TW201920577A - Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements - Google Patents

Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements Download PDF

Info

Publication number
TW201920577A
TW201920577A TW107132388A TW107132388A TW201920577A TW 201920577 A TW201920577 A TW 201920577A TW 107132388 A TW107132388 A TW 107132388A TW 107132388 A TW107132388 A TW 107132388A TW 201920577 A TW201920577 A TW 201920577A
Authority
TW
Taiwan
Prior art keywords
moisture
light
resin composition
meth
curable resin
Prior art date
Application number
TW107132388A
Other languages
Chinese (zh)
Inventor
徐坤
結城彰
高橋徹
木田拓身
玉川智一
Original Assignee
日商積水化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商積水化學工業股份有限公司 filed Critical 日商積水化學工業股份有限公司
Publication of TW201920577A publication Critical patent/TW201920577A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/302—Water
    • C08G18/307—Atmospheric humidity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/067—Polyurethanes; Polyureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/16—Catalysts
    • C08G18/18—Catalysts containing secondary or tertiary amines or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

One purpose of the present invention is to provide a photo/moisture curable resin composition which has excellent storage stability and fast curing properties. Another purpose of the present invention is to provide an adhesive for electronic components and an adhesive for display elements, each of which is obtained using this photo/moisture curable resin composition. The present invention is a photo/moisture curable resin composition which contains a moisture curable urethane resin, a photopolymerizable compound, a photopolymerization initiator, a moisture curing accelerating catalyst, and a stabilizer.

Description

光與濕氣硬化型樹脂組成物、電子零件用接著劑及顯示元件用接著劑Light and moisture curing resin composition, adhesive for electronic parts, and adhesive for display elements

本發明係關於一種速硬化性及保存穩定性優異之光與濕氣硬化型樹脂組成物。又，本發明係關於一種使用該光與濕氣硬化型樹脂組成物而成之電子零件用接著劑及顯示元件用接著劑。The present invention relates to a light- and moisture-curable resin composition excellent in quick-curing properties and storage stability. The present invention also relates to an adhesive for electronic parts and an adhesive for display elements using the light and moisture-curable resin composition.

近年來，作為具有薄型、輕量、低耗電等特徵之顯示元件，廣泛利用液晶顯示元件、有機EL顯示元件等。於該等顯示元件中，通常於液晶或發光層之密封、基板、光學膜、保護膜等各種構件之接著等中使用由樹脂組成物構成之接著劑。 又，近年來，對半導體晶片等電子零件要求高積體化、小型化，例如經由接著劑層而將複數個較薄之半導體晶片接合而製成半導體晶片之積層體。此種半導體晶片之積層體例如係藉由於一半導體晶片上塗佈接著劑後，經由該接著劑而積層另一半導體晶片，其後使接著劑硬化之方法；於隔開一定間隔所保持之半導體晶片間填充接著劑，其後使接著劑硬化之方法等而製造。In recent years, liquid crystal display elements, organic EL display elements, and the like have been widely used as display elements having characteristics such as thinness, light weight, and low power consumption. In these display elements, an adhesive composed of a resin composition is usually used for sealing various components such as a liquid crystal or light-emitting layer, a substrate, an optical film, and a protective film. In recent years, electronic components such as semiconductor wafers have been required to be highly integrated and miniaturized. For example, a plurality of thinner semiconductor wafers are bonded to form a laminated body of a semiconductor wafer via an adhesive layer. Such a laminated body of a semiconductor wafer is, for example, a method of laminating another semiconductor wafer through the adhesive after applying an adhesive on one semiconductor wafer, and then curing the adhesive; the semiconductors held at a certain interval A wafer is filled with an adhesive, and then the adhesive is cured by a method or the like.

作為用於此種顯示元件或電子零件等之接著之接著劑，研究有使用濕氣硬化型樹脂組成物之接著劑。例如於專利文獻1中，揭示有含有藉由使樹脂中之異氰酸基與空氣中或被接著體中之濕氣（水分）進行反應而交聯硬化之濕氣硬化型胺酯樹脂之樹脂組成物。然而，專利文獻1所揭示之樹脂組成物係用作二液型，故而有作業性等較差之問題。另一方面，於專利文獻2中，揭示有使用濕氣硬化型胺酯樹脂之一液型接著劑，但存在硬化耗費時間之課題。 [先前技術文獻] [專利文獻]As an adhesive used for such display elements, electronic parts, etc., an adhesive using a moisture-curable resin composition has been studied. For example, Patent Document 1 discloses a resin containing a moisture-curable urethane resin that is crosslinked and cured by reacting an isocyanate group in a resin with moisture (water) in the air or an adherend.组合 物。 Composition. However, since the resin composition disclosed in Patent Document 1 is used as a two-liquid type, there is a problem that the workability is poor. On the other hand, Patent Document 2 discloses that a liquid-type adhesive using a moisture-curable urethane resin is used, but there is a problem that it takes time to cure. [Prior Art Literature] [Patent Literature]

專利文獻1：日本特開2007-308705號公報 專利文獻2：國際公開第2010/086924號Patent Document 1: Japanese Patent Application Laid-Open No. 2007-308705 Patent Document 2: International Publication No. 2010/086924

[發明所欲解決之課題][Problems to be Solved by the Invention]

本發明之目的在於提供一種速硬化性及保存穩定性優異之光與濕氣硬化型樹脂組成物。又，本發明之目的在於提供一種使用該光與濕氣硬化型樹脂組成物而成之電子零件用接著劑及顯示元件用接著劑。 [解決課題之技術手段]An object of the present invention is to provide a light and moisture-curable resin composition excellent in rapid curing properties and storage stability. Another object of the present invention is to provide an adhesive for electronic parts and an adhesive for display elements using the light and moisture-curable resin composition. [Technical means to solve the problem]

本發明係一種含有濕氣硬化型胺酯樹脂、光聚合性化合物、光聚合起始劑、濕氣硬化促進觸媒、及穩定劑之光與濕氣硬化型樹脂組成物。 以下，詳細敍述本發明。The present invention is a light and moisture-curable resin composition containing a moisture-curable amine ester resin, a photopolymerizable compound, a photopolymerization initiator, a moisture-curing accelerator, and a stabilizer. Hereinafter, the present invention will be described in detail.

本發明者等人研究了利用使用有濕氣硬化型胺酯樹脂與光聚合性化合物之一液型光與濕氣硬化型樹脂組成物，藉由濕氣硬化與光硬化之兩種機制而提高接著性，進而為了提高作業性等，摻合濕氣硬化促進觸媒而提高濕氣硬化時之速硬化性。然而，若欲摻合濕氣硬化促進觸媒而獲得迅速之硬化速度，則有難以賦予保存穩定性之問題。 因此，本發明者等人進一步努力研究，結果發現：藉由製成於含有濕氣硬化促進觸媒之光與濕氣硬化型樹脂組成物中進而含有穩定劑者，可獲得速硬化性及保存穩定性優異之光與濕氣硬化型樹脂組成物，從而完成本發明。The present inventors have studied the use of a liquid-type light and moisture-curable resin composition using a moisture-curable urethane resin and a photopolymerizable compound, which are improved by two mechanisms of moisture-cured and light-cured. Adhesiveness, and in order to improve workability, etc., moisture-curing accelerators are blended to improve the rapid curing properties during moisture-curing. However, if a moisture hardening accelerator is to be blended to obtain a rapid hardening speed, it is difficult to provide storage stability. Therefore, the inventors of the present inventors made further efforts and found out that by including a stabilizer in a light- and moisture-curable resin composition containing a moisture-hardening-promoting catalyst, rapid hardening properties and storage can be obtained. The light and moisture-curable resin composition having excellent stability has completed the present invention.

本發明之光與濕氣硬化型樹脂組成物含有濕氣硬化型胺酯樹脂。上述濕氣硬化型胺酯樹脂具有胺酯鍵與異氰酸基，分子內之異氰酸基與空氣中或被接著體中之水分反應而硬化。The light and moisture-curable resin composition of the present invention contains a moisture-curable urethane resin. The moisture-curable amine ester resin has an amine ester bond and an isocyanate group, and the isocyanate group in the molecule reacts with moisture in the air or an adherend to be hardened.

上述濕氣硬化型胺酯樹脂可於1分子中僅具有一個異氰酸基，亦可具有兩個以上。其中，較佳為於分子之主鏈兩封端具有異氰酸基。The moisture-curable urethane resin may have only one isocyanate group in one molecule, or may have two or more. Among them, an isocyanate group is preferred at both ends of the main chain of the molecule.

上述濕氣硬化型胺酯樹脂可藉由使1分子中具有兩個以上之羥基之多元醇化合物、與於1分子中具有兩個以上之異氰酸基之聚異氰酸酯化合物進行反應而獲得。The moisture-curable amine ester resin can be obtained by reacting a polyol compound having two or more hydroxyl groups in one molecule and a polyisocyanate compound having two or more isocyanate groups in one molecule.

上述多元醇化合物與聚異氰酸酯化合物之反應通常係於以多元醇化合物中之羥基（OH）與聚異氰酸酯化合物中之異氰酸基（NCO）之莫耳比計[NCO]/[OH]＝2.0〜2.5之範圍內進行。The reaction between the above-mentioned polyol compound and polyisocyanate compound is usually based on the molar ratio of the hydroxyl group (OH) in the polyol compound to the isocyanate group (NCO) in the polyisocyanate compound [NCO] / [OH] = 2.0 Perform within a range of ~ 2.5.

作為上述多元醇化合物，可使用通常用於製造聚胺酯之公知之多元醇化合物，例如可列舉：聚酯多元醇、聚醚多元醇、聚伸烷基多元醇、聚碳酸酯多元醇等。該等多元醇化合物可單獨使用，亦可將兩種以上組合而使用。As the polyol compound, a known polyol compound generally used for producing polyurethane can be used, and examples thereof include polyester polyols, polyether polyols, polyalkylene polyols, polycarbonate polyols, and the like. These polyol compounds may be used alone or in combination of two or more kinds.

作為上述聚酯多元醇，例如可列舉：藉由多元羧酸與多元醇之反應所獲得之聚酯多元醇、使ε-己內酯開環聚合所獲得之聚-ε-己內酯多元醇等。Examples of the polyester polyol include a polyester polyol obtained by reacting a polycarboxylic acid and a polyol, and a poly-ε-caprolactone polyol obtained by ring-opening polymerization of ε-caprolactone. Wait.

作為成為上述聚酯多元醇之原料之上述多元羧酸，例如可列舉：對苯二甲酸、間苯二甲酸、1,5-萘二甲酸、2,6-萘二甲酸、丁二酸、戊二酸、己二酸、庚二酸、辛二酸、壬二酸、癸二酸、癸二甲酸、十二烷二甲酸等。Examples of the polycarboxylic acid used as a raw material of the polyester polyol include terephthalic acid, isophthalic acid, 1,5-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, succinic acid, and pentylene. Diacid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, sebacic acid, dodecanedioic acid and the like.

作為成為上述聚酯多元醇之原料之上述多元醇，例如可列舉：乙二醇、丙二醇、1,3-丙二醇、1,4-丁二醇、新戊二醇、1,5-戊二醇、1,6-己二醇、二乙二醇、環己二醇等。Examples of the polyol that serves as a raw material for the polyester polyol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,4-butanediol, neopentyl glycol, and 1,5-pentanediol. , 1,6-hexanediol, diethylene glycol, cyclohexanediol and the like.

作為上述聚醚多元醇，例如可列舉：乙二醇、丙二醇、四氫呋喃之開環聚合物、3-甲基四氫呋喃之開環聚合物、及其等或其衍生物之無規共聚物或嵌段共聚物、雙酚型聚氧伸烷基改質物等。Examples of the polyether polyol include ethylene glycol, propylene glycol, a ring-opening polymer of tetrahydrofuran, a ring-opening polymer of 3-methyltetrahydrofuran, and random copolymers or blocks thereof or their derivatives. Copolymers, bisphenol-type polyoxyalkylene modifiers, etc.

上述雙酚型聚氧伸烷基改質物係使環氧烷（例如，環氧乙烷、環氧丙烷、環氧丁烷等）與雙酚型分子骨架之活性氫部分進行加成反應所獲得之聚醚多元醇，可為無規共聚物，亦可為嵌段共聚物。上述雙酚型聚氧伸烷基改質物較佳為於雙酚型分子骨架之兩封端加成一種或兩種以上之環氧烷。作為上述雙酚型，並無特別限定，可列舉：A型、F型、S型等，較佳為雙酚A型。The bisphenol-type polyoxyalkylene modified product is obtained by adding an alkylene oxide (for example, ethylene oxide, propylene oxide, butylene oxide, etc.) to an active hydrogen portion of a bisphenol-type molecular skeleton. The polyether polyol may be a random copolymer or a block copolymer. The above-mentioned bisphenol-type polyoxyalkylene modified product is preferably one or two or more kinds of alkylene oxides added to the two ends of the bisphenol-type molecular skeleton. The bisphenol type is not particularly limited, and examples thereof include A type, F type, and S type, and the bisphenol A type is preferred.

作為上述聚伸烷基多元醇，例如可列舉：聚丁二烯多元醇、氫化聚丁二烯多元醇、氫化聚異戊二烯多元醇等。Examples of the polyalkylene polyol include polybutadiene polyol, hydrogenated polybutadiene polyol, hydrogenated polyisoprene polyol, and the like.

作為上述聚碳酸酯多元醇，例如可列舉：聚碳酸己二酯多元醇、聚碳酸環己二甲酯多元醇等。Examples of the polycarbonate polyol include polycarbonate adipate polyol and polycarbonate adipate polyol.

