound. Therefore, the polyurethane constituting the urethane prepolymer preferably has two isocyanate groups. Also, each isocyanate group is preferably contained at the end of the molecule.
- the blending amount of the silicone polyol should be larger than the blending amount of the polycarbonate polyol on a mass basis.
- the content of the silicone skeleton portion is greater than the content of the polycarbonate skeleton portion.
- the ratio (Si/PC) of the compounding amount (Si) of the silicone polyol to the compounding amount (PC) of the polycarbonate polyol should be greater than 50/50 on a mass basis. , preferably 55/45 or more and 95/5 or less, more preferably 60/40 or more and 90/10 or less, and still more preferably 70/30 or more and 85/15 or less.
- the moisture-curable adhesive composition has even better adhesion to various types of adherends.
- the silicone skeleton portion is a portion derived from a silicone polyol
- the polycarbonate skeleton portion is a portion derived from a polycarbonate polyol. Therefore, the preferred range of the mass-based ratio of the content of the silicone skeleton portion to the content of the polycarbonate skeleton portion in the urethane prepolymer is as described in the above ratio (Si/PC).
- the polyol compound used as a raw material may consist of a polycarbonate polyol and a silicone polyol, but may contain polyols other than these as long as the effects of the present invention are not impaired.
- the urethane prepolymer may be a reaction product of polycarbonate polyols, silicone polyols, and mixtures with other polyols and polyisocyanate compounds.
- the blending ratio of polyols other than polycarbonate polyols and silicone polyols (other polyols) is preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 10% by mass or less, and most preferably 10% by mass or less, based on the total polyol compound. is 0% by mass.
- the urethane prepolymer may have other polyol-derived moieties in addition to the silicone skeleton and the polycarbonate skeleton, and the preferred range of the content of the other polyol-derived moieties in the urethane prepolymer is the above. It is the same as the blending ratio derived from other polyols.
- the urethane prepolymer may be used singly or as a mixture of two or more.
- each urethane prepolymer is preferably a reaction product obtained by reacting a polyol compound with a polyisocyanate compound.
- at least one of the polyol compound and the polyisocyanate compound used as raw materials may be different from each other.
- the polyol compound used as a raw material in each urethane prepolymer contains both a polycarbonate polyol and a silicone polyol.
- any one of the two or more urethane prepolymers may use both polycarbonate polyol and silicone polyol as raw material polyol compounds. It is not necessary to use both polyols.
- silicone polyols examples include hydroxy group-modified organopolysiloxane compounds having an organopolysiloxane skeleton and hydroxy groups. Moreover, the silicone polyol is preferably a silicone diol having two hydroxyl groups. Specific examples of hydroxy group-modified organopolysiloxane compounds include a compound having an organopolysiloxane skeleton and hydroxyl groups at both ends thereof, and a compound having an organopolysiloxane skeleton and two hydroxyl groups at one end thereof. etc.
- the terminal hydroxy group may be directly bonded to the Si atom constituting the organopolysiloxane skeleton, or may be bonded via a hydrocarbon group or a hydrocarbon group having an ether bond.
- the hydrocarbon group has, for example, about 2 to 50 carbon atoms, preferably about 2 to 30 carbon atoms. Silicone polyols may be used singly or in combination of two or more.
- the weight average molecular weight of the silicone polyol is preferably from 100 to 10,000, more preferably from 500 to 5,000, and even more preferably from 800 to 3,000.
- the weight average molecular weight is improved. Therefore, by using a mixture of a polycarbonate polyol and a silicone polyol as a raw material for producing a urethane prepolymer, a urethane prepolymer containing a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule can be produced appropriately. be able to. Then, by adjusting the elastic modulus of the cured product within an appropriate range, the adhesion and the like can be improved.
- polycarbonate polyol Polycarbonate diols are preferred as polycarbonate polyols, and specific examples of polycarbonate diols include compounds represented by the following formula (1).
- R is a divalent hydrocarbon group having 4 or more and 16 or less carbon atoms, and n is an integer of 2 or more and 500 or less.
- R is preferably an aliphatic saturated hydrocarbon group.
- R is an aliphatic saturated hydrocarbon group
- the heat resistance tends to be good.
- yellowing or the like due to heat deterioration or the like is less likely to occur, and weather resistance is improved.
- R composed of an aliphatic saturated hydrocarbon group may have a cyclic structure, it preferably has a chain structure from the viewpoint of easily improving flexibility and the like.
- R in the chain structure may be linear or branched.
- n is preferably 5 or more and 200 or less, more preferably 5 or more and 100 or less, and further preferably 5 or more and 50 or less. Alternatively, two or more types may be used in combination.
- the chain aliphatic saturated hydrocarbon group having 6 or more and 16 or less carbon atoms preferably has 6 or more and 12 or less carbon atoms, more preferably 6 or more and 10 or less carbon atoms.
- two or more kinds of divalent hydrocarbon groups having 4 to 16 carbon atoms are used in combination, and at least a part thereof is a chain aliphatic saturated hydrocarbon group having 6 to 16 carbon atoms, further 4 carbon atoms or 5 divalent hydrocarbon groups.
- R may be linear groups such as a tetramethylene group, pentylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group, decamethylene group, and, for example, a 3-methylpentylene group. It may be branched such as a methylpentylene group such as a methylpentylene group or a methyloctamethylene group. Plural R's in one molecule may be the same or different. Furthermore, from the viewpoint of increasing the elastic modulus to a certain value or more, R preferably contains a branched saturated aliphatic hydrocarbon group, and from the viewpoint of weather resistance, R contains a linear saturated aliphatic hydrocarbon group. is preferred. Branched R and linear R may be used in combination in the polycarbonate polyol. Polycarbonate polyols may be used singly or in combination of two or more.
- the weight average molecular weight of the polycarbonate polyol is preferably 100 or more and 10000 or less, more preferably 500 or more and 5000 or less, and even more preferably 800 or more and 3000 or less.
- the weight average molecular weight is preferably 100 or more and 10000 or less, more preferably 500 or more and 5000 or less, and even more preferably 800 or more and 3000 or less.
- polyisocyanate compound examples of polyisocyanate compounds used as raw materials for urethane prepolymers include aliphatic polyisocyanate compounds and aromatic polyisocyanate compounds.
- aliphatic polyisocyanate compounds include hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, and cyclohexane diisocyanate.
- Aliphatic polyisocyanate compounds may be those obtained by increasing these.
- aromatic polyisocyanate compounds include diphenylmethane diisocyanate, liquid modified diphenylmethane diisocyanate, tolylene diisocyanate, and naphthalene-1,5-diisocyanate.
- the aromatic polyisocyanate compound may be a multimer of these compounds, polymeric MDI, or the like.
- the polyisocyanate compound is preferably a diisocyanate compound.
- a polyisocyanate compound may be used individually by 1 type, and may be used in combination of 2 or more type.
- the weight average molecular weight of the urethane prepolymer is not particularly limited, it is preferably 800 or more and 20,000 or less. By setting the weight-average molecular weight within the above range, it is possible to adjust the elastic modulus of the cured product within an appropriate range while improving the applicability of the moisture-curable adhesive composition.
- the weight average molecular weight of the urethane prepolymer is more preferably 1500 or more, more preferably 2000 or more, and more preferably 18000 or less, still more preferably 15000 or less.
- a weight average molecular weight is a value which measures by a gel permeation chromatography (GPC), and is calculated
- Shodex LF-804 (manufactured by Showa Denko KK) can be used as a column for measuring the weight average molecular weight in terms of polystyrene by GPC. Moreover, tetrahydrofuran is mentioned as a solvent used in GPC.
- the moisture-curable adhesive composition of the present invention preferably contains a radically polymerizable compound.
- the moisture-curable adhesive composition of the present invention is imparted with photo-curability, and can be a light-moisture-curable adhesive composition.
- in a semi-cured state after photocuring and before moisture curing it has a hardness of at least a certain level, making it easy to ensure shape retention. If the shape retainability in the semi-cured state can be secured, it becomes easier to secure a constant space between the adherends by the cured body formed from the moisture-curable adhesive composition.
- the moisture-curable adhesive composition contains a radically polymerizable compound, a certain amount of adhesive strength is imparted only by light irradiation. It is possible to secure the above adhesion strength.
- the radically polymerizable compound is not particularly limited as long as it is a radically polymerizable compound having photopolymerizability, and is a compound having a radically polymerizable functional group in the molecule.
- a compound having an unsaturated double bond is suitable as the radically polymerizable functional group, and the radically polymerizable functional group includes a (meth)acryloyl group, a vinyl group, a styryl group, an allyl group, and the like.
- a (meth)acryloyl group is preferable from the viewpoint of reactivity. Therefore, the radically polymerizable compound is a compound having a (meth)acryloyl group (hereinafter, also referred to as "(meth)acrylic compound" ) is preferred.
- (meth)acrylic compounds include (meth)acrylic acid ester compounds, epoxy (meth)acrylates, urethane (meth)acrylates, and the like.
- urethane (meth)acrylate does not have a residual isocyanate group.
- (meth)acryloyl group means acryloyl group or (meth)acryloyl group
- (meth)acrylate” means acrylate or methacrylate, and the same applies to other similar terms. be.
- the (meth)acrylic acid ester compound may be monofunctional, bifunctional, or trifunctional or more.
- monofunctional (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, isomyristyl (meth)acrylates, alkyl (meth)acrylates such as stearyl (meth)acrylate, cyclohexyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acryl
- acrylate methoxyethylene glycol (meth)acrylate, alkoxyethylene glycol (meth)acrylate such as ethoxyethylene glycol (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate polyoxyethylene-based (meth)acrylates such as acrylates, ethyl carbitol (meth)acrylates, ethoxydiethylene glycol (meth)acrylates, ethoxytriethylene glycol (meth)acrylates, and ethoxypolyethylene glycol (meth)acrylates;
- the (meth)acrylic acid ester compound may have an aromatic ring.
- phenoxyalkyl (meth)acrylates such as Furthermore, it may be a (meth)acrylate having a plurality of benzene rings such as a fluorene skeleton or a biphenyl skeleton, and specific examples thereof include fluorene-type (meth)acrylates and ethoxylated o-phenylphenol acrylates.
- Phenoxypolyoxyethylene-based (meth)acrylates such as phenoxydiethyleneglycol (meth)acrylate, phenoxypolyethyleneglycol (meth)acrylate, nonylphenoxydiethyleneglycol (meth)acrylate and nonylphenoxypolyethyleneglycol (meth)acrylate are also included.
- monofunctional (meth)acrylic acid ester compounds include tetrahydrofurfuryl (meth)acrylate, alkoxylated tetrahydrofurfuryl (meth)acrylate, cyclic trimethylolpropane formal (meth)acrylate, 3-ethyl-3- (Meth)acrylates having a heterocyclic structure such as oxetanylmethyl (meth)acrylate, various imide (meth)acrylates, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoro Propyl (meth)acrylate, 1H,1H,5H-octafluoropentyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, 2-(meth)acryloyloxyethyl succinate, 2-( meth) acryloyloxyethyl hexahydro
- bifunctional (meth)acrylate compounds include 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di( meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, Polypropylene glycol di(meth)acrylate, ethylene oxide-added bisphenol A di(meth)acrylate, propylene oxide-added bisphenol A
- tri- or higher functional ones include, for example, trimethylolpropane tri(meth)acrylate, ethylene oxide-added trimethylolpropane tri(meth)acrylate, propylene oxide-added trimethylolpropane tri(meth) ) acrylate, caprolactone-modified trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethylene oxide-added isocyanuric acid tri(meth)acrylate, glycerin tri(meth)acrylate, propylene oxide-added glycerin tri(meth)acrylate, tris (Meth)acryloyloxyethyl phosphate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate
- Examples of the epoxy (meth)acrylate include those obtained by reacting an epoxy compound with (meth)acrylic acid.
- the reaction between the epoxy compound and (meth)acrylic acid is preferably carried out in the presence of a basic catalyst or the like according to a conventional method.
- the epoxy (meth)acrylate may be monofunctional or polyfunctional such as bifunctional, but polyfunctional is preferred, and bifunctional is more preferred.
- Examples of epoxy compounds that are raw materials for synthesizing the epoxy (meth)acrylate include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and 2,2′-diallylbisphenol A type epoxy resin.
- urethane (meth)acrylate for example, a product obtained by reacting an isocyanate compound with a (meth)acrylic acid derivative having a hydroxyl group can be used.
