WO2022161125A1 - 化学强化微晶玻璃及其制备方法和电子设备 - Google Patents
化学强化微晶玻璃及其制备方法和电子设备 Download PDFInfo
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- WO2022161125A1 WO2022161125A1 PCT/CN2022/070288 CN2022070288W WO2022161125A1 WO 2022161125 A1 WO2022161125 A1 WO 2022161125A1 CN 2022070288 W CN2022070288 W CN 2022070288W WO 2022161125 A1 WO2022161125 A1 WO 2022161125A1
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- Prior art keywords
- glass
- ceramic
- chemically strengthened
- temperature
- strengthened glass
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- 239000002241 glass-ceramic Substances 0.000 title claims abstract description 355
- 238000002360 preparation method Methods 0.000 title claims description 19
- 238000000034 method Methods 0.000 claims abstract description 151
- 230000008569 process Effects 0.000 claims abstract description 141
- 238000005728 strengthening Methods 0.000 claims abstract description 108
- 239000002994 raw material Substances 0.000 claims abstract description 69
- 238000001816 cooling Methods 0.000 claims abstract description 43
- 238000002425 crystallisation Methods 0.000 claims abstract description 41
- 230000008025 crystallization Effects 0.000 claims abstract description 41
- 239000011734 sodium Substances 0.000 claims abstract description 35
- 238000000137 annealing Methods 0.000 claims abstract description 33
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 29
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 26
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims abstract description 24
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000011591 potassium Substances 0.000 claims abstract description 24
- 238000002834 transmittance Methods 0.000 claims abstract description 16
- 239000011521 glass Substances 0.000 claims description 134
- 238000005342 ion exchange Methods 0.000 claims description 61
- 150000003839 salts Chemical class 0.000 claims description 42
- 238000000465 moulding Methods 0.000 claims description 32
- 239000013078 crystal Substances 0.000 claims description 31
- 229910003002 lithium salt Inorganic materials 0.000 claims description 17
- 159000000002 lithium salts Chemical class 0.000 claims description 17
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 13
- FUJCRWPEOMXPAD-UHFFFAOYSA-N Li2O Inorganic materials [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 claims description 11
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims description 11
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Na2O Inorganic materials [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 10
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 10
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 10
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 10
- 159000000000 sodium salts Chemical class 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims description 7
- PAZHGORSDKKUPI-UHFFFAOYSA-N lithium metasilicate Chemical compound [Li+].[Li+].[O-][Si]([O-])=O PAZHGORSDKKUPI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052912 lithium silicate Inorganic materials 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- WVMPCBWWBLZKPD-UHFFFAOYSA-N dilithium oxido-[oxido(oxo)silyl]oxy-oxosilane Chemical compound [Li+].[Li+].[O-][Si](=O)O[Si]([O-])=O WVMPCBWWBLZKPD-UHFFFAOYSA-N 0.000 claims description 5
- 159000000001 potassium salts Chemical class 0.000 claims description 3
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims 1
- 229910000271 hectorite Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 20
- 239000010410 layer Substances 0.000 description 76
- 238000013003 hot bending Methods 0.000 description 47
- 238000003426 chemical strengthening reaction Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 229910052744 lithium Inorganic materials 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 150000002500 ions Chemical class 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910001416 lithium ion Inorganic materials 0.000 description 7
- 229910018068 Li 2 O Inorganic materials 0.000 description 6
- 229910013553 LiNO Inorganic materials 0.000 description 6
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000010433 feldspar Substances 0.000 description 6
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910001415 sodium ion Inorganic materials 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- 239000005354 aluminosilicate glass Substances 0.000 description 3
- -1 aluminum ion Chemical class 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910052681 coesite Inorganic materials 0.000 description 3
- 229910052906 cristobalite Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000012634 fragment Substances 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000002787 reinforcement Effects 0.000 description 3
- 229910052682 stishovite Inorganic materials 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910052905 tridymite Inorganic materials 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical group [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- JFBZPFYRPYOZCQ-UHFFFAOYSA-N [Li].[Al] Chemical compound [Li].[Al] JFBZPFYRPYOZCQ-UHFFFAOYSA-N 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
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- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000004031 devitrification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002159 nanocrystal Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229910001414 potassium ion Chemical group 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 238000009662 stress testing Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/0066—Re-forming shaped glass by bending
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/02—Re-forming glass sheets
- C03B23/023—Re-forming glass sheets by bending
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B25/00—Annealing glass products
- C03B25/02—Annealing glass products in a discontinuous way
- C03B25/025—Glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B32/00—Thermal after-treatment of glass products not provided for in groups C03B19/00, C03B25/00 - C03B31/00 or C03B37/00, e.g. crystallisation, eliminating gas inclusions or other impurities; Hot-pressing vitrified, non-porous, shaped glass products
- C03B32/02—Thermal crystallisation, e.g. for crystallising glass bodies into glass-ceramic articles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0018—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents
- C03C10/0027—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing SiO2, Al2O3 and monovalent metal oxide as main constituents containing SiO2, Al2O3, Li2O as main constituents
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C21/00—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface
- C03C21/001—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions
- C03C21/002—Treatment of glass, not in the form of fibres or filaments, by diffusing ions or metals in the surface in liquid phase, e.g. molten salts, solutions to perform ion-exchange between alkali ions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/097—Glass compositions containing silica with 40% to 90% silica, by weight containing phosphorus, niobium or tantalum
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Definitions
- the embodiments of the present application relate to the technical field of glass-ceramics, and in particular, to chemically strengthened glass-ceramics, preparation methods thereof, and electronic devices.