作為上述聚異氰酸酯化合物，可列舉：芳香族聚異氰酸酯及脂肪族聚異氰酸酯。就硬化速度及硬化物之力學特性之觀點而言，較佳為使用上述芳香族聚異氰酸酯，就耐黃變特性（長期可靠性）之觀點而言，較佳為使用上述脂肪族聚異氰酸酯。 作為上述芳香族聚異氰酸酯，例如可列舉：二苯基甲烷二異氰酸酯（MDI）、二苯基甲烷二異氰酸酯之液狀改質物、聚合MDI、甲苯二異氰酸酯、萘-1,5-二異氰酸酯、間苯二異氰酸酯（XDI）等。其中，就蒸汽壓及毒性較低之方面、或操作容易性之方面而言，較佳為二苯基甲烷二異氰酸酯及其改質物。 作為上述脂肪族聚異氰酸酯，例如可列舉：六亞甲基二異氰酸酯（HDI）、二環己基甲烷4,4'-二異氰酸酯（氫化MDI）、氫化苯二甲基二異氰酸酯（氫化XDI）、降莰烷二異氰酸酯等。其中，就毒性較低之方面、或硬化速度較快之方面而言，較佳為HDI或氫化XDI。 上述聚異氰酸酯化合物可單獨使用，亦可將兩種以上組合而使用。Examples of the polyisocyanate compound include an aromatic polyisocyanate and an aliphatic polyisocyanate. From the viewpoint of the hardening rate and the mechanical properties of the cured product, it is preferable to use the above-mentioned aromatic polyisocyanate, and from the viewpoint of yellowing resistance (long-term reliability), the above-mentioned aliphatic polyisocyanate is preferably used. Examples of the aromatic polyisocyanate include diphenylmethane diisocyanate (MDI), liquid modification of diphenylmethane diisocyanate, polymerized MDI, toluene diisocyanate, naphthalene-1,5-diisocyanate, and Benzene diisocyanate (XDI), etc. Among them, diphenylmethane diisocyanate and a modified product thereof are preferred in terms of low vapor pressure and toxicity or ease of handling. Examples of the aliphatic polyisocyanate include hexamethylene diisocyanate (HDI), dicyclohexylmethane 4,4'-diisocyanate (hydrogenated MDI), hydrogenated xylylene diisocyanate (hydrogenated XDI), and Pinane diisocyanate and the like. Among them, HDI or hydrogenated XDI is preferred in terms of lower toxicity or faster curing speed. These polyisocyanate compounds may be used alone or in combination of two or more kinds.

又，上述濕氣硬化型胺酯樹脂較佳為使用具有下述式（1）所表示之結構之多元醇化合物所獲得者。藉由使用具有下述式（1）所表示之結構之多元醇化合物，可獲得接著性優異之組成物、及柔軟且伸長率良好之硬化物，成為與下述之光聚合性化合物之相溶性優異者。 其中，較佳為使用由丙二醇、四氫呋喃（THF）化合物之開環聚合化合物、或具有甲基等取代基之四氫呋喃化合物之開環聚合化合物構成之聚醚多元醇者。The moisture-curable urethane resin is preferably obtained by using a polyol compound having a structure represented by the following formula (1). By using a polyhydric alcohol compound having a structure represented by the following formula (1), a composition having excellent adhesion and a hardened material having good elongation can be obtained, and it is compatible with the photopolymerizable compound described below. Outstanding. Among them, a polyether polyol composed of propylene glycol, a ring-opening polymerization compound of a tetrahydrofuran (THF) compound, or a ring-opening polymerization compound of a tetrahydrofuran compound having a substituent such as a methyl group is preferably used.

式（1）中，R表示氫、甲基、或乙基，l為0〜5之整數，m為1〜500之整數，n為1〜10之整數。l較佳為0〜4，m較佳為50〜200，n較佳為1〜5。 再者，l為0之情形表示與R鍵結之碳直接與氧鍵結之情形。In formula (1), R represents hydrogen, methyl, or ethyl, l is an integer of 0 to 5, m is an integer of 1 to 500, and n is an integer of 1 to 10. l is preferably 0 to 4, m is preferably 50 to 200, and n is preferably 1 to 5. The case where l is 0 indicates a case where the carbon bonded to R is directly bonded to oxygen.

進而，上述濕氣硬化型胺酯樹脂亦可具有自由基聚合性官能基。 作為上述濕氣硬化型胺酯樹脂可具有之自由基聚合性官能基，較佳為具有不飽和雙鍵之基，尤其就反應性之方面而言，更佳為(甲基)丙烯醯基。 再者，具有自由基聚合性官能基之濕氣硬化型胺酯樹脂不包含於下述之自由基聚合性化合物中，當作濕氣硬化型胺酯樹脂。Further, the moisture-curable urethane resin may have a radical polymerizable functional group. As the radical polymerizable functional group that the moisture-curable amine ester resin may have, a group having an unsaturated double bond is preferable, and in particular, a (meth) acrylfluorenyl group is more preferable in terms of reactivity. In addition, the moisture-curable urethane resin having a radical polymerizable functional group is not included in the radical-polymerizable compound described below, and is referred to as a moisture-curable urethane resin.

上述濕氣硬化型胺酯樹脂之重量平均分子量並無特別限定，較佳之下限為800，較佳之上限為1萬。藉由上述濕氣硬化型胺酯樹脂之重量平均分子量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物於硬化時交聯密度不會過度升高而成為柔軟性更優異者，且成為塗佈性更優異者。上述濕氣硬化型胺酯樹脂之重量平均分子量之更佳之下限為2000，更佳之上限為8000，進而較佳之下限為2500，進而較佳之上限為6000。再者，於本說明書中，上述重量平均分子量係利用凝膠滲透層析法（GPC）進行測定，並藉由聚苯乙烯換算所求出之值。作為藉由GPC測定藉由聚苯乙烯換算之重量平均分子量時之管柱，例如可列舉：Shodex LF-804（昭和電工公司製造）等。又，作為GPC中所使用之溶劑，可列舉：四氫呋喃等。The weight-average molecular weight of the moisture-curable amine ester resin is not particularly limited, and a preferred lower limit is 800, and a preferred upper limit is 10,000. When the weight-average molecular weight of the moisture-curable urethane resin is within this range, the light and moisture-curable resin composition obtained will not have an excessively high cross-linking density when cured, and will become more flexible. And it becomes a thing with more excellent coating property. A more preferable lower limit of the weight-average molecular weight of the moisture-curable amine ester resin is 2000, a more preferable upper limit is 8000, a more preferable lower limit is 2500, and a more preferable upper limit is 6000. In addition, in this specification, the said weight average molecular weight is measured by the gel permeation chromatography (GPC), and the value calculated | required by polystyrene conversion. Examples of the column for measuring the weight-average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko). Examples of the solvent used in GPC include tetrahydrofuran and the like.

上述濕氣硬化型胺酯樹脂之含量相對於濕氣硬化型胺酯樹脂與光聚合性化合物之合計100重量份，較佳之下限為20重量份，較佳之上限為90重量份。藉由上述濕氣硬化型胺酯樹脂之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為濕氣硬化性及光硬化性更優異者。上述濕氣硬化型胺酯樹脂之含量之更佳之下限為30重量份，更佳之上限為75重量份，進而較佳之下限為41重量份，進而較佳之上限為70重量份。The content of the moisture-curable amine ester resin is 100 parts by weight with respect to the total of the moisture-curable amine ester resin and the photopolymerizable compound, with a preferred lower limit of 20 parts by weight and a preferred upper limit of 90 parts by weight. When the content of the moisture-curable urethane resin is within this range, the obtained light and moisture-curable resin composition becomes more excellent in moisture-curability and light-curability. A more preferable lower limit of the content of the moisture-curable urethane resin is 30 parts by weight, a more preferable upper limit is 75 parts by weight, a more preferable lower limit is 41 parts by weight, and a more preferable upper limit is 70 parts by weight.

本發明之光與濕氣硬化型樹脂組成物含有光聚合性化合物。 作為上述光聚合性化合物，可較佳地使用自由基聚合性化合物。作為上述自由基聚合性化合物，只要為具有光聚合性之自由基聚合性化合物即可，只要為於分子中具有自由基聚合性官能基之化合物，則並無特別限定，較佳為具有不飽和雙鍵作為自由基聚合性官能基之化合物，尤其就反應性之方面而言，較佳為(甲基)丙烯酸化合物。 再者，於本說明書中，上述「(甲基)丙烯醯基」表示丙烯醯基或甲基丙烯醯基，上述「(甲基)丙烯酸」表示丙烯酸或甲基丙烯酸，上述「(甲基)丙烯酸化合物」表示具有(甲基)丙烯醯基之化合物。The light and moisture-curable resin composition of the present invention contains a photopolymerizable compound. As the photopolymerizable compound, a radical polymerizable compound can be preferably used. The radical polymerizable compound is not particularly limited as long as it is a photopolymerizable radical polymerizable compound, as long as it is a compound having a radical polymerizable functional group in the molecule, it is preferably unsaturated. The compound having a double bond as a radical polymerizable functional group is particularly preferably a (meth) acrylic compound in terms of reactivity. In addition, in this specification, the "(meth) acrylfluorenyl" means acrylfluorenyl or methacrylfluorenyl, the "(meth) acryl" refers to acrylic acid or methacrylic acid, and the "(meth) "Acrylic compound" means a compound having a (meth) acrylfluorenyl group.

作為上述(甲基)丙烯酸化合物，例如可列舉：(甲基)丙烯酸酯化合物、環氧(甲基)丙烯酸酯、(甲基)丙烯酸胺酯等。 再者，於本說明書中，上述「(甲基)丙烯酸酯」表示丙烯酸酯或甲基丙烯酸酯。又，成為上述(甲基)丙烯酸胺酯之原料之異氰酸酯化合物之異氰酸基均可用於形成胺酯鍵，上述(甲基)丙烯酸胺酯不具有殘存異氰酸基。Examples of the (meth) acrylic compound include (meth) acrylate compounds, epoxy (meth) acrylates, and (meth) acrylates. In addition, in this specification, the "(meth) acrylate" means an acrylate or a methacrylate. In addition, any isocyanate group of the isocyanate compound that is a raw material of the amine (meth) acrylate can be used to form an amine ester bond, and the amine (meth) acrylate does not have a residual isocyanate group.

作為上述(甲基)丙烯酸酯化合物中之單官能者，例如可列舉：鄰苯二甲醯亞胺丙烯酸酯類、各種醯亞胺(甲基)丙烯酸酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸異肉豆蔻酯、(甲基)丙烯酸硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸二環戊烯酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸2-羥基丁酯、(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸2-甲氧基乙酯、(甲基)丙烯酸2-乙氧基乙酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸甲氧基乙二醇酯、(甲基)丙烯酸甲氧基聚乙二醇酯、(甲基)丙烯酸乙基卡必醇酯、(甲基)丙烯酸四氫呋喃甲酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸苯氧基二乙二醇酯、(甲基)丙烯酸苯氧基聚乙二醇酯、(甲基)丙烯酸2,2,2-三氟乙酯、(甲基)丙烯酸2,2,3,3-四氟丙酯、(甲基)丙烯酸1H,1H,5H-八氟戊酯、(甲基)丙烯酸二甲基胺基乙酯、(甲基)丙烯酸二乙基胺基乙酯、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基乙基六氫鄰苯二甲酸、鄰苯二甲酸2-(甲基)丙烯醯氧基乙基-2-羥基丙酯、(甲基)丙烯酸縮水甘油酯、磷酸2-(甲基)丙烯醯氧基乙酯等。 作為上述鄰苯二甲醯亞胺丙烯酸酯類，例如可列舉：N-丙烯醯氧基乙基六氫鄰苯二甲醯亞胺等。Examples of the monofunctional group in the (meth) acrylate compound include phthalimide acrylates, various imidate (meth) acrylates, methyl (meth) acrylate, ( Ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, n-octyl (meth) acrylate Ester, isooctyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isononyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, ( Isomyristyl methacrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, isoamyl (meth) acrylate, dicyclopentene (meth) acrylate, (methyl ) Benzyl acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, ( 2-methoxyethyl meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, methoxyethylene glycol (meth) acrylate (Meth) acrylate Polyethylene glycol ester, ethyl carbitol (meth) acrylate, tetrahydrofuran methyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, phenoxydiethyl (meth) acrylate Glycol ester, phenoxy polyethylene glycol (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropane (meth) acrylate Esters, 1H, 1H, 5H-octafluoropentyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethylaminoethyl (meth) acrylate, 2- (methyl) Acrylic ethoxyethyl succinic acid, 2- (meth) acrylic ethoxy ethyl hexahydrophthalic acid, 2- (meth) acrylic ethoxy ethyl-2-hydroxypropyl phthalate Esters, glycidyl (meth) acrylate, 2- (meth) acryloxyethyl phosphate, and the like. Examples of the phthalimide acrylates include N-propenyloxyethylhexahydrophthalimide and the like.

又，作為上述(甲基)丙烯酸酯化合物中之二官能者，例如可列舉：1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、2-正丁基-2-乙基-1,3-丙二醇二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、三丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、環氧乙烷加成雙酚A二(甲基)丙烯酸酯、環氧丙烷加成雙酚A二(甲基)丙烯酸酯、環氧乙烷加成雙酚F二(甲基)丙烯酸酯、二羥甲基二環戊二烯基二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、環氧乙烷改質異三聚氰酸二(甲基)丙烯酸酯、(甲基)丙烯酸2-羥基-3-(甲基)丙烯醯氧基丙酯、碳酸酯二醇二(甲基)丙烯酸酯、聚醚二醇二(甲基)丙烯酸酯、聚酯二醇二(甲基)丙烯酸酯、聚己內酯二醇二(甲基)丙烯酸酯、聚丁二烯二醇二(甲基)丙烯酸酯等。Examples of the difunctional group in the (meth) acrylate compound include 1,3-butanediol di (meth) acrylate and 1,4-butanediol di (meth) acrylate. , 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 1,10-decanediol di (meth) acrylate, 2-n-butyl 2-ethyl-1,3-propanediol di (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetraethylene glycol di (methyl) Base) acrylate, polyethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, ethylene oxide Alkane addition bisphenol A di (meth) acrylate, propylene oxide addition bisphenol A di (meth) acrylate, ethylene oxide addition bisphenol F di (meth) acrylate, dimethylol Dicyclopentadienyl di (meth) acrylate, neopentyl glycol di (meth) acrylate, ethylene oxide modified isotricyanic acid di (meth) acrylate, (meth) 2-hydroxy-3- (meth) acrylic acid oxypropyl acrylate, carbonate diol di (meth) propyl Acrylates, polyether diol di (meth) acrylates, polyester diol di (meth) acrylates, polycaprolactone diol di (meth) acrylates, polybutadiene diol di ( (Meth) acrylates and the like.