- a catalytic amount of a tin-based compound or the like for the reaction between the isocyanate compound and the (meth)acrylic acid derivative, it is preferable to use a catalytic amount of a tin-based compound or the like as a catalyst.
- the urethane (meth)acrylate may be monofunctional or polyfunctional such as bifunctional, but bifunctional is preferred.
- isocyanate compounds used to obtain urethane (meth)acrylates include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4, 4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris ( Polyisocyanate compounds such as isocyanatophenyl)thiophosphate, tetramethylxylylene diisocyanate, 1,6,11-undecane triisocyanate and the like can be mentioned.
- MDI diisocyanate
- isocyanate compound a chain-extended polyisocyanate compound obtained by reacting a polyol with an excess isocyanate compound can also be used.
- polyols include ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone diol.
- Examples of (meth)acrylic acid derivatives having a hydroxyl group include dihydric alcohols such as ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol.
- dihydric alcohols such as ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol.
- Examples of commercially available urethane (meth)acrylates include M-1100, M-1200, M-1210, M-1600 (all manufactured by Toagosei Co., Ltd.), EBECRYL230, EBECRYL270, EBECRYL8402, EBECRYL8411, EBECRYL8412 ⁇ EBECRYL8413 ⁇ EBECRYL8804 ⁇ EBECRYL8803 ⁇ EBECRYL8807 ⁇ EBECRYL9270 ⁇ EBECRYL210 ⁇ EBECRYL4827 ⁇ EBECRYL6700 ⁇ EBECRYL220 ⁇ EBECRYL2220( ⁇ ) ⁇ UN-9000H ⁇ UN-9000A ⁇ UN-7100 ⁇ Resin UN-1255, Artresin UN-330, Artresin UN-3320HB, Artresin UN-1200TPK, Artresin SH-500B (all manufactured by Neagari Kogyo Co., Ltd.), U-2HA, U-2PHA, U-3HA, U -4HA, U-6H, U-6
- radically polymerizable compounds other than those mentioned above can also be used as appropriate.
- Other radically polymerizable compounds include, for example, N,N-dimethyl(meth)acrylamide, N-(meth)acryloylmorpholine, N-hydroxyethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N- (Meth)acrylamide compounds such as isopropyl (meth)acrylamide and N,N-dimethylaminopropyl (meth)acrylamide, vinyls such as styrene, ⁇ -methylstyrene, N-vinyl-2-pyrrolidone and N-vinyl- ⁇ -caprolactam compounds and the like.
- the (meth)acrylic acid ester compound is preferably a monofunctional (meth)acrylic acid ester compound. It is more preferable to include at least one selected.
- a radically polymerizable compound it is also preferable to use a monofunctional (meth)acrylate compound and a urethane (meth)acrylate together.
- the content of the radically polymerizable compound is preferably 5 parts by mass with respect to 100 parts by mass of the total amount of the urethane prepolymer and the radically polymerizable compound. It is more than 70 mass parts or less.
- the content of the radically polymerizable compound is equal to or higher than the above lower limit, it is possible to appropriately impart photocurability to the moisture-curable adhesive composition and to improve the above-described shape retention. In addition, it becomes easier to improve the applicability of the adhesive composition.
- the amount of urethane prepolymer can be increased to a certain amount or more, and by making the urethane prepolymer moisture-curable, appropriate moisture-curable adhesive composition can be imparted.
- the content of the radical polymerizable compound is more preferably 10 parts by mass or more and 60 parts by mass or less, still more preferably 20 parts by mass or more and 50 parts by mass or less, and even more preferably 25 parts by mass or more and 45 parts by mass or less. is.
- the total amount of the urethane prepolymer and the radically polymerizable compound is not particularly limited, but is preferably 70% by mass or more, more preferably 75% by mass or more and 97% by mass or less, and even more preferably, based on the total amount of the moisture-curable adhesive composition. is 80% by mass or more and 95% by mass or less.
- the moisture-curable adhesive composition of the present invention contains a radically polymerizable compound, it preferably further contains a photopolymerization initiator.
- a photopolymerization initiator By containing a photopolymerization initiator, it is possible to appropriately impart photocurability to the moisture-curable adhesive composition.
- photopolymerization initiators include benzophenone-based compounds, acetophenone-based compounds, acylphosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, benzoin ether-based compounds, and thioxanthone.
- Examples of commercially available photopolymerization initiators include IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 784, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, Lucirin TPO (all manufactured by BASF), benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether (both manufactured by Tokyo Kasei Kogyo Co., Ltd.), and the like.
- the content of the photopolymerization initiator in the moisture-curable adhesive composition is preferably 0.01 parts by mass or more and 10 parts by mass or less, more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the radically polymerizable compound. It is 5 parts by mass or less.
- the content of the photopolymerization initiator is within these ranges, the resulting moisture-curable adhesive composition has excellent photocurability and storage stability.
- the photoradical polymerizable compound is appropriately cured, and the adhesive strength tends to be improved.
- the moisture-curable adhesive composition of the present invention may contain fillers.
- a filler By containing a filler, the moisture-curable adhesive composition of the present invention has suitable thixotropic properties, which facilitates good shape retention after application.
- a particulate filler may be used as the filler.
- Preferred fillers include inorganic fillers such as silica, talc, titanium oxide, zinc oxide, and calcium carbonate. Among these, silica is preferable because the moisture-curable adhesive composition has excellent ultraviolet transmittance.
- the filler may be subjected to hydrophobic surface treatment such as silylation treatment, alkylation treatment, and epoxidation treatment.
- a filler may be used individually by 1 type, and 2 or more types may be used in combination.
- the content of the filler is preferably 0.5 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 25 parts by mass or less, still more preferably 2 parts by mass with respect to 100 parts by mass of the moisture-curable adhesive composition. It is at least 15 parts by mass and no more than 15 parts by mass.
- the moisture-curable adhesive composition of the present invention contains a moisture-curing accelerating catalyst, a coupling agent such as a silane coupling agent, a titanate-based coupling agent, a zirconate-based coupling agent, and wax particles. , ionic liquids, colorants, expanded particles, expanded particles, reactive diluents, antioxidants, radical scavengers, and other additives.
- a moisture-hardening acceleration catalyst is a catalyst that accelerates the moisture-hardening reaction of a moisture-curable resin. By using a moisture-curing acceleration catalyst, the moisture-curable adhesive composition becomes more excellent in moisture-curing properties, making it easier to increase adhesive strength.
- Specific examples of moisture curing acceleration catalysts include amine-based compounds and metal-based catalysts.
- Examples of amine compounds include compounds having a morpholine skeleton such as di(methylmorpholino) diethyl ether, 4-morpholinopropyl morpholine, 2,2′-dimorpholino diethyl ether, bis(2-dimethylaminoethyl) ether, 1,2 -Dimethylamino group-containing amine compounds having two dimethylamino groups such as bis(dimethylamino)ethane, triethylamine, 1,4-diazabicyclo[2.2.2]octane, 2,6,7-trimethyl-1,4 -diazabicyclo[2.2.2]octane and the like.
- a morpholine skeleton such as di(methylmorpholino) diethyl ether, 4-morpholinopropyl morpholine, 2,2′-dimorpholino diethyl ether, bis(2-dimethylaminoethyl) ether, 1,2 -Dimethylamin
- metal-based catalysts examples include tin compounds such as di-n-butyltin dilaurate, di-n-butyltin diacetate and tin octylate; zinc compounds such as zinc octoate and zinc naphthenate; zirconium tetraacetylacetonate; copper naphthenate; Other metal compounds such as cobalt naphthenate are included.
- the moisture-curable adhesive composition contains a moisture-curing accelerating catalyst
- the content of the moisture-curing accelerating catalyst in the moisture-curable adhesive composition is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 8 parts by mass, still more preferably 0.3 to 5 parts by mass.
- the moisture-curable adhesive composition may be diluted with a solvent if necessary.
- each amount (parts by weight, % by weight) of the moisture-curable adhesive composition is based on the solid content, i.e., parts by weight excluding the solvent, weight means %.
- a mixer is used to prepare a urethane prepolymer, and, if necessary, a radically polymerizable compound, a photopolymerization initiator, a moisture curing acceleration catalyst, and a filler. and a method of mixing with other additives such as an agent and a coupling agent.
- mixers include homodispers, homomixers, universal mixers, planetary mixers (planetary stirring devices), kneaders, and three rolls.
- the cured product of the moisture-curable adhesive composition has a storage elastic modulus of 0.01 MPa or more and 50 MPa or less at an elongation of 25%.
- the moisture-curable adhesive composition has a storage elastic modulus of 0.01 MPa or more at an elongation of 25% of the cured product, so that cohesive failure is unlikely to occur even when shearing or the like is applied, and the adhesive strength is sufficiently high. can do.
- the pressure to 50 MPa or less, the elasticity of the cured product becomes appropriate, and the adhesive strength to various adherends can be easily improved.
- the storage elastic modulus of the cured product of the moisture-curable adhesive composition at an elongation rate of 25% is preferably 0.05 MPa or more, more preferably 0.1 MPa or more, from the viewpoint of improving adhesive strength to various adherends. 2 MPa or more is more preferable, 25 MPa or less is more preferable, 15 MPa or less is more preferable, and 8 MPa or less is even more preferable.
- the storage elastic modulus at 25% elongation of the cured product is the storage elastic modulus measured at 23° C. in a state in which the cured product is elongated by 25%.
- the storage elastic modulus of the cured product at an elongation of 25% can be measured by the following method.
- a moisture-curable adhesive composition is poured into a Teflon (registered trademark) mold having a width of 2 mm, a length of 10 mm, and a thickness of 1 mm, and cured to obtain a cured sample.
- the obtained cured body sample is pulled up to 100% elongation using a tensile tester, and the storage elastic modulus at 25% elongation is determined from the resulting tensile curve.
- the measurement conditions are 25° C. and a tensile speed of 50 mm/min.
- Curing of the moisture-curable adhesive composition for obtaining a cured product sample may be performed by the following method according to the curing mechanism, as long as the moisture-curable adhesive composition can be completely cured.
- UV-LED wavelength 365 nm
- Moisture hardening is carried out by leaving it to stand.
- the moisture-curable adhesive composition of the present invention is preferably cured and used as a cured product.
- the cured product is preferably obtained by curing a moisture-curable adhesive composition with at least moisture, and is preferably cured with light and moisture.
- the moisture-curable adhesive composition of the present invention is preferably used for bonding between adherends by being placed between the adherends and cured.
- the moisture-curable adhesive composition is cured by moisture, for example, by placing a moisture-curable adhesive composition between adherends, or a moisture-curable adhesive composition semi-cured by light irradiation as described later. It is preferable that the two adherends are adhered by the cured body.
- the moisture-curable adhesive composition of the present invention preferably has photocurability and is used as a light-moisture-curable adhesive composition. Therefore, the moisture-curable adhesive composition of the present invention is photo-cured by light irradiation to, for example, a B-stage state (semi-cured state), and then further cured by moisture to be fully cured before use. is preferred. For example, the moisture-curable adhesive composition is applied to one adherend, then photo-cured by light irradiation, for example, in a B-stage state, and the photo-cured moisture-curable adhesive composition is coated on the other. It is recommended that the adherends are superimposed and temporarily adhered to each other with an appropriate adhesive force.
- the moisture-curable adhesive composition in the B-stage state is completely cured by curing a moisture-curable resin such as a urethane prepolymer with moisture, and the moisture-curable adhesive composition is superimposed.
- the bodies are joined with sufficient adhesive strength.
- the moisture-curable adhesive composition contains a radically polymerizable compound, a certain thickness or more can be ensured even when the other adherend is superimposed in the B-stage state. Therefore, it is possible to maintain a constant interval between the adherends.
- the application of the moisture-curable adhesive composition to the adherend is preferably carried out, for example, with a dispenser, but is not particularly limited.
- the light to be irradiated during photocuring is not particularly limited as long as it is light that cures the radically polymerizable compound, but ultraviolet rays are preferable.
- the moisture-curable adhesive composition when completely cured by moisture, it may be left in the atmosphere for a predetermined period of time.