- a first aspect of the embodiments of the present application provides a chemically strengthened glass-ceramic, wherein two opposite sides of the chemically strengthened glass-ceramic are respectively formed with strengthening layers, and the strengthening layers extend from the surface of the chemically strengthened glass-ceramic to the inside It includes a potassium strengthening layer and a sodium strengthening layer in sequence, the depth of the potassium strengthening layer is 0.01 ⁇ m-5 ⁇ m, the depth of the sodium strengthening layer is ⁇ 0.1t, and the t is the thickness of the chemically strengthened glass-ceramic.
- the chemically strengthened glass-ceramic has suitable depth of potassium strengthening layer and sodium strengthening layer, and has excellent drop resistance, impact resistance and weather resistance (high temperature and high humidity environment resistance), and can be used in electronic equipment to improve electronic equipment. reliability and service life in hot and humid environments, and ultimately enhance the market competitiveness of electronic equipment.
- the average tensile stress of the chemically strengthened glass-ceramic is 35MPa-85MPa. Appropriate average tensile stress can ensure that the glass has high strength and at the same time prevent the fragments from being too small after the glass fails.
- the total mass content of the crystal phase is ⁇ 50%.
- the Vickers hardness of the chemically strengthened glass-ceramic is ⁇ 650kgf/mm 2 ; the impact strength of the chemically strengthened glass-ceramic is ⁇ 0.07J.
- the higher Vickers hardness can effectively inhibit the expansion of cracks and improve the impact resistance and drop resistance. Higher impact strength can improve product reliability.
- a second aspect of the embodiments of the present application provides a method for preparing the above chemically strengthened glass-ceramic, comprising:
- the glass-ceramic raw material is accommodated in a forming mold, and the preheating process, the forming process, the crystallization process and the annealing and cooling process are sequentially performed to obtain the 3D glass-ceramic to be strengthened; the crystallinity of the glass-ceramic raw material is is 5%-75%; the temperature of the crystallization process is greater than or equal to the temperature of the molding process.
- the Vickers hardness of the 3D glass-ceramic is ⁇ 650kgf/mm 2 ; the process capability index CPK of the 3D glass-ceramic with a length and width dimension tolerance within ⁇ 0.1 mm is greater than or equal to 0.8.
- the 3D glass-ceramic includes the following components:
- the 3D glass-ceramic includes a glass phase and a crystal phase, and the total mass content of the crystal phase in the 3D glass-ceramic is ⁇ 50%.
- the embodiment of the present application further provides a glass cover plate, and the glass cover plate is made of the chemically strengthened glass-ceramics described in the first aspect and/or the 3D glass-ceramics described in the third aspect.
- the glass cover can be a display cover, a back cover or a camera protection cover of an electronic device.
- the housing includes a display screen cover plate assembled on the front side of the electronic device, and the display screen cover plate includes the glass-ceramic.
- the housing includes a rear cover assembled on the rear side of the electronic device, and the rear cover adopts the glass-ceramic.
- the electronic device further includes a camera assembly inside the casing, the casing includes a camera protection cover, the camera protection cover is covered on the camera assembly, and the camera protects The cover plate adopts the glass-ceramic.
- part of the outer shell may be made of glass-ceramic, or all of the outer shell may be made of glass-ceramic.
- the electronic device in the present application may be one or more of a display screen cover, a rear cover, and a camera protection cover using the above-mentioned glass-ceramics.
- FIG. 1 is a schematic structural diagram of a front side of an electronic device provided by an embodiment of the present application.
- FIG. 2 is a schematic diagram of a rear structure of an electronic device provided by an embodiment of the present application.
- FIG. 4 is a schematic diagram of the distribution of exchange ions of the strengthening layer of the chemically strengthened glass-ceramic provided in the embodiment of the present application;
- FIG. 5 is a stress curve diagram of the chemically strengthened glass-ceramic in an embodiment of the application and the existing Al-Si-strong glass and Li-Al-Si 2-strong glass;
- FIG. 6 is a temperature curve diagram of the hot bending process of 3D glass-ceramic in the embodiment of the application.
- FIG. 7 is a schematic diagram of the crystal phase change inside the glass at different heat treatment stages during the hot bending process of the 3D glass-ceramic in the embodiment of the present application.
- an embodiment of the present application provides an electronic device 100.
- the electronic device 100 may be an electronic product such as a mobile phone, a tablet computer, a smart wearable device, etc.
- the electronic device 100 includes an electronic device assembled outside the electronic device.
- the casing, and components such as circuit boards and batteries located inside the casing, the casing includes a display screen cover 101 assembled on the front side and a rear cover 102 assembled on the rear side, and the display screen cover 101 is covered on the display module.
- the display screen cover 101 and/or the rear cover 102 are made of glass-ceramic.
