WO2022022156A1 - Boîtier de dispositif électronique, son procédé de fabrication et dispositif électronique - Google Patents

Boîtier de dispositif électronique, son procédé de fabrication et dispositif électronique Download PDF

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Publication number
WO2022022156A1
WO2022022156A1 PCT/CN2021/101041 CN2021101041W WO2022022156A1 WO 2022022156 A1 WO2022022156 A1 WO 2022022156A1 CN 2021101041 W CN2021101041 W CN 2021101041W WO 2022022156 A1 WO2022022156 A1 WO 2022022156A1
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WIPO (PCT)
Prior art keywords
layer
liquid crystal
substrate
electronic device
crystal layer
Prior art date
Application number
PCT/CN2021/101041
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English (en)
Chinese (zh)
Inventor
金挺顺
Original Assignee
Oppo广东移动通信有限公司
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Publication date
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Publication of WO2022022156A1 publication Critical patent/WO2022022156A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133553—Reflecting elements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H05K5/0243—Mechanical details of casings for decorative purposes

Definitions

  • the present application relates to the technical field of electronic device casings, and in particular, to a casing of an electronic device and a manufacturing method thereof, and an electronic device.
  • An embodiment of the present application provides a casing of an electronic device, the casing of the electronic device includes a substrate and a liquid crystal layer; the liquid crystal layer is disposed on the substrate and includes oriented liquid crystal, so that the liquid crystal layer enters the liquid crystal layer.
  • the incident light can be reflected by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.
  • An embodiment of the present application provides a method for manufacturing a casing of an electronic device, including: providing a substrate; and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer includes oriented liquid crystal, so that the liquid crystal enters the liquid crystal.
  • the incident light of the layer can be reflected out through the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.
  • An embodiment of the present application provides an electronic device, including: a casing and a functional device, wherein the casing defines an accommodating space and includes a substrate, a bonding layer and a liquid crystal layer; the bonding layer is disposed on the substrate The liquid crystal layer is disposed on the side of the bonding layer away from the substrate, and contains oriented liquid crystal, so that the incident light entering the liquid crystal layer can be reflected by the liquid crystal, and the reflection The wavelength of the light changes with the change of the incident angle of the incident light; the functional device is accommodated in the accommodating space.
  • FIG. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application.
  • FIG. 2 is a schematic structural diagram of an embodiment of the housing of the electronic device of the present application.
  • FIG. 3 is a schematic structural diagram of a base body in an embodiment of the housing of the electronic device of the present application.
  • FIG. 4 is a schematic diagram of a path of light entering a liquid crystal layer in an embodiment of the housing of the electronic device of the present application;
  • FIG. 5 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 6 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 7 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 8 is a schematic structural diagram of yet another embodiment of the housing of the electronic device of the present application.
  • FIG. 9 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 10 is a schematic structural diagram of a light shielding layer in an embodiment of the housing of the electronic device of the present application.
  • FIG. 11 is a schematic structural diagram of a casing of an electronic device in the related art.
  • FIG. 12 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 13 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 15 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 16 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 17 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • FIG. 18 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 19 is another structural schematic diagram of the housing of the electronic device in the related art.
  • 20 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 21 is a schematic structural diagram of another embodiment of the housing of the electronic device of the present application.
  • 22 is a schematic flowchart of an embodiment of a method for manufacturing a casing of an electronic device of the present application
  • FIG 23 is a schematic flowchart of step S20 in Figure 22;
  • Figure 24 is a schematic flowchart of step S23 in Figure 23;
  • 25 is a schematic flowchart of another embodiment of a method for manufacturing a casing of an electronic device of the present application.
  • FIG. 26 is a partial schematic flowchart of another embodiment of the method for manufacturing a casing of an electronic device of the present application.
  • An aspect of the embodiments of the present application provides a casing of an electronic device, the casing of the electronic device includes a substrate and a liquid crystal layer; the liquid crystal layer is disposed on the substrate and includes oriented liquid crystals, so that the The incident light of the liquid crystal layer can be reflected by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.
  • the housing of the electronic device according to claim 1, wherein the wavelength of the reflected light satisfies: ⁇ 2np sin ⁇ , wherein ⁇ is the wavelength of the reflected light, and n is the wavelength of the liquid crystal layer.