- the moisture-curable adhesive composition of the present invention is preferably used as an adhesive for electronic devices. Therefore, although the adherend is not particularly limited, it is preferably various parts constituting an electronic device. Examples of various parts that constitute an electronic device include electronic parts, substrates to which electronic parts are attached, semiconductor chips, and the like. Examples of electronic devices include, but are not limited to, display devices such as liquid crystal displays and organic EL displays. Further, the electronic device may be a portable electronic device or the like, or may be a large-sized electronic device or the like.
- the moisture-curable adhesive composition of the present invention can ensure high adhesive strength to various materials. Therefore, the material of the adherend is not particularly limited, and may be any of metal, glass, plastic, etc., and can be adhered to various types of plastics with high adhesive strength.
- the shape of the adherend is not particularly limited, and examples thereof include film-like, sheet-like, plate-like, panel-like, tray-like, rod-like, box-like, and housing-like shapes.
- the moisture-curable adhesive composition of the present invention is used in the interior of electronic equipment, for example, to bond substrates together to obtain assembled parts.
- the assembly part thus obtained has a first substrate, a second substrate, and the cured product of the present invention, wherein at least a portion of the first substrate is at least a portion of the second substrate. is joined through a hardened body.
- At least one electronic component is preferably attached to each of the first substrate and the second substrate.
- the second plate 12 is superimposed, and a weight of 100 g is allowed to stand thereon for 10 seconds in a state where there is no gap material, thereby applying a load of 0.04 MPa to the cured product in the photocured state. Acted for 10 seconds.
- the weight of 100 g was removed, and the sample 13 for evaluation was prepared by leaving it in an environment of 23° C. and 50 RH% for 3 days for moisture curing (main curing).
- SUS plates were used as the first and second plates 11 and 12.
- the prepared evaluation sample 13 is pulled at a speed of 12 mm / min in the shear direction S using a tensile tester in an environment of 20 to 25 ° C.
- ⁇ PMMA adhesion> The adhesive force was measured in the same manner as described above, except that polymethyl methacrylate resin plates (PMMA plates) were used as the first and second plates 11 and 12 instead of SUS plates.
- the measured adhesive strength was evaluated according to the following evaluation criteria. AA: 150 N or more A: 100 N or more and less than 150 N B: 80 N or more and less than 100 N C: less than 80 N
- urethane prepolymer 1 having isocyanate groups at both ends.
- the weight average molecular weight of the obtained urethane prepolymer 1 was 10,000.
- Components other than the moisture-curable urethane resin used in each example and comparative example were as follows.
- (Radical polymerizable compound) Acrylic 1: urethane acrylate, manufactured by Daicel Allnex, trade name “EBECRYL8411”, bifunctional, weight average molecular weight 12000, diluted with 20% by mass isobornyl acrylate (IBOA), urethane acrylate content 80% by mass
- Acrylic 2 Phenoxyethyl acrylate, manufactured by Kyoeisha Chemical Co., Ltd., trade name “Light acrylate PO-A”, monofunctional acrylic 3: Lauryl acrylate: manufactured by Kyoeisha Chemical Co., Ltd., trade name “Light acrylate LA”, monofunctional acrylic 4: Cyclohexyl acrylate: Osaka Organic, trade name "Viscoat #155" Filler: trimethylsilylated silica, trade name "R812" manufactured by Nippon Aerosil Co., Ltd., primary particle
- Examples 1 to 4 According to the compounding ratio shown in Table 1, each material was stirred at a temperature of 50°C with a planetary stirrer (manufactured by Thinky Co., Ltd., "Awatori Mixer"), and then at a temperature of 50°C with three ceramic rolls. They were uniformly mixed to obtain moisture-curable adhesive compositions of Examples 1-4 and Comparative Examples 1-3.
- a planetary stirrer manufactured by Thinky Co., Ltd., "Awatori Mixer
- the moisture-curable adhesive composition of each example contained a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule, and the content of the silicone skeleton was, on a mass basis, polycarbonate More urethane prepolymer was used than the backbone content. Therefore, in each example, the adhesiveness to adherends made of various materials was excellent.
- Comparative Examples 1 and 3 although polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule was contained, the content of the silicone skeleton portion was lower than the content of the polycarbonate skeleton portion on a mass basis. A prepolymer was used.
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Abstract
Description
また、特許文献3には、防湿絶縁処理剤として有用な一液湿気硬化型ポリウレタンコーティング剤として、有機ポリイソシアネートと、特定の分子量を有するポリカーボネートジオール、ポリエステルポリオール、及びシロキサン変性ポリオールを、所定の割合で反応させて得られるものが使用されることが開示されている。 For example, in Patent Document 1, a carboxyl group characterized by having a structure derived from a silicone-containing diol compound having a hydroxyl value of 5 to 200 mgKOH/g is used as a polyurethane used in solder resist ink or overcoat ink. A contained polyurethane is disclosed. Patent Document 2 describes a composition used for medical devices, implants, etc., containing at least one polysiloxane macrodiol and at least one polyether and/or polycarbonate macrodiol soft segment. A polyurethane elastomer composition is disclosed.
Further, Patent Document 3 describes a one-part moisture-curable polyurethane coating agent useful as a moisture-proof insulation agent, which is obtained by mixing an organic polyisocyanate, a polycarbonate diol having a specific molecular weight, a polyester polyol, and a siloxane-modified polyol in a predetermined ratio. It is disclosed that those obtained by reacting with are used.
[1]分子内にポリカーボネート骨格と、シリコーン骨格とを有するポリウレタンを含有するウレタンプレポリマーを含み、
前記ウレタンプレポリマーにおける、シリコーン骨格部分の含有量が、質量基準でポリカーボネート骨格部分の含有量よりも多い、湿気硬化型接着剤組成物。
[2]硬化物の伸び率25%における貯蔵弾性率が0.01MPa以上50MPa以下である、上記[1]に記載の湿気硬化型接着剤組成物。
[3]前記ウレタンプレポリマーが、湿気硬化性を有する、上記[1]又は[2]に記載の湿気硬化型接着剤組成物。
[4]前記ウレタンプレポリマーが、イソシアネート基を有する、上記[3]に記載の湿気硬化型接着剤組成物。
[5]前記ウレタンプレポリマーが、ポリカーボネートポリオール及びシリコーンポリオールを含むポリオール化合物と、ポリイソシアネート化合物の反応生成物であり、前記ポリオール化合物におけるシリコーンポリオールの配合量が、質量基準で、ポリカーボネートの配合量よりも多い上記[1]~[4]のいずれか1項に記載の湿気硬化型接着剤組成物。
[6]前記シリコーンポリオールがヒドロキシ基を2つ有するシリコーンジオールである、上記[5]に記載の湿気硬化型接着剤組成物。
[7]前記ポリカーボネートポリオールがポリカーボネートジオールである、上記[5]又は[6]に記載の湿気硬化型接着剤組成物。
[8]前記ポリイソシアネート化合物が、ジイソシアネート化合物である、上記[5]~[7]のいずれか1項に記載の湿気硬化型接着剤組成物。
[9]前記ポリオール化合物において、前記ポリカーボネートポリオールの配合量(PC)に対する、前記シリコーンポリオールの配合量(Si)の比(Si/PC)は、質量基準で、55/45以上95/5以下である、上記[5]~[8]のいずれか1項に記載の湿気硬化型接着剤組成物。
[10]前記ウレタンプレポリマーの重量平均分子量が、800以上20000以下である上記[1]~[9]のいずれか1項に記載の湿気硬化型接着剤組成物。
[11]ラジカル重合性化合物をさらに含有する上記[1]~[10]のいずれか1項に記載の湿気硬化型接着剤組成物。
[12]前記ラジカル重合性化合物が、(メタ)アクリロイル基を有する化合物を含む上記[11]に記載の湿気硬化型接着剤組成物。
[13]前記(メタ)アクリロイル基を有する化合物が、(メタ)アクリル酸エステル化合物、エポキシ(メタ)アクリレート、及びウレタン(メタ)アクリレートからなる群から選択される少なくとも1種である、上記[12]に記載の湿気硬化型接着剤組成物。
[14]前記(メタ)アクリル酸エステル化合物が、脂環式構造を有する(メタ)アクリル酸エステル化合物、芳香環を有する(メタ)アクリル酸エステル化合物、及びアルキル(メタ)アクリレートからなる群から選択される単官能の(メタ)アクリル酸エステル化合物を少なくとも1種含む、上記[13]に記載の湿気硬化型接着剤組成物。
[15]前記ラジカル重合性化合物の含有量は、ウレタンプレポリマーとラジカル重合性化合物の合計量100質量部に対して、5質量部以上70質量部以下である、上記[11]~[14]のいずれか1項に記載の湿気硬化型接着剤組成物。
[16]さらに光重合開始剤を含有する、上記[11]~[15]のいずれか1項に記載の湿気硬化型接着剤組成物。
[17]前記ウレタンプレポリマーにおける、前記ポリカーボネート骨格部分の含有量に対する、前記シリコーン骨格部分の含有量の質量基準の比が、55/45以上95/5以下である上記[1]~[16]のいずれか1項に記載の湿気硬化型接着剤組成物。
[18]前記ウレタンプレポリマーが、イソシアネート基を末端に有する、上記[1]~[17]のいずれか1項に記載の湿気硬化型接着剤組成物。
[19]ウレタンプレポリマー及びラジカル重合性化合物の合計量は、湿気硬化型接着剤組成物全量基準で、70質量%以上である、上記[1]~[18]のいずれか1項に記載の湿気硬化型接着剤組成物。
[20]上記[1]~[19]のいずれか1項に記載の湿気硬化型接着剤組成物の硬化体。
[21]上記[20]に記載の硬化体を含む電子機器。
[22]上記[1]~[19]のいずれか1項に記載の湿気硬化型接着剤組成物の被着体間を接着する用途への使用。
[23]前記被着体が、電子機器を構成する部品である上記[22]に記載の使用。 As a result of intensive studies, the present inventors have found that the above problems can be solved by including a urethane prepolymer having a specific skeleton portion in a certain content in a moisture-curable adhesive composition. I completed the present invention. That is, the present invention provides the following [1] to [23].
[1] A urethane prepolymer containing a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule,
A moisture-curable adhesive composition, wherein the content of the silicone skeleton portion in the urethane prepolymer is higher than the content of the polycarbonate skeleton portion on a mass basis.
[2] The moisture-curable adhesive composition according to [1] above, wherein the cured product has a storage elastic modulus of 0.01 MPa or more and 50 MPa or less at an elongation of 25%.
[3] The moisture-curable adhesive composition according to [1] or [2] above, wherein the urethane prepolymer is moisture-curable.
[4] The moisture-curable adhesive composition according to [3] above, wherein the urethane prepolymer has an isocyanate group.
[5] The urethane prepolymer is a reaction product of a polyol compound containing polycarbonate polyol and silicone polyol, and a polyisocyanate compound, and the amount of silicone polyol in the polyol compound is, on a mass basis, higher than the amount of polycarbonate. The moisture-curable adhesive composition according to any one of [1] to [4] above.
[6] The moisture-curable adhesive composition according to [5] above, wherein the silicone polyol is a silicone diol having two hydroxyl groups.
[7] The moisture-curable adhesive composition according to [5] or [6] above, wherein the polycarbonate polyol is a polycarbonate diol.
[8] The moisture-curable adhesive composition according to any one of [5] to [7] above, wherein the polyisocyanate compound is a diisocyanate compound.
[9] In the polyol compound, the ratio (Si/PC) of the compounding amount (Si) of the silicone polyol to the compounding amount (PC) of the polycarbonate polyol is 55/45 or more and 95/5 or less on a mass basis. The moisture-curable adhesive composition according to any one of [5] to [8] above.
[10] The moisture-curable adhesive composition according to any one of [1] to [9] above, wherein the urethane prepolymer has a weight average molecular weight of 800 or more and 20,000 or less.
[11] The moisture-curable adhesive composition according to any one of [1] to [10] above, further containing a radically polymerizable compound.
[12] The moisture-curable adhesive composition according to [11] above, wherein the radically polymerizable compound contains a compound having a (meth)acryloyl group.
[13] The above [12], wherein the compound having a (meth)acryloyl group is at least one selected from the group consisting of (meth)acrylic acid ester compounds, epoxy (meth)acrylates, and urethane (meth)acrylates. ] The moisture-curable adhesive composition according to .
[14] The (meth)acrylic acid ester compound is selected from the group consisting of a (meth)acrylic acid ester compound having an alicyclic structure, a (meth)acrylic acid ester compound having an aromatic ring, and an alkyl (meth)acrylate. The moisture-curable adhesive composition according to [13] above, which contains at least one monofunctional (meth)acrylic acid ester compound.