- the display screen cover plate 101 and the rear cover 102 may be all made of glass-ceramic, or only partially made of glass-ceramic.
- the electronic device 100 further includes a camera assembly 2 located inside the casing, and the casing may include a camera protection cover 103 , and the camera protection cover 103 is covered on the camera assembly 2 for protection
- the camera protection cover 103 is made of glass-ceramic.
- the camera protection cover 103 may be partially made of glass-ceramic, or may be entirely made of glass-ceramic.
- the installation position of the camera protection cover 103 is determined according to the installation position of the camera assembly 2 .
- the camera protection cover 103 may be a separate structure from the display cover 101 or the back cover 102 .
- the camera protection cover plate 103 may also be an integral structure with the display screen cover plate 101 or the back cover 102.
- the display screen cover 101 , the rear cover 102 , and the camera protection cover 103 in the electronic device 100 may be made of glass-ceramic for any one of the three, or glass-ceramic for any two of them. Glass, or glass-ceramic can be used for all three.
- the above-mentioned glass-ceramic used in the electronic device 100 is chemically strengthened glass-ceramic 10 , and strengthening layers 11 are respectively formed on opposite sides of the chemically-strengthened glass-ceramic 10 , and the strengthening layer 11 is formed from the surface of the chemically strengthened glass-ceramic It includes a potassium strengthening layer 111 and a sodium strengthening layer 112 in sequence, the depth of the potassium strengthening layer 111 is 0.01 ⁇ m-5 ⁇ m, and the depth of the sodium strengthening layer 112 is ⁇ 0.1t, where t is the thickness of the chemically strengthened glass-ceramic.
- the chemically strengthened glass-ceramic 10 in the embodiment of the present application is obtained by chemically strengthening the glass-ceramic to be strengthened. As shown in FIG. Layer 11.
- the strengthening layer 11 is obtained from the glass-ceramic to be strengthened through two-step ion exchange, and the part of the intermediate layer 113 that does not participate in the ion-exchange has the same composition as the glass-ceramic to be chemically strengthened. Referring to FIG.
- the sodium strengthening layer 112 of the inner layer is formed by the first step of ion exchange, the first step of ion exchange is Na+-Li+ exchange, and the first step of ion exchange introduces sodium ions into the glass-ceramic; and the outer layer
- the potassium reinforced layer 111 is formed by the joint action of the first step ion exchange and the second step ion exchange, the second step ion exchange includes K+-Na+, Na+-Li+ exchange, and the second step ion exchange introduces potassium into the glass-ceramic at the same time. ions and lithium ions.
- the potassium-strengthened layer 111 and the sodium-strengthened layer 112 with suitable depths enable the glass to have both excellent drop resistance and weather resistance.
- Figure 4 only illustrates the introduction of K, Na, and Li into the glass by the two-step ion exchange.
- the distribution position and quantity of each component are not limited to those shown in Figure 4.
- the Li introduced in the second step of ion exchange can be It is not limited to being introduced only to the potassium strengthening layer, but can also be introduced to the sodium strengthening layer.
- the depth of the potassium strengthening layer and the sodium strengthening layer refers to the dimension from the glass surface inward to the boundary of the corresponding layer.
- the depth of the potassium strengthening layer 111 is 0.1 ⁇ m-3 ⁇ m; in some embodiments, the depth of the potassium strengthening layer 111 is 0.5 ⁇ m-2.5 ⁇ m; in other embodiments, the depth of the potassium strengthening layer 111 is 1.0 ⁇ m -2.0 ⁇ m; in other embodiments, the depth of the potassium strengthening layer 111 is 1.2 ⁇ m-1.8 ⁇ m; in other embodiments, the depth of the potassium strengthening layer 111 is 1.5 ⁇ m-1.6 ⁇ m. Controlling the depth of the potassium strengthening layer to a suitable thickness can maintain the good impact resistance of the glass while obtaining excellent drop resistance and weather resistance.
- the main principle of chemical strengthening is to form a layer of compressive stress on the surface through the "crowding effect" by exchanging ions with a larger radius (such as K+) in the molten salt with ions with a smaller radius (such as Na + ) in the glass, And form a strengthening layer with a certain depth.
- the depth of the strengthening layer refers to the depth of the strengthening layer on one side of the glass, that is, the depth from the glass surface to the point where the internal compressive stress is 0.
- the strengthening layer is the ion exchange layer, that is, the compressive stress layer. A certain compressive stress can be obtained on the glass surface through ion exchange.
- the compressive stress on the surface needs to be offset first, and then the glass is in a state of tension, so the strength of the glass is significantly improved after chemical strengthening; on the other hand , because ion exchange forms a certain depth of compressive stress layer on the glass surface, so even if external force forms cracks on the glass surface, the formed ion exchange layer will effectively prevent the further expansion of cracks, thus greatly improving the resistance of the glass to external forces.
- the depth of the reinforcement layer 11 is greater than or equal to 80 ⁇ m. In some embodiments, the depth of the reinforcement layer 11 is greater than or equal to 90 ⁇ m.
- the depth of the reinforcement layer 11 is greater than or equal to 100 ⁇ m. In other embodiments, the depth of the strengthening layer 11 is greater than or equal to 105 ⁇ m. In other embodiments, the depth of the strengthening layer 11 is greater than or equal to 110 ⁇ m.