  • the casing further includes a reflective layer, and the reflective layer is disposed on the side of the liquid crystal layer away from the substrate, or on the side of the liquid crystal layer facing the substrate, for reflecting the incident light.
  • the casing further includes a bonding layer arranged on the side of the substrate facing the reflective layer.
  • the reflective layer is a metal film layer
  • the material is at least one of indium and tin
  • the thickness of the reflective layer is 20-30 nm.
  • the casing further includes a color layer, and the color layer is disposed between the liquid crystal layer and the reflection layer, and has a thickness of 9-13 ⁇ m.
  • the casing further includes a color layer, the color layer is disposed on the side of the reflection layer away from the liquid crystal layer, and has a thickness of 9-13 ⁇ m; the reflection layer is an anti-reflection film, and the material is ZrO2, At least one of Nb2O5, the thickness of the reflective layer is 40-80nm.
  • the casing further includes a texture layer, a light shielding layer and a protective layer; the texture layer is disposed between the liquid crystal layer and the reflective layer, and has a texture pattern; the light shielding layer is disposed on the reflective layer.
  • the side far from the texture layer includes at least one ink layer; when the reflective layer is disposed on the side of the liquid crystal layer far away from the substrate, the protective layer is disposed on the substrate far away from the One side of the liquid crystal layer; when the reflective layer is disposed on the side of the liquid crystal layer facing the substrate, the protective layer is disposed on the side of the liquid crystal layer away from the substrate.
  • the shell further includes the texture layer with a thickness of 9-12 ⁇ m, and the texture layer is made of ultraviolet curing glue;
  • the ink layer and two gray ink layers the thickness of each ink layer is 5-8 ⁇ m, the thickness of the light-shielding layer is 25-40 ⁇ m; the thickness of the protective layer is 6-9 ⁇ m, and the hardness of the shell is not less than Pencil hardness 3H.
  • the shell further includes that the liquid crystal is a cholesteric liquid crystal, and the cholesteric liquid crystal includes a polymerizable monomer, a nematic liquid crystal, a chiral compound, an ultraviolet light absorber, and a photoinitiator.
  • the thickness of the layer is 2-3 ⁇ m;
  • the material of the substrate is a composite sheet of polycarbonate and polymethyl methacrylate, including a polycarbonate layer and a polymethyl methacrylate layer, and the thickness of the substrate is 0.5 mm or 0.64mm, and the thickness of the polymethyl methacrylate layer is 40-55 ⁇ m.
  • One aspect of the embodiments of the present application provides a method for manufacturing a casing of an electronic device, the manufacturing method includes: providing a substrate; and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer includes oriented liquid crystals , so that the incident light entering the liquid crystal layer can be reflected out by the liquid crystal, and the wavelength of the reflected light changes with the change of the incident angle of the incident light.
  • the step of forming a liquid crystal layer on the substrate includes: providing a carrier film; sequentially coating a liquid crystal aligning agent and a liquid crystal on the carrier film to form the oriented liquid crystal on the carrier film; and transferring the oriented liquid crystal to the substrate to form the liquid crystal layer, wherein the liquid crystal layer is bonded to the substrate through an adhesive layer.
  • the material of the carrier film is polyethylene terephthalate
  • the material of the adhesive layer is UV-curable resin
  • the oriented liquid crystal is transferred to the substrate, and is bonded by bonding
  • the step of bonding the layer on the substrate to form the liquid crystal layer includes: using a roll coater to roll a UV-curable resin between the oriented liquid crystal and the substrate; The ultraviolet light-curable resin is subjected to ultraviolet light irradiation, so that the ultraviolet light-curable resin is cured to form the adhesive layer, so that the oriented liquid crystal is adhered to the substrate to form the liquid crystal layer; and Remove the carrier film.
  • the manufacturing method further includes: forming a reflective layer on a side of the liquid crystal layer away from the substrate, wherein the reflective layer is used to reflect incident light.
  • the reflective layer is a metal film layer
  • the material is at least one of indium and tin
  • the thickness of the reflective layer is 20-30 nm.
  • the manufacturing method further includes: forming a color layer on the side of the liquid crystal layer away from the substrate, wherein the The thickness of the color layer is 9-13 ⁇ m.