[15] The above [11] to [14], wherein the content of the radically polymerizable compound is 5 parts by mass or more and 70 parts by mass or less with respect to 100 parts by mass of the total amount of the urethane prepolymer and the radically polymerizable compound. The moisture-curable adhesive composition according to any one of .
[16] The moisture-curable adhesive composition according to any one of [11] to [15] above, further comprising a photopolymerization initiator.
[17] The above [1] to [16], wherein the ratio by mass of the content of the silicone skeleton portion to the content of the polycarbonate skeleton portion in the urethane prepolymer is 55/45 or more and 95/5 or less. The moisture-curable adhesive composition according to any one of .
[18] The moisture-curable adhesive composition according to any one of [1] to [17] above, wherein the urethane prepolymer has an isocyanate group at its terminal.
[19] The total amount of the urethane prepolymer and the radically polymerizable compound is 70% by mass or more based on the total amount of the moisture-curable adhesive composition, according to any one of [1] to [18] above. A moisture-curable adhesive composition.
[20] A cured product of the moisture-curable adhesive composition according to any one of [1] to [19] above.
[21] An electronic device comprising the cured product according to [20] above.
[22] Use of the moisture-curable adhesive composition according to any one of [1] to [19] above for bonding between adherends.
[23] The use according to [22] above, wherein the adherend is a part constituting an electronic device.
本発明の湿気硬化型接着剤組成物は、分子内にポリカーボネート骨格と、シリコーン骨格とを有するポリウレタンを含有するウレタンプレポリマーを含む。
本発明の湿気硬化型接着剤組成物は、湿気硬化性樹脂を含有することで湿気硬化性を有する。湿気硬化型接着剤組成物は、湿気硬化性樹脂を含有すれば、いかなる種類の湿気硬化性樹脂を使用してもよいが、以下で説明するとおり、上記ウレタンプレポリマーが湿気硬化性であることが好ましい。 <Moisture-curable adhesive composition>
The moisture-curable adhesive composition of the present invention contains a urethane prepolymer containing polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule.
The moisture-curable adhesive composition of the present invention has moisture-curable properties by containing a moisture-curable resin. Any type of moisture-curable resin may be used in the moisture-curable adhesive composition as long as it contains a moisture-curable resin. is preferred.
本発明で使用されるウレタンプレポリマーは、分子内にポリカーボネート骨格と、シリコーン骨格とを有するポリウレタンを含有する。本発明の湿気硬化性接着剤組成物は、ウレタンプレポリマーに機械強度が高いポリカーボネート骨格と、表面自由エネルギーが低いシリコーン骨格の両方を含有させることで、各種の被着体に対する濡れ性を確保しつつ、硬化体の機械強度が向上する。したがって、様々な種類の被着体に対して、高い接着力を確保できる。また、耐熱性が良好となり、高温環境下でも高い接着性を確保できる。
また、ウレタンプレポリマーは、湿気硬化性官能基を有することが好ましく、イソシアネート基を含有するウレタンプレポリマーであることがより好ましい。 [Urethane prepolymer]
The urethane prepolymer used in the present invention contains polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule. The moisture-curable adhesive composition of the present invention secures wettability to various adherends by incorporating both a polycarbonate skeleton with high mechanical strength and a silicone skeleton with low surface free energy into the urethane prepolymer. At the same time, the mechanical strength of the cured product is improved. Therefore, high adhesive strength can be ensured for various types of adherends. Moreover, heat resistance is improved, and high adhesiveness can be secured even in a high-temperature environment.
Moreover, the urethane prepolymer preferably has a moisture-curable functional group, and more preferably a urethane prepolymer containing an isocyanate group.
なお、ウレタンプレポリマーでは、後述する通り、原料であるポリオール化合物として、シリコーンポリオールとポリカーボネートポリオールの両方を使用することで、ポリカーボネート骨格と、シリコーン骨格が導入されるものである。したがって、本発明では、上記シリコーン骨格部分は、シリコーンポリオール由来の部分であり、ポリカーボネート骨格部分は、ポリカーボネートポリオール由来の部分である。また、シリコーン骨格とは、オルガノポリシロキサン骨格を意味する。 In addition, in the urethane prepolymer of the present invention, the content of the silicone skeleton portion is greater than the content of the polycarbonate skeleton portion on a mass basis. When the content of the silicone skeleton portion is large, the adhesive force to various types of adherends can be further improved.
In the urethane prepolymer, as described later, a polycarbonate skeleton and a silicone skeleton are introduced by using both a silicone polyol and a polycarbonate polyol as polyol compounds that are raw materials. Therefore, in the present invention, the silicone skeleton portion is a portion derived from a silicone polyol, and the polycarbonate skeleton portion is a portion derived from a polycarbonate polyol. Moreover, a silicone skeleton means an organopolysiloxane skeleton.
また、ウレタンプレポリマーを得るために使用されるポリオール化合物は、ジオール化合物であり、かつポリイソシアネート化合物はジイソシアネート化合物であることが好ましい。したがって、ウレタンプレポリマーを構成するポリウレタンは、イソシアネート基を2つ有することが好ましい。また、各イソシアネート基は、分子の末端に含有されることが好ましい。 As described above, the polyurethane constituting the urethane prepolymer contains isocyanate groups by increasing [NCO]/[OH], and preferably contains a plurality of isocyanate groups in the molecule.
Moreover, the polyol compound used to obtain the urethane prepolymer is preferably a diol compound, and the polyisocyanate compound is preferably a diisocyanate compound. Therefore, the polyurethane constituting the urethane prepolymer preferably has two isocyanate groups. Also, each isocyanate group is preferably contained at the end of the molecule.
なお、上記の通り、シリコーン骨格部分は、シリコーンポリオール由来の部分であり、ポリカーボネート骨格部分は、ポリカーボネートポリオール由来の部分である。そのため、ウレタンプレポリマーにおける、ポリカーボネート骨格部分の含有量に対する、シリコーン骨格部分の含有量の質量基準の比の好適な範囲は、上記した比(Si/PC)で述べたとおりとなる。 Here, in the polyol compound used as the raw material, the ratio (Si/PC) of the compounding amount (Si) of the silicone polyol to the compounding amount (PC) of the polycarbonate polyol should be greater than 50/50 on a mass basis. , preferably 55/45 or more and 95/5 or less, more preferably 60/40 or more and 90/10 or less, and still more preferably 70/30 or more and 85/15 or less. By setting the blending ratio within the above range, the moisture-curable adhesive composition has even better adhesion to various types of adherends.
In addition, as described above, the silicone skeleton portion is a portion derived from a silicone polyol, and the polycarbonate skeleton portion is a portion derived from a polycarbonate polyol. Therefore, the preferred range of the mass-based ratio of the content of the silicone skeleton portion to the content of the polycarbonate skeleton portion in the urethane prepolymer is as described in the above ratio (Si/PC).
ポリカーボネートポリオール及びシリコーンポリオール以外のポリオール(他のポリオール)の配合割合は、全ポリオール化合物に対して、好ましくは30質量%以下、より好ましくは20質量%以下、さらに好ましくは10質量%以下、最も好ましくは0質量%である。
したがって、ウレタンプレポリマーは、シリコーン骨格部分及びポリカーボネート骨格以外にも、他のポリオール由来の部分を有してもよく、ウレタンプレポリマーにおける他のポリオール由来の部分の含有割合の好適な範囲は、上記した他のポリオール由来の配合割合と同じである。 Moreover, the polyol compound used as a raw material may consist of a polycarbonate polyol and a silicone polyol, but may contain polyols other than these as long as the effects of the present invention are not impaired. For example, the urethane prepolymer may be a reaction product of polycarbonate polyols, silicone polyols, and mixtures with other polyols and polyisocyanate compounds.
The blending ratio of polyols other than polycarbonate polyols and silicone polyols (other polyols) is preferably 30% by mass or less, more preferably 20% by mass or less, still more preferably 10% by mass or less, and most preferably 10% by mass or less, based on the total polyol compound. is 0% by mass.
Therefore, the urethane prepolymer may have other polyol-derived moieties in addition to the silicone skeleton and the polycarbonate skeleton, and the preferred range of the content of the other polyol-derived moieties in the urethane prepolymer is the above. It is the same as the blending ratio derived from other polyols.
ただし、2種以上のウレタンプレポリマーは、いずれか1種が、原料となるポリオール化合物として、ポリカーボネートポリオールと、シリコーンポリオールの両方を使用すればよく、全てのウレタンプレポリマーにおいて、ポリカーボネートポリオールと、シリコーンポリオールの両方を使用する必要はない。 The urethane prepolymer may be used singly or as a mixture of two or more. When two or more types of urethane prepolymers are used, each urethane prepolymer is preferably a reaction product obtained by reacting a polyol compound with a polyisocyanate compound. For example, at least one of the polyol compound and the polyisocyanate compound used as raw materials may be different from each other. Even when two or more kinds of urethane prepolymers are used, it is preferable that the polyol compound used as a raw material in each urethane prepolymer contains both a polycarbonate polyol and a silicone polyol.
However, any one of the two or more urethane prepolymers may use both polycarbonate polyol and silicone polyol as raw material polyol compounds. It is not necessary to use both polyols.
シリコーンポリオールは、オルガノポリシロキサン骨格を有し、ヒドロキシ基を有するヒドロキシ基変性オルガノポリシロキサン化合物が挙げられる。また、シリコーンポリオールはヒドロキシ基を2つ有するシリコーンジオールが好ましい。
ヒドロキシ基変性オルガノポリシロキサン化合物の具体例としては、オルガノポリシロキサン骨格を有し、その両末端にヒドロキシ基を有する化合物、オルガノポリシロキサン骨格を有し、その片末端にヒドロキシル基を2つ有する化合物などが挙げられる。
末端のヒドロキシ基は、オルガノポリシロキサン骨格を構成するSi原子に直接結合してもよいが、炭化水素基又はエーテル結合を有する炭化水素基を介して結合してもよい。炭化水素基は、例えば炭素数2~50程度、好ましくは炭素数2~30程度である。
シリコーンポリオールは、1種単独で用いてもよいし、2種以上を組み合わせて用いてもよい。 (silicone polyol)
Examples of silicone polyols include hydroxy group-modified organopolysiloxane compounds having an organopolysiloxane skeleton and hydroxy groups. Moreover, the silicone polyol is preferably a silicone diol having two hydroxyl groups.
Specific examples of hydroxy group-modified organopolysiloxane compounds include a compound having an organopolysiloxane skeleton and hydroxyl groups at both ends thereof, and a compound having an organopolysiloxane skeleton and two hydroxyl groups at one end thereof. etc.
The terminal hydroxy group may be directly bonded to the Si atom constituting the organopolysiloxane skeleton, or may be bonded via a hydrocarbon group or a hydrocarbon group having an ether bond. The hydrocarbon group has, for example, about 2 to 50 carbon atoms, preferably about 2 to 30 carbon atoms.
Silicone polyols may be used singly or in combination of two or more.
ポリカーボネートポリオールとしては、ポリカーボネートジオールが好ましく、ポリカーボネートジオールの具体例としては、以下の式(1)で表される化合物が挙げられる。
式(1)においてRは炭素数4以上16以下の二価の炭化水素基、nは2以上500以下の整数である。 (polycarbonate polyol)
Polycarbonate diols are preferred as polycarbonate polyols, and specific examples of polycarbonate diols include compounds represented by the following formula (1).
In formula (1), R is a divalent hydrocarbon group having 4 or more and 16 or less carbon atoms, and n is an integer of 2 or more and 500 or less.