- the strengthening layer 11 has a large depth, and the chemically strengthened glass-ceramic has better anti-drop performance, which can improve the reliability of electronic equipment.
- CS50 > 100 MPa.
- the strengthening layer 11 constitutes a compressive stress layer
- the chemically strengthened glass-ceramic also has a tensile stress layer corresponding to the compressive stress layer.
- the average tensile stress of the chemically strengthened glass-ceramic 10 is 35 MPa to 85 MPa.
- the average tensile stress may be, for example, 35 MPa, 39 MPa, 45 MPa, 60 MPa, 70 MPa, and 85 MPa. If the average tensile stress is too small, the strength performance of the glass is poor; if the average tensile stress is too high, the fragments will be too small ( ⁇ 2mm) after the glass fails, which is not suitable for use in electronic equipment.
- Appropriate average tensile stress can ensure that the glass has high strength and at the same time prevent the fragments from being too small after the glass fails.
- the size of the chemically strengthened glass-ceramics in the examples of the present application after failure is greater than 2 mm.
- the falling ball impact strength of the chemically strengthened glass-ceramic 10 is greater than or equal to 0.07J. In some embodiments, the falling ball impact strength of the chemically strengthened glass-ceramic 10 is greater than or equal to 0.10J. In other embodiments, the falling ball impact strength of the chemically strengthened glass-ceramic 10 is greater than or equal to 0.15J.
- Falling ball that is, the steel ball hits the glass surface with a certain height in free fall motion.
- the impact strength of the falling ball refers to the ability of the glass to be smashed to the surface by a steel ball in a certain height of free fall motion and remain undamaged.
- the sodium element concentration decreases monotonically. That is, from the surface of the chemically strengthened glass-ceramic to the inner depth of 0.01t to the depth of 0.1t, the concentration of sodium element decreases monotonically.
- the distribution of sodium element is beneficial to the glass to obtain better anti-drop performance and weather resistance.
- the chemically strengthened glass-ceramic 10 has good heat and humidity resistance. No white sodium-containing compounds are precipitated, that is, no "white” corrosion marks will appear on the surface of the chemically strengthened glass-ceramic 10 .
- the chemically strengthened glass-ceramic 10 is kept at a temperature of 85° C. and a humidity of 85% for more than or equal to 180 hours, and no white sodium-containing compound is precipitated on the surface.
- the chemically strengthened glass-ceramic 10 is kept at a temperature of 85° C. and a humidity of 85% for more than or equal to 240 hours, and no white sodium-containing compound is precipitated on the surface. Chemically strengthened glass-ceramic has good resistance to heat and humidity, which can improve the adaptability of electronic equipment to use in hot and humid scenarios and prolong the service life of electronic equipment.
- the depth of the strengthening layer, the compressive stress CS50 at a depth of 50 ⁇ m of the strengthening layer, and the average tensile stress can be obtained by testing with a glass stress meter (eg, SLP2000, FSM6000).
- a glass stress meter eg, SLP2000, FSM6000.
- the chemically strengthened glass-ceramics in the examples of this application were tested for the stress of the potassium-strengthened layer by using a glass stress meter, and there were no stress stripes.
- the drop resistance height of the chemically strengthened glass-ceramic 10 is greater than or equal to 1.5m.
- the test method for the anti-drop height is to attach chemically strengthened glass-ceramic 10 to a 200g electronic device model, drop the glass downwards horizontally onto a marble board with 180# sandpaper on the surface, and take the highest glass that does not break. The point is the anti-drop height.
- the glass-ceramic to be strengthened is a lithium-containing glass-ceramic, and the glass-ceramic to be strengthened may include the following components in molar percentage:
- SiO 2 is the main oxide constituting the glass network, and provides the glass with network structure strength.
- the content of SiO 2 may be 60%-72%, and further may be 65%-70%.
- Higher SiO2 content can enhance the connectivity of the glass network structure and improve the glass density and mechanical properties.
- Li 2 O and Na 2 O are the main components of ion exchange, wherein lithium ion is the key exchange ion for the first step of ion exchange to form a sodium exchange layer.
- Li 2 O content With a higher Li 2 O content, a deeper strengthening layer depth can be obtained through the first step of ion exchange, and a higher surface compressive stress can also be obtained, thereby improving the anti-crack generation ability and improving the anti-drop performance of the glass, but the Li 2 O content is too high
- the thermal expansion coefficient of the glass will increase, the thermal shock resistance will decrease, and the network structure will be destroyed. Therefore, the content of Li 2 O is controlled within the range of 10%-25% in the examples of the present application.
- the content of Li 2 O is controlled in the range of 18%-23%. In other embodiments, the content of Li 2 O is controlled within the range of 20%-22%.
- Sodium ion is the key exchange ion to form the outer potassium strengthening layer, and the existence of K 2 O can reduce the viscosity at high temperature and reduce the difficulty of smelting, but excessive K 2 O will reduce the ion exchange rate. Therefore, in the examples of the present application, the total content of Na 2 O and K 2 O is controlled within the range of 3%-5%. In some embodiments, the total content of Na 2 O and K 2 O is controlled at 3.5%-4.5%. In the embodiment of the present application, only Na 2 O may be included, or both K 2 O and Na 2 O may be included.