  • the manufacturing method further includes: forming a color layer on a side of the reflective layer away from the substrate, wherein the The thickness of the color layer is 9-13 ⁇ m; wherein, the reflective layer is an anti-reflection film, and the thickness of the reflective layer is 40-80 nm.
  • the manufacturing method further includes: performing a three-dimensional molding process on the base body, so that the base body has a preset three-dimensional shape; and performing a finishing process on the base body, so as to obtain an electronic device having a preset size. case.
  • an aspect of the embodiments of the present application provides an electronic device, the electronic device includes a casing and a functional device, wherein the casing defines an accommodating space and includes a substrate, a bonding layer and a liquid crystal layer; the bonding The liquid crystal layer is arranged on one side of the substrate, the liquid crystal layer is arranged on the side of the bonding layer away from the substrate, and contains oriented liquid crystal, so that the incident light entering the liquid crystal layer can pass through the liquid crystal layer. and the wavelength of the reflected light changes with the change of the incident angle of the incident light; the functional device is accommodated in the accommodating space.
  • the bonding layer is a film
  • the material can be at least one of polyethylene terephthalate, polyvinyl chloride, and thermoplastic polyurethane elastomer rubber.
  • the liquid crystal layer is arranged between the bonding layer and the functional device, or is arranged on a side of the bonding layer away from the functional device.
  • the electronic device includes a casing 10 and a functional device 20 .
  • the housing 10 defines an accommodating space 11, and the functional device 20 is disposed in the accommodating space 11.
  • the housing 10 can protect the functional device 20 (eg, a motherboard, a battery, etc.).
  • the electronic device may be a mobile phone, a tablet computer, a notebook computer, a smart bracelet, a smart watch, etc., which is not limited here.
  • the casing 10 may include a base body 12 and a liquid crystal layer 13 , wherein the liquid crystal layer 13 may be disposed on one side of the base body 12 .
  • the material of the base body 12 may be glass, plastic, or the like.
  • the material of the substrate 12 may be a composite sheet of polycarbonate (PC) and polymethyl methacrylate (PMMA), specifically a composite sheet made of PC and PMMA particles through co-extrusion.
  • the base 12 may include a PC layer 121 and a PMMA layer 122 .
  • the base body 12 may be made of a material with a certain color according to actual requirements.
  • the thickness of the base body 12 may be 0.5 mm or 0.64 mm, so as to meet the requirement of light and thin electronic devices.
  • the thickness of the PMMA layer 122 can be 40-55 ⁇ m, and the PMMA layer 122 of this thickness can be used to make the base body 12 and the protective layer 17 cooperate with each other to meet the wear resistance requirements of the casing 10 , and at the same time, it can also reduce the wear resistance of the base body 12 .
  • the thickness of the PMMA layer 122 may be 40 ⁇ m, 45 ⁇ m, 50 ⁇ m, 55 ⁇ m, etc., which is not specifically limited here.
  • the liquid crystal layer 13 contains liquid crystals, which may be cholesteric liquid crystals, and may specifically include polymerizable monomers, nematic liquid crystals, chiral compounds, ultraviolet light absorbers, photoinitiators, and the like.
  • the liquid crystal in the liquid crystal layer 13 in this embodiment may include oriented liquid crystal, and the incident light entering the liquid crystal layer 13 can be reflected by the oriented liquid crystal, thereby improving the brightness and gloss of the housing 10; on the other hand, the After the oriented liquid crystal reflects the light, the reflected light can show a certain color, and the incident light entering the liquid crystal layer 13 is reflected by the oriented liquid crystal to generate reflected light with different wavelengths as the incident angle of the incident light changes. Therefore, when the user's viewing angle is different, the observed color of the liquid crystal layer 13 will undergo a red shift or a blue shift with the change of the viewing angle, so that the liquid crystal layer 13 has a dazzling effect.
  • the aligned liquid crystals can be arranged according to the corresponding helical pitch p. As the user's viewing angle changes, the incident angle of the incident light entering the user's eyes changes, and ⁇ changes, resulting in a corresponding change in the wavelength ⁇ of the reflected light, thereby changing the color of the reflected light.