又，作為上述(甲基)丙烯酸酯化合物中之三官能以上者，例如可列舉：三羥甲基丙烷三(甲基)丙烯酸酯、環氧乙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、環氧丙烷加成三羥甲基丙烷三(甲基)丙烯酸酯、己內酯改質三羥甲基丙烷三(甲基)丙烯酸酯、新戊四醇三(甲基)丙烯酸酯、環氧乙烷加成異三聚氰酸三(甲基)丙烯酸酯、甘油三(甲基)丙烯酸酯、環氧丙烷加成甘油三(甲基)丙烯酸酯、磷酸三(甲基)丙烯醯氧基乙酯、二-三羥甲基丙烷四(甲基)丙烯酸酯、新戊四醇四(甲基)丙烯酸酯、二新戊四醇五(甲基)丙烯酸酯、二新戊四醇六(甲基)丙烯酸酯等。In addition, examples of the tri- or more functional group in the (meth) acrylate compound include trimethylolpropane tri (meth) acrylate and ethylene oxide-added trimethylolpropane tri (methyl) ) Acrylate, propylene oxide addition trimethylolpropane tri (meth) acrylate, caprolactone modified trimethylolpropane tri (meth) acrylate, neopentaerythritol tri (meth) acrylic acid Ester, ethylene oxide addition isotricyanate tri (meth) acrylate, glycerol tri (meth) acrylate, propylene oxide addition glycerol tri (meth) acrylate, phosphate tri (meth) acrylate Acrylic ethoxyethyl, di-trimethylolpropane tetra (meth) acrylate, neopentaerythritol tetra (meth) acrylate, dinepentaerythritol penta (meth) acrylate, dineopentyl Tetraol hexa (meth) acrylate and the like.

作為上述環氧(甲基)丙烯酸酯，例如可列舉：依據常法使環氧化合物與(甲基)丙烯酸於鹼性觸媒之存在下進行反應所獲得者等。Examples of the epoxy (meth) acrylate include those obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a basic catalyst in accordance with a conventional method.

作為用以合成上述環氧(甲基)丙烯酸酯之原料之環氧化合物，例如可列舉：雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、2,2'-二烯丙基雙酚A型環氧樹脂、氫化雙酚型環氧樹脂、環氧丙烷加成雙酚A型環氧樹脂、間苯二酚型環氧樹脂、聯苯型環氧樹脂、硫醚型環氧樹脂、二苯醚型環氧樹脂、二環戊二烯型環氧樹脂、萘型環氧樹脂、苯酚酚醛清漆型環氧樹脂、鄰甲酚酚醛清漆型環氧樹脂、二環戊二烯酚醛清漆型環氧樹脂、聯苯酚醛清漆型環氧樹脂、萘-苯酚酚醛清漆型環氧樹脂、縮水甘油胺型環氧樹脂、烷基多元醇型環氧樹脂、橡膠改質型環氧樹脂、縮水甘油酯化合物、雙酚A型環硫樹脂等。Examples of the epoxy compound used as a raw material for synthesizing the above-mentioned epoxy (meth) acrylate include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxy resin, and 2, 2'-diallyl bisphenol A epoxy resin, hydrogenated bisphenol epoxy resin, propylene oxide addition bisphenol A epoxy resin, resorcinol epoxy resin, biphenyl epoxy Resin, thioether type epoxy resin, diphenyl ether type epoxy resin, dicyclopentadiene type epoxy resin, naphthalene type epoxy resin, phenol novolac type epoxy resin, o-cresol novolac type epoxy resin Dicyclopentadiene novolac epoxy resin, biphenol novolac epoxy resin, naphthalene-phenol novolac epoxy resin, glycidylamine epoxy resin, alkyl polyol epoxy resin, rubber Modified epoxy resin, glycidyl ester compound, bisphenol A episulfide resin, etc.

作為上述環氧(甲基)丙烯酸酯中所市售者，例如可列舉：Daicel Allnex公司製造之環氧(甲基)丙烯酸酯、新中村化學工業公司製造之環氧(甲基)丙烯酸酯、共榮社化學公司製造之環氧(甲基)丙烯酸酯、Nagase chemteX公司製造之環氧(甲基)丙烯酸酯等。 作為上述Daicel Allnex公司製造之環氧(甲基)丙烯酸酯，例如可列舉：EBECRYL 860、EBECRYL 3200、EBECRYL 3201、EBECRYL 3412、EBECRYL 3600、EBECRYL 3700、EBECRYL 3701、EBECRYL 3702、EBECRYL 3703、EBECRYL 3800、EBECRYL 6040、EBECRYL RDX 63182等。 作為上述新中村化學工業公司製造之環氧(甲基)丙烯酸酯，例如可列舉：EA-1010、EA-1020、EA-5323、EA-5520、EA-CHD、EMA-1020等。 作為上述共榮社化學公司製造之環氧(甲基)丙烯酸酯，例如可列舉：Epoxy Ester M-600A、Epoxy Ester 40EM、Epoxy Ester 70PA、Epoxy Ester 200PA、Epoxy Ester 80MFA、Epoxy Ester 3002M、Epoxy Ester 3002A、Epoxy Ester 1600A、Epoxy Ester 3000M、Epoxy Ester 3000A、Epoxy Ester 200EA、Epoxy Ester 400EA等。 作為上述Nagase chemteX公司製造之環氧(甲基)丙烯酸酯，例如可列舉：Denacol Acrylate DA-141、Denacol Acrylate DA-314、Denacol Acrylate DA-911等。Examples of commercially available epoxy (meth) acrylates include epoxy (meth) acrylates manufactured by Daicel Allnex, epoxy (meth) acrylates manufactured by Shin Nakamura Chemical Industries, Epoxy (meth) acrylate manufactured by Kyoeisha Chemical Co., Ltd., and epoxy (meth) acrylate manufactured by Nagase chemteX. As the epoxy (meth) acrylate manufactured by the above-mentioned Daicel Allnex company, for example, EBECRYL 860, EBECRYL 3200, EBECRYL 3201, EBECRYL 3412, EBECRYL 3600, EBECRYL 3700, EBECRYL 3701, EBECRYL 3702, EBECRYL 3703, EBECRYL 3800, EBECRYL 6040, EBECRYL RDX 63182, etc. Examples of the epoxy (meth) acrylate manufactured by the aforementioned Shin Nakamura Chemical Industry Company include EA-1010, EA-1020, EA-5323, EA-5520, EA-CHD, and EMA-1020. Examples of the epoxy (meth) acrylate manufactured by the aforementioned Kyoeisha Chemical Company include Epoxy Ester M-600A, Epoxy Ester 40EM, Epoxy Ester 70PA, Epoxy Ester 200PA, Epoxy Ester 80MFA, Epoxy Ester 3002M, and Epoxy Ester. 3002A, Epoxy Ester 1600A, Epoxy Ester 3000M, Epoxy Ester 3000A, Epoxy Ester 200EA, Epoxy Ester 400EA, etc. Examples of the epoxy (meth) acrylate manufactured by the Nagase chemteX company include Denacol Acrylate DA-141, Denacol Acrylate DA-314, Denacol Acrylate DA-911, and the like.

上述(甲基)丙烯酸胺酯例如可藉由使具有羥基之(甲基)丙烯酸衍生物與異氰酸酯化合物於觸媒量之錫系化合物存在下進行反應而獲得。The (meth) acrylic acid amine ester can be obtained, for example, by reacting a (meth) acrylic acid derivative having a hydroxyl group with an isocyanate compound in the presence of a tin-based compound in a catalytic amount.

作為上述異氰酸酯化合物，例如可列舉：異佛爾酮二異氰酸酯、2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、六亞甲基二異氰酸酯、三甲基六亞甲基二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯（MDI）、氫化MDI、聚合MDI、1,5-萘二異氰酸酯、降莰烷二異氰酸酯、聯甲苯胺二異氰酸酯、苯二甲基二異氰酸酯（XDI）、氫化XDI、離胺酸二異氰酸酯、三苯基甲烷三異氰酸酯、硫代磷酸三(異氰酸基苯基)酯、四甲基苯二甲基二異氰酸酯、1,6,11-十一烷三異氰酸酯等。Examples of the isocyanate compound include isophorone diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, and diisocyanate. Phenylmethane-4,4'-diisocyanate (MDI), hydrogenated MDI, polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, benzylamine diisocyanate, xylylene diisocyanate (XDI) , Hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanophenyl) thiophosphate, tetramethylxylylene diisocyanate, 1,6,11-undecane Triisocyanate, etc.

又，作為上述異氰酸酯化合物，亦可使用藉由多元醇與過量之異氰酸酯化合物之反應所獲得之經鏈延長之異氰酸酯化合物。作為上述多元醇，例如可列舉：乙二醇、丙二醇、甘油、山梨糖醇、三羥甲基丙烷、碳酸酯二醇、聚醚二醇、聚酯二醇、聚己內酯二醇等。As the isocyanate compound, a chain-extended isocyanate compound obtained by reacting a polyol with an excessive amount of an isocyanate compound can also be used. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, glycerol, sorbitol, trimethylolpropane, carbonate diol, polyether diol, polyester diol, and polycaprolactone diol.

作為上述具有羥基之(甲基)丙烯酸衍生物，例如可列舉：二元醇之單(甲基)丙烯酸酯、三元醇之單(甲基)丙烯酸酯或二(甲基)丙烯酸酯、環氧(甲基)丙烯酸酯等。 作為上述二元醇，例如可列舉：乙二醇、丙二醇、1,3-丙二醇、1,3-丁二醇、1,4-丁二醇、聚乙二醇等。 作為上述三元醇，例如可列舉：三羥甲基乙烷、三羥甲基丙烷、甘油等。 作為上述環氧(甲基)丙烯酸酯，例如可列舉：雙酚A型環氧(甲基)丙烯酸酯等。Examples of the (meth) acrylic acid derivative having a hydroxyl group include a mono (meth) acrylate of a diol, a mono (meth) acrylate or a di (meth) acrylate of a triol, and a cyclic Oxygen (meth) acrylate and the like. Examples of the glycol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, and polyethylene glycol. Examples of the triol include trimethylolethane, trimethylolpropane, and glycerol. Examples of the epoxy (meth) acrylate include a bisphenol A epoxy (meth) acrylate and the like.

作為上述(甲基)丙烯酸胺酯中所市售者，例如可列舉：東亞合成公司製造之(甲基)丙烯酸胺酯、Daicel Allnex公司製造之(甲基)丙烯酸胺酯、根上工業公司製造之(甲基)丙烯酸胺酯、新中村化學工業公司製造之(甲基)丙烯酸胺酯、共榮社化學公司製造之(甲基)丙烯酸胺酯等。 作為上述東亞合成公司製造之(甲基)丙烯酸胺酯，例如可列舉：M-1100、M-1200、M-1210、M-1600等。 作為上述Daicel Allnex公司製造之(甲基)丙烯酸胺酯，例如可列舉：EBECRYL 230、EBECRYL 270、EBECRYL 4858、EBECRYL 8402、EBECRYL 8411、EBECRYL 8412、EBECRYL 8413、EBECRYL 8804、EBECRYL 8803、EBECRYL 8807、EBECRYL 9260、EBECRYL 1290、EBECRYL 5129、EBECRYL 4842、EBECRYL 210、EBECRYL 4827、EBECRYL 6700、EBECRYL 220、EBECRYL 2220、KRM 7735、KRM-8295等。 作為上述根上工業公司製造之(甲基)丙烯酸胺酯，例如可列舉：Artresin UN-9000H、Artresin UN-9000A、Artresin UN-7100、Artresin UN-1255、Artresin UN-330、Artresin UN-3320HB、Artresin UN-1200TPK、Artresin SH-500B等。 作為上述新中村化學工業公司製造之(甲基)丙烯酸胺酯，例如可列舉：U-2HA、U-2PHA、U-3HA、U-4HA、U-6H、U-6LPA、U-6HA、U-10H、U-15HA、U-122A、U-122P、U-108、U-108A、U-324A、U-340A、U-340P、U-1084A、U-2061BA、UA-340P、UA-4100、UA-4000、UA-4200、UA-4400、UA-5201P、UA-7100、UA-7200、UA-W2A等。 作為上述共榮社化學公司製造之(甲基)丙烯酸胺酯，例如可列舉：Al-600、AH-600、AT-600、UA-101I、UA-101T、UA-306H、UA-306I、UA-306T等。Examples of the commercially available amine (meth) acrylate include, for example, amine (meth) acrylate manufactured by Toa Kosei, amine (meth) acrylate manufactured by Daicel Allnex, and manufactured by Kegami Industry Co., Ltd. (Meth) acrylic acid amine esters, (meth) acrylic acid amine esters manufactured by Shin Nakamura Chemical Co., Ltd., Kyoeisha Chemical Co., Ltd. (meth) acrylic acid amine esters, and the like. Examples of the (meth) acrylic acid amine ester manufactured by the Toa Synthesis Corporation include M-1100, M-1200, M-1210, and M-1600. Examples of the (meth) acrylic acid amine ester manufactured by the above-mentioned Daicel Allnex company include, for example, EBECRYL 230, EBECRYL 270, EBECRYL 4858, EBECRYL 8402, EBECRYL 8411, EBECRYL 8412, EBECRYL 8413, EBECRYL 8804, EBECRYL 8803, EBECRYL 8807, EBECRYL 9260, EBECRYL 1290, EBECRYL 5129, EBECRYL 4842, EBECRYL 210, EBECRYL 4827, EBECRYL 6700, EBECRYL 220, EBECRYL 2220, KRM 7735, KRM-8295, etc. Examples of the (meth) acrylic acid amine esters manufactured by the above-mentioned Gensangyo include: Artresin UN-9000H, Artresin UN-9000A, Artresin UN-7100, Artresin UN-1255, Artresin UN-330, Artresin UN-3320HB, Artresin UN-1200TPK, Artresin SH-500B, etc. Examples of the (meth) acrylic acid amine esters manufactured by the aforementioned Shin Nakamura Chemical Industry Co., Ltd. include, for example, U-2HA, U-2PHA, U-3HA, U-4HA, U-6H, U-6LPA, U-6HA, U -10H, U-15HA, U-122A, U-122P, U-108, U-108A, U-324A, U-340A, U-340P, U-1084A, U-2061BA, UA-340P, UA-4100 , UA-4000, UA-4200, UA-4400, UA-5201P, UA-7100, UA-7200, UA-W2A, etc. Examples of the (meth) acrylic acid amine manufactured by the aforementioned Kyoeisha Chemical Company include Al-600, AH-600, AT-600, UA-101I, UA-101T, UA-306H, UA-306I, and UA -306T and so on.