- the aluminum ion (Al 3+ ) is basically in the form of a tetrahedron Participating in the network structure of the glass, with the increase of Al 2 O 3 content, the strength of the glass increases, and the mechanical properties develop in a good direction. Moreover, due to the large volume of the [AlO 4 ] tetrahedron, the network voids can be enlarged, so that the Exchange ions move more easily, so ion exchange performance can be improved. In some embodiments of the present application, the content of Al 2 O 3 may be 2%-8%.
- the glass component further includes one or more of P 2 O 5 , ZrO 2 and TiO 2 .
- P 2 O 5 , ZrO 2 and TiO 2 exist as nucleating agents, which can crystallize inside the glass to make the glass microcrystalline, thereby enhancing the strength of the glass.
- the mechanical strength of the glass will decrease, especially the surface hardness , which will cause the glass to be easily scratched. reduce. Therefore, in the embodiments of the present application, the total content of P 2 O 5 , ZrO 2 and TiO 2 is controlled within the range of 2%-10%.
- the glass component may further include one or more of MgO, CaO, and ZnO.
- the total mass content of MgO, CaO and ZnO may be 1%-3%, or 2%-2.5%.
- MgO as a network intermediate, can improve the Young's modulus of the glass and the toughness of the glass body, which is beneficial to improve the drop performance of the whole electronic product; it can also improve the ion exchange performance of the glass and reduce the high temperature viscosity of the glass.
- CaO can have an effect on the glass melting temperature and can make the glass network denser.
- ZnO is an effective component to reduce the viscosity of glass at low temperature, but excessive ZnO will lead to phase separation of glass and reduce devitrification resistance.
- the glass component may further include B 2 O 3 .
- B 2 O 3 has a good fluxing effect, but excessive B 2 O 3 will destroy the main network structure of the glass and reduce water resistance and mechanical properties. strength. Therefore, in the embodiment of the present application, the content of B 2 O 3 is controlled within the range of 0%-5%. In some embodiments, the content of B 2 O 3 is controlled in the range of 1%-4%. In other embodiments, the content of B 2 O 3 is controlled within the range of 2%-3%.
- the glass-ceramic to be strengthened includes a glass phase and a crystal phase, wherein the crystal phase includes at least one of lithium feldspar, lithium silicate, and lithium disilicate.
- the total mass content of the crystal phase is ⁇ 50%.
- the crystal phase content represents the crystallinity of chemically strengthened glass-ceramics.
- the total mass content of the crystalline phase is greater than or equal to 60%.
- the total mass content of the crystalline phase is greater than or equal to 70%.
- the total mass content of the crystalline phase is 70%-90%.
- the total mass content of the crystalline phase is 80%-88%.
- the content of crystal phase can be detected by X-ray diffraction (XRD) method.
- the thickness of the chemically strengthened glass-ceramic 10 may be ⁇ 0.03 mm. In some embodiments, the thickness of the chemically strengthened glass-ceramic 10 may be ⁇ 0.04 mm. The specifics may be determined according to application requirements. In some embodiments, the thickness of the chemically strengthened glass-ceramic 10 may be 0.4 mm-1.5 mm. Specifically, the thickness of the chemically strengthened glass-ceramic 10 can be, for example, but not limited to, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm , 1.5mm.
- the suitable thickness can not only ensure high strength, but also meet the ultra-thin requirements of cover products.
- the chemically strengthened glass-ceramic may be 2D chemically strengthened glass-ceramic, 2.5D chemically strengthened glass-ceramic or 3D chemically strengthened glass-ceramic.
- the chemically strengthened glass-ceramic 10 has excellent optical properties, high transmittance and low haze. Moreover, when the chemically strengthened glass-ceramic is 3D chemically strengthened glass-ceramic, it also has excellent optical properties. Specifically, the average transmittance of the chemically strengthened glass-ceramic in the light wavelength range of 400nm-700nm is ⁇ 85%; the Lab color and chromaticity index b value is ⁇ -2.0; and the haze is ⁇ 0.25%.
- the average transmittance of chemically strengthened glass-ceramic with a thickness of ⁇ 0.4 mm in the light wavelength range of 400nm-700nm is ⁇ 85%; the Lab color and chromaticity index b value is ⁇ -2.0; and the haze is ⁇ 0.25%.
- the average transmittance of the chemically strengthened glass-ceramic in the light wavelength range of 400nm-700nm is ⁇ 90%.
- the Lab color chromaticity index b value of the chemically strengthened glass-ceramic 10 is greater than or equal to -1.5; in some embodiments, the Lab color and chromaticity index b value of the chemically strengthened glass-ceramic 10 is greater than or equal to -0.4.
- the haze of the chemically strengthened glass-ceramic 10 is ⁇ 0.2%. In some embodiments, the haze of the chemically strengthened glass-ceramic 10 is ⁇ 0.15%.
- the chemically strengthened glass-ceramic has high dimensional stability, the length and width dimensional tolerances are within ⁇ 0.1 mm, and the CPK (Process Capability Index) is greater than or equal to 0.8. In some embodiments, the length and width dimension tolerance is within ⁇ 0.1mm, and CPK ⁇ 0.9. In some embodiments, the length and width dimension tolerance is within ⁇ 0.1mm, and CPK ⁇ 1.0.