  • the thickness of the liquid crystal layer 13 can be 2-3 ⁇ m, such as 2 ⁇ m, 2.5 ⁇ m, 3 ⁇ m, etc., which can be selected according to actual needs.
  • a bonding layer 19 can also be arranged between the liquid crystal layer 13 and the substrate 12 , the bonding layer 19 can be a film, and the material can be polyethylene terephthalate ( At least one of polyethylene terephthalate (PET), polyvinyl chloride (Polyvinyl chloride, PVC), thermoplastic polyurethane elastomer rubber (Thermoplastic polyurethanes, TPU) and the like.
  • PET polyethylene terephthalate
  • PVC polyvinyl chloride
  • TPU thermoplastic polyurethane elastomer rubber
  • the liquid crystal layer 13 can be directly formed on the substrate 12 or the bonding layer 19, and can also be bonded to the substrate 12 or the bonding layer 19 through an adhesive.
  • an ultraviolet (ultraviolet, UV) curing resin can be used as the adhesive.
  • the adhesive is used for bonding. Of course, other adhesives can also be used, which are not limited here.
  • the liquid crystal layer 13 may be located on the side of the casing 10 facing the functional device 20 inside the electronic device, that is, the liquid crystal layer 13 is disposed between the functional device 20 and the bonding layer 19 .
  • the material of the base body 12 and the bonding layer 19 is a material with a certain light transmittance, so that the external light can enter the liquid crystal layer 13 through the base body 12 ; of course, the liquid crystal layer 13 can also be located in the casing 10 away from the electronic device.
  • One side of the inner functional device 20 that is, the liquid crystal layer 13 is disposed on the side of the bonding layer 19 away from the functional device 20 .
  • the material of the base body 12 and the bonding layer 19 can be either a light-transmitting material or an opaque material, which can be selected according to actual needs.
  • the housing 10 of the electronic device may further include a reflective layer 15 , and the reflective layer 15 may be used to reflect incident light, thereby further improving the brightness of the housing 10 .
  • the casing 10 can present a bright colorful effect with the change of the viewing angle of the user.
  • the reflective layer 15 may be a metal film layer, the material may be at least one of indium and tin, and the thickness may be 20-30 nm, such as 20 nm, 25 nm, 30 nm, and the like.
  • the reflective layer 15 has strong reflectivity and good brightness enhancement effect, so that the casing 10 can present a brighter dazzling effect.
  • the reflective layer 15 can also be an anti-reflection film
  • the material can be at least one of ZrO 2 and Nb 2 O 5
  • the thickness can be 40-80 nm, such as 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc.
  • the reflective layer 15 has both a certain reflectivity and a certain anti-reflection effect, so as to meet different usage requirements.
  • the reflective layer 15 can be arranged on the side of the liquid crystal layer 13 away from the substrate 12 , and in actual use, the liquid crystal layer 13 and the reflective layer 15 can be arranged on the side of the substrate 12 facing the inside of the electronic device side of the structure.
  • FIG. 7 Similar to the housing 10 corresponding to FIG. 5 , in this application scenario, the side of the substrate 12 facing the liquid crystal layer 13 is provided with a bonding layer 19 , and the reflective layer 15 can be provided on the side of the liquid crystal layer 13 . between the liquid crystal layer 13 and the bonding layer 19 .
  • the housing 10 of the electronic device may further include a texture layer 14 , a light shielding layer 16 and a protective layer 17 .
  • the texture layer 14 can be disposed between the liquid crystal layer 13 and the reflective layer 15 and has a texture pattern, so that the casing 10 can further exhibit a texture effect.
  • the texture layer 14 can be made of UV curing glue, and the texture layer 14 can be formed by UV transfer printing or the like. It should be noted that if the texture layer 14 is too thin, the texture effect presented by the casing 10 will be poor, and if the texture layer 14 is too thick, the texture layer 14 will be more brittle, thereby reducing the adhesion and improving the casing. 10 Risk of cracking when dropped, considering these factors, in this embodiment, the thickness of the texture layer 14 may be 9-12 ⁇ m, specifically 9 ⁇ m, 10 ⁇ m, 11 ⁇ m, 12 ⁇ m, and the like.