又，亦可適宜使用上述以外之其他自由基聚合性化合物。 作為上述其他自由基聚合性化合物，例如可列舉：(甲基)丙烯醯胺化合物、乙烯系化合物等。 作為上述(甲基)丙烯醯胺化合物，例如可列舉：N,N-二甲基(甲基)丙烯醯胺、N-(甲基)丙烯醯口末啉、N-羥基乙基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-異丙基(甲基)丙烯醯胺、N,N-二甲基胺基丙基(甲基)丙烯醯胺等。 作為上述乙烯系化合物，例如可列舉：苯乙烯、α-甲基苯乙烯、N-乙烯-2-吡咯啶酮、N-乙烯-ε-己內醯胺等。Moreover, other radically polymerizable compounds other than the above may be suitably used. Examples of the other radically polymerizable compound include (meth) acrylamido compounds and vinyl compounds. Examples of the (meth) acrylamide compound include N, N-dimethyl (meth) acrylamide, N- (meth) acrylamine, and N-hydroxyethyl (methyl) Acrylamide, N, N-diethyl (meth) acrylamide, N-isopropyl (meth) acrylamide, N, N-dimethylaminopropyl (meth) acrylamine Amine, etc. Examples of the vinyl compound include styrene, α-methylstyrene, N-ethylene-2-pyrrolidone, N-ethylene-ε-caprolactam, and the like.

關於上述自由基聚合性化合物，就調整硬化性等觀點而言，較佳為含有單官能自由基聚合性化合物與多官能自由基聚合性化合物。藉由含有上述單官能自由基聚合性化合物與上述多官能自由基聚合性化合物，而所獲得之光與濕氣硬化型樹脂組成物成為硬化性及黏性更優異者。其中，較佳為將(甲基)丙烯酸胺酯與上述單官能自由基聚合性化合物組合而用作上述多官能自由基聚合性化合物。又，上述多官能自由基聚合性化合物較佳為二官能或三官能，更佳為二官能。It is preferable that the said radically polymerizable compound contains a monofunctional radically polymerizable compound and a polyfunctional radically polymerizable compound from a viewpoint of adjusting hardenability. By containing the above-mentioned monofunctional radically polymerizable compound and the above-mentioned polyfunctional radically polymerizable compound, the obtained light and moisture-curable resin composition becomes more excellent in curability and viscosity. Among these, it is preferable to use the amine (meth) acrylate in combination with the monofunctional radical polymerizable compound as the polyfunctional radical polymerizable compound. The polyfunctional radical polymerizable compound is preferably difunctional or trifunctional, and more preferably difunctional.

於上述自由基聚合性化合物含有上述單官能自由基聚合性化合物與上述多官能自由基聚合性化合物之情形時，上述多官能自由基聚合性化合物之含量相對於上述單官能自由基聚合性化合物與上述多官能自由基聚合性化合物之合計100重量份，較佳之下限為2重量份，較佳之上限為45重量份。藉由上述多官能自由基聚合性化合物之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為硬化性及黏性更優異者。上述多官能自由基聚合性化合物之含量之更佳之下限為5重量份，更佳之上限為35重量份。When the said radically polymerizable compound contains the said monofunctional radically polymerizable compound and the said polyfunctional radically polymerizable compound, content of the said polyfunctional radically polymerizable compound with respect to the said monofunctional radically polymerizable compound and The total of the above-mentioned polyfunctional radical polymerizable compound is 100 parts by weight, with a preferred lower limit of 2 parts by weight and a preferred upper limit of 45 parts by weight. When the content of the above-mentioned polyfunctional radically polymerizable compound is within this range, the obtained light and moisture-curable resin composition becomes one having more excellent curability and viscosity. A more preferable lower limit of the content of the polyfunctional radical polymerizable compound is 5 parts by weight, and a more preferable upper limit is 35 parts by weight.

上述光聚合性化合物之含量相對於濕氣硬化型胺酯樹脂與光聚合性化合物之合計100重量份，較佳之下限為10重量份，較佳之上限為80重量份。藉由上述光聚合性化合物之含量在該範圍，而使所獲得之光與濕氣硬化型樹脂組成物成為光硬化性與濕氣硬化性之兩者更優異者。上述光聚合性化合物之含量之更佳之下限為30重量份，更佳之上限為60重量份。The content of the photopolymerizable compound is 100 parts by weight based on the total of the moisture-curable amine ester resin and the photopolymerizable compound, with a preferred lower limit of 10 parts by weight and a preferred upper limit of 80 parts by weight. When the content of the photopolymerizable compound is within this range, the obtained light and moisture-curable resin composition becomes more excellent in both light-curability and moisture-curability. A more preferable lower limit of the content of the photopolymerizable compound is 30 parts by weight, and a more preferable upper limit is 60 parts by weight.

本發明之光與濕氣硬化型樹脂組成物含有光聚合起始劑。 作為上述光聚合起始劑，可較佳地使用光自由基聚合起始劑。 作為上述光自由基聚合起始劑，例如可列舉：二苯甲酮系化合物、苯乙酮系化合物、醯基膦氧化物系化合物、二茂鈦系化合物、肟酯系化合物、安息香醚系化合物、9-氧硫口山口星等。The light and moisture-curable resin composition of the present invention contains a photopolymerization initiator. As the photopolymerization initiator, a photoradical polymerization initiator can be preferably used. Examples of the photoradical polymerization initiator include benzophenone-based compounds, acetophenone-based compounds, fluorenylphosphine oxide-based compounds, titanocene-based compounds, oxime ester-based compounds, and benzoin-ether-based compounds. , 9-oxysulfur mouth Yamaguchi magnitude.

作為上述光自由基聚合起始劑中所市售者，例如可列舉：BASF公司製造之光自由基聚合起始劑、東京化成工業公司製造之光自由基聚合起始劑等。 作為上述BASF公司製造之光自由基聚合起始劑，例如可列舉：IRGACURE 184、IRGACURE 369、IRGACURE 379、IRGACURE 651、IRGACURE 784、IRGACURE 819、IRGACURE 907、IRGACURE 2959、IRGACURE OXE01、IRGACURE TPO等。 作為上述東京化成工業公司製造之光自由基聚合起始劑，例如可列舉：安息香甲醚、安息香***、安息香異丙醚等。Examples of the commercially available photoradical polymerization initiators include photoradical polymerization initiators manufactured by BASF Corporation, photoradical polymerization initiators manufactured by Tokyo Chemical Industry Co., Ltd., and the like. Examples of the photoradical polymerization initiator manufactured by the BASF company include IRGACURE 184, IRGACURE 369, IRGACURE 379, IRGACURE 651, IRGACURE 784, IRGACURE 819, IRGACURE 907, IRGACURE 2959, IRGACURE OXE01, IRGACURE TPO, and the like. Examples of the photo-radical polymerization initiator produced by the Tokyo Chemical Industry Co., Ltd. include benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether.

上述光聚合起始劑之含量相對於上述光聚合性化合物100重量份，較佳之下限為0.01重量份，較佳之上限為10重量份。藉由上述光聚合起始劑之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為光硬化性及保存穩定性更優異者。上述光聚合起始劑之含量之更佳之下限為0.1重量份，更佳之上限為5重量份。The content of the photopolymerization initiator is preferably 0.01 part by weight with respect to 100 parts by weight of the photopolymerizable compound, and the preferable upper limit is 10 parts by weight. When the content of the photopolymerization initiator is within this range, the obtained light and moisture-curable resin composition becomes one having more excellent light-curability and storage stability. A more preferable lower limit of the content of the photopolymerization initiator is 0.1 part by weight, and a more preferable upper limit is 5 parts by weight.

本發明之光與濕氣硬化型樹脂組成物含有濕氣硬化促進觸媒。 關於上述濕氣硬化促進觸媒，就促進上述濕氣硬化型胺酯樹脂之濕氣硬化反應之效果優異之方面而言，較佳為含有胺觸媒，更佳為含有三級胺，進而較佳為含有二烷基胺型之三級胺。又，較佳為二胺或三胺，更佳為下述式（2）所表示之胺系觸媒。其中，較佳為含有雙(二烷基胺基烷基)醚、N,N,N',N',N'',N''-五甲基二伸乙基三胺、2,2'-二嗎啉基二***，更佳為含有雙(2-二甲基胺基乙基)醚。The light and moisture-curable resin composition of the present invention contains a moisture-curing promoting catalyst. Regarding the above-mentioned moisture hardening accelerating catalyst, it is preferable to contain an amine catalyst, and more preferably a tertiary amine, in terms of the effect of accelerating the moisture hardening reaction of the above moisture-curing amine ester resin. A tertiary amine of the dialkylamine type is preferred. Moreover, a diamine or a triamine is preferable, and an amine catalyst represented by following formula (2) is more preferable. Among these, bis (dialkylaminoalkyl) ether, N, N, N ', N', N '', N ''-pentamethyldiethylene triamine, and 2,2 'are preferable. -Dimorpholinyl diethyl ether, more preferably bis (2-dimethylaminoethyl) ether.

式（2）中，R1 分別獨立地表示氫原子或碳數3以下之伸烷基，Y分別獨立地表示碳數1以上且6以下之伸烷基，X表示NR2 或氧原子，R2 表示氫原子或碳數3以下之烷基，較佳為表示碳數3以下之烷基。In the formula (2), R 1 each independently represents a hydrogen atom or an alkylene group having a carbon number of 3 or less, Y is each independently an alkylene group having a carbon number of 1 to 6 and X, X represents NR 2 or an oxygen atom, and R 2 represents a hydrogen atom or an alkyl group having 3 or less carbon atoms, and preferably represents an alkyl group having 3 or less carbon atoms.

上述濕氣硬化促進觸媒相對於上述濕氣硬化型胺酯樹脂100重量份之含量之較佳之下限為0.1重量份，較佳之上限為10重量份。藉由上述濕氣硬化促進觸媒之含量在該範圍，而成為維持所獲得之光與濕氣硬化型樹脂組成物之優異之保存穩定性，並且促進上述濕氣硬化型胺酯樹脂之濕氣硬化反應之效果更優異者。上述濕氣硬化促進觸媒之含量之更佳之下限為0.2重量份，進而較佳之下限為0.3重量份，尤佳之下限為0.5重量份，更佳之上限為8重量份，進而較佳之上限為5重量份。A preferable lower limit of the content of the moisture hardening promoting catalyst with respect to 100 parts by weight of the moisture hardening amine ester resin is 0.1 part by weight, and a preferable upper limit is 10 parts by weight. When the content of the moisture-hardening-promoting catalyst is within this range, the excellent storage stability of the obtained light and moisture-curing resin composition is maintained, and the moisture of the moisture-curing amine ester resin is promoted. The effect of the hardening reaction is more excellent. The more preferable lower limit of the content of the moisture-hardening-promoting catalyst is 0.2 part by weight, and the more preferable lower limit is 0.3 part by weight, the more preferable lower limit is 0.5 part by weight, the more preferable upper limit is 8 parts by weight, and the more preferable upper limit is 5 Parts by weight.

本發明之光與濕氣硬化型樹脂組成物含有穩定劑。 藉由將上述穩定劑與上述硬化促進觸媒組合而含有，而本發明之光與濕氣硬化型樹脂組成物成為濕氣硬化時之速硬化性及保存穩定性優異者。The light and moisture-curable resin composition of the present invention contains a stabilizer. The light stabilizer and the moisture-curable resin composition of the present invention are contained in combination with the above-mentioned stabilizer and the hardening-accelerating catalyst, and are excellent in rapid curing properties and storage stability during moisture curing.