また、ポリカーボネートポリオールに含まれるRは、1種単独で使用してよいし、2種以上を併用してもよい。炭素数4以上16以下の二価の炭化水素基を2種以上併用する場合には、少なくとも一部が炭素数6以上16以下の鎖状の脂肪族飽和炭化水素基であることが好ましい。ここで、炭素数6以上16以下の鎖状の脂肪族飽和炭化水素基は、好ましくは炭素数6以上12以下であり、さらに好ましくは炭素数6以上10以下である。炭素数4以上16以下の二価の炭化水素基を2種以上併用し、少なくとも一部が炭素数6以上16以下の鎖状の脂肪族飽和炭化水素基である場合には、さらに炭素数4又は5の二価の炭化水素基を含むことが好ましい。
Rの具体例としては、テトラメチレン基、ペンチレン基、ヘキサメチレン基、ヘプタメチレン基、オクタメチレン基、ノナメチレン基、デカメチレン基などの直鎖状であってもよいし、例えば3-メチルペンチレン基などのメチルペンチレン基、メチルオクタメチレン基などの分岐状であってもよい。一分子中における複数のRは、互いに同一であってもよいし、異なっていてもよい。さらに、弾性率を一定値以上とする観点からRは分岐状の脂肪族飽和炭化水素基を含むことが好ましく、耐候性の観点からはRは直鎖状の脂肪族飽和炭化水素基を含むことが好ましい。ポリカーボネートポリオールにおけるRは分岐状と直鎖状のRが併用されていてもよい。
ポリカーボネートポリオールは、1種単独で用いてもよいし、2種以上を組み合わせて用いてもよい。 In formula (1), R is preferably an aliphatic saturated hydrocarbon group. When R is an aliphatic saturated hydrocarbon group, the heat resistance tends to be good. In addition, yellowing or the like due to heat deterioration or the like is less likely to occur, and weather resistance is improved. Although R composed of an aliphatic saturated hydrocarbon group may have a cyclic structure, it preferably has a chain structure from the viewpoint of easily improving flexibility and the like. In addition, R in the chain structure may be linear or branched. n is preferably 5 or more and 200 or less, more preferably 5 or more and 100 or less, and further preferably 5 or more and 50 or less. Alternatively, two or more types may be used in combination. When two or more divalent hydrocarbon groups having 4 to 16 carbon atoms are used in combination, at least a portion thereof is preferably a chain aliphatic saturated hydrocarbon group having 6 to 16 carbon atoms. Here, the chain aliphatic saturated hydrocarbon group having 6 or more and 16 or less carbon atoms preferably has 6 or more and 12 or less carbon atoms, more preferably 6 or more and 10 or less carbon atoms. When two or more kinds of divalent hydrocarbon groups having 4 to 16 carbon atoms are used in combination, and at least a part thereof is a chain aliphatic saturated hydrocarbon group having 6 to 16 carbon atoms, further 4 carbon atoms or 5 divalent hydrocarbon groups.
Specific examples of R may be linear groups such as a tetramethylene group, pentylene group, hexamethylene group, heptamethylene group, octamethylene group, nonamethylene group, decamethylene group, and, for example, a 3-methylpentylene group. It may be branched such as a methylpentylene group such as a methylpentylene group or a methyloctamethylene group. Plural R's in one molecule may be the same or different. Furthermore, from the viewpoint of increasing the elastic modulus to a certain value or more, R preferably contains a branched saturated aliphatic hydrocarbon group, and from the viewpoint of weather resistance, R contains a linear saturated aliphatic hydrocarbon group. is preferred. Branched R and linear R may be used in combination in the polycarbonate polyol.
Polycarbonate polyols may be used singly or in combination of two or more.
ウレタンプレポリマーの原料となるポリイソシアネート化合物としては、脂肪族ポリイソシアネート化合物、芳香族ポリイソシアネート化合物が挙げられる。
脂肪族ポリイソシアネート化合物としては、例えば、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、リジンジイソシアネート、ノルボルナンジイソシアネート、トランスシクロヘキサン-1,4-ジイソシアネート、イソホロンジイソシアネート、水添キシリレンジイソシアネート、水添ジフェニルメタンジイソシアネート、シクロヘキサンジイソシアネート、ビス(イソシアネートメチル)シクロヘキサン、ジシクロヘキシルメタンジイソシアネート等が挙げられる。脂肪族ポリイソシアネート化合物は、これらを多量化したものなどであってもよい。
芳香族ポリイソシアネート化合物としては、例えば、ジフェニルメタンジイソシアネート、ジフェニルメタンジイソシアネートの液状変性物、トリレンジイソシアネート、ナフタレン-1,5-ジイソシアネート等が挙げられる。芳香族ポリイソシアネート化合物は、これらを多量化したものでもあってもよく、ポリメリックMDIなどでもよい。
また、ポリイソシアネート化合物は、ジイソシアネート化合物であることが好ましい。
ポリイソシアネート化合物は、1種単独で用いられてもよいし、2種以上を組み合わせて用いられてもよい。 (Polyisocyanate compound)
Examples of polyisocyanate compounds used as raw materials for urethane prepolymers include aliphatic polyisocyanate compounds and aromatic polyisocyanate compounds.
Examples of aliphatic polyisocyanate compounds include hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, lysine diisocyanate, norbornane diisocyanate, transcyclohexane-1,4-diisocyanate, isophorone diisocyanate, hydrogenated xylylene diisocyanate, hydrogenated diphenylmethane diisocyanate, and cyclohexane diisocyanate. , bis(isocyanatomethyl)cyclohexane, dicyclohexylmethane diisocyanate, and the like. Aliphatic polyisocyanate compounds may be those obtained by increasing these.
Examples of aromatic polyisocyanate compounds include diphenylmethane diisocyanate, liquid modified diphenylmethane diisocyanate, tolylene diisocyanate, and naphthalene-1,5-diisocyanate. The aromatic polyisocyanate compound may be a multimer of these compounds, polymeric MDI, or the like.
Also, the polyisocyanate compound is preferably a diisocyanate compound.
A polyisocyanate compound may be used individually by 1 type, and may be used in combination of 2 or more type.
ウレタンプレポリマーの重量平均分子量は、より好ましくは1500以上、さらに好ましくは2000以上であり、また、より好ましくは18000以下、さらに好ましくは15000以下である。
なお、本明細書において重量平均分子量は、ゲルパーミエーションクロマトグラフィー(GPC)で測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による重量平均分子量を測定する際のカラムとしては、Shodex LF-804(昭和電工社製)が挙げられる。また、GPCで用いる溶媒としては、テトラヒドロフランが挙げられる。 Although the weight average molecular weight of the urethane prepolymer is not particularly limited, it is preferably 800 or more and 20,000 or less. By setting the weight-average molecular weight within the above range, it is possible to adjust the elastic modulus of the cured product within an appropriate range while improving the applicability of the moisture-curable adhesive composition.
The weight average molecular weight of the urethane prepolymer is more preferably 1500 or more, more preferably 2000 or more, and more preferably 18000 or less, still more preferably 15000 or less.
In addition, in this specification, a weight average molecular weight is a value which measures by a gel permeation chromatography (GPC), and is calculated|required by polystyrene conversion. Shodex LF-804 (manufactured by Showa Denko KK) can be used as a column for measuring the weight average molecular weight in terms of polystyrene by GPC. Moreover, tetrahydrofuran is mentioned as a solvent used in GPC.
本発明の湿気硬化型接着剤組成物は、ラジカル重合性化合物を含有することが好ましい。本発明の湿気硬化型接着剤組成物は、ラジカル重合性化合物を含有することで、光硬化性が付与され、光湿気硬化型とすることができる。また、光硬化後かつ湿気硬化前の半硬化状態において、一定以上の硬度を有し、形状保持性を確保しやすくなる。半硬化状態での形状保持性が確保できると、湿気硬化型接着剤組成物から形成された硬化体により被着体間に一定の間隔を確保しやすくなる。
また、湿気硬化型接着剤組成物は、ラジカル重合性化合物を含有することで、光照射するだけで一定の接着力が付与されるので、光硬化後かつ湿気硬化前の半硬化状態においても一定以上の接着力を確保できる。 [Radical polymerizable compound]
The moisture-curable adhesive composition of the present invention preferably contains a radically polymerizable compound. By containing a radically polymerizable compound, the moisture-curable adhesive composition of the present invention is imparted with photo-curability, and can be a light-moisture-curable adhesive composition. In addition, in a semi-cured state after photocuring and before moisture curing, it has a hardness of at least a certain level, making it easy to ensure shape retention. If the shape retainability in the semi-cured state can be secured, it becomes easier to secure a constant space between the adherends by the cured body formed from the moisture-curable adhesive composition.
In addition, since the moisture-curable adhesive composition contains a radically polymerizable compound, a certain amount of adhesive strength is imparted only by light irradiation. It is possible to secure the above adhesion strength.
上記したものの中では、反応性の観点から、(メタ)アクリロイル基が好適であり、したがって、ラジカル重合性化合物は、(メタ)アクリロイル基を有する化合物(以下、「(メタ)アクリル化合物」ともいう)が好適である。 The radically polymerizable compound is not particularly limited as long as it is a radically polymerizable compound having photopolymerizability, and is a compound having a radically polymerizable functional group in the molecule. A compound having an unsaturated double bond is suitable as the radically polymerizable functional group, and the radically polymerizable functional group includes a (meth)acryloyl group, a vinyl group, a styryl group, an allyl group, and the like.
Among the above, a (meth)acryloyl group is preferable from the viewpoint of reactivity. Therefore, the radically polymerizable compound is a compound having a (meth)acryloyl group (hereinafter, also referred to as "(meth)acrylic compound" ) is preferred.
また、本明細書において、「(メタ)アクリロイル基」は、アクリロイル基又は(メタ)アクリロイル基を意味し、「(メタ)アクリレート」はアクリレート又はメタクリレートを意味し、他の類似する用語も同様である。 Specific examples of (meth)acrylic compounds include (meth)acrylic acid ester compounds, epoxy (meth)acrylates, urethane (meth)acrylates, and the like. In addition, urethane (meth)acrylate does not have a residual isocyanate group.
In the present specification, "(meth)acryloyl group" means acryloyl group or (meth)acryloyl group, "(meth)acrylate" means acrylate or methacrylate, and the same applies to other similar terms. be.
(メタ)アクリル酸エステル化合物のうち単官能のものとしては、例えば、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、n-ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、t-ブチル(メタ)アクリレート、n-オクチル(メタ)アクリレート、イソオクチル(メタ)アクリレート、2-エチルヘキシル(メタ)アクリレート、イソノニル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、イソミリスチル(メタ)アクリレート、ステアリル(メタ)アクリレートなどのアルキル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、4-tert-ブチルシクロヘキシル(メタ)アクリレート、3,3,5-トリメチルシクロヘキシル(メタ)アクリレート、イソボルニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート等の脂環式構造を有する(メタ)アクリレート、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、2-ヒドロキシブチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレートなどのヒドロキシアルキル(メタ)アクリレート、2-メトキシエチル(メタ)アクリレート、2-エトキシエチル(メタ)アクリレート、2-ブトキシエチル(メタ)アクリレートなどのアルコキシアルキル(メタ)アクリレート、メトキシエチレングリコール(メタ)アクリレート、エトキシエチレングリコール(メタ)アクリレートなどのアルコキシエチレングリコール(メタ)アクリレート、メトキシジエチレングリコール(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート、メトキシポリエチレングリコール(メタ)アクリレート、エチルカルビトール(メタ)アクリレート、エトキシジエチレングリコール(メタ)アクリレート、エトキシトリエチレングリコール(メタ)アクリレート、エトキシポリエチレングリコール(メタ)アクリレートなどのポリオキシエチレン系(メタ)アクリレートなどが挙げられる。 The (meth)acrylic acid ester compound may be monofunctional, bifunctional, or trifunctional or more.
Examples of monofunctional (meth)acrylate compounds include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isononyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, isomyristyl (meth)acrylates, alkyl (meth)acrylates such as stearyl (meth)acrylate, cyclohexyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, isobornyl ( meth)acrylates, (meth)acrylates having an alicyclic structure such as dicyclopentenyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate , hydroxyalkyl (meth)acrylates such as 4-hydroxybutyl (meth)acrylate, alkoxyalkyl (meth)acrylates such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-butoxyethyl (meth)acrylate, etc. ) acrylate, methoxyethylene glycol (meth)acrylate, alkoxyethylene glycol (meth)acrylate such as ethoxyethylene glycol (meth)acrylate, methoxydiethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate polyoxyethylene-based (meth)acrylates such as acrylates, ethyl carbitol (meth)acrylates, ethoxydiethylene glycol (meth)acrylates, ethoxytriethylene glycol (meth)acrylates, and ethoxypolyethylene glycol (meth)acrylates;
また、フェノキシジエチレングリコール(メタ)アクリレート、フェノキシポリエチレングリコール(メタ)アクリレート、ノニルフェノキシジエチレングリコール(メタ)アクリレート、ノニルフェノキシポリエチレングリコール(メタ)アクリレートなどのフェノキシポリオキシエチレン系(メタ)アクリレートなども挙げられる。 In addition, the (meth)acrylic acid ester compound may have an aromatic ring. and phenoxyalkyl (meth)acrylates such as Furthermore, it may be a (meth)acrylate having a plurality of benzene rings such as a fluorene skeleton or a biphenyl skeleton, and specific examples thereof include fluorene-type (meth)acrylates and ethoxylated o-phenylphenol acrylates.