  • the light shielding layer 16 may be disposed on the side of the reflective layer 15 away from the textured layer 14 , and may include at least one ink layer. Specifically, as shown in FIG. Three layers of white ink layers 161 and two layers of gray ink layers 162, or may also include three layers of black ink layers and two layers of gray ink layers arranged in sequence along the direction away from the reflective layer 15, which are not specifically limited here. Among them, the gray ink layer can play the role of shading and mold release.
  • each ink layer can be formed by printing, and the thickness of each ink layer can be 5-8 ⁇ m, such as 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, etc., and the total thickness of the light shielding layer 16 can be 25-40 ⁇ m, such as 25 ⁇ m , 30 ⁇ m, 35 ⁇ m, 40 ⁇ m, etc. It should be noted that, compared with the method of forming the light shielding layer 16 by one-time printing, the ink layer formed in this embodiment is thin, has strong adhesion, and is low in brittleness, thereby improving the stability of the casing 10 .
  • the protective layer 17 can be formed by flow coating of a curing liquid, specifically, a curing liquid of a UV system can be flow coated.
  • the thickness of the protective layer 17 can be 6-9 ⁇ m, such as 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m, etc.
  • the protective layer 17 can meet the requirements of wear resistance and scratch resistance, and the hardness of the housing 10 of the electronic device Satisfy not less than pencil hardness 3H (1000gf).
  • the protective layer 17 may be disposed on the side of the substrate 12 away from the liquid crystal layer 13 .
  • the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , and the light shielding layer 16 can be disposed on the side of the substrate 12 facing the internal structure of the electronic device, and the protective layer 17 can be disposed on the side of the substrate 12 away from the electronic device side of the internal structure.
  • the side of the base 12 of the casing 10 facing the liquid crystal layer 13 is provided with a bonding layer 19 and a light shielding layer. 16 is disposed between the reflective layer 15 and the bonding layer 19 , and the protective layer 17 can be disposed on the side of the liquid crystal layer 13 away from the substrate 12 .
  • one side of the base body 12 faces the internal structure of the electronic device, and the side of the protective layer 17 is disposed away from the internal structure of the electronic device.
  • the protective layer 17 may also have a certain light transmittance, so that external light can enter other structural layers through the protective layer 17 .
  • the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 11 for details.
  • the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell A in the embodiment corresponding to FIG. 8 and the gloss of the shell B corresponding to FIG. 11 , wherein the shell B except the Except for not having the liquid crystal layer 13, other structures are the same as the case A, and the obtained test results are shown in Table 1 below:
  • the housing 10 may further include a color layer, and the color layer may be formed by spraying, silk screen printing, printing, offset printing and other processes.
  • the color presented by the color layer can be selected according to actual needs, which is not limited here.
  • the color layer 18 can be disposed between the liquid crystal layer 13 and the texture layer 14, and the thickness can be 9-13 ⁇ m, specifically 9 ⁇ m, 10 ⁇ m, 11 ⁇ m, 12 ⁇ m, 13 ⁇ m, etc.
  • the disposition of the color layer 18 in this embodiment makes the color of the color layer 18 superimpose with the color of the liquid crystal layer 13 and the effect of changing color with an angle, so that the color presented by the casing 10 can be more abundant.
  • the liquid crystal layer 13 , the color layer 18 , the texture layer 14 , the reflective layer 15 and the light shielding layer are sequentially arranged on the side of the substrate 12 away from the protective layer 17 along the direction away from the substrate 12 Layer 16.
  • a light shielding layer 16 , a reflective layer 15 , a texture layer 14 , a color layer 18 , a liquid crystal layer 13 and a color layer 18 are sequentially arranged on the side of the bonding layer 19 away from the substrate 12 along the direction away from the substrate 13 .
  • protective layer 17 is sequentially arranged on the side of the bonding layer 19 away from the substrate 12 along the direction away from the substrate 13 .
  • the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 14 for details.
  • the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell C in the embodiment corresponding to FIG. 12 and the gloss of the shell D corresponding to FIG. 14 , wherein the shell D except for Except for not having the liquid crystal layer 13, other structures are the same as the case C, and the obtained test results are shown in Table 2 below:
  • the casing 10 may not include the texture layer 14 , the light shielding layer 15 and the protective layer 17 in the above embodiments, for example, the casing structure in FIGS. 15 and 16 , and the color layer 18 in FIG. 15 .