上述穩定劑較佳為含有亞磷酸酯及/或磷酸酯。 作為上述亞磷酸酯，例如可列舉：亞磷酸三乙酯、亞磷酸三(2-乙基己基)酯、亞磷酸十三烷基酯、亞磷酸三月桂酯、亞磷酸三(十三烷基)酯、亞磷酸三油酯、亞磷酸三硬脂酯、亞磷酸三苯酯、亞磷酸三甲苯酯、亞磷酸三壬基苯酯、亞磷酸三(2,4-二第三丁基苯基)酯、亞磷酸二苯基單(2-乙基己基)酯、亞磷酸二苯基單癸酯、亞磷酸二苯基單(十三烷基)酯、三月桂基三硫代亞磷酸酯、二乙基氫亞磷酸酯、雙(2-乙基己基)氫亞磷酸酯、二月桂基氫亞磷酸酯、二油基氫亞磷酸酯、二苯基氫亞磷酸酯、四苯基二丙二醇二亞磷酸酯、雙(癸基)新戊四醇二亞磷酸酯、雙(十三烷基)新戊四醇二亞磷酸酯、二硬脂基新戊四醇二亞磷酸酯等。其中，較佳為亞磷酸二苯基單(十三烷基)酯。 作為上述磷酸酯，例如可列舉：磷酸三甲酯、磷酸三乙酯、磷酸三苯酯、磷酸三甲苯酯、磷酸三(二甲苯)酯、磷酸甲苯基二苯酯、磷酸甲苯基二2,6-(二甲苯)酯、磷酸三(氯丙基)酯、磷酸三(三溴新戊基)酯、或縮合磷酸酯等。其中，較佳為縮合磷酸酯，更佳為芳香族縮合磷酸酯。The stabilizer preferably contains a phosphite and / or a phosphate. Examples of the phosphite include triethyl phosphite, tri (2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, and tris (tridecyl phosphite). ) Ester, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, tricresyl phosphite, trinonylphenyl phosphite, tris (2,4-di-tert-butylbenzene phosphite) Yl) ester, diphenyl mono (2-ethylhexyl) phosphite, diphenyl monodecyl phosphite, diphenyl mono (tridecyl) phosphite, trilauryl trithiophosphite Ester, diethylhydrophosphite, bis (2-ethylhexyl) hydrophosphite, dilaurylhydrophosphite, dioleylhydrophosphite, diphenylhydrophosphite, tetraphenyl Dipropylene glycol diphosphite, bis (decyl) nepentaerythritol diphosphite, bis (tridecyl) nepentaerythritol diphosphite, distearyl neopentaerythritol diphosphite, etc. . Among them, diphenyl mono (tridecyl) phosphite is preferred. Examples of the phosphate include trimethyl phosphate, triethyl phosphate, triphenyl phosphate, tricresyl phosphate, tris (xyl) phosphate, tolyl diphenyl phosphate, and tolyl diphosphate 2, 6- (xylene) ester, tri (chloropropyl) phosphate, tri (tribromoneopentyl) phosphate, or condensed phosphate. Among these, a condensed phosphate is preferable, and an aromatic condensed phosphate is more preferable.

上述穩定劑相對於上述濕氣硬化型胺酯樹脂100重量份之含量之較佳之下限為0.1重量份，較佳之上限為20重量份。藉由上述穩定劑之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為維持濕氣硬化時之速硬化性，並且保存穩定性更優異者。上述穩定劑之含量之更佳之下限為1重量份，進而較佳之下限為3重量份，更佳之上限為15重量份，進而較佳之上限為10重量份。A preferable lower limit of the content of the stabilizer with respect to 100 parts by weight of the moisture-curable amine ester resin is 0.1 part by weight, and a preferable upper limit is 20 parts by weight. When the content of the above-mentioned stabilizer is within this range, the obtained light and moisture-curable resin composition becomes one that maintains the rapid curing property during moisture curing and has more excellent storage stability. The more preferable lower limit of the content of the stabilizer is 1 part by weight, the more preferable lower limit is 3 parts by weight, the more preferable upper limit is 15 parts by weight, and the more preferable upper limit is 10 parts by weight.

就兼顧保存穩定性與速硬化性之觀點而言，上述濕氣硬化促進觸媒與上述穩定劑之重量比（濕氣硬化促進觸媒：穩定劑）較佳為1：20〜5：1，更佳為1：10〜1：1。又，上述濕氣硬化促進觸媒中之胺基與上述穩定劑之莫耳比（胺基：穩定劑）較佳為1：5〜20：1，更佳為1：2.5〜4：1。From the viewpoint of considering both storage stability and rapid curing, the weight ratio of the moisture curing accelerator to the stabilizer (moisture curing accelerator: stabilizer) is preferably 1:20 to 5: 1. It is more preferably 1:10 to 1: 1. In addition, the molar ratio (amine group: stabilizer) of the amine group in the moisture hardening promoting catalyst to the stabilizer is preferably 1: 5 to 20: 1, and more preferably 1: 2.5 to 4: 1.

本發明之光與濕氣硬化型樹脂組成物較佳為含有填充劑。藉由含有上述填充劑，而本發明之光與濕氣硬化型樹脂組成物成為具有較佳之觸變性者，可充分地保持塗佈後之形狀。The light and moisture curing resin composition of the present invention preferably contains a filler. By containing the above-mentioned filler, the light and moisture-curable resin composition of the present invention has better thixotropy, and can sufficiently maintain the shape after coating.

上述填充劑之一次粒徑之較佳之下限為1 nm，較佳之上限為50 nm。藉由上述填充劑之一次粒徑在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為塗佈性及塗佈後之形狀保持性更優異者，尤其成為適於窄邊緣設計之顯示元件者。上述填充劑之一次粒徑之更佳之下限為5 nm，更佳之上限為30 nm，進而較佳之下限為10 nm，進而較佳之上限為20 nm。 再者，上述填充劑之一次粒徑可使用NICOMP 380ZLS（PARTICLE SIZING SYSTEMS公司製造），使上述填充劑分散於溶劑（水、有機溶劑等）中進行測定。 又，上述填充劑有於本發明之光與濕氣硬化型樹脂組成物中以二次粒子（複數個一次粒子聚集而成者）之形式存在之情形，此種二次粒子之粒徑之較佳之下限為5 nm，較佳之上限為500 nm，更佳之下限為10 nm，更佳之上限為100 nm。上述填充劑之二次粒子之粒徑可藉由使用穿透式電子顯微鏡（TEM）觀察本發明之光與濕氣硬化型樹脂組成物或其硬化物而測定。The preferred lower limit of the primary particle diameter of the filler is 1 nm, and the preferred upper limit is 50 nm. With the primary particle diameter of the filler in this range, the obtained light and moisture-curable resin composition becomes more excellent in coatability and shape retention after coating, and is particularly suitable for narrow-edge design. Display component. The lower limit of the primary particle diameter of the filler is more preferably 5 nm, the more preferable upper limit is 30 nm, the more preferable lower limit is 10 nm, and the more preferable upper limit is 20 nm. The primary particle diameter of the filler can be measured by using NICOMP 380ZLS (manufactured by PARTICLE SIZING SYSTEMS), dispersing the filler in a solvent (water, organic solvent, etc.). In addition, the filler mentioned above may exist in the form of secondary particles (composed of a plurality of primary particles) in the light and moisture-curable resin composition of the present invention. The lower limit is 5 nm, the upper limit is 500 nm, the lower limit is 10 nm, and the upper limit is 100 nm. The particle diameter of the secondary particles of the filler can be measured by observing the light and moisture-curable resin composition of the present invention or a cured product thereof using a transmission electron microscope (TEM).

作為上述填充劑，較佳為無機填充劑，例如可列舉：二氧化矽（silica）、滑石、氧化鈦、氧化鋅、碳酸鈣等。其中，就所獲得之光與濕氣硬化型樹脂組成物成為紫外線穿透性優異者之方面而言，較佳為二氧化矽。該等填充劑可單獨使用，亦可將兩種以上組合而使用。The filler is preferably an inorganic filler, and examples thereof include silica, talc, titanium oxide, zinc oxide, and calcium carbonate. Among these, silicon dioxide is preferred in that the obtained light and moisture-curable resin composition is excellent in ultraviolet light transmission. These fillers may be used alone or in combination of two or more.

上述填充劑較佳為進行疏水性表面處理。藉由上述疏水性表面處理，而所獲得之光與濕氣硬化型樹脂組成物成為塗佈後之形狀保持性更優異者。 作為上述疏水性表面處理，可列舉：矽烷化處理、烷基化處理、環氧化處理等。其中，就提高形狀保持性之效果優異之方面而言，較佳為矽烷化處理，更佳為三甲基矽烷化處理。The filler is preferably subjected to a hydrophobic surface treatment. By the above-mentioned hydrophobic surface treatment, the obtained light and moisture-curable resin composition becomes more excellent in shape retention after coating. Examples of the hydrophobic surface treatment include a silylation treatment, an alkylation treatment, and an epoxidation treatment. Among them, in terms of the effect of improving the shape retention property, a silylation treatment is preferred, and a trimethylsilanization treatment is more preferred.

作為對上述填充劑進行疏水性表面處理之方法，例如可列舉：使用六甲基二矽氮烷等表面處理劑對填充劑之表面進行處理之方法等。 具體而言，例如上述三甲基矽烷化處理二氧化矽可藉由將二氧化矽利用溶膠凝膠法等方法進行合成，於使二氧化矽流動之狀態下噴霧表面處理劑之方法；或於醇、甲苯等有機溶劑中添加二氧化矽，進而添加表面處理劑與水後，利用蒸發器將水與有機溶劑進行蒸發乾燥之方法等而製作。Examples of the method for the hydrophobic surface treatment of the filler include a method of treating the surface of the filler with a surface treatment agent such as hexamethyldisilazane. Specifically, for example, the above trimethylsilanized silicon dioxide can be synthesized by a method such as sol-gel method, and the method of spraying a surface treatment agent in a state where the silicon dioxide flows; or It is produced by adding silicon dioxide to an organic solvent such as alcohol and toluene, further adding a surface treatment agent and water, and then evaporating and drying the water and the organic solvent with an evaporator.

本發明之光與濕氣硬化型樹脂組成物100重量份中之上述填充劑之含量之較佳之下限為1重量份，較佳之上限為20重量份。藉由上述填充劑之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為塗佈性及塗佈後之形狀保持性更優異者。上述填充劑之含量之更佳之下限為2重量份，更佳之上限為15重量份，進而較佳之下限為3重量份，進而較佳之上限為10重量份，尤佳之下限為4重量份。A preferable lower limit of the content of the filler in 100 parts by weight of the light and moisture-curable resin composition of the present invention is 1 part by weight, and a preferable upper limit is 20 parts by weight. When the content of the filler is within this range, the obtained light and moisture-curable resin composition becomes more excellent in coatability and shape retention after coating. The more preferable lower limit of the content of the filler is 2 parts by weight, the more preferable upper limit is 15 parts by weight, the more preferable lower limit is 3 parts by weight, the more preferable upper limit is 10 parts by weight, and the more preferable lower limit is 4 parts by weight.

本發明之光與濕氣硬化型樹脂組成物亦可含有遮光劑。 藉由含有上述遮光劑，而本發明之光與濕氣硬化型樹脂組成物成為遮光性優異者，例如於用於顯示元件之情形時可防止漏光。又，使用摻合有上述遮光劑之本發明之光與濕氣硬化型樹脂組成物所製造之顯示元件由於光與濕氣硬化型樹脂組成物具有充分之遮光性，故而無光之洩漏而具有較高之對比度，成為具有優異之圖像顯示品質者。 再者，於本說明書中，上述「遮光劑」表示具有不易使可見光區域之光穿透之能力之材料。The light and moisture-curable resin composition of the present invention may contain a light-shielding agent. By containing the above-mentioned light-shielding agent, the light and moisture-curable resin composition of the present invention is excellent in light-shielding properties, and can prevent light leakage when used in a display device, for example. In addition, a display element manufactured by using the light and moisture-curable resin composition of the present invention in which the above-mentioned light-shielding agent is blended, has sufficient light-shielding properties, and therefore has no light leakage. The higher the contrast, the better the image display quality. In addition, in the present specification, the above-mentioned "shading agent" means a material having a capability of not easily transmitting light in the visible light region.

作為上述遮光劑，例如可列舉：氧化鐵、鈦黑、苯胺黑、花青黑、富勒烯、碳黑、樹脂被覆型碳黑等。又，上述遮光劑亦可不為呈現黑色者，只要為具有不易使可見光區域之光穿透之能力之材料，則二氧化矽、滑石、氧化鈦等作為填充劑所列舉之材料亦包含於上述遮光劑中。其中，較佳為鈦黑。Examples of the light-shielding agent include iron oxide, titanium black, aniline black, cyanine black, fullerene, carbon black, and resin-coated carbon black. In addition, the above-mentioned light-shielding agent may not be black, as long as the material has the ability to not easily transmit light in the visible light region, the materials listed as fillers such as silicon dioxide, talc, and titanium oxide are also included in the light-shielding. Agent. Among these, titanium black is preferred.

上述鈦黑係與對波長300〜800 nm之光之平均穿透率相比，對紫外線區域附近、尤其是波長370〜450 nm之光之穿透率提高之物質。 即，上述鈦黑係藉由充分遮蔽可見光區域之波長之光而對本發明之光與濕氣硬化型樹脂組成物賦予遮光性，另一方面，具有使紫外線區域附近之波長之光穿透之性質之遮光劑。因此，作為光聚合起始劑，可藉由使用可藉由上述鈦黑之穿透率提高之波長（370〜450 nm）之光而開始反應者，而進一步增大本發明之光與濕氣硬化型樹脂組成物之光硬化性。又，另一方面，作為本發明之光與濕氣硬化型樹脂組成物中所含之遮光劑，較佳為絕緣性較高之物質，作為絕緣性較高之遮光劑，亦較佳為鈦黑。 上述鈦黑之光學濃度（OD值）較佳為3以上，更佳為4以上。又，上述鈦黑之黑色度（L值）較佳為9以上，更佳為11以上。上述鈦黑之遮光性越高越佳，上述鈦黑之OD值並無特別較佳之上限，通常成為5以下。Compared with the average transmittance of the above-mentioned titanium black to light having a wavelength of 300 to 800 nm, the material having an improved transmittance to the vicinity of the ultraviolet region, particularly to light having a wavelength of 370 to 450 nm. That is, the above-mentioned titanium black is capable of imparting light-shielding properties to the light and the moisture-curable resin composition of the present invention by sufficiently shielding light of a wavelength in a visible light region, and has a property of transmitting light of a wavelength near an ultraviolet region. Of sunscreen. Therefore, as a photopolymerization initiator, the light and moisture of the present invention can be further increased by using light having a wavelength (370 to 450 nm) that can increase the transmittance of the titanium black as described above. Photocurability of the curable resin composition. On the other hand, as the light-shielding agent contained in the light-and-moisture-curable resin composition of the present invention, a substance having a high insulating property is preferable, and as a light-shielding agent having a high insulating property, titanium is also preferable. black. The optical density (OD value) of the titanium black is preferably 3 or more, and more preferably 4 or more. The blackness (L value) of the titanium black is preferably 9 or more, and more preferably 11 or more. The higher the light-shielding property of the titanium black, the better. The OD value of the titanium black does not have a particularly preferable upper limit, but it is usually 5 or less.