- the Vickers hardness of the chemically strengthened glass-ceramic is ⁇ 650 kgf/mm 2 . In some embodiments, the Vickers hardness of the chemically strengthened glass-ceramic is ⁇ 720 kgf/mm 2 . In other embodiments, the Vickers hardness of the chemically strengthened glass-ceramic is ⁇ 730 kgf/mm 2 .
- the chemically strengthened glass-ceramics of the embodiments of the present application have good weather resistance and good drop resistance, while maintaining good optical properties, and can meet the display and display requirements of electronic device display screen covers, back covers and camera protection covers.
- the optical requirements of shooting can also be adapted to extreme humid and hot use environments, and it can also improve the reliability of electronic equipment.
- the embodiments of the present application provide a method for preparing the above chemically strengthened glass-ceramic, including:
- Step S101 placing the glass-ceramic to be strengthened in a first salt bath to perform the first step of ion exchange, wherein the strengthening salt of the first salt bath includes sodium salt with a mass fraction of ⁇ 30%;
- Step S102 placing the glass-ceramic to be strengthened after the first-step ion-exchange in a second salt bath for the second-step ion-exchange to obtain a chemically strengthened glass-ceramic; wherein, the strengthening salt of the second salt bath includes a mass of Potassium salts with a fraction greater than or equal to 85%, and lithium salts with a mass fraction of 0.005% to 1%.
- the above chemical strengthening process is used to strengthen the glass-ceramic, and the depth of the potassium strengthening layer is controlled at 0.01 ⁇ m-5 ⁇ m, which can make the glass have good resistance to humidity and heat environment and anti-rough ground drop performance at the same time.
- Impact strength Specifically, an appropriate amount of lithium salt is added to the salt bath of the second step of ion exchange, and the presence of lithium salt in the salt bath can introduce an appropriate amount of lithium ions into the glass during the second step of ion exchange, and lithium ions are relatively sodium ions. It has a greater accumulation effect and enters the glass network, making the glass network more stable and forming a denser structure.
- the presence of lithium salts can also inhibit the ion exchange of the crystal phase in the glass and improve the weather resistance of the glass.
- the depth of the potassium strengthening layer is controlled at 0.01 ⁇ m-5 ⁇ m.
- FIG. 5 shows the chemically strengthened glass-ceramic in an embodiment of the application, and the prior art alumino-silicon-strong glass (primary chemically strengthened alumino-silicon non-ceramic glass) and lithium-alumina-silicon double-strength glass ( That is, the stress curve of the secondary chemically strengthened lithium aluminum silicon non-ceramic glass). It can be known from FIG.
- the first step of ion exchange is the first step of strengthening.
- the first salt bath is a pure sodium salt salt bath or a mixed salt bath of sodium salt and potassium salt.
- the mass fraction of sodium salt is not limited, such as but not limited to 30%, 40%, 50%, 60%, 70%, 80%, 90%, 95%, 99%.
- the temperature of the first ion exchange may be 380°C-490°C. In other embodiments, the temperature of the first ion exchange may be 400°C to 480°C. In some embodiments, the time of the first ion exchange can be 3h-24h. In other embodiments, the time of the first ion exchange can be 6h-20h.
- the average transmittance of the 3D glass-ceramic to be strengthened in the light wavelength range of 400nm-700nm is ⁇ 90%.
- the Lab color chromaticity index b value of the 3D glass-ceramic to be strengthened is greater than or equal to -1.5; in some embodiments, the Lab color and chromaticity index b value of the 3D glass-ceramic to be strengthened is greater than or equal to -0.4.
- the haze of the 3D glass-ceramic to be strengthened is ⁇ 0.2%. In some embodiments, the haze of the 3D glass-ceramic to be strengthened is ⁇ 0.15%.
- the Vickers hardness of the 3D glass-ceramic to be strengthened is ⁇ 650 kgf/mm 2 .
- the crystallization process is to pass the forming mold containing the glass-ceramic raw material through the crystallization station of the hot bending equipment.
- the temperature of the crystallizing station is greater than or equal to the temperature of the forming station.
- the temperature of the crystallization station is greater than or equal to the temperature of the forming station, which can further crystallize the glass-ceramic raw material during the crystallization process, and finally obtain the 3D glass-ceramic to be strengthened with high crystallinity.
- the temperature of the crystallization step is in the range of 700°C to 900°C.
- the preparation method of the 3D glass-ceramic in the embodiment of the present application is to use the glass-ceramic raw material of medium crystallinity (5%-75%) to carry out 3D hot bending forming, and introduce a crystallization process after the forming process to prepare the 3D micro-ceramic. Crystallized glass can finally obtain glass-ceramics with high crystallinity, which has both excellent optical properties and good drop resistance, and can improve the efficiency of 3D molding, improve the product yield of 3D molding, and obtain good dimensional stability. .
- the strengthened glass cover plate of the mobile phone obtained by the chemical strengthening process provided in the examples of the present application can achieve a high degree of chemical strengthening.
- the drop resistance height of the whole machine under the scene of 200g, 180# sandpaper is ⁇ 1.5m.