  • the housing 10 in FIG. 16 Disposed between the liquid crystal layer 13 and the reflective layer 15 , the housing 10 in FIG. 16 further includes a bonding layer 19 disposed on one side of the substrate 12 .
  • the color layer 18 can be disposed on the side of the reflective layer 15 away from the texture layer 14 and between the reflective layer 15 and the light shielding layer 16 , and the thickness can be 9-13 ⁇ m , specifically 9 ⁇ m, 10 ⁇ m, 11 ⁇ m, 12 ⁇ m, 13 ⁇ m, etc.
  • the reflective layer 15 in this embodiment may be different from those in the above-mentioned embodiments, and specifically may be an anti-reflection film, the material may be at least one of ZrO 2 and Nb 2 O 5 , and the thickness may be 40- 80nm, such as 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc.
  • the reflective layer 15 is an anti-reflection film
  • the color layer 18 is located on the side of the reflective film away from the substrate 12 , and the light entering the color layer 18 sequentially passes through the reflective layer 15 , the texture layer 14 , the liquid crystal layer 13 , the substrate 12 and the
  • the protective layer 17 enters the eyes of the user, so that the color presented by the casing 10 is more vivid and transparent; further, the color layer 18 cooperates with the reflection of the light by the liquid crystal layer 13 and the reflective layer 15, so as to make the casing 10 more bright and transparent. Body 10 is more vivid, transparent and bright.
  • the liquid crystal layer 13 , the texture layer 14 , the reflective layer 15 , and the color layer 18 are sequentially provided on the side of the substrate 12 away from the protective layer 17 along the direction away from the substrate 12 . and the light shielding layer 16 .
  • the casing 10 may not include the above-mentioned liquid crystal layer 13 , please refer to FIG. 19 for details.
  • the German BYK miniature triangular gloss meter is used to test the surface gloss of the shell E in the embodiment corresponding to FIG. 17 and the gloss of the shell F and the shell G corresponding to FIG. 19 , wherein,
  • the casing F has the same structure as the casing E except that it does not have the liquid crystal layer 13, the casing G does not have the liquid crystal layer 13, and the thickness of the reflective layer 15 is 280 nm, and other structures are the same as the casing E.
  • Table 3 The test results are shown in Table 3 below:
  • the case E with the liquid crystal layer 13 in this embodiment is more glossy than the case F in the related art that does not have the liquid crystal layer 13 but has the same structure as the case E in this embodiment.
  • the thickness of the reflective layer 15 of the casing E in this embodiment satisfies 40-80 nm, which can achieve the same gloss effect as the casing G with the reflective layer 15 thickness of 280 nm in the above-mentioned related art.
  • the arrangement of the liquid crystal layer 13 in the embodiment can improve the brightness and gloss of the casing 10 .
  • the casing 10 may not include the texture layer 14 , the light shielding layer 15 and the protective layer 17 in the above-mentioned embodiments.
  • the color layer 18 is disposed on the side of the reflective layer 15 away from the liquid crystal layer 13
  • the housing 10 in FIG. 21 further includes a bonding layer 19 disposed on one side of the substrate 12
  • the color layer 18 is disposed on the side of the reflective layer 15 away from the liquid crystal layer 13 .
  • each structural layer can be formed on the lamination layer 19 first to form a membrane structure, and then through in-mold injection molding, etc. It is obtained by injection molding the base body 12 on the diaphragm structure.
  • injection molding the base body 12 on the diaphragm structure.
  • it can also be formed in other ways, which is not specifically limited here.
  • the present application also provides a manufacturing method of a casing of an electronic device.
  • the manufacturing method of the casing of the electronic device may include:
  • Step S10 providing a substrate
  • Step S20 forming a liquid crystal layer on the substrate
  • the liquid crystal layer in this embodiment includes oriented liquid crystal, and the incident light entering the liquid crystal layer can be reflected by the oriented liquid crystal, thereby improving the brightness and gloss of the casing;
  • the oriented liquid crystal can make the reflected light show a certain color after reflecting the light, and the incident light entering the liquid crystal layer is reflected by the oriented liquid crystal to produce reflected light with different wavelengths with the change of the incident angle of the incident light.