上述鈦黑即便為不進行表面處理者，亦發揮充分之效果，但亦可使用表面經偶合劑等有機成分所處理者、由氧化矽、氧化鈦、氧化鍺、氧化鋁、氧化鋯、氧化鎂等無機成分所被覆者等、經表面處理之鈦黑。其中，就進一步提高絕緣性之方面而言，經有機成分所處理者較佳。The above-mentioned titanium black exhibits sufficient effects even if it is not subjected to surface treatment, but it can also be treated with organic components such as coupling agents on the surface, silicon oxide, titanium oxide, germanium oxide, aluminum oxide, zirconia, and magnesium oxide. Surface-treated titanium black, such as those covered by inorganic components. Among them, in terms of further improving the insulation properties, those treated with an organic component are preferred.

上述鈦黑之比表面積之較佳之下限為5 m2 /g，較佳之上限為40 m2 /g，更佳之下限為10 m2 /g，更佳之上限為25 m2 /g。 又，關於上述鈦黑之薄片電阻之較佳之下限，於與樹脂混合之情形（摻合70%）時，為109 Ω/□，更佳之下限為1011 Ω/□。The preferred lower limit of the specific surface area of the titanium black is 5 m 2 / g, the preferred upper limit is 40 m 2 / g, the more preferred lower limit is 10 m 2 / g, and the more preferred upper limit is 25 m 2 / g. The lower limit of the sheet resistance of the titanium black is 10 9 Ω / □ when it is mixed with the resin (70% blend), and the more preferable lower limit is 10 11 Ω / □.

作為上述鈦黑中所市售者，例如可列舉：12S、13M、13M-C、13R-N（均為Mitsubishi Materials公司製造）、Tilack D（赤穗化成公司製造）等。Examples of commercially available titanium blacks include 12S, 13M, 13M-C, and 13R-N (all manufactured by Mitsubishi Materials), and Tilack D (made by Akaho Kasei).

於本發明之光與濕氣硬化型樹脂組成物中，上述遮光劑之一次粒徑可根據用途而適宜選擇顯示元件之基板間之距離以下等，但較佳之下限為30 nm，較佳之上限為500 nm。藉由上述遮光劑之一次粒徑在該範圍，而於不使黏度及觸變性大幅度增加之情況下，使所獲得之光與濕氣硬化型樹脂組成物成為於基板之塗佈性及作業性更優異者。上述遮光劑之一次粒徑之更佳之下限為50 nm，更佳之上限為200 nm。 再者，上述遮光劑之一次粒徑可與上述填充劑之一次粒徑同樣地進行測定。In the light and moisture-curable resin composition of the present invention, the primary particle diameter of the above-mentioned light-shielding agent can be appropriately selected according to the use, the distance between the substrates of the display element and the like, but the preferred lower limit is 30 nm, and the preferred upper limit is 500 nm. With the primary particle size of the above-mentioned light-shielding agent in this range, the obtained light and moisture-curable resin composition can be applied to a substrate and work without greatly increasing viscosity and thixotropy. People with better sex. The lower limit of the primary particle size of the above-mentioned sunscreen is more preferably 50 nm, and the more preferable upper limit is 200 nm. In addition, the primary particle diameter of the said light-shielding agent can be measured similarly to the primary particle diameter of the said filler.

本發明之光與濕氣硬化型樹脂組成物100重量份中之上述遮光劑之含量之較佳之下限為0.05重量份，較佳之上限為10重量份。藉由上述遮光劑之含量在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為維持優異之繪圖性、對基板等之接著性、及硬化後之強度，並且遮光性更優異者。上述遮光劑之含量之更佳之下限為0.1重量份，更佳之上限為2重量份，進而較佳之上限為1重量份。A preferable lower limit of the content of the light-shielding agent in 100 parts by weight of the light and moisture-curable resin composition of the present invention is 0.05 parts by weight, and a preferable upper limit is 10 parts by weight. When the content of the above-mentioned light-shielding agent is within this range, the obtained light and moisture-curable resin composition becomes one that maintains excellent drawing properties, adherence to a substrate, etc., and strength after curing, and has more excellent light-shielding properties. . A more preferable lower limit of the content of the light-shielding agent is 0.1 part by weight, a more preferable upper limit is 2 parts by weight, and a more preferable upper limit is 1 part by weight.

本發明之光與濕氣硬化型樹脂組成物進而視需要亦可含有著色劑、離子液體、溶劑、含金屬之粒子、反應性稀釋劑等添加劑。The light and moisture-curable resin composition of the present invention may further contain additives such as a colorant, an ionic liquid, a solvent, metal-containing particles, and a reactive diluent, if necessary.

作為製造本發明之光與濕氣硬化型樹脂組成物之方法，例如可列舉：使用勻相分散機、均質攪拌機、萬能攪拌機、行星式混合機、捏合機、三輥研磨機等混合機，將濕氣硬化型胺酯樹脂、光聚合性化合物、光聚合起始劑、濕氣硬化促進觸媒、穩定劑、及視需要添加之填充劑等進行混合之方法等。As a method for manufacturing the light and moisture-curable resin composition of the present invention, for example, a homomixer, a homomixer, a universal mixer, a planetary mixer, a kneader, a three-roll mill, or the like may be used. A method of mixing a moisture-curable amine ester resin, a photopolymerizable compound, a photopolymerization initiator, a moisture-curing accelerator, a stabilizer, and a filler if necessary.

本發明之光與濕氣硬化型樹脂組成物較佳為含有之水分量為100 ppm以下。藉由上述水分量為100 ppm以下，可抑制保存中之上述濕氣硬化型樹脂與水分之反應，而使光與濕氣硬化型樹脂組成物成為保存穩定性更優異者。上述水分量更佳為80 ppm以下。 再者，上述水分量可藉由卡氏水分測定裝置而測定。The light and moisture-curable resin composition of the present invention preferably contains a water content of 100 ppm or less. When the moisture content is 100 ppm or less, the reaction between the moisture-curable resin and moisture during storage can be suppressed, and the light and moisture-curable resin composition can be made more excellent in storage stability. The above water content is more preferably 80 ppm or less. In addition, the said moisture content can be measured with a Karst moisture measuring device.

本發明之光與濕氣硬化型樹脂組成物之使用錐板型黏度計於25℃、1 rpm之條件下所測定之黏度之較佳之下限為30 Pa·s，較佳之上限為500 Pa·s。藉由上述黏度在該範圍，而成為將光與濕氣硬化型樹脂組成物塗佈於基板等被接著體時之作業性更優異者，尤其成為適於窄邊緣設計之顯示元件或電子零件者。上述黏度之更佳之下限為50 Pa·s，更佳之上限為300 Pa·s。 再者，於本發明之光與濕氣硬化型樹脂組成物之黏度過高之情形時，可藉由於塗佈時進行加溫而提高塗佈性。The lower limit of the viscosity of the light and moisture-curable resin composition of the present invention measured at 25 ° C and 1 rpm using a cone-plate viscosity meter is 30 Pa · s, and the upper limit is preferably 500 Pa · s. . When the viscosity is in this range, it becomes a person having better workability when applying light and moisture-curable resin composition to an adherend such as a substrate, especially a display element or an electronic part suitable for narrow-edge design. . The lower limit of the viscosity is more preferably 50 Pa · s, and the upper limit of the viscosity is 300 Pa · s. Furthermore, in the case where the viscosity of the light and moisture-curable resin composition of the present invention is too high, the coating properties can be improved by heating during coating.

本發明之光與濕氣硬化型樹脂組成物之搖變指數之較佳之下限為1.2，較佳之上限為5.0。藉由上述搖變指數在該範圍，而所獲得之光與濕氣硬化型樹脂組成物成為塗佈性及塗佈後之形狀保持性更優異者。該形狀保持性例如於窄邊緣設計之顯示元件中，就可保持塗佈寬度之方面而言，技術之意義較大。又，於微細之半導體晶片之接著中，就可保持不自接著面伸出之狀態之方面而言，技術之意義較大。上述搖變指數之更佳之下限為1.3，更佳之上限為4.0。 再者，於本說明書中，所謂上述搖變指數，意指用使用錐板型黏度計於25℃、1 rpm之條件下所測定之黏度除以使用錐板型黏度計於25℃、10 rpm之條件下所測定之黏度所得之值。A preferred lower limit of the shake index of the light and moisture-curable resin composition of the present invention is 1.2, and a preferred upper limit is 5.0. When the above-mentioned shake index is within this range, the obtained light and moisture-curable resin composition becomes more excellent in coatability and shape retention after coating. This shape-retaining property is, for example, a display element having a narrow-edge design, and is technically significant in terms of maintaining a coating width. In addition, in the bonding of fine semiconductor wafers, the meaning of technology is great in terms of maintaining a state where they do not protrude from the bonding surface. The better lower limit of the above shake index is 1.3, and the better upper limit is 4.0. In addition, in the present specification, the above-mentioned shake index means dividing the viscosity measured at 25 ° C and 1 rpm using a cone-plate type viscosity meter by 25 ° C and 10 rpm using a cone-plate type viscosity meter. The value obtained by measuring the viscosity under the conditions.

本發明之光與濕氣硬化型樹脂組成物較佳為硬化後之1 mm厚度之硬化物之光學濃度（OD值）為1以上。藉由上述OD值為1以上，可使遮光性優異，於用於顯示元件之情形時防止光之洩漏，獲得較高之對比度。上述OD值更佳為1.5以上。 上述OD值越高越佳，但若為了提高上述OD值而摻合過量之遮光劑，則產生因增黏導致之作業性之降低等，故而為了取得與遮光劑之摻合量之平衡，上述硬化體之OD值之較佳之上限為4。 再者，上述光與濕氣硬化型樹脂組成物之硬化後之OD值可使用光學濃度計進行測定。The light and moisture-curable resin composition of the present invention preferably has an optical density (OD value) of 1 or more of the cured material having a thickness of 1 mm after curing. With the above-mentioned OD value of 1 or more, excellent light-shielding properties can be prevented, and leakage of light can be prevented when used in a display element, and a high contrast can be obtained. The above OD value is more preferably 1.5 or more. The higher the OD value is, the better it is. However, if an excessive amount of a light-shielding agent is blended in order to increase the OD value, a decrease in workability due to thickening and the like will occur. Therefore, in order to achieve a balance with the amount of the light-shielding agent blended, the above A preferable upper limit of the OD value of the hardened body is 4. The OD value of the light and moisture-curable resin composition after curing can be measured using an optical densitometer.

本發明之光與濕氣硬化型樹脂組成物主要用於在電子零件中被接著體之接著。 作為可使用本發明之光與濕氣硬化型樹脂組成物而接著之被接著體，可列舉：金屬、玻璃、塑膠等各種被接著體。 作為上述被接著體之形狀，例如可列舉：膜狀、片狀、板狀、面板狀、盤狀、桿（棒狀體）狀、箱體狀、殼體狀等。The light and moisture-curable resin composition of the present invention is mainly used for bonding an adherend in an electronic component. Examples of the adherend to which the light and moisture-curable resin composition of the present invention can be applied include various adherends such as metal, glass, and plastic. Examples of the shape of the adherend include a film shape, a sheet shape, a plate shape, a panel shape, a disk shape, a rod (rod shape) shape, a box shape, and a shell shape.

作為上述金屬，例如可列舉：鋼鐵、不鏽鋼、鋁、銅、鎳、鉻或其合金等。Examples of the metal include steel, stainless steel, aluminum, copper, nickel, chromium, and alloys thereof.

作為上述玻璃，例如可列舉：鹼玻璃、無鹼玻璃、石英玻璃等。Examples of the glass include alkali glass, alkali-free glass, and quartz glass.

作為上述塑膠，例如可列舉：聚烯烴系樹脂、聚醯胺系樹脂、芳香族聚酯系樹脂、聚腈系樹脂、聚碳酸酯、聚甲基丙烯酸酯系樹脂、聚乙烯樹脂等。 作為上述聚烯烴系樹脂，例如可列舉：高密度聚乙烯、超高分子量聚乙烯、同排聚丙烯、對排聚丙烯、乙烯-丙烯共聚物樹脂。 作為上述聚醯胺系樹脂，例如可列舉：尼龍6（N6）、尼龍66（N66）、尼龍46（N46）、尼龍11（N11）、尼龍12（N12）、尼龍610（N610）、尼龍612（N612）、尼龍6/66共聚物（N6/66）、尼龍6/66/610共聚物（N6/66/610）、尼龍MXD6（MXD6）、尼龍6T、尼龍6/6T共聚物、尼龍66/PP共聚物、尼龍66/PPS共聚物等。 作為上述芳香族聚酯系樹脂，例如可列舉：聚對苯二甲酸丁二酯（PBT）、聚對苯二甲酸乙二酯（PET）、聚間苯二甲酸乙二酯（PEI）、PET/PEI共聚物、聚芳酯（PAR）、聚萘二甲酸丁二酯（PBN）、液晶聚酯、聚氧伸烷基二醯亞胺二酸/聚對苯二甲酸丁二酯共聚物等。 作為上述聚腈系樹脂，例如可列舉：聚丙烯腈（PAN）、聚甲基丙烯腈、丙烯腈/苯乙烯共聚物（AS）、甲基丙烯腈/苯乙烯共聚物、甲基丙烯腈/苯乙烯/丁二烯共聚物等。 作為上述聚甲基丙烯酸酯系樹脂，例如可列舉：聚甲基丙烯酸甲酯（PMMA）、聚甲基丙烯酸乙酯等。 作為上述聚乙烯樹脂，例如可列舉：乙烯/乙酸乙烯酯共聚物（EVA）、聚乙烯醇（PVA）、乙烯醇/乙烯共聚物（EVOH）、聚偏二氯乙烯（PVDC）、聚氯乙烯（PVC）、氯乙烯/偏二氯乙烯共聚物、偏二氯乙烯/丙烯酸甲酯共聚物等。Examples of the plastic include polyolefin resins, polyamide resins, aromatic polyester resins, polynitrile resins, polycarbonates, polymethacrylate resins, and polyethylene resins. Examples of the polyolefin-based resin include high-density polyethylene, ultra-high molecular weight polyethylene, in-row polypropylene, opposite-row polypropylene, and ethylene-propylene copolymer resin. Examples of the polyamide resin include nylon 6 (N6), nylon 66 (N66), nylon 46 (N46), nylon 11 (N11), nylon 12 (N12), nylon 610 (N610), and nylon 612. (N612), nylon 6/66 copolymer (N6 / 66), nylon 6/66/610 copolymer (N6 / 66/610), nylon MXD6 (MXD6), nylon 6T, nylon 6 / 6T copolymer, nylon 66 / PP copolymer, nylon 66 / PPS copolymer, etc. Examples of the aromatic polyester-based resin include polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyethylene isophthalate (PEI), and PET. / PEI copolymer, polyarylate (PAR), polybutylene naphthalate (PBN), liquid crystal polyester, polyoxyalkylene diimide diacid / polybutylene terephthalate copolymer, etc. . Examples of the polynitrile resin include polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile / styrene copolymer (AS), methacrylonitrile / styrene copolymer, and methacrylonitrile / Styrene / butadiene copolymer and the like. Examples of the polymethacrylate-based resin include polymethylmethacrylate (PMMA), polyethylmethacrylate, and the like. Examples of the polyethylene resin include ethylene / vinyl acetate copolymer (EVA), polyvinyl alcohol (PVA), vinyl alcohol / ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), and polyvinyl chloride. (PVC), vinyl chloride / vinylidene chloride copolymer, vinylidene chloride / methyl acrylate copolymer, etc.

又，作為上述被接著體，亦可列舉：表面具有金屬鍍覆層之複合材料，作為該複合材料之鍍覆之基材，例如可列舉：上述金屬、玻璃、塑膠等。 進而，作為上述被接著體，亦可列舉：藉由對金屬表面進行鈍態化處理而形成鈍態皮膜之材料，作為該鈍態化處理，例如可列舉：加熱處理、陽極氧化處理等。尤其於國際鋁合金名為6000系之材質之鋁合金等情形時，可藉由進行硫酸法耐酸鋁處理或磷酸法耐酸鋁處理作為上述鈍態化處理，而提高接著性。Moreover, as the said adherend, the composite material which has a metal plating layer on the surface is mentioned, and as a base material of this composite material plating, the said metal, glass, plastic, etc. are mentioned, for example. Further, examples of the adherend include a material that forms a passive film by subjecting a metal surface to a passive state. Examples of the passive state include heat treatment and anodizing. In particular, in the case of an international aluminum alloy named 6000 series aluminum alloy, etc., it is possible to improve the adhesiveness by performing the sulfuric acid method and aluminum acid resistance treatment or the phosphoric acid method and aluminum acid resistance treatment as the passivation treatment.

作為使用本發明之光與濕氣硬化型樹脂組成物將被接著體進行接著之方法，例如可列舉：具有以下之步驟之方法等。 即，可列舉：首先，進行於第1構件塗佈本發明之光與濕氣硬化型樹脂組成物之步驟。繼而，進行對塗佈於上述第1構件之本發明之光與濕氣硬化型樹脂組成物照射光，而使本發明之光與濕氣硬化型樹脂組成物中之光聚合性化合物硬化之步驟（第1硬化步驟）；及經由上述第1硬化步驟後之光與濕氣硬化型樹脂組成物而將上述第1構件與第2構件貼合之步驟（貼合步驟）。上述貼合步驟後，進行藉由本發明之濕氣硬化型樹脂組成物中之濕氣硬化型樹脂之濕氣硬化而將上述第1構件與上述第2構件接著之步驟（濕氣硬化步驟）之方法等。 又，較佳為包括於上述貼合步驟後照射光之步驟。藉由包括於上述貼合步驟後照射光之步驟，可提高與被接著體剛接著後之接著性（初期接著性）。於上述第1構件及/或上述第2構件為使光穿透之材質之情形時，較佳為越過使光穿透之上述第1構件及/或上述第2構件而照射光。於上述第1構件及/或上述第2構件為不易使光穿透之材質之情形時，較佳為對上述第1構件與上述第2構件經由上述光與濕氣硬化型樹脂組成物所接著之結構體之側面即光與濕氣硬化型樹脂組成物露出之部分照射光。Examples of a method for adhering an adherend using the light and moisture-curable resin composition of the present invention include a method having the following steps and the like. That is, first, the step of applying the light and moisture-curable resin composition of the present invention to the first member is performed. Then, a step of curing the photopolymerizable compound in the light and moisture-curable resin composition of the present invention by applying light to the light and moisture-curable resin composition of the present invention applied to the first member is performed. (First hardening step); and a step of bonding the first member and the second member through the light and moisture-curable resin composition after the first hardening step (bonding step). After the above bonding step, a step (moisture curing step) of adhering the first member and the second member by moisture curing of the moisture curing resin in the moisture curing resin composition of the present invention is performed. Method, etc. In addition, it is preferable to include a step of irradiating light after the above-mentioned bonding step. By including the step of irradiating light after the above-mentioned bonding step, it is possible to improve the adhesion (initial adhesion) immediately after the adherend. When the first member and / or the second member are made of a material that transmits light, it is preferable to irradiate light over the first member and / or the second member that transmit light. When the first member and / or the second member are made of a material that does not easily penetrate light, it is preferable that the first member and the second member are bonded to each other through the light and moisture-curable resin composition. The side of the structure is the light and the exposed portion of the moisture-curable resin composition is irradiated with light.

本發明之光與濕氣硬化型樹脂組成物可尤佳地用作電子零件用接著劑或顯示元件用接著劑。使用本發明之光與濕氣硬化型樹脂組成物而成之電子零件用接著劑、及使用本發明之光與濕氣硬化型樹脂組成物而成之顯示元件用接著劑亦分別為本發明之一種。 [發明之效果]The light and moisture-curable resin composition of the present invention is particularly useful as an adhesive for electronic parts or an adhesive for display elements. Adhesives for electronic parts using the light and moisture-curable resin composition of the present invention, and adhesives for display elements using the light and moisture-curable resin composition of the present invention are also included in the present invention. One. [Effect of the invention]

根據本發明，可提供一種速硬化性及保存穩定性優異之光與濕氣硬化型樹脂組成物。又，根據本發明，可提供一種使用該光與濕氣硬化型樹脂組成物而成之電子零件用接著劑及顯示元件用接著劑。According to the present invention, it is possible to provide a light- and moisture-curable resin composition excellent in rapid curing properties and storage stability. Furthermore, according to the present invention, it is possible to provide an adhesive for electronic parts and an adhesive for display elements using the light and moisture-curable resin composition.

以下，列舉實施例更詳細地說明本發明，但本發明並不僅限定於該等實施例。Hereinafter, the present invention will be described in more detail with examples, but the present invention is not limited to these examples.

（合成例1（濕氣硬化型胺酯樹脂A之製作）） 將作為多元醇化合物之100重量份之聚四亞甲基醚二醇（Mitsubishi Chemical公司製造之「PTMG-2000」）、與0.01重量份之二丁基二月桂酸錫放入至500 mL容量之可分離式燒瓶，於真空下（20 mmHg以下）、100℃攪拌30分鐘，使其等混合。其後，設為常壓，加入作為聚異氰酸酯化合物之二苯基甲烷二異氰酸酯（日曹商事公司製造之「Pure MDI」）26.5重量份，於80℃攪拌3小時而進行反應，獲得濕氣硬化型胺酯樹脂A（重量平均分子量2700）。(Synthesis Example 1 (Preparation of Moisture Curing Amine Ester Resin A)) 100 parts by weight of polytetramethylene ether glycol ("PTMG-2000" manufactured by Mitsubishi Chemical Co., Ltd.) as a polyol compound, and 0.01 Part by weight of dibutyltin dilaurate was placed in a separable flask with a capacity of 500 mL, and stirred under vacuum (20 mmHg or less) at 100 ° C. for 30 minutes, and mixed. Thereafter, it was set to normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate ("Pure MDI" manufactured by Nissho Shoji Co., Ltd.) as a polyisocyanate compound was added, and the reaction was carried out by stirring at 80 ° C for 3 hours to obtain moisture curing. Type amine ester resin A (weight average molecular weight 2700).

（合成例2（濕氣硬化型胺酯樹脂B之製作）） 將作為多元醇化合物之100重量份之聚丙二醇（AGC公司製造之「EXCENOL 2020」）、與0.01重量份之二丁基二月桂酸錫放入至500 mL容量之可分離式燒瓶，於真空下（20 mmHg以下）、100℃攪拌30分鐘攪拌而使其等混合。其後，設為常壓，加入作為聚異氰酸酯化合物之二苯基甲烷二異氰酸酯（日曹商事公司製造之「Pure MDI」）26.5重量份，於80℃攪拌3小時而進行反應，獲得濕氣硬化型胺酯樹脂B（重量平均分子量2900）。(Synthesis Example 2 (Preparation of Moisture Curing Amine Ester Resin B)) 100 parts by weight of a polypropylene glycol ("EXCENOL 2020" manufactured by AGC Corporation) as a polyol compound and 0.01 part by weight of dibutyl dilaurate Put the acid tin into a separable flask with a capacity of 500 mL, and stir under vacuum (less than 20 mmHg) at 100 ° C for 30 minutes to mix. Thereafter, it was set to normal pressure, 26.5 parts by weight of diphenylmethane diisocyanate ("Pure MDI" manufactured by Nissho Shoji Co., Ltd.) as a polyisocyanate compound was added, and the reaction was carried out by stirring at 80 ° C for 3 hours to obtain moisture curing. Type amine ester resin B (weight average molecular weight 2900).

（合成例3（濕氣硬化型胺酯樹脂C之製作）） 於放入有以與合成例1相同之方式所獲得之濕氣硬化型胺酯樹脂A100重量份之反應容器中，添加3-巰基丙基三甲氧基矽烷（信越化學工業公司製造之「KBM-803」）9.8重量份。其後，於氮氣氣流下、80℃進行1小時攪拌混合，獲得於分子末端具有異氰酸基與三甲氧基矽烷基之濕氣硬化型胺酯樹脂C（重量平均分子量3100）。(Synthesis Example 3 (Production of Moisture-hardening Amine Ester Resin C)) Into a reaction container containing 100 parts by weight of the moisture-hardening amine ester A obtained in the same manner as in Synthesis Example 1, was added 3- 9.8 parts by weight of mercaptopropyltrimethoxysilane ("KBM-803" manufactured by Shin-Etsu Chemical Industry Co., Ltd.). Thereafter, the mixture was stirred and mixed at 80 ° C. for 1 hour under a nitrogen gas flow to obtain a moisture-curable urethane resin C (weight average molecular weight 3100) having an isocyanate group and a trimethoxysilyl group at a molecular terminal.

（合成例4（濕氣硬化型胺酯樹脂D之製作）） 將作為多元醇化合物之100重量份之聚四亞甲基醚二醇（Mitsubishi Chemical公司製造之「PTMG-2000」）、與0.01重量份之二丁基二月桂酸錫放入至500 mL容量之可分離式燒瓶，於真空下（20 mmHg以下）、100℃攪拌30分鐘而使其等混合。其後，設為常壓，加入作為聚異氰酸酯化合物之脂肪族系二異氰酸酯27.5重量份，於80℃攪拌3小時而進行反應，獲得濕氣硬化型胺酯樹脂D（重量平均分子量2600）。(Synthesis Example 4 (Preparation of Moisture Curing Amine Ester Resin D)) 100 parts by weight of polytetramethylene ether glycol ("PTMG-2000" manufactured by Mitsubishi Chemical Co., Ltd.) as a polyol compound, and 0.01 Part by weight of dibutyltin dilaurate was placed in a separable flask having a capacity of 500 mL, and the mixture was stirred under vacuum (20 mmHg or less) at 100 ° C. for 30 minutes to be mixed. Thereafter, it was set at normal pressure, 27.5 parts by weight of an aliphatic diisocyanate as a polyisocyanate compound was added, and the mixture was stirred at 80 ° C. for 3 hours to perform a reaction to obtain a moisture-curable amine resin D (weight average molecular weight 2600).

（實施例1〜10、比較例1〜4） 依據表1中所記載之摻合比，將各材料藉由行星式攪拌裝置（Thinky公司製造之「去泡攪拌太郎」）進行攪拌後，藉由陶瓷三輥研磨機而均勻地混合，獲得實施例1〜10、比較例1〜4之光與濕氣硬化型樹脂組成物。(Examples 1 to 10, Comparative Examples 1 to 4) According to the blending ratios described in Table 1, each material was stirred by a planetary stirring device ("Defoaming Stir Taro" manufactured by Thinky), and then borrowed The three-roll ceramic grinder was uniformly mixed to obtain the light and moisture-curable resin compositions of Examples 1 to 10 and Comparative Examples 1 to 4.

＜評價＞ 對實施例及比較例中所獲得之各光與濕氣硬化型樹脂組成物進行以下之評價。將結果示於表1。<Evaluation> The following evaluations were performed on each of the light and moisture-curable resin compositions obtained in the examples and comparative examples. The results are shown in Table 1.