- the glass cover of the mobile phone of Examples 1-6 has a falling ball impact strength>0.15J.
- the mobile phone glass cover sheets of Examples 1-6 have strong weather resistance, and can be stored for 240 hours in a humid and hot environment with a temperature of 85° C./85% humidity, and no corrosion residues will appear.
- the furnace water for the first step of strengthening contains 40wt%-100wt% NaNO 3 and 0-60wt% KNO 3 , The strengthening temperature is 380-490 °C, and the strengthening time is 3-24 hours; the furnace water of the second step strengthening adopts the strengthening salt containing ⁇ 85wt% KNO 3 and 0.005wt% ⁇ 1wt% LiNO 3 , the strengthening temperature is 370-450 °C, and the strengthening Time 2-240min.
- the furnace water for the first step of strengthening contains 40wt%-100wt% NaNO 3 and 0-60wt% KNO 3 , The strengthening temperature is 380-490 °C, and the strengthening time is 3-24 hours; the furnace water of the second step strengthening adopts the strengthening salt containing ⁇ 85wt% KNO 3 and 0.005wt% ⁇ 1wt% LiNO 3 , the strengthening temperature is 370-450 °C, and the strengthening Time 2-240min.
- Example 9 The only difference from Example 9 is that the temperature regime during hot bending in step (3) is different, see Table 2 for details.
- Example 7 The only difference from Example 7 is that the process parameters such as temperature and time of step (1) and step (2) are adjusted to obtain glass-ceramic raw materials with different crystallinity.
- Example 7 The only difference from Example 7 is that the glass-ceramic raw material with a crystallinity greater than 85% is used to undergo the hot bending treatment process in Table 2.
- Example 9 The only difference from Example 9 is that the glass-ceramic raw material with a crystallinity of 0% was used to undergo the hot bending treatment process in Table 2, and then placed in a crystallization furnace and subjected to a heat preservation treatment at 650 °C for 4 hours to obtain a crystallized glass-ceramic raw material. glass sample.
- the hot bending fragmentation rate can be reduced, and at the same time, the excessive growth of the crystal grains can be prevented, and good optical performance can be obtained; On the other hand, it can also ensure the dimensional stability of hot bending forming and obtain the desired main crystal phase.
- the glass by introducing the crystallization process in the hot bending process, the glass enters the high temperature crystallization process after the hot bending process is completed, which can improve the crystallinity of the glass and obtain good anti-drop performance.
- the hot bending forming process has lower requirements on hot bending equipment, high hot bending yield and high hot bending efficiency.
- high-crystallinity glass raw materials are used for hot bending.
- a higher preheating temperature is required.
- the glass turns blue, and the optical properties deteriorate; and the nano-crystals grow, the micro-cracks increase, and the crystallinity increases.
- Example 11 and Example 14 It can also be known from Example 11 and Example 14 that when a glass-ceramic raw material with a crystallinity of less than 5% is selected for hot bending by the hot bending process of the embodiment of the present application, the dimensional stability of the glass cover product is poor; When the glass-ceramic raw material with a crystallinity higher than 75% is subjected to hot bending by the hot bending process of the embodiment of the present application, the optical properties of the glass cover product are obviously deteriorated.