Phenoxypolyoxyethylene-based (meth)acrylates such as phenoxydiethyleneglycol (meth)acrylate, phenoxypolyethyleneglycol (meth)acrylate, nonylphenoxydiethyleneglycol (meth)acrylate and nonylphenoxypolyethyleneglycol (meth)acrylate are also included.
上記エポキシ(メタ)アクリレートを合成するための原料となるエポキシ化合物としては、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、2,2’-ジアリルビスフェノールA型エポキシ樹脂、水添ビスフェノール型エポキシ樹脂、プロピレンオキシド付加ビスフェノールA型エポキシ樹脂、レゾルシノール型エポキシ樹脂、ビフェニル型エポキシ樹脂、スルフィド型エポキシ樹脂、ジフェニルエーテル型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、ナフタレン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、オルトクレゾールノボラック型エポキシ樹脂、ジシクロペンタジエンノボラック型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂、ナフタレンフェノールノボラック型エポキシ樹脂、グリシジルアミン型エポキシ樹脂、アルキルポリオール型エポキシ樹脂、ゴム変性型エポキシ樹脂、グリシジルエステル化合物、ビスフェノールA型エピスルフィド樹脂等が挙げられる。 Examples of the epoxy (meth)acrylate include those obtained by reacting an epoxy compound with (meth)acrylic acid. Here, the reaction between the epoxy compound and (meth)acrylic acid is preferably carried out in the presence of a basic catalyst or the like according to a conventional method. The epoxy (meth)acrylate may be monofunctional or polyfunctional such as bifunctional, but polyfunctional is preferred, and bifunctional is more preferred.
Examples of epoxy compounds that are raw materials for synthesizing the epoxy (meth)acrylate include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, and 2,2′-diallylbisphenol A type epoxy resin. , hydrogenated bisphenol type epoxy resin, propylene oxide added bisphenol A type epoxy resin, resorcinol type epoxy resin, biphenyl type epoxy resin, sulfide type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol Novolak type epoxy resin, ortho-cresol novolak type epoxy resin, dicyclopentadiene novolak type epoxy resin, biphenyl novolak type epoxy resin, naphthalenephenol novolak type epoxy resin, glycidylamine type epoxy resin, alkyl polyol type epoxy resin, rubber modified type epoxy resin , glycidyl ester compounds, bisphenol A type episulfide resins, and the like.
ウレタン(メタ)アクリレートを得るために使用するイソシアネート化合物としては、例えば、イソホロンジイソシアネート、2,4-トリレンジイソシアネート、2,6-トリレンジイソシアネート、ヘキサメチレンジイソシアネート、トリメチルヘキサメチレンジイソシアネート、ジフェニルメタン-4,4’-ジイソシアネート(MDI)、水添MDI、ポリメリックMDI、1,5-ナフタレンジイソシアネート、ノルボルナンジイソシアネート、トリジンジイソシアネート、キシリレンジイソシアネート(XDI)、水添XDI、リジンジイソシアネート、トリフェニルメタントリイソシアネート、トリス(イソシアネートフェニル)チオフォスフェート、テトラメチルキシリレンジイソシアネート、1,6,11-ウンデカントリイソシアネート等のポリイソシアネート化合物が挙げられる。
また、イソシアネート化合物としては、ポリオールと過剰のイソシアネート化合物との反応により得られる鎖延長されたポリイソシアネート化合物も使用することができる。ここで、ポリオールとしては、例えば、エチレングリコール、プロピレングリコール、グリセリン、ソルビトール、トリメチロールプロパン、カーボネートジオール、ポリエーテルジオール、ポリエステルジオール、ポリカプロラクトンジオール等が挙げられる。 As urethane (meth)acrylate, for example, a product obtained by reacting an isocyanate compound with a (meth)acrylic acid derivative having a hydroxyl group can be used. Here, for the reaction between the isocyanate compound and the (meth)acrylic acid derivative, it is preferable to use a catalytic amount of a tin-based compound or the like as a catalyst. The urethane (meth)acrylate may be monofunctional or polyfunctional such as bifunctional, but bifunctional is preferred.
Examples of isocyanate compounds used to obtain urethane (meth)acrylates include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4, 4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris ( Polyisocyanate compounds such as isocyanatophenyl)thiophosphate, tetramethylxylylene diisocyanate, 1,6,11-undecane triisocyanate and the like can be mentioned.
As the isocyanate compound, a chain-extended polyisocyanate compound obtained by reacting a polyol with an excess isocyanate compound can also be used. Examples of polyols include ethylene glycol, propylene glycol, glycerin, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone diol.
これら観点から、ラジカル重合性化合物の上記含有量は、より好ましくは10質量部以上60質量部以下、さらに好ましくは20質量部以上50質量部以下、よりさらに好ましくは25質量部以上45質量部以下である。 When the moisture-curable adhesive composition contains a radically polymerizable compound, the content of the radically polymerizable compound is preferably 5 parts by mass with respect to 100 parts by mass of the total amount of the urethane prepolymer and the radically polymerizable compound. It is more than 70 mass parts or less. When the content of the radically polymerizable compound is equal to or higher than the above lower limit, it is possible to appropriately impart photocurability to the moisture-curable adhesive composition and to improve the above-described shape retention. In addition, it becomes easier to improve the applicability of the adhesive composition. On the other hand, by setting the amount to the above upper limit or less, the amount of urethane prepolymer can be increased to a certain amount or more, and by making the urethane prepolymer moisture-curable, appropriate moisture-curable adhesive composition can be imparted. can.
From these viewpoints, the content of the radical polymerizable compound is more preferably 10 parts by mass or more and 60 parts by mass or less, still more preferably 20 parts by mass or more and 50 parts by mass or less, and even more preferably 25 parts by mass or more and 45 parts by mass or less. is.
本発明の湿気硬化型接着剤組成物は、ラジカル重合性化合物を含有する場合、さらに光重合開始剤を含有することが好ましい。光重合開始剤を含有させることで、湿気硬化型接着剤組成物に光硬化性を適切に付与できる。
光重合開始剤としては、例えば、ベンゾフェノン系化合物、アセトフェノン系化合物、アシルフォスフィンオキサイド系化合物、チタノセン系化合物、オキシムエステル系化合物、ベンゾインエーテル系化合物、チオキサントン等が挙げられる。
上記光重合開始剤のうち市販されているものとしては、例えば、IRGACURE184、IRGACURE369、IRGACURE379、IRGACURE651、IRGACURE784、IRGACURE819、IRGACURE907、IRGACURE2959、IRGACURE OXE01、ルシリンTPO(いずれもBASF社製)、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル(いずれも東京化成工業社製)等が挙げられる。 [Photoinitiator]
When the moisture-curable adhesive composition of the present invention contains a radically polymerizable compound, it preferably further contains a photopolymerization initiator. By containing a photopolymerization initiator, it is possible to appropriately impart photocurability to the moisture-curable adhesive composition.
Examples of photopolymerization initiators include benzophenone-based compounds, acetophenone-based compounds, acylphosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, benzoin ether-based compounds, and thioxanthone.
Examples of commercially available photopolymerization initiators include IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 784, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, Lucirin TPO (all manufactured by BASF), benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether (both manufactured by Tokyo Kasei Kogyo Co., Ltd.), and the like.
本発明の湿気硬化型接着剤組成物は、充填剤を含有してもよい。充填剤を含有することにより、本発明の湿気硬化型接着剤組成物は、好適なチクソ性を有するものとなり、塗布後の形状保持性を良好にしやすくなる。充填剤としては、粒子状のものを使用すればよい。
充填剤としては、無機充填剤が好ましく、例えば、シリカ、タルク、酸化チタン、酸化亜鉛、炭酸カルシウム等が挙げられる。なかでも、湿気硬化型接着剤組成物が紫外線透過性に優れるものとなることから、シリカが好ましい。また、充填剤は、シリル化処理、アルキル化処理、エポキシ化処理等の疎水性表面処理がなされていてもよい。
充填剤は、1種単独で用いられてもよいし、2種以上が組み合わせて用いられてもよい。
充填剤の含有量は、湿気硬化型接着剤組成物100質量部に対して、好ましくは0.5質量部以上30質量部以下、より好ましくは1質量部以上25質量部以下、さらに好ましくは2質量部以上15質量部以下である。 [filler]
The moisture-curable adhesive composition of the present invention may contain fillers. By containing a filler, the moisture-curable adhesive composition of the present invention has suitable thixotropic properties, which facilitates good shape retention after application. A particulate filler may be used as the filler.
Preferred fillers include inorganic fillers such as silica, talc, titanium oxide, zinc oxide, and calcium carbonate. Among these, silica is preferable because the moisture-curable adhesive composition has excellent ultraviolet transmittance. In addition, the filler may be subjected to hydrophobic surface treatment such as silylation treatment, alkylation treatment, and epoxidation treatment.
A filler may be used individually by 1 type, and 2 or more types may be used in combination.
The content of the filler is preferably 0.5 parts by mass or more and 30 parts by mass or less, more preferably 1 part by mass or more and 25 parts by mass or less, still more preferably 2 parts by mass with respect to 100 parts by mass of the moisture-curable adhesive composition. It is at least 15 parts by mass and no more than 15 parts by mass.
金属系触媒としては、ジラウリル酸ジn-ブチルスズ、ジ酢酸ジn-ブチルスズ、オクチル酸スズ等のスズ化合物、オクチル酸亜鉛、ナフテン酸亜鉛等の亜鉛化合物、ジルコニウムテトラアセチルアセトナート、ナフテン酸銅、ナフテン酸コバルト等のその他の金属化合物が挙げられる。
湿気硬化型接着剤組成物が湿気硬化促進触媒を含有する場合、湿気硬化型接着剤組成物における湿気硬化促進触媒の含有量は、湿気硬化型接着剤組成物100質量部に対して、好ましくは0.1質量部以上10質量部以下、より好ましくは0.2質量部以上8質量部以下、さらに好ましくは0.3質量部以上5質量部以下である。 A moisture-hardening acceleration catalyst is a catalyst that accelerates the moisture-hardening reaction of a moisture-curable resin. By using a moisture-curing acceleration catalyst, the moisture-curable adhesive composition becomes more excellent in moisture-curing properties, making it easier to increase adhesive strength. Specific examples of moisture curing acceleration catalysts include amine-based compounds and metal-based catalysts. Examples of amine compounds include compounds having a morpholine skeleton such as di(methylmorpholino) diethyl ether, 4-morpholinopropyl morpholine, 2,2′-dimorpholino diethyl ether, bis(2-dimethylaminoethyl) ether, 1,2 -Dimethylamino group-containing amine compounds having two dimethylamino groups such as bis(dimethylamino)ethane, triethylamine, 1,4-diazabicyclo[2.2.2]octane, 2,6,7-trimethyl-1,4 -diazabicyclo[2.2.2]octane and the like.
Examples of metal-based catalysts include tin compounds such as di-n-butyltin dilaurate, di-n-butyltin diacetate and tin octylate; zinc compounds such as zinc octoate and zinc naphthenate; zirconium tetraacetylacetonate; copper naphthenate; Other metal compounds such as cobalt naphthenate are included.
When the moisture-curable adhesive composition contains a moisture-curing accelerating catalyst, the content of the moisture-curing accelerating catalyst in the moisture-curable adhesive composition is preferably 0.1 to 10 parts by mass, more preferably 0.2 to 8 parts by mass, still more preferably 0.3 to 5 parts by mass.