（保存穩定性） 求出對實施例及比較例中所獲得之各光與濕氣硬化型樹脂組成物測定剛製造後之初期黏度、與於25℃保管30天時之黏度時之（於25℃保管30天時之黏度）/（初期黏度）所表示之值作為黏度變化率。將黏度變化率未達1.3之情形設為「〇」，將1.3以上且未達1.8之情形設為「△」，將1.8以上之情形設為「×」而評價保存穩定性。 再者，黏度係使用錐板型黏度計（東機產業公司製造之「VISCOMETER TV-22」），於25℃、旋轉速度1 rpm之條件下進行測定。(Storage stability) The initial viscosity immediately after manufacture of each light and moisture-curable resin composition obtained in the examples and comparative examples and the viscosity at the time of storage at 25 ° C for 30 days were determined (at 25 Viscosity when stored for 30 days at ℃) / (initial viscosity) was used as the viscosity change rate. The case where the viscosity change rate was less than 1.3 was set to "0", the case where 1.3 or more and less than 1.8 was set to "△", and the case where 1.8 or more was set to "x" to evaluate storage stability. The viscosity was measured using a cone-plate viscometer ("VISCOMETER TV-22" manufactured by Toki Sangyo Co., Ltd.) at 25 ° C and a rotation speed of 1 rpm.

（速硬化性（放置30分鐘後之接著力）） 藉由使用點膠裝置，將實施例及比較例中所獲得之各光與濕氣硬化型樹脂組成物以約1 mm之寬度塗佈於鋁基板，使用UV-LED（波長405 nm），照射紫外線1000 mJ/cm2 而使其光硬化。其後，藉由於該鋁基板貼合玻璃板，並放置50 g之砝碼，放置30分鐘而進行濕氣硬化，獲得速硬化性評價用樣品。圖1表示自上方看見速硬化性評價用樣品之情形之模式圖（圖1（a））、及表示自橫向看見速硬化性評價用樣品之情形之模式圖（圖1（b））。對各速硬化性評價用樣品，經過30分鐘之放置時間後立即進行下述之測定。 使用拉伸試驗機（島津製作所公司製造之「Ez-Graph」），將所製作之速硬化性評價用樣品於25℃，於剪斷方向上以5 mm/sec之速度進行拉伸，測定鋁基板與玻璃板剝離時之強度（接著力）。將接著力為8.0 kgf/cm2 以上之情形設為「〇」，將超過2.0 kgf/cm2 且未達8.0 kgf/cm2 之情形設為「△」，將2.0 kgf/cm2 以下之情形設為「×」而評價放置30分鐘後之接著力。(Quick-curing property (adhesion after 30 minutes of standing time)) Each light and moisture-curable resin composition obtained in Examples and Comparative Examples was applied to a width of about 1 mm by using a dispensing device. An aluminum substrate was UV-LED (wavelength 405 nm) and irradiated with ultraviolet light at 1000 mJ / cm 2 to harden the light. Thereafter, a glass plate was bonded to the aluminum substrate, and a weight of 50 g was placed thereon. The glass plate was allowed to stand for 30 minutes to carry out moisture curing, thereby obtaining a sample for rapid curing evaluation. FIG. 1 is a schematic view showing a case where a sample for rapid hardening evaluation is seen from above (FIG. 1 (a)), and a schematic view showing a case where a sample for quick curing property is viewed from a lateral direction (FIG. 1 (b)). For each sample for rapid curing evaluation, the following measurement was performed immediately after the 30-minute standing time had elapsed. Using a tensile tester ("Ez-Graph" manufactured by Shimadzu Corporation), the prepared sample for rapid hardening evaluation was stretched at 25 ° C at a speed of 5 mm / sec in the shearing direction to measure aluminum. Strength (adhesive force) when the substrate and the glass plate are peeled off. A case where the adhesion force is 8.0 kgf / cm 2 or more is set to "0", a case where the adhesion force is more than 2.0 kgf / cm 2 and less than 8.0 kgf / cm 2 is set to "△", and a case where 2.0 kgf / cm 2 or less It was set to "×" and the adhesion after 30 minutes of standing was evaluated.

（高溫接著性（硬化後之於100℃之接著力）） 將濕氣硬化時之放置時間變更為16小時，除此以外，以與上述「（速硬化性（放置30分鐘後之接著力））」之評價中之速硬化性評價用樣品相同之方式獲得高溫接著力測定用樣品。 使用拉伸試驗機（島津製作所公司製造之「Ez-Graph」），將所製作之高溫接著力測定用樣品於100℃，於剪斷方向上以5 mm/sec之速度進行拉伸，測定鋁基板與玻璃板剝離時之強度（接著力）。將接著力為10.0 kgf/cm2 以上之情形設為「〇」，將超過5.0 kgf/cm2 且未達10.0 kgf/cm2 之情形設為「△」，將5.0 kgf/cm2 以下之情形設為「×」而評價高溫接著性。(High temperature adhesiveness (adhesive force at 100 ° C after hardening)) In addition to changing the standing time during moisture curing to 16 hours, in addition to the above-mentioned "(rapid curing (adhesive force after 30 minutes of standing)" In the same manner as in the sample for evaluation of rapid hardenability evaluation, a sample for high-temperature adhesive force measurement was obtained. Using a tensile tester ("Ez-Graph" manufactured by Shimadzu Corporation), the produced high-temperature adhesive force measurement sample was stretched at a rate of 5 mm / sec in the shearing direction at 100 ° C to measure aluminum. Strength (adhesive force) when the substrate and the glass plate are peeled off. A case where the adhesive force is 10.0 kgf / cm 2 or more is "0", a case where it exceeds 5.0 kgf / cm 2 and less than 10.0 kgf / cm 2 is "△", and a case where 5.0 kgf / cm 2 or less is used It was set to "x" to evaluate high temperature adhesiveness.

[表1] [產業上之可利用性][Table 1] [Industrial availability]

根據本發明，可提供一種速硬化性及保存穩定性優異之光與濕氣硬化型樹脂組成物。又，根據本發明，可提供一種使用該光與濕氣硬化型樹脂組成物而成之電子零件用接著劑及顯示元件用接著劑。According to the present invention, it is possible to provide a light- and moisture-curable resin composition excellent in rapid curing properties and storage stability. Furthermore, according to the present invention, it is possible to provide an adhesive for electronic parts and an adhesive for display elements using the light and moisture-curable resin composition.

1‧‧‧鋁基板1‧‧‧ aluminum substrate

2‧‧‧光與濕氣硬化型樹脂組成物2‧‧‧Light and moisture hardening resin composition

3‧‧‧玻璃板3‧‧‧ glass plate

圖1（a）係表示自上方看見速硬化性評價用樣品之情形之模式圖，（b）係表示自橫向看見速硬化性評價用樣品之情形之模式圖。FIG. 1 (a) is a schematic diagram showing a case where a sample for evaluation of rapid hardenability is viewed from above, and FIG. 1 (b) is a schematic diagram showing a case where a sample for evaluation of fast curing is viewed from a lateral direction.

Claims (10)

一種光與濕氣硬化型樹脂組成物，其含有：濕氣硬化型胺酯樹脂、光聚合性化合物、光聚合起始劑、濕氣硬化促進觸媒、及穩定劑。A light and moisture-curable resin composition includes a moisture-curable amine ester resin, a photopolymerizable compound, a photopolymerization initiator, a moisture-curing accelerator, and a stabilizer. 如請求項1所述之光與濕氣硬化型樹脂組成物，其中，上述濕氣硬化促進觸媒包含胺觸媒。The light and moisture-curable resin composition according to claim 1, wherein the moisture-curing promoting catalyst includes an amine catalyst. 如請求項2所述之光與濕氣硬化型樹脂組成物，其中，上述胺觸媒包含三級胺。The light and moisture-curable resin composition according to claim 2, wherein the amine catalyst includes a tertiary amine. 如請求項3所述之光與濕氣硬化型樹脂組成物，其中，上述三級胺包含二烷基胺型之三級胺。The light and moisture-curable resin composition according to claim 3, wherein the tertiary amine includes a tertiary amine of a dialkylamine type. 3或4所述之光與濕氣硬化型樹脂組成物，其中，上述胺觸媒為二胺或三胺。The light and moisture curing resin composition according to 3 or 4, wherein the amine catalyst is a diamine or a triamine. 2、3、4或5所述之光與濕氣硬化型樹脂組成物，其中，上述濕氣硬化促進觸媒之含量相對於上述濕氣硬化型胺酯樹脂100重量份，為0.1重量份以上且10重量份以下。The light and moisture-curable resin composition according to 2, 3, 4 or 5, wherein the content of the moisture-curing accelerating catalyst is 0.1 parts by weight or more relative to 100 parts by weight of the moisture-curing amine ester resin. And 10 parts by weight or less. 2、3、4、5或6所述之光與濕氣硬化型樹脂組成物，其中，上述穩定劑包含亞磷酸酯及/或磷酸酯。The light and moisture hardening resin composition according to 2, 3, 4, 5 or 6, wherein the stabilizer comprises a phosphite and / or a phosphate. 2、3、4、5、6或7所述之光與濕氣硬化型樹脂組成物，其中，上述穩定劑之含量相對於上述濕氣硬化型胺酯樹脂100重量份，為0.1重量份以上且20重量份以下。The light and moisture-curable resin composition according to 2, 3, 4, 5, 6, or 7, wherein the content of the stabilizer is 0.1 part by weight or more relative to 100 parts by weight of the moisture-curable amine ester resin. And 20 parts by weight or less. 一種電子零件用接著劑，其係使用請求項1、2、3、4、5、6、7或8所述之光與濕氣硬化型樹脂組成物而成。An adhesive for electronic parts, which is formed by using the light and moisture-curable resin composition according to claim 1, 2, 3, 4, 5, 6, 7, or 8. 一種顯示元件用接著劑，其係使用請求項1、2、3、4、5、6、7或8所述之光與濕氣硬化型樹脂組成物而成。An adhesive for display elements, which is obtained by using the light and moisture-curable resin composition according to claim 1, 2, 3, 4, 5, 6, 7, or 8.
TW107132388A 2017-09-15 2018-09-14 Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements TW201920577A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2017-177757 2017-09-15
JP2017177757 2017-09-15

Publications (1)

Publication Number Publication Date
TW201920577A true TW201920577A (en) 2019-06-01

Family

ID=65723401

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107132388A TW201920577A (en) 2017-09-15 2018-09-14 Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements

Country Status (5)

Country Link
JP (1) JPWO2019054463A1 (en)
KR (1) KR20200047444A (en)
CN (1) CN110650983A (en)
TW (1) TW201920577A (en)
WO (1) WO2019054463A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110387031B (en) * 2019-07-12 2021-06-29 万华化学集团股份有限公司 Preparation method of light-colored isocyanate
KR102569482B1 (en) * 2021-11-22 2023-08-24 주식회사 아이델 UV curable adhesive composition

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180713B1 (en) * 1998-02-19 2001-01-30 The Yokohama Rubber Co., Ltd. One-can moisture-curing urethane compositions
JP2001064543A (en) * 1999-08-27 2001-03-13 Nippon Shokubai Co Ltd Resin composition for curable coating material
JP4433571B2 (en) * 2000-06-07 2010-03-17 横浜ゴム株式会社 Moisture curable polyurethane composition
JP2002179753A (en) * 2000-12-13 2002-06-26 Nippon Shiika Kk Highly weatherable polyurethane-based one-pack type moisture curable composition
JP4301821B2 (en) * 2003-01-22 2009-07-22 株式会社カネカ Curable composition with improved storage stability
US7834123B2 (en) 2006-05-19 2010-11-16 Henkel Ag & Co. Kgaa Two component polyurethane adhesive
KR101413125B1 (en) 2009-01-29 2014-07-01 세메다인 가부시키 가이샤 Heat-resistant one-part moisture-curable adhesive composition for polycarbonate resin
DE102010010598A1 (en) * 2010-03-08 2011-09-08 Delo Industrie Klebstoffe Gmbh & Co. Kgaa Dual-curing compound and its use
WO2013016133A2 (en) * 2011-07-22 2013-01-31 H.B. Fuller Company A one-component, dual-cure adhesive for use on electronics
US9315695B2 (en) * 2014-06-26 2016-04-19 Dymax Corporation Actinic radiation and moisture dual curable composition
JP2016199672A (en) * 2015-04-09 2016-12-01 積水化学工業株式会社 Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements
JP6798791B2 (en) * 2015-04-13 2020-12-09 積水化学工業株式会社 Adhesives for electronic components and adhesives for display elements

Also Published As

Publication number Publication date
JPWO2019054463A1 (en) 2020-08-27
KR20200047444A (en) 2020-05-07
WO2019054463A1 (en) 2019-03-21
CN110650983A (en) 2020-01-03

Similar Documents

Publication Publication Date Title
TWI687444B (en) Hardened body, electronic parts and display elements
TWI701310B (en) Hardened bodies, electronic parts, display elements, and light and moisture hardening resin compositions
TWI666285B (en) Light and moisture curing resin composition, adhesive for electronic parts, and adhesive for display elements
TW201927845A (en) Light/moisture-curable resin composition, adhesive for electronic component, and adhesive for display device
TWI673571B (en) Light and moisture curing resin composition, adhesive for electronic parts, and adhesive for display elements
TWI826354B (en) Adhesive compositions, hardened bodies, electronic parts and assembly parts
JP6798791B2 (en) Adhesives for electronic components and adhesives for display elements
TW201920577A (en) Photo/moisture curable resin composition, adhesive for electronic components, and adhesive for display elements
WO2020149377A1 (en) Curable resin composition and cured body
TWI682982B (en) Light and moisture curable resin composition, adhesive for electronic parts, and adhesive for display elements
TWI712665B (en) Light moisture curable resin composition, adhesive for electronic parts, and adhesive for display elements
JP2018002925A (en) Photo- and moisture-curable resin composition, adhesive for electronic components, and adhesive for display elements
TW202031850A (en) Light/moisture-curable urethane-based compound, light/moisture-curable urethane polymer, and light/moisture-curable resin composition
JP2016147969A (en) Photo- and moisture-curable resin composition, adhesive agent for electronic component, and adhesive agent for display element
KR102458390B1 (en) Moisture-curable resin composition and assembly parts
WO2022230819A1 (en) Moisture-curable adhesive composition and cured object
WO2022230820A1 (en) Light/moisture-curable adhesive composition, and cured body
TW201934712A (en) Curable resin composition, cured article, electronic components and assembly components