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Abstract
Description
Claims (29)
- 一种化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃相对两侧分别形成有强化层,所述强化层自所述化学强化微晶玻璃表面向内部依次包括钾强化层和钠强化层,所述钾强化层的深度为0.01μm-5μm,所述钠强化层的深度≥0.1t,所述t为所述化学强化微晶玻璃的厚度。
- 如权利要求1所述的化学强化微晶玻璃,其特征在于,所述强化层的深度大于或等于80μm。
- 如权利要求1或2所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃在所述强化层深度为50μm处的压应力CS50≥50MPa。
- 如权利要求1-3任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃的平均张应力为35MPa-85MPa。
- 如权利要求1-4任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃自表面向内部的0.01t-0.1t厚度范围内,钠元素浓度单调递减。
- 如权利要求1-5任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃在温度为85℃、湿度为85%的条件下保持大于或等于120小时,表面不析出白色含钠的化合物。
- 如权利要求1-6任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃由待强化的微晶玻璃经化学强化得到,以摩尔百分比计,所述待强化的微晶玻璃包括如下组分:Li 2O:10%-25%,SiO 2:58%-72%,Na 2O和K 2O:3%-7%,Al 2O 3:2%-8%,P 2O 5+ZrO 2+TiO 2:2%-13%,MgO+CaO+ZnO:0-3%,B 2O 3:0-5%。
- 如权利要求7所述的化学强化微晶玻璃,其特征在于,所述待强化的微晶玻璃包括玻璃相和晶体相,所述晶体相包含透锂长石、硅酸锂、二硅酸锂中的至少一种。
- 如权利要求8所述的化学强化微晶玻璃,其特征在于,所述待强化的微晶玻璃中,所述晶体相的总质量含量≥50%。
- 如权利要求1-9任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃包括2D化学强化微晶玻璃、2.5D化学强化微晶玻璃或3D化学强化微晶玻璃。
- 如权利要求1-10任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃的厚度≥0.03mm。
- 如权利要求1-11任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃在400nm-700nm光波长范围的平均透过率≥85%;Lab颜色色度指标b值≥-2.0;雾度≤0.25%;所述3D微晶玻璃长宽尺寸公差在±0.1mm以内的过程能力指数CPK≥0.8。
- 如权利要求1-12任一项所述的化学强化微晶玻璃,其特征在于,所述化学强化微晶玻璃的维氏硬度≥650kgf/mm 2;所述化学强化微晶玻璃的抗冲击强度≥0.07J。
- 一种如权利要求1-13任一项所述的化学强化微晶玻璃的制备方法,其特征在于,包 括:将待强化的微晶玻璃置于第一盐浴中进行第一步离子交换,所述第一盐浴的强化盐包括质量分数≥30%的钠盐;将经所述第一步离子交换后的待强化的微晶玻璃置于第二盐浴中进行第二步离子交换,得到所述化学强化微晶玻璃,所述第二盐浴的强化盐包括质量分数大于或等于85%的钾盐,以及质量分数为0.005%~1%的锂盐。
- 如权利要求14所述的制备方法,其特征在于,所述第一步离子交换的温度为380℃-490℃,时间为3h-24h;所述第二步离子交换的温度为370℃-450℃,时间为2min-240min。
- 如权利要求14或15所述的制备方法,其特征在于,所述待强化的微晶玻璃包括待强化的3D微晶玻璃,所述待强化的3D微晶玻璃采用如下方式制备得到:将微晶玻璃原材收容于成型模具内,依次经过预热工序、成型工序、晶化工序和退火冷却工序,得到所述待强化的3D微晶玻璃;所述微晶玻璃原材的结晶度为5%-75%;所述晶化工序的温度大于或等于所述成型工序的温度。
- 如权利要求16所述的制备方法,其特征在于,所述预热工序的温度在0℃~780℃范围内;所述成型工序的温度在600℃~800℃范围内,成型压力在0MPa-0.9MPa范围内;所述晶化工序的温度在700℃~900℃范围内;所述退火冷却工序的温度在0℃~800℃范围内。
- 一种3D微晶玻璃,其特征在于,所述3D微晶玻璃在400nm-700nm光波长范围的平均透过率≥85%;Lab颜色色度指标b值≥-2.0;雾度≤0.25%。
- 如权利要求18所述的3D微晶玻璃,其特征在于,所述3D微晶玻璃的维氏硬度≥650kgf/mm 2;所述3D微晶玻璃长宽尺寸公差在±0.1mm以内的过程能力指数CPK≥0.8。
- 如权利要求18或19所述的3D微晶玻璃,其特征在于,以摩尔百分比计,所述3D微晶玻璃包括如下组分:Li 2O:10%-25%,SiO 2:58%-72%,Na 2O和K 2O:3%-7%,Al 2O 3:2%-8%,P 2O 5+ZrO 2+TiO 2:2%-13%,MgO+CaO+ZnO:0-3%,B 2O 3:0-5%。
- 如权利要求18-20任一项所述的3D微晶玻璃,其特征在于,所述3D微晶玻璃包括玻璃相和晶体相,所述晶体相在所述3D微晶玻璃中的总质量含量≥50%。
- 如权利要求18-21任一项所述的3D微晶玻璃,其特征在于,所述3D微晶玻璃包括化学强化3D微晶玻璃,所述化学强化3D微晶玻璃表面具有压应力层。
- 一种3D微晶玻璃的制备方法,其特征在于,包括:将微晶玻璃原材收容于成型模具内,依次经过预热工序、成型工序、晶化工序和退火冷却工序,得到所述3D微晶玻璃;所述微晶玻璃原材的结晶度为5%-75%;所述晶化工序的温度大于或等于所述成型工序的温度。
- 如权利要求23所述的制备方法,其特征在于,所述预热工序的温度在0℃~780℃ 范围内;所述成型工序的温度在600℃~800℃范围内,成型压力在0MPa-0.9MPa范围内;所述晶化工序的温度在700℃~900℃范围内;所述退火冷却工序的温度在0℃~800℃范围内。
- 一种玻璃盖板,其特征在于,所述玻璃盖板采用如权利要求1-13任一项所述的化学强化微晶玻璃或如权利要求18-22任一项所述的3D微晶玻璃制成。
- 一种电子设备,其特征在于,包括组装在所述电子设备外侧的外壳,以及位于所述外壳内部的电路板,所述外壳采用微晶玻璃,所述微晶玻璃包括如权利要求1-13任一项所述的化学强化微晶玻璃或如权利要求18-22任一项所述的3D微晶玻璃。
- 如权利要求26所述的电子设备,其特征在于,所述外壳包括组装在所述电子设备前侧的显示屏盖板,所述显示屏盖板包括所述微晶玻璃。
- 如权利要求26或27所述的电子设备,其特征在于,所述外壳包括组装在所述电子设备后侧的后盖,所述后盖采用所述微晶玻璃。
- 如权利要求26-28任一项所述的电子设备,其特征在于,所述电子设备还包括位于所述外壳内部的摄像头组件,所述外壳包括摄像头保护盖板,所述摄像头保护盖板盖设在所述摄像头组件上,所述摄像头保护盖板采用所述微晶玻璃。
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