本発明では、湿気硬化型接着剤組成物の硬化物の伸び率25%における貯蔵弾性率が0.01MPa以上50MPa以下であることが好ましい。湿気硬化型接着剤組成物は、硬化物の伸び率25%における貯蔵弾性率が0.01MPa以上となることで、せん断などが作用されても凝集破壊が生じにくくなり、接着力を十分に高くすることができる。また、50MPa以下とすることで、硬化物の弾性を適度なものとして各種被着体に対する接着力を向上させやすくなる。
湿気硬化型接着剤組成物の硬化物の伸び率25%における貯蔵弾性率は、各種被着体に対する接着力を向上させる観点から、0.05MPa以上が好ましく、0.1MPa以上がより好ましく、0.2MPa以上がさらに好ましく、また、25MPa以下が好ましく、15MPa以下がより好ましく、8MPa以下がさらに好ましい。 [Storage modulus at elongation of 25%]
In the present invention, it is preferable that the cured product of the moisture-curable adhesive composition has a storage elastic modulus of 0.01 MPa or more and 50 MPa or less at an elongation of 25%. The moisture-curable adhesive composition has a storage elastic modulus of 0.01 MPa or more at an elongation of 25% of the cured product, so that cohesive failure is unlikely to occur even when shearing or the like is applied, and the adhesive strength is sufficiently high. can do. In addition, by setting the pressure to 50 MPa or less, the elasticity of the cured product becomes appropriate, and the adhesive strength to various adherends can be easily improved.
The storage elastic modulus of the cured product of the moisture-curable adhesive composition at an elongation rate of 25% is preferably 0.05 MPa or more, more preferably 0.1 MPa or more, from the viewpoint of improving adhesive strength to various adherends. 2 MPa or more is more preferable, 25 MPa or less is more preferable, 15 MPa or less is more preferable, and 8 MPa or less is even more preferable.
湿気硬化型接着剤組成物を、幅2mm、長さ10mm、厚み1mmのテフロン(登録商標)型に流し込み、硬化させることで硬化体サンプルを得る。得られた硬化体サンプルを、引張試験器を用いて伸び率100%まで引張り、得られた引張曲線から伸び率25%時の貯蔵弾性率を求める。なお、測定条件は、25℃、引張速度50mm/minである。
硬化体サンプルを得るための湿気硬化型接着剤組成物の硬化は、湿気硬化型接着剤組成物が全硬化できればよいが、その硬化メカニズムに応じて以下の方法で行うとよい。例えば、光湿気硬化型の場合には、UV-LED(波長365nm)を用いて、紫外線を1000mJ/cm2照射することによって光硬化させ、その後、23℃、50%RHの環境下に24時間放置することにより湿気硬化させることで行う。また、光硬化性を有さない湿気硬化型の場合には、光硬化の工程を省略する以外は、上記と同様に行うとよい。 In the present invention, the storage elastic modulus at 25% elongation of the cured product is the storage elastic modulus measured at 23° C. in a state in which the cured product is elongated by 25%. The storage elastic modulus of the cured product at an elongation of 25% can be measured by the following method.
A moisture-curable adhesive composition is poured into a Teflon (registered trademark) mold having a width of 2 mm, a length of 10 mm, and a thickness of 1 mm, and cured to obtain a cured sample. The obtained cured body sample is pulled up to 100% elongation using a tensile tester, and the storage elastic modulus at 25% elongation is determined from the resulting tensile curve. The measurement conditions are 25° C. and a tensile speed of 50 mm/min.
Curing of the moisture-curable adhesive composition for obtaining a cured product sample may be performed by the following method according to the curing mechanism, as long as the moisture-curable adhesive composition can be completely cured. For example, in the case of light moisture curing type, UV-LED (wavelength 365 nm) is used to photo-cure by irradiating 1000 mJ/cm 2 of ultraviolet rays, and then for 24 hours in an environment of 23 ° C. and 50% RH. Moisture hardening is carried out by leaving it to stand. Moreover, in the case of a moisture-curing type that does not have photo-curing properties, it is preferable to carry out in the same manner as described above, except that the step of photo-curing is omitted.
本発明の湿気硬化型接着剤組成物は、硬化され、硬化体として使用されるとよい。硬化体は、湿気硬化型接着剤組成物を少なくとも湿気により硬化させたものであるとよいが、光及び湿気により硬化されたものであることが好ましい。本発明の湿気硬化型接着剤組成物は、被着体間に配置させ硬化されることで、その被着体間を接合させるために使用するとよい。
湿気硬化型接着剤組成物は、例えば、被着体間に湿気硬化型接着剤組成物、又は後述する通り光照射により半硬化された湿気硬化型接着剤組成物を配置して、湿気により硬化された硬化体により、2つの被着体を接着させるとよい。 [Hardened body]
The moisture-curable adhesive composition of the present invention is preferably cured and used as a cured product. The cured product is preferably obtained by curing a moisture-curable adhesive composition with at least moisture, and is preferably cured with light and moisture. The moisture-curable adhesive composition of the present invention is preferably used for bonding between adherends by being placed between the adherends and cured.
The moisture-curable adhesive composition is cured by moisture, for example, by placing a moisture-curable adhesive composition between adherends, or a moisture-curable adhesive composition semi-cured by light irradiation as described later. It is preferable that the two adherends are adhered by the cured body.
例えば、湿気硬化型接着剤組成物は、一方の被着体に塗布し、その後、光照射により光硬化させ、例えばBステージ状態にし、その光硬化した湿気硬化型接着剤組成物の上に他方の被着体を重ね合わせ、被着体間を適度な接着力で仮接着させるとよい。その後、Bステージ状態の湿気硬化型接着剤組成物は、ウレタンプレポリマーなどの湿気硬化性樹脂を湿気により硬化させることで全硬化させ、湿気硬化型接着剤組成物を介して重ね合わされた被着体間が十分な接着力で接合される。
本発明では、湿気硬化型接着剤組成物がラジカル重合性化合物を含有する場合には、Bステージ状態で、他方の被着体が重ね合わされても、一定以上の厚みを確保できる。そのため、被着体間を一定の間隔に保持することができる。 Moreover, the moisture-curable adhesive composition of the present invention preferably has photocurability and is used as a light-moisture-curable adhesive composition. Therefore, the moisture-curable adhesive composition of the present invention is photo-cured by light irradiation to, for example, a B-stage state (semi-cured state), and then further cured by moisture to be fully cured before use. is preferred.
For example, the moisture-curable adhesive composition is applied to one adherend, then photo-cured by light irradiation, for example, in a B-stage state, and the photo-cured moisture-curable adhesive composition is coated on the other. It is recommended that the adherends are superimposed and temporarily adhered to each other with an appropriate adhesive force. After that, the moisture-curable adhesive composition in the B-stage state is completely cured by curing a moisture-curable resin such as a urethane prepolymer with moisture, and the moisture-curable adhesive composition is superimposed. The bodies are joined with sufficient adhesive strength.
In the present invention, when the moisture-curable adhesive composition contains a radically polymerizable compound, a certain thickness or more can be ensured even when the other adherend is superimposed in the B-stage state. Therefore, it is possible to maintain a constant interval between the adherends.
被着体の形状としては、特に限定されず、例えば、フィルム状、シート状、板状、パネル状、トレイ状、ロッド(棒状体)状、箱体状、筐体状等が挙げられる。 Moreover, the moisture-curable adhesive composition of the present invention can ensure high adhesive strength to various materials. Therefore, the material of the adherend is not particularly limited, and may be any of metal, glass, plastic, etc., and can be adhered to various types of plastics with high adhesive strength.
The shape of the adherend is not particularly limited, and examples thereof include film-like, sheet-like, plate-like, panel-like, tray-like, rod-like, box-like, and housing-like shapes.
<伸び率25%における貯蔵弾性率>
明細書記載の条件で、硬化体サンプルを得て、得られた硬化体サンプルについて明細書記載の方法により25℃で伸び率25%における貯蔵弾性率を測定した。なお、引張試験器としては、島津製作所社製の商品名「オートグラフAG-X」を使用した。 Various physical properties were measured and evaluated as follows.
<Storage modulus at 25% elongation>
A cured sample was obtained under the conditions described in the specification, and the storage elastic modulus at 25° C. and an elongation of 25% was measured by the method described in the specification for the obtained cured sample. As the tensile tester, a trade name "Autograph AG-X" manufactured by Shimadzu Corporation was used.
実施例及び比較例で得られた湿気硬化型樹脂組成物が光硬化性を有する場合には、以下のとおり実施した。図1(a)、(b)に示すように、実施例及び比較例で得られた湿気硬化型樹脂組成物10を、20~25℃の環境下、幅1.0±0.05mm、長さ25±2mm、及び厚さが0.2±0.05mmとなるように第1の板11に塗布した。塗布完了後1分以内に、UV-LED(波長365nm)を用いて、紫外線を1000mJ/cm2照射することによって、湿気硬化型接着剤組成物10を光硬化させた。その後、第2の板12を重ね合わせて、ギャップ材がない状態で、その上に100gの錘を10秒間静置させることで、光硬化した状態の硬化物に対して0.04MPaの荷重を10秒間作用させた。次いで、100gの錘を取り除き、3日間、23℃、50RH%の環境下に放置することにより湿気硬化(本硬化)させ、評価用サンプル13を作製した。なお、第1及び第2の板11、12としては、いずれもSUS板を使用した。
作製した評価用サンプル13を、20~25℃の環境下において、引張り試験機を用いて剪断方向Sに12mm/minの速度で引張り、第1の板11と第2の板12とが剥がれる際の強度を測定して接着力を測定した。測定された接着力により、以下の評価基準により評価した。
また、実施例及び比較例で得られた湿気硬化型樹脂組成物が光硬化性を有しない場合には、紫外線の照射による光硬化を省略した以外は、上記と同様に実施して接着力を測定し、以下の評価基準により評価した。
AA:90N以上
A:75N以上90N未満
B:65N以上75N未満
C:65N未満 <SUS Adhesion>
When the moisture-curable resin compositions obtained in Examples and Comparative Examples had photocurability, the following was carried out. As shown in FIGS. 1(a) and (b), the moisture-
The
In addition, when the moisture-curable resin compositions obtained in Examples and Comparative Examples do not have photocurability, the same procedure as described above was performed except that the photocuring by irradiation with ultraviolet rays was omitted. It was measured and evaluated according to the following evaluation criteria.
AA: 90 N or more A: 75 N or more and less than 90 N B: 65 N or more and less than 75 N C: less than 65 N
第1及び第2の板11、12としてSUS板の代わりに、ポリカーボネート板を使用した以外は、上記と同様に接着力を測定した。測定された接着力により、SUS接着性と同じ評価基準により評価した。 <PC adhesion>
The adhesive force was measured in the same manner as described above, except that polycarbonate plates were used as the first and
第1及び第2の板11、12としてSUS板の代わりに、ポリメタクリル酸メチル樹脂板(PMMA板)を使用した以外は、上記と同様に接着力を測定した。測定された接着力により、以下の評価基準により評価した。
AA:150N以上
A:100N以上150N未満
B:80N以上100N未満
C:80N未満 <PMMA adhesion>
The adhesive force was measured in the same manner as described above, except that polymethyl methacrylate resin plates (PMMA plates) were used as the first and
AA: 150 N or more A: 100 N or more and less than 150 N B: 80 N or more and less than 100 N C: less than 80 N
SUS接着性試験において評価用サンプルを作成する際、100gの錘を取り除いた後の湿気硬化型樹脂組成物10の厚みを測定することで評価した。評価基準は、以下のとおりである。
A:湿気硬化型樹脂組成物の厚みが0.1mm以上である。
C:湿気硬化型樹脂組成物の厚みが0.1mm未満である。 <Shape retention>
When preparing an evaluation sample in the SUS adhesion test, evaluation was performed by measuring the thickness of the moisture-
A: The thickness of the moisture-curable resin composition is 0.1 mm or more.
C: The thickness of the moisture-curable resin composition is less than 0.1 mm.
[合成例1]
ポリオール化合物として、80質量部のシリコーンジオール(JNC社製「polyol FM-4411」)及び20質量部のポリカーボネートジオール(クラレ社製「polyol C―1090」)と、0.01質量部のジブチル錫ジラウレートとを500mL容量のセパラブルフラスコに入れた。フラスコ内を真空下(20mmHg以下)、100℃で30分間撹拌して混合した。その後常圧とし、ポリイソシアネート化合物としてジフェニルメタンジイソシアネート(日曹商事社製、商品名「Pure MDI」)50質量部を入れ、80℃で3時間撹拌して反応させ、ポリカーボネート骨格とシリコーン骨格を有し、両末端がイソシアネート基であるウレタンプレポリマー1を得た。得られたウレタンプレポリマー1の重量平均分子量は10000であった。 Urethane prepolymers used in Examples and Comparative Examples were produced according to the following Synthesis Examples.