  • the observed color of the casing will undergo a red-shift or a blue-shift with the change of the viewing angle, thereby producing a dazzling effect.
  • the oriented liquid crystal can present the main color under the irradiation of light, and the phenomenon of color change occurs with the change of the observation angle. It should be pointed out that different types of liquid crystals can be selected according to different main colors required to manufacture the above-mentioned liquid crystal layer.
  • the liquid crystal layer can be formed on the substrate in different ways according to actual requirements.
  • the alignment agent may be coated on the substrate first, and then the liquid crystal may be further coated on the alignment agent, or other methods may also be used, which are not specifically limited here.
  • the above-mentioned step S20 of forming the liquid crystal layer on the substrate may include:
  • Step S21 providing a carrier film
  • the material of the carrier film may be a polymer material, such as PET.
  • Step S22 sequentially coating a liquid crystal aligning agent and a liquid crystal on the carrier film to form an oriented liquid crystal
  • the alignment agent may be a polyvinyl alcohol alignment agent, and the coating thickness may be less than 1 ⁇ m.
  • the composition of the liquid crystal can be selected and determined according to factors such as the color to be displayed, which is not specifically limited here.
  • Step S23 transferring the oriented liquid crystal to the substrate to form a liquid crystal layer, wherein the liquid crystal layer is bonded to the substrate through an adhesive layer.
  • the material of the adhesive layer may be UV curable resin, and the thickness may be 4-6 ⁇ m, specifically 4 ⁇ m, 5 ⁇ m, 6 ⁇ m, etc., which are not limited here.
  • step S23 may include:
  • Step S231 using a coil coater to roll-coat the UV-curable resin between the oriented liquid crystal and the substrate;
  • a UV-curable resin tank can be provided, and a doctor blade can be used to scrape the UV-curable resin onto the liquid crystal on the carrier film, and then the liquid crystal can be covered on the substrate by a roll coater.
  • Step S232 irradiating the UV-curable resin with UV light after the roller coating, so that the UV-curable resin is cured to form a bonding layer, so as to bond the oriented liquid crystal to the substrate to form a liquid crystal layer;
  • a mercury lamp can be used to illuminate the UV-curable resin, and the curing energy can be 100-1000 mj/cm 2 .
  • the curing energy can be 100-1000 mj/cm 2 .
  • other methods can also be used for irradiation, which is not specifically limited here.
  • Step S233 removing the carrier film.
  • the carrier film can be removed directly.
  • the manufacturing method of the housing of the electronic device may further include:
  • Step S30 forming a reflective layer on the side of the liquid crystal layer away from the substrate;
  • the reflective layer can be a metal film layer, which can be formed by magnetron sputtering or evaporation plating, the material can be at least one of indium and tin, and the thickness can be 20-30nm, such as 20nm, 25nm, 30nm, etc., or an anti-reflection film, the material can be at least one of ZrO 2 and Nb 2 O 5 , and the thickness can be 40-80nm, such as 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc.
  • the reflective layer can be used to reflect light incident through the substrate and the liquid crystal layer.
  • the manufacturing method of the casing of the electronic device may further include:
  • Step S40 forming a texture layer on the side of the liquid crystal layer away from the substrate;
  • the texture layer can be formed by using UV glue, and specifically, the texture layer can be formed by means of UV transfer printing.
  • UV glue can be coated on the texture template, and then the side of the substrate on which the liquid crystal layer is formed is attached to the master.
  • emitting diode, LED) curing if necessary, a mercury lamp can be added for secondary curing, after curing, the master is further separated from the substrate, so that the textured UV glue is retained on the substrate liquid crystal layer to form a textured layer with a textured pattern.
  • Step S50 forming a light shielding layer on the side of the reflective layer away from the substrate;
  • the light-shielding layer may include a single-layer ink layer or a multi-layer ink layer.
  • three layers of white ink layers and two layers of white ink layers and two layers of white ink layers can be formed on the side of the reflective layer away from the substrate along the direction away from the substrate by printing.
  • the gray ink layer, or three black ink layers and two gray ink layers, are not specifically limited here.
  • Step S60 after the light-shielding layer is formed, three-dimensional molding is performed on the base body, so that the base body has a preset three-dimensional shape;
  • high pressure forming equipment can be used to perform 3D high pressure forming on the base body, so that the base body has a preset radian.
  • the infrared heating temperature of the high-pressure molding equipment can be 380°C
  • the heating time can be 36s ⁇ 15s
  • the air pressure can be 65kg ⁇ 10kg
  • the temperature of the lower mold on the PC layer side of the substrate can be 130 ⁇ 140°C
  • the upper mold temperature can be in the range of 110 ⁇ 120°C
  • the preforming time can be 10 ⁇ 20s
  • the blowing time can be 5 ⁇ 10s
  • the holding time can be 10 ⁇ 20s.
  • the above parameters can be adjusted according to the requirements.
  • Step S70 forming a protective layer on the side of the substrate away from the liquid crystal layer.
  • the protective layer can be formed on the side of the substrate away from the liquid crystal layer by means of a flow coating of a hardening liquid.
  • the hardening liquid can be a hardening liquid of UV system.
  • the surface hardness of the obtained shell is not lower than the pencil hardness of 3H, and can play the role of anti-wear and anti-scratch.
  • Step S80 finishing the base body to obtain a casing of an electronic device having a preset size.
  • the base body can be finished by using a numerical control machine tool, and specifically can be finished according to the shape and size of the casing of each electronic device, so as to obtain the casing of the electronic device.
  • a color layer may also be formed.
  • the difference between the method for manufacturing a casing of an electronic device and the foregoing method for manufacturing a casing for an electronic device is that, before step S40, the manufacturing method may further include: : A color layer is formed on the side of the liquid crystal layer away from the substrate.
  • the color layer can be formed by spraying, screen printing, printing, offset printing and other processes.
  • the color presented by the color layer can be selected according to actual needs, which is not limited here.
  • the reflective layer is a metal film layer, and the material is at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm, such as 20 nm, 25 nm, 30 nm, and the like.
  • the reflective layer has strong reflectivity and good brightening effect, so that the shell can present a brighter dazzling effect.
  • the difference between the method for fabricating a housing of an electronic device and the aforementioned embodiments of the method for fabricating a housing for an electronic device that does not include a color layer is that after step S30, the fabricating method further comprises: It may include: forming a color layer on a side of the reflective layer away from the liquid crystal layer.
  • the color layer in this embodiment can be the same as the color in the previous embodiment.
  • the reflective layer can be an anti-reflection film, and the thickness of the reflective layer can be 40-80 nm, such as 40 ⁇ m, 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc., which is not specifically limited here.
  • the above-mentioned manufacturing method of the casing of the electronic device of the present application can be used to manufacture the casing of the above-mentioned electronic device that does not include the bonding layer in the embodiment, and the structures of each layer involved in the manufacturing method
  • the position, material, size, function, etc. of the electronic device can be the same as those in the above-mentioned embodiments of the housing of the electronic device of the present application. Please refer to the above-mentioned embodiments for relevant details, which will not be repeated here.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
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  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un boîtier d'un dispositif électronique, son procédé de fabrication, et un dispositif électronique, le boîtier (10) du dispositif électronique comprenant un substrat (12) et une couche de cristaux liquides (13) ; et la couche de cristaux liquides (13) est disposée sur le substrat (12), et comprend des cristaux liquides orientés, de telle sorte que la lumière incidente entrant dans la couche de cristaux liquides (13) peut être émise par réflexion à travers les cristaux liquides, et la longueur d'onde de la lumière réfléchie change avec des changements de l'angle incident de la lumière incidente. L'effet de présentation du boîtier (10) du dispositif électronique peut être enrichi, et la beauté du boîtier (10) du dispositif électronique peut être améliorée, ce qui satisfait aux exigences d'utilisation des utilisateurs.
PCT/CN2021/101041 2020-07-27 2021-06-18 Boîtier de dispositif électronique, son procédé de fabrication et dispositif électronique WO2022022156A1 (fr)

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CN115550493A (zh) * 2022-09-21 2022-12-30 东莞市聚龙高科电子技术有限公司 一种复合板手机后盖及其制造方法

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CN114919147B (zh) * 2022-06-02 2023-11-14 四川龙华光电薄膜股份有限公司 一种用于背光模组的薄型遮光反射片的制备工艺

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