[Synthesis Example 1]
As polyol compounds, 80 parts by mass of silicone diol ("polyol FM-4411" manufactured by JNC), 20 parts by mass of polycarbonate diol ("polyol C-1090" manufactured by Kuraray Co., Ltd.), and 0.01 parts by mass of dibutyltin dilaurate. was placed in a 500 mL separable flask. The inside of the flask was stirred and mixed at 100° C. for 30 minutes under vacuum (20 mmHg or less). After that, the pressure is reduced to normal pressure, and 50 parts by mass of diphenylmethane diisocyanate (manufactured by Nisso Shoji Co., Ltd., trade name “Pure MDI”) is added as a polyisocyanate compound and stirred at 80 ° C. for 3 hours to react to have a polycarbonate skeleton and a silicone skeleton. , to obtain a urethane prepolymer 1 having isocyanate groups at both ends. The weight average molecular weight of the obtained urethane prepolymer 1 was 10,000.
ポリオール化合物の配合量を、シリコーンジオール85質量部及びポリカーボネートジオール15質量部に変更した以外は合成例1と同様に実施して、ポリカーボネート骨格とシリコーン骨格を有し、両末端がイソシアネート基であるウレタンプレポリマー2を得た。得られたウレタンプレポリマー2の重量平均分子量は9800であった。 [Synthesis Example 2]
In the same manner as in Synthesis Example 1, except that the amount of the polyol compound was changed to 85 parts by mass of silicone diol and 15 parts by mass of polycarbonate diol, a urethane having a polycarbonate skeleton and a silicone skeleton and having isocyanate groups at both ends was prepared. A prepolymer 2 was obtained. The weight average molecular weight of the resulting urethane prepolymer 2 was 9,800.
ポリオール化合物の配合量を、シリコーンジオール20質量部及びポリカーボネートジオール80質量部に変更した以外は合成例1と同様に実施して、ポリカーボネート骨格とシリコーン骨格を有し、両末端がイソシアネート基である湿気硬化性ウレタン樹脂(ウレタンプレポリマー3)を得た。得られたウレタンプレポリマー3の重量平均分子量は12000であった。 [Synthesis Example 3]
In the same manner as in Synthesis Example 1, except that the amount of the polyol compound was changed to 20 parts by mass of silicone diol and 80 parts by mass of polycarbonate diol, a moisture having a polycarbonate skeleton and a silicone skeleton and having isocyanate groups at both ends A curable urethane resin (urethane prepolymer 3) was obtained. The weight average molecular weight of the resulting urethane prepolymer 3 was 12,000.
ポリオール化合物としてシリコーンジオールを使用せずに、ポリオール化合物の配合をポリカーボネートジオール100質量部に変更した以外は合成例1と同様に実施して、ポリカーボネート骨格を有し、両末端がイソシアネート基であるウレタンプレポリマー4を得た。得られたウレタンプレポリマー4の重量平均分子量は14000であった。 [Synthesis Example 4]
A urethane having a polycarbonate skeleton and isocyanate groups at both ends was prepared in the same manner as in Synthesis Example 1, except that the polyol compound was changed to 100 parts by mass of a polycarbonate diol instead of using a silicone diol as the polyol compound. A prepolymer 4 was obtained. The weight average molecular weight of the resulting urethane prepolymer 4 was 14,000.
(ラジカル重合性化合物)
アクリル1:ウレタンアクリレート、ダイセル・オルネクス社製、商品名「EBECRYL8411」、2官能、重量平均分子量12000、20質量%のイソボニルアクリレート(IBOA)で希釈、ウレタンアクリレートの含有量80質量%
アクリル2:フェノキシエチルアクリレート、共栄社化学株式会社製、商品名「ライトアクリレートPO-A」、単官能
アクリル3:ラウリルアクリレート:共栄社化学株式会社製、商品名「ライトアクリレートL-A」、単官能
アクリル4:シクロヘキシルアクリレート:大阪有機、商品名「ビスコート#155」
充填剤:トリメチルシリル化処理シリカ、日本アエロジル社製、商品名「R812」、一次粒子径7nm
光重合開始剤:2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)-ブタノン-1、BASF社製、商品名「IRGACURE 369」
その他の添加剤:湿気硬化促進触媒、シランカップリング剤、酸化防止剤 Components other than the moisture-curable urethane resin used in each example and comparative example were as follows.
(Radical polymerizable compound)
Acrylic 1: urethane acrylate, manufactured by Daicel Allnex, trade name “EBECRYL8411”, bifunctional, weight average molecular weight 12000, diluted with 20% by mass isobornyl acrylate (IBOA), urethane acrylate content 80% by mass
Acrylic 2: Phenoxyethyl acrylate, manufactured by Kyoeisha Chemical Co., Ltd., trade name “Light acrylate PO-A”, monofunctional acrylic 3: Lauryl acrylate: manufactured by Kyoeisha Chemical Co., Ltd., trade name “Light acrylate LA”, monofunctional acrylic 4: Cyclohexyl acrylate: Osaka Organic, trade name "Viscoat #155"
Filler: trimethylsilylated silica, trade name "R812" manufactured by Nippon Aerosil Co., Ltd., primary particle size 7 nm
Photopolymerization initiator: 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, manufactured by BASF, trade name "IRGACURE 369"
Other additives: Moisture curing acceleration catalyst, silane coupling agent, antioxidant
表1に記載された配合比に従い、各材料を、遊星式撹拌装置(シンキー社製、「あわとり練太郎」)にて温度50℃で撹拌した後、セラミック3本ロールにて温度50℃で均一に混合して実施例1~4、比較例1~3の湿気硬化型接着剤組成物を得た。 [Examples 1 to 4, Comparative Examples 1 to 3]
According to the compounding ratio shown in Table 1, each material was stirred at a temperature of 50°C with a planetary stirrer (manufactured by Thinky Co., Ltd., "Awatori Mixer"), and then at a temperature of 50°C with three ceramic rolls. They were uniformly mixed to obtain moisture-curable adhesive compositions of Examples 1-4 and Comparative Examples 1-3.
それに対して、比較例1、3では、分子内にポリカーボネート骨格と、シリコーン骨格とを有するポリウレタンを含有するものの、シリコーン骨格部分の含有量が、質量基準でポリカーボネート骨格部分の含有量よりも少ないウレタンプレポリマーを使用した。そのため、様々な材質の被着体に対して一定の接着力が確保できたが、接着性が優れたものとならなかった。また、比較例2では、分子内にシリコーン骨格を有するウレタンを含まないウレタンプレポリマーを使用したため、様々な材質の被着体に対して一定の接着力を確保することができなかった。 As shown in Table 1, the moisture-curable adhesive composition of each example contained a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule, and the content of the silicone skeleton was, on a mass basis, polycarbonate More urethane prepolymer was used than the backbone content. Therefore, in each example, the adhesiveness to adherends made of various materials was excellent.
On the other hand, in Comparative Examples 1 and 3, although polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule was contained, the content of the silicone skeleton portion was lower than the content of the polycarbonate skeleton portion on a mass basis. A prepolymer was used. As a result, although a certain level of adhesive strength could be ensured for adherends made of various materials, the adhesiveness was not excellent. In addition, in Comparative Example 2, since a urethane prepolymer having a silicone skeleton in the molecule and containing no urethane was used, it was not possible to ensure a constant adhesive strength to adherends made of various materials.
Claims (8)
- 分子内にポリカーボネート骨格と、シリコーン骨格とを有するポリウレタンを含有するウレタンプレポリマーを含み、
前記ウレタンプレポリマーにおける、シリコーン骨格部分の含有量が、質量基準でポリカーボネート骨格部分の含有量よりも多い、湿気硬化型接着剤組成物。 A urethane prepolymer containing a polyurethane having a polycarbonate skeleton and a silicone skeleton in the molecule,
A moisture-curable adhesive composition, wherein the content of the silicone skeleton portion in the urethane prepolymer is higher than the content of the polycarbonate skeleton portion on a mass basis. - 硬化物の伸び率25%における貯蔵弾性率が0.01MPa以上50MPa以下である、請求項1に記載の湿気硬化型接着剤組成物。 The moisture-curable adhesive composition according to claim 1, wherein the cured product has a storage elastic modulus of 0.01 MPa or more and 50 MPa or less at an elongation of 25%.
- 前記ウレタンプレポリマーが、湿気硬化性を有する、請求項1又は2に記載の湿気硬化型接着剤組成物。 The moisture-curable adhesive composition according to claim 1 or 2, wherein the urethane prepolymer has moisture-curable properties.
- 前記ウレタンプレポリマーが、イソシアネート基を有する、請求項3に記載の湿気硬化型接着剤組成物。 The moisture-curable adhesive composition according to claim 3, wherein the urethane prepolymer has an isocyanate group.
- 前記ウレタンプレポリマーが、ポリカーボネートポリオール及びシリコーンポリオールを含むポリオール化合物と、ポリイソシアネート化合物の反応生成物であり、前記ポリオール化合物におけるシリコーンポリオールの配合量が、質量基準で、ポリカーボネートの配合量よりも多い請求項1~4のいずれか1項に記載の湿気硬化型接着剤組成物。 The urethane prepolymer is a reaction product of a polyol compound containing a polycarbonate polyol and a silicone polyol and a polyisocyanate compound, and the content of the silicone polyol in the polyol compound is greater than the content of the polycarbonate on a mass basis. Item 5. The moisture-curable adhesive composition according to any one of items 1 to 4.
- 前記ウレタンプレポリマーの重量平均分子量が、800以上20000以下である請求項1~5のいずれか1項に記載の湿気硬化型接着剤組成物。 The moisture-curable adhesive composition according to any one of claims 1 to 5, wherein the urethane prepolymer has a weight average molecular weight of 800 or more and 20,000 or less.
- ラジカル重合性化合物をさらに含有する請求項1~6のいずれか1項に記載の湿気硬化型接着剤組成物。 The moisture-curable adhesive composition according to any one of claims 1 to 6, which further contains a radically polymerizable compound.
- 請求項1~7のいずれか1項に記載の湿気硬化型接着剤組成物の硬化体。
A cured product of the moisture-curable adhesive composition according to any one of claims 1 to 7.
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09194560A (en) * | 1996-01-11 | 1997-07-29 | Toray Ind Inc | Moisture-setting composition |
JPH10259222A (en) * | 1997-01-14 | 1998-09-29 | Toray Ind Inc | Moisture curing resin and production of the same |
US20170183551A1 (en) * | 2015-12-24 | 2017-06-29 | Nan Ya Plastics Corporation | Polyurethane adhesive and use of the same |
JP2020105485A (en) * | 2018-12-26 | 2020-07-09 | 信越化学工業株式会社 | Stretchable film and method for forming the same |
CN111500235A (en) * | 2020-05-25 | 2020-08-07 | 上海牛元工贸有限公司 | Pounding-free brick moisture-curing liquid waterproof composition suitable for seam beautifying pretreatment and repair |
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AUPO251096A0 (en) | 1996-09-23 | 1996-10-17 | Cardiac Crc Nominees Pty Limited | Polysiloxane-containing polyurethane elastomeric compositions |
JP2007100036A (en) | 2005-10-07 | 2007-04-19 | Showa Denko Kk | Carboxy group-containing polyurethane and thermosetting polyurethane resin composition |
JP2008156501A (en) | 2006-12-25 | 2008-07-10 | Hitachi Kasei Polymer Co Ltd | One-part moisture-curable polyurethane coating agent, mounting circuit board having been subjected to moistureproof insulation treatment using the same, and method for producing the mounting circuit board |
-
2022
- 2022-04-25 WO PCT/JP2022/018758 patent/WO2022230819A1/en active Application Filing
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09194560A (en) * | 1996-01-11 | 1997-07-29 | Toray Ind Inc | Moisture-setting composition |
JPH10259222A (en) * | 1997-01-14 | 1998-09-29 | Toray Ind Inc | Moisture curing resin and production of the same |
US20170183551A1 (en) * | 2015-12-24 | 2017-06-29 | Nan Ya Plastics Corporation | Polyurethane adhesive and use of the same |
JP2020105485A (en) * | 2018-12-26 | 2020-07-09 | 信越化学工業株式会社 | Stretchable film and method for forming the same |
CN111500235A (en) * | 2020-05-25 | 2020-08-07 | 上海牛元工贸有限公司 | Pounding-free brick moisture-curing liquid waterproof composition suitable for seam beautifying pretreatment and repair |
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JPWO2022230819A1 (en) | 2022-11-03 